FSBF15CH60BT. Motion SPM 3 Series. FSBF15CH60BT Motion SPM 3 Series. Features. General Description. Applications.

Similar documents
FSBB15CH60. Motion SPM 3 Series. FSBB15CH60 Motion SPM 3 Series. Features. General Description. Applications. Related Resources

FSAM10SH60A Motion SPM 2 Series

FSBB30CH60DF. Motion SPM 3 Series. FSBB30CH60DF Motion SPM 3 Series. Features. General Description. Applications.

FSB44104A Motion SPM 45 LV Series

FNC42060F / FNC42060F2

FSBB10CH120D Motion SPM 3 Series

FNB41060 Motion SPM 45 Series

FSBS3CH60 Motion SPM 3 Series Features

FSAM30SH60A Motion SPM 2 Series

FNA V Motion SPM 2 Series. FNA V Motion SPM 2 Series. Features. General Description. Applications.

FBA42060 PFC SPM 45 Series for Single-Phase Boost PFC

FPDB40PH60B PFC SPM 3 Series for 2-Phase Bridgeless PFC

FPDB30PH60 PFC SPM 3 Series for 2-Phase Bridgeless PFC

FPAB30BH60B PFC SPM 3 Series for Single-Phase Boost PFC

FPAB30BH60 PFC SPM 3 Series for Single-Phase Boost PFC

FNA41060 / FNA41060B2

Motion-SPM TM. FSBF15CH60BT Smart Power Module. FSBF15CH60BT Smart Power Module. General Description. Features. Applications. Figure 1.

FSB50450UD Motion SPM 5 Series

Package Marking and Ordering Information. Device Device Marking Package Packing Type Quantity. FNA41560T2 FNA41560T2 SPMAB-C26 Rail 12

FPAM30LH60 PFC SPM 2 Series for 2-Phase Interleaved PFC

FSB50450S Motion SPM 5 Series

FSB50760SF, FSB50760SFT Motion SPM 5 SuperFET Series

FSB50250AS Motion SPM 5 Series

Is Now Part of To learn more about ON Semiconductor, please visit our website at

Motion-SPM. FSB50250UD Smart Power Module (SPM ) General Description. Features. Absolute Maximum Ratings. Symbol Parameter Conditions Rating Units

FNA23512A V Motion SPM 2 Series. FNA23512A 1200 V Motion SPM 2 Series. General Description. Features. Applications.

FSBB20CH60C. Motion SPM 3 Series. FSBB20CH60C Motion SPM 3 Series. General Description. Features. Applications. Related Resources

Motion-SPM FPAB30BH60B. Smart Power Module(SPM ) for Front-End Rectifier. General Description. Features. Applications. April Fig. 1.

Motion-SPM. FSB50550UTD Smart Power Module (SPM ) General Description. Features. Absolute Maximum Ratings. Symbol Parameter Conditions Rating Units

Is Now Part of To learn more about ON Semiconductor, please visit our website at

FCAS20DN60BB Smart Power Module for SRM

FNA25012A V Motion SPM 2 Series

FCAS30DN60BB Smart Power Module for SRM

SPM TM. FSBB30CH60 Smart Power Module. FSBB30CH60 Smart Power Module. General Description. Features. Applications. Figure 1.

FSAM10SH60 FSAM10SH60. SPM TM (Smart Power Module) Features. General Description. Applications. External View. Fig. 1.

FCAS50SN60 Smart Power Module for SRM

FCBS0550 Smart Power Module (SPM)

PS21963-S Intellimod Module Dual-In-Line Intelligent Power Module 10 Amperes/600 Volts

Motion-SPM TM. FNB41060/B2 Smart Power Module. General Description. Features. Applications. Additional Information. Figure 1.

