Lead (Pb)-Bearing High Stability Thin Film Chip Resistors High Stability Thin Film Chip Resistors are the perfect choice for most fields of modern electronics where lead (Pb)-bearing terminations are mandatory and reliability and stability are of major concern. FEATURES Metal film layer on high quality ceramic SnPb termination plating, Pb content > 6 % Excellent overall stability at different environmental conditions.5 % ( h rated power at 7 C) Low temperature coefficient and tight tolerances (±.1 %; ± 1 ppm/k) Single lot date code available APPLICATIONS Military Avionics Industrial TECHNICAL SPECIFICATIONS DESCRIPTION 42 121 (1) Imperial size 42 3 85 126 121 Metric size code RR5M RR18M RR212M RR3216M RR3225M Resistance range 1 to k 1 to 332 k 1 to 1 M 1 to 2 M 1 to 3.1 M Resistance tolerance ± 1 %; ; ±.1 % Temperature coefficient ± 5 ppm/k; ± 25 ppm/k; ± 15 ppm/k; ± 1 ppm/k Climatic category (LCT/UCT/days) 55/125/56 55/125/56 55/125/56 55/125/56 55/125/56 Rated dissipation, P (2) 7.63 W.1 W.125 W.25 W.33 W Operating voltage, U max. AC RMS or DC 5 V 75 V 15 V 2 V 2 V Permissible film temperature, F max. 155 C Operating Temperature Range -55 C to 125 C (155 C) Thermal resistance (3) 87 K/W 55 K/W 44 K/W 22 K/W 17 K/W Insulation voltage: U ins 1 min 75 V V 2 V 3 V 3 V Continuous 75 V 75 V 75 V 75 V 75 V Failure rate: FIT observed.3 x 1-9 /h Notes (1) The detail specification EN1441-81 does not cover this product size. (2) Rated voltage P x R. The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. (3) Measuring conditions in accordance with EN 1441-81. Revision: 24-Jan-14 1 Document Number: 36
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE TCR TOLERANCE RESISTANCE E-SERIES ±5 ppm/k ± 1 % 1 to k 42 ±.1 % ±15 ppm/k ±.1 % 47 to k ±1 ppm/k ±.1 % ±5 ppm/k ± 1 % 1 to 332 k ±.1 % ±15 ppm/k ±.1 % 47 to 332 k ±1 ppm/k ±.1 % ±5 ppm/k ± 1 % 1 to 1. M ±.1 % ±15 ppm/k ±.1 % 47 to 1. M ±1 ppm/k ±.1 % ±5 ppm/k ± 1 % 1 to 2. M ±.1 % ±15 ppm/k ±.1 % 47 to 2. M ±1 ppm/k ±.1 % ±5 ppm/k ± 1 % 1 to 3.1 M 121 ±.1 % ±15 ppm/k ±.1 % 47 to 2.13 M ±1 ppm/k ±.1 % PART NUMBER AND PRODUCT DESCRIPTION Part Number: 1K32DETA T N P W 1 2 6 1 K 3 2 D E T A TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL 42 121 R = Decimal K = Thousand M = Million (4 digits) B = ±.1 % D = F = ± 1. % H = ± 5 ppm/k E = ± 25 ppm/k X = ± 15 ppm/k Y = ± 1 ppm/k Product Description: -126 1.32K.5 % T-9 RT1-126 1.32K.5 % T-9 RT1 TP TD CN TA TC Blank = Standard H = Single lot date code TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL -42-3 -85-126 -121 Examples: 1K32 = 132 99.68K = 99 68 3 = 3 ±.1 % ± 1. % T-2 = ± 5 ppm/k T-9 = ± 25 ppm/k T-1 = ± 15 ppm/k T-13 = ± 1 ppm/k Notes The products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER. TP1 RT7 R52 RT1 RT6 Blank = Standard BV2545 = Single lot date code Revision: 24-Jan-14 2 Document Number: 36
PACKAGING TYPE CODE QUANTITY PACKAGING STYLE WIDTH PITCH REEL DIAMETER 42 TP1 = TP (1) 8 mm 2 18 mm/7" 42 RT7 = TD 1 8 mm 2 18 mm/7" 121 121 R52 = CN (1) Tape and reel cardboard tape acc. IEC 286-3 Type I 8 mm 4 18 mm/7" RT1 = TA 5 8 mm 4 18 mm/7" Note (1) pieces packaging quantity is only available for precision resistors with tolerance ±.1 %. DESCRIPTION The production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade ceramic body (Al 2 O 3 ) and conditioned to achieve the desired temperature coefficient. A special laser is used to achieve the target value by smoothly cutting an appropriate groove in the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final tin-lead (SnPb) on nickel plating. The result of the determined production is verified by an extensive testing procedure performed on % of the individual resistors. Only accepted products are placed into the tape in accordance with IEC 286-3, Type I. Resistance marking is not applied on 42. RELATED PRODUCTS For ordering with lead free terminations please refer to latest edition of data sheet e3, (www.vishay.com/doc?28758). TNPS... ESCC high-reliability thin film chip resistors are the premium choice for design and manufacture of equipment, where mature technology and proven reliability are of utmost importance. (www.vishay.com/doc?28789) ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapour phase as shown in IEC 617-1 (1). Solderability is specified for 2 years after production. The permitted storage time is 2 years. The terminations are plated with SnPb solder, controlled for a minimum lead Pb content of 6 % for compliance with the respective requirements of Bellcore, MIL and ESCC specifications. The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. Revision: 24-Jan-14 3 Document Number: 36
Non-Linearity A 3 in db 12 11 9 42 Current Noise in µv/v 3 2 1.5.3.1 42 8.5 7.3 1 1K 1K K Resistance Value in Ω Non-Linearity.1 1K 1K K 1M Resistance Value in Ω Current Noise Phase Angle in ϑ 4 2 1 Ω Ω - 2 1 kω - 4-4.75 kω - 8 1 kω 1 5 1 5 5 Frequency f in MHz HF Performance [Z]-RO in % RO 4 2-2 - 4 - - 8 HF Performance 1 Ω Ω 1 kω 4.75 kω 1 kω 1 5 1 5 5 Frequency f in MHz Phase Angle in ϑ 4 2-2 - 4 1 Ω Ω 1 kω [Z]-RO in % RO 4 2-2 - 4 1 Ω Ω 1 kω - 1 kω - 8 1 5 1 5 5 Frequency f in MHz HF Performance - - 8 1 5 1 5 5 Frequency f in MHz HF Performance 1 kω Revision: 24-Jan-14 4 Document Number: 36
Rated Power in % 12 8 Test Voltage in V 3K 1K 4 2 Derating EN - 55-25 25 5 75 125 15 175 7 Ambient Temperature in C Note The solid line is based on IEC/EN reference test conditions which is considered as standard mode. However, above that the maximum permissible film temperature is 155 