Is Now Part of To learn more about ON Semiconductor, please visit our website at

Mitsubishi Semiconductors <Dual-In-Line Package Intelligent Power Module> PS21865 Transfer-Mold Type Insulated Type

PS , PS A, PS C Intellimod Module Dual-In-Line Intelligent Power Module 20 Amperes/600 Volts

PS , PS A, PS C Intellimod Module Dual-In-Line Intelligent Power Module 5 Amperes/600 Volts

PS S Intellimod Module Dual-In-Line Intelligent Power Module 20 Amperes/600 Volts

C L DETAIL "B" TERMINAL CODE 1 (VNC) 2 VUFB 3 VVFB 4 VWFB 5 UP 6 VP 7 WP 8 VP1 9 VNC* 10 UN 11 VN 12 WN 13 VN1 HEATSINK SIDE

FSAM75SM60A Motion SPM 2 Series

Applied between V UFB -V UFS, V VFB -V VFS,V WFB -V WFS. Applied between U P,V P,W P -V PC, U N,V N,W N -V NC

AIM5C05B060N1 Dual-In-Line Package Intelligent Power Module

PS21867-P. Intellimod Module Dual-In-Line Intelligent Power Module 30 Amperes/600 Volts

PS21265-P PS21265-AP Intellimod Module Dual-In-Line Intelligent Power Module 20 Amperes/600 Volts

AIM5D05B060M1S. Dual-In-Line Package Intelligent Power Module. Features. External View. Applications. Internal Equivalent Circuit / Pin Configuration

NFVA23512NP2T. ASPM34 Series. Automotive 3 Phase 1200 V, 35 A IGBT Intelligent Power Module

Package BIP Features (18)VD(HW) VD COM IN (17)IN(HW) (20)VS(W) (15)VB(V) VB (14)VD(HV) VD COM IN (13)IN(HV) Cbsc (16)VS(V) (11)VB(U)

AB (2 PLACES) 30 NC 31 P 33 V 34 W

Application Note Mitsubishi Semiconductors <Dual-In-Line Package Intelligent Power Module> PS21867 Transfer-Mold Type Insulated Type

PS21A79 MAIN FUNCTION AND RATINGS 3 phase inverter with N-side open emitter structure 600V / 50A (CSTBT)

SLLIMM small low-loss intelligent molded module IPM, 3-phase inverter - 15 A, 600 V short-circuit rugged IGBT. Description. Table 1.

PS21562-SP PS21562-SP. APPLICATION AC100V~200V inverter drive for small power motor control. PS21562-SP

PS22A78-E Transfer-Mold Type Insulated Type

PS21562-P. Intellimod Module Dual-In-Line Intelligent Power Module 5 Amperes/600 Volts

APPLICATION AC100V~200V three-phase inverter drive for small power motor control (1.96) 17.7 (3.5) 35.9 ±0.5 (5.5)

N P HEATSINK SIDE 25 UN 26 VUFB 27 UP 30 NC 31 NC 32 NC 33 NC 34 NC 35 NC 28 U(VUFS) 29 NC

PS11035 Intellimod Module Application Specific IPM 20 Amperes/600 Volts

MITSUBISHI INTELLIGENT POWER MODULES PM800HSA060 FLAT-BASE TYPE INSULATED PACKAGE

Is Now Part of To learn more about ON Semiconductor, please visit our website at

PS21353-GP. Intellimod Module Dual-In-Line Intelligent Power Module 10 Amperes/600 Volts

LDIP- IPM IM (Preliminary)

PS11036 Intellimod Module Application Specific IPM 30 Amperes/600 Volts

Is Now Part of To learn more about ON Semiconductor, please visit our website at

Reference Design RD-356

Reference Design RD-408

Chapter 1. Product Outline

Description of Terminal Symbols and Terminology

Detail of Signal Input/Output Terminals

PS , PS A, PS C Intellimod Module Dual-In-Line Intelligent Power Module 3 Amperes/600 Volts

Is Now Part of To learn more about ON Semiconductor, please visit our website at

N 36 NU 37 W 38 V 39 U 40 P 41 U 42 V

Application Note DIP-Smart Power Module Test Board IV

T - 4 TYP. XØ (2 PLACES) W SQ. PIN (10 PLACES) TERMINAL CODE 1. VN1 2. SNR 3. CN1 4. VNC 5. FNO VP1 RFO AMP E2 C2E1 C1

PM300DSA060 Intellimod Module Single Phase IGBT Inverter Output 300 Amperes/600 Volts

Reference Design RD-402

PS21661-RZ/FR PS21661-FR. APPLICATION AC100V~200V, three-phase inverter drive for small power motor control.

APPLICATION AC100V~200V three-phase inverter drive for small power motor control (1.96) 17.7 (12.78) (3.5) 35.9 ±0.5 (5.5) (13.5)

FPAB30PH60 FPAB30PH60. January, Smart Power Module for Front-End Rectifier. Features. General Description. Applications. Fig. 1.

Integrated Power Hybrid IC for Appliance Motor Drive Applications

TENTATIVE PP225D120. POW-R-PAK TM 225A / 1200V Half Bridge IGBT Assembly. Description:

U P V VPI VFO WFO UP UFO V VPC GND GND

U P V VPI VFO R (2 TYP.) WFO UP UFO V VPC GND GND

PS21965, PS21965-A, PS21965-C Intellimod Module Dual-In-Line Intelligent Power Module 20 Amperes/600 Volts

PM30CSJ060 Intellimod Module Three Phase IGBT Inverter Output 30 Amperes/600 Volts

U (2 TYP.) T WFO VUPC IN F O GND GND OUT OT OUT OT S I

1 RevH,

PS21767 Intellimod Module Dual-In-Line Intelligent Power Module 30 Amperes/600 Volts

Application Note DIP-Smart Power Module Test Board V

Part No. Package Marking Material Packing SD05M50D DIP-23 SD05M50D Pb free Tube SD05M50S SOP-23 SD05M50S Pb free Tube

PS22A74. < Dual-In-Line Package Intelligent Power Module > Publication Date : January 2012 TRANSFER MOLDING TYPE INSULATED TYPE

Plug N Drive TM Integrated Power Module for Appliance Motor Drive

V VPI V (14 TYP.) VFO R (2 TYP.) WFO UP UFO V VPC GND GND GND GND GND GND VCC

Smart Pack Electric Co., Ltd< Intelligent Power Module > SPE04M50T-A TRANSFER-MOLD TYPE FULL PACK TYPE

SLIMDIP-L TRANSFER MOLDING TYPE INSULATED TYPE

Transcription:

FSBF15CH60BT Motion SPM 3 Series Features UL Certified No. E209204 (UL1557) 600 V - 15 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection Low-Loss, Short-Circuit Rated IGBTs Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing Single-Grounded Power Supply Isolation Rating: 2500 V rms / min. General Description January 2014 FSBF15CH60BT is an advanced Motion SPM 3 module providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. These modules integrate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multiple on-module protection features including under-voltage lockouts, over-current shutdown, and fault reporting. The built-in, high-speed HVIC requires only a single supply voltage and translates the incoming logic-level gate inputs to the high-voltage, high-current drive signals required to properly drive the module's internal IGBTs. Separate negative IGBT terminals are available for each phase to support the widest variety of control algorithms. Applications Motion Control - Home Appliance / Industrial Motor Related Resources AN-9044 - Motion SPM 3 Series Users Guide Figure 1. Package Overview Package Marking and Ordering Information Device Device Marking Package Packing Type Quantity FSBF15CH60BT FSBF15CH60BT SPMJA-027 Rail 10 2007 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com

Integrated Power Functions 600 V - 15 A IGBT inverter for three-phase DC / AC power conversion (please refer to Figure 3) Integrated Drive, Protection, and System Control Functions For inverter high-side IGBTs: gate drive circuit, high-voltage isolated high-speed level shifting control circuit Under-Voltage Lock-Out Protection (UVLO) Note: Available bootstrap circuit example is given in Figures 12 and 13. For inverter low-side IGBTs: gate drive circuit, Short-Circuit Protection (SCP) control supply circuit Under-Voltage Lock-Out Protection (UVLO) Fault signaling: corresponding to UVLO (low-side supply) and SC faults Input interface: active-high interface, works with 3.3 / 5 V logic, Schmitt-trigger input Pin Configuration Figure 2. Top View 2007 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com

Pin Descriptions Pin Number Pin Name Pin Description 1 V CC(L) Low-Side Common Bias Voltage for IC and IGBTs Driving 2 Common Supply Ground 3 IN (UL) Signal Input for Low-Side U-Phase 4 IN (VL) Signal Input for Low-Side V-Phase 5 IN (WL) Signal Input for Low-Side W-Phase 6 V FO Fault Output 7 C FOD Capacitor for Fault Output Duration Selection 8 C SC Capacitor (Low-Pass Filter) for Short-Circuit Current Detection Input 9 IN (UH) Signal Input for High-Side U-Phase 10 V CC(H) High-Side Common Bias Voltage for IC and IGBTs Driving 11 V B(U) High-Side Bias Voltage for U-Phase IGBT Driving 12 V S(U) High-Side Bias Voltage Ground for U-Phase IGBT Driving 13 IN (VH) Signal Input for High-Side V-Phase 14 V CC(H) High-Side Common Bias Voltage for IC and IGBTs Driving 15 V B(V) High-Side Bias Voltage for V-Phase IGBT Driving 16 V S(V) High-Side Bias Voltage Ground for V Phase IGBT Driving 17 IN (WH) Signal Input for High-Side W-Phase 18 V CC(H) High-Side Common Bias Voltage for IC and IGBTs Driving 19 V B(W) High-Side Bias Voltage for W-Phase IGBT Driving 20 V S(W) High-Side Bias Voltage Ground for W-Phase IGBT Driving 21 N U Negative DC-Link Input for U-Phase 22 N V Negative DC-Link Input for V-Phase 23 N W Negative DC-Link Input for W-Phase 24 U Output for U-Phase 25 V Output for V-Phase 26 W Output for W-Phase 27 P Positive DC-Link Input 2007 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com

Internal Equivalent Circuit and Input/Output Pins (19) V B(W) (18) V CC(H) (17) IN (WH) (20) V S(W) (15) V B(V) (14) V CC(H) (13) IN (VH) (16) V S(V) (11) V B(U) (10) V CC(H) (9) IN (UH) (12) V S(U) VB IN VB IN VB IN OUT VS OUT VS OUT VS P (27) W (26) V (25) U (24) (8) C SC (7) C FOD (6) V FO C(SC) OUT(WL) C(FOD) VFO N W (23) (5) IN (WL) IN(WL) OUT(VL) (4) IN (VL) IN(VL) N V (22) (3) IN (UL) (2) (1) V CC(L) IN(UL) OUT(UL) V SL N U (21) Figure 3. Internal Block Diagram 1st Notes: 1. Inverter low-side is composed of three IGBTs, freewheeling diodes for each IGBT, and one control IC. It has gate drive and protection functions. 2. Inverter power side is composed of four inverter DC-link input terminals and three inverter output terminals. 3. Inverter high-side is composed of three IGBTs, freewheeling diodes, and three drive ICs for each IGBT. 2007 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com

Absolute Maximum Ratings (T J = 25 C, unless otherwise specified.) Inverter Part Symbol Parameter Conditions Rating Unit V PN Supply Voltage Applied between P - N U, N V, N W 450 V V PN(Surge) Supply Voltage (Surge) Applied between P - N U, N V, N W 500 V V CES Collector - Emitter Voltage 600 V ± I C Each IGBT Collector Current T C = 25 C, T J 150 C 15 A ± I CP Each IGBT Collector Current (Peak) T C = 25 C, T J 150 C, Under 1 ms Pulse 30 A Width P C Collector Dissipation T C = 25 C per Chip 25 W T J Operating Junction Temperature (2nd Note 1) - 40 ~ 150 C 2nd Notes: 1. The maximum junction temperature rating of the power chips integrated within the Motion SPM 3 product is 150 C (at T C 125 C). Control Part Symbol Parameter Conditions Rating Unit V CC Control Supply Voltage Applied between V CC(H), V CC(L) - 20 V V BS High-Side Control Bias Voltage Applied between V B(U) - V S(U), V B(V) - V S(V), 20 V V B(W) - V S(W) V IN Input Signal Voltage Applied between IN (UH), IN (VH), IN (WH), IN (UL), IN (VL), IN (WL) - -0.3 ~ V CC + 0.3 V V FO Fault Output Supply Voltage Applied between V FO - -0.3 ~ V CC + 0.3 V I FO Fault Output Current Sink Current at V FO pin 5 ma V SC Current-Sensing Input Voltage Applied between C SC - -0.3 ~ V CC + 0.3 V Bootstrap Diode Part Symbol Parameter Conditions Rating Unit V RRM Maximum Repetitive Reverse Voltage 600 V I F Forward Current T C = 25 C, T J 150 C 0.5 A I FP Forward Current (Peak) T C = 25 C, T J 150 C Under 1 ms Pulse 2.0 A Width T J Operating Junction Temperature -40 ~ 150 C Total System Symbol Parameter Conditions Rating Unit V PN(PROT) Thermal Resistance Self-Protection Supply Voltage Limit (Short-Circuit Protection Capability) 2nd Notes: 2. For the measurement point of case temperature (T C ), please refer to Figure 2. V CC = V BS = 13.5 ~ 16.5 V T J = 150 C, Non-Repetitive, < 2 s 400 V T C Module Case Operation Temperature -40 C T J 150 C, See Figure 2-40 ~ 125 C T STG Storage Temperature -40 ~ 125 C V ISO Isolation Voltage 60 Hz, Sinusoidal, AC 1 Minute, Connect Pins to Heat Sink Plate 2500 V rms Symbol Parameter Conditions Min. Typ. Max. Unit R th(j-c)q Junction to Case Thermal Resistance Inverter IGBT Part (per 1 / 6 module) - - 4.9 C / W R th(j-c)f Inverter FWDi Part (per 1 / 6 module) - - 5.7 C / W 2007 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com

Electrical Characteristics (T J = 25 C, unless otherwise specified.) Inverter Part Symbol Parameter Conditions Min. Typ. Max. Unit V CE(SAT) Collector - Emitter Saturation Voltage V CC = V BS = 15 V V IN = 5 V I C = 15 A, T J = 25 C - - 2.2 V V F FWDi Forward Voltage V IN = 0 V I F = 15 A, T J = 25 C - - 2.5 V HS t ON Switching Times V PN = 300 V, V CC = V BS = 15 V - 0.75 - s t C(ON) I C = 15 A V IN = 0 V 5 V, Inductive Load - 0.20 - s t OFF (2nd Note 3) - 0.55 - s t C(OFF) - 0.10 - s t rr - 0.10 - s LS t ON V PN = 300 V, V CC = V BS = 15 V - 0.45 - s t C(ON) I C = 15 A V IN = 0 V 5 V, Inductive Load - 0.25 - s t OFF (2nd Note 3) - 0.55 - s t C(OFF) - 0.10 - s t rr - 0.10 - s I CES Collector - Emitter Leakage Current V CE = V CES - - 1 ma 2nd Notes: 3. t ON and t OFF include the propagation delay of the internal drive IC. t C(ON) and t C(OFF) are the switching time of IGBT itself under the given gate driving condition internally. For the detailed information, please see Figure 4. Control Part Symbol Parameter Conditions Min. Typ. Max. Unit I QCCL I QCCH I QBS Quiescent V CC Supply Current Quiescent V BS Supply Current V CC = 15 V IN (UL, VL, WL) = 0 V V CC = 15 V IN (UH, VH, WH) = 0 V V BS = 15 V IN (UH, VH, WH) = 0 V V CC(L) - - - 23 ma V CC(H) - - - 600 A V B(U) - V S(U), V B(V) - V S(V), - - 500 A V B(W) - V S(W) V FOH Fault Output Voltage V SC = 0 V, V FO Circuit: 4.7 k to 5 V Pull-up 4.5 - - V V FOL V SC = 1 V, V FO Circuit: 4.7 k to 5 V Pull-up - - 0.8 V V SC(ref) Short-Circuit Current Trip Level V CC = 15 V (2nd Note 4) 0.45 0.50 0.55 V TSD TSD Over-Temperature Protection Over-Temperature Protection Hysterisis Temperature at LVIC - 160 - C Temperature at LVIC - 5 - C UV CCD Supply Circuit Detection Level 10.7 11.9 13.0 V UV CCR Under-Voltage Protection Reset Level 11.2 12.4 13.4 V UV BSD Detection Level 10 11 12 V UV BSR Reset Level 10.5 11.5 12.5 V t FOD Fault-Out Pulse Width C FOD = 33 nf (2nd Note 5) 1.0 1.8 - ms V IN(ON) ON Threshold Voltage Applied between IN (UH), IN (VH), IN (WH), IN (UL), 2.8 - - V V IN(OFF) OFF Threshold Voltage IN (VL), IN (WL) - - - 0.8 V 2nd Notes: 4. Short-circuit protection is functioning only at the low-sides. 5. The fault-out pulse width t FOD depends on the capacitance value of C FOD according to the following approximate equation: C FOD = 18.3 x 10-6 x t FOD [F] 2007 Fairchild Semiconductor Corporation 6 www.fairchildsemi.com

0 V IN t ON V CE 100% I C t rr 100% I C I C V IN t OFF I C V CE t C(ON) t C(OFF) V IN(ON) 10% I C 90% I C 10% V CE (a) turn-on V IN(OFF) 10% V CE 10% I C (b) turn-off Figure 4. Switching Time Definition SWITCHING LOSS(ON) VS. COLLECTOR CURRENT SWITCHING LOSS(OFF) VS. COLLECTOR CURRENT SWITCHING LOSS, E SW(ON) [uj] 800 700 600 500 400 300 200 100 V CE =300V V CC =15V V IN =5V T J =25 T J =150 SWITCHING LOSS, E SW(OFF) [uj] 500 450 400 350 300 250 200 150 100 50 V CE =300V V CC =15V V IN =5V T J =25 T J =150 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 COLLECTOR CURRENT, I c [AMPERES] 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 COLLECTOR CURRENT, I c [AMPERES] Figure 5. Switching Loss Characteristics (Typical) 2007 Fairchild Semiconductor Corporation 7 www.fairchildsemi.com

Bootstrap Diode Part Symbol Parameter Conditions Min. Typ. Max. Unit V F Forward Voltage I F = 0.1 A, T C = 25 C - 2.5 - V t rr Reverse-Recovery Time I F = 0.1 A, T C = 25 C - 80 - ns Built-in Bootstrap Diode V F -I F Characteristic I F [A] 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 V F [V] T C =25 o C 2nd Notes: 6. Built-in bootstrap diode includes around 15 Ω resistance characteristic. Figure 6. Built-in Bootstrap Diode Characteristics Recommended Operating Conditions Symbol Parameter Conditions Min. Typ. Max. Unit V PN Supply Voltage Applied between P - N U, N V, N W - 300 400 V V CC Control Supply Voltage Applied between V CC(H), V CC(L) - 13.5 15.0 16.5 V V BS High-Side Bias Voltage Applied between V B(U) - V S(U), V B(V) - V S(V), 13.0 15.0 18.5 V V B(W) - V S(W) dv CC / dt, Control Supply Variation -1-1 V / s dv BS / dt t dead Blanking Time for Preventing Arm-Short Each Input Signal 2 - - s f PWM PWM Input Signal -40 C T C 125 C, -40 C T J 150 C - - 20 khz V SEN Voltage for Current Sensing Applied between N U, N V, N W - -4 4 V (Including Surge Voltage) 2007 Fairchild Semiconductor Corporation 8 www.fairchildsemi.com

Mechanical Characteristics and Ratings Parameter Conditions Min. Typ. Max. Unit Mounting Torque Mounting Screw: M3 Recommended 0.62 N m 0.51 0.62 1.00 N m Device Flatness See Figure 7 0 - +120 m Weight - 15.40 - g ( + ) ( + ) Figure 7. Flatness Measurement Position 2007 Fairchild Semiconductor Corporation 9 www.fairchildsemi.com

Time Charts of Protective Function Input Signal Protection Circuit State Control Supply Voltage Output Current Fault Output Signal UV CCR RESET a1 a2 UV CCD SET a3 a4 a5 RESET a6 a7 a1 : Control supply voltage rises: after the voltage rises UV CCR, the circuits start to operate when next input is applied. a2 : Normal operation: IGBT ON and carrying current. a3 : Under-voltage detection (UV CCD ). a4 : IGBT OFF in spite of control input condition. a5 : Fault output operation starts. a6 : Under-voltage reset (UV CCR ). a7 : Normal operation: IGBT ON and carrying current. Figure 8. Under-Voltage Protection (Low-Side) Input Signal Protection Circuit State RESET SET RESET Control Supply Voltage UV BSR b1 b2 UV BSD b3 b4 b5 b6 Output Current Fault Output Signal High-level (no fault output) b1 : Control supply voltage rises: after the voltage reaches UV BSR, the circuits start to operate when next input is applied. b2 : Normal operation: IGBT ON and carrying current. b3 : Under-voltage detection (UV BSD ). b4 : IGBT OFF in spite of control input condition, but there is no fault output signal. b5 : Under-voltage reset (UV BSR ). b6 : Normal operation: IGBT ON and carrying current. Figure 9. Under-Voltage Protection (High-Side) 2007 Fairchild Semiconductor Corporation 10 www.fairchildsemi.com

Lower Arms Control Input Protection Circuit State SET RESET Internal IGBT Gate - Emitter Voltage Output Current c1 c4 c3 c2 SC c6 c7 c8 Sensing Voltage of Shunt Resistance SC Reference Voltage Fault Output Signal c5 CR Circuit Time Constant Delay (with the external shunt resistance and CR connection) c1 : Normal operation: IGBT ON and carrying current. c2 : Short-circuit current detection (SC trigger). c3 : Hard IGBT gate interrupt. c4 : IGBT turns OFF. c5 : Fault output timer operation starts: the pulse width of the fault output signal is set by the external capacitor C FO. c6 : Input LOW : IGBT OFF state. c7 : Input HIGH : IGBT ON state, but during the active period of fault output, the IGBT doesn t turn ON. c8 : IGBT OFF state. Figure 10. Short-Circuit Protection (Low-Side Operation Only) 2007 Fairchild Semiconductor Corporation 11 www.fairchildsemi.com

MCU +5 V R PF = 4.7 kω 100 Ω 100 Ω 100 Ω 1 nf C PF = 1 nf 1 nf 1 nf SPM,, IN (UH) IN (VH) IN (WH),, IN (UL) IN (VL) IN (WL) V FO 3rd Notes: Figure 11. Recommended MCU I/O Interface Circuit 1. RC coupling at each input might change depending on the PWM control scheme in the application and the wiring impedance of the application s printed circuit board. The input signal section of the Motion SPM 3 product integrates a 5 k (typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the signal voltage drop at input terminal. 2. The logic input works with standard CMOS or LSTTL outputs. These values depend on PWM control algorithm. 15 V 22 µf 0.1 µf One-Leg Diagram of Motion SPM 3 Product Vcc VB IN HO VS P 1000 µf 1 µf Vcc IN OUT Inverter Output VSL N Figure 12. Recommended Bootstrap Operation Circuit and Parameters 3rd Notes: 3. The ceramic capacitor placed between V CC - should be over 1 F and mounted as close to the pins of the Motion SPM 3 product as possible. 2007 Fairchild Semiconductor Corporation 12 www.fairchildsemi.com

M C U Gating WH Gating VH Gating UH RS RS RS CPS CPS CPS +5 V +15 V RF CBS CBS CBS CBSC CBSC CBSC (19) VB(W) (18) (H) (17) IN(WH) (20) VS(W) (15) VB(V) (14) (H) (13) IN(VH) (16) VS(V) (11) VB(U) (10) (H) (9) IN(UH) (12) VS(U) VB IN VB IN VB IN OUT VS OUT VS OUT VS P (27) W (26) V (25) U (24) M CDCS Vdc RPF CSC (8) CSC C(SC) OUT(WL) Fault RS CFOD (7) CFOD (6) VFO C(FOD) VFO NW (23) RSW Gating WL RS (5) IN(WL) IN(WL) OUT(VL) Gating VL RS (4) IN(VL) IN(VL) NV (22) RSV Gating UL RS (3) IN(UL) IN(UL) CBPF CPS CPS CPS CPF (2) (1) (L) OUT(UL) VSL NU (21) RSU CSP15 CSPC15 Input Signal for Short-Circuit Protection W-Phase Current V-Phase Current U-Phase Current RFW RFV RFU CFW CFV CFU 4th Notes: Figure 13. Typical Application Circuit 1. To avoid malfunction, the wiring of each input should be as short as possible (less than 2-3cm). 2. By virtue of integrating an application-specific type of HVIC inside the Motion SPM 3 product, direct coupling to MCU terminals without any optocoupler or transformer isolation is possible. 3. V FO output is open-collector type. This signal line should be pulled up to the positive side of the 5 V power supply with approximately 4.7 k resistance (please refer to Figure11). 4. C SP15 of around seven times larger than bootstrap capacitor C BS is recommended. 5. V FO output pulse width should be determined by connecting an external capacitor (C FOD ) between C FOD (pin 7) and (pin 2). (Example: if C FOD = 33 nf, then t FO = 1.8 ms (typ.)) Please refer to the 2nd note 5 for calculation method. 6. Input signal is active-high type. There is a 5 k resistor inside the IC to pull down each input signal line to GND. RC coupling circuits should be used to prevent input signal oscillation. R S C PS time constant should be selected in the range 50 ~ 150 ns. C PS should not be less than 1 nf (recommended R S = 100 Ω, C PS = 1 nf). 7. To prevent errors of the protection function, the wiring around R F and C SC should be as short as possible. 8. In the short-circuit protection circuit, please select the R F C SC time constant in the range 1.5 ~ 2.0 s. 9. Each capacitor should be mounted as close to the pins of the Motion SPM 3 product as possible. 10. To prevent surge destruction, the wiring between the smoothing capacitor and the P & GND pins should be as short as possible. The use of a high-frequency non-inductive capacitor of around 0.1 ~ 0.22 F between the P & GND pins is recommended. 11. Relays are used in almost every systems of electrical equipment in home appliances. In these cases, there should be sufficient distance between the MCU and the relays. 12. C SPC15 should be over 1 F and mounted as close to the pins of the Motion SPM 3 product as possible. 2007 Fairchild Semiconductor Corporation 13 www.fairchildsemi.com

Detailed Package Outline Drawings Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild s worldwide therm and conditions, specifically the the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/mo/mod27da.pdf 2007 Fairchild Semiconductor Corporation 14 www.fairchildsemi.com

2007 Fairchild Semiconductor Corporation 15 www.fairchildsemi.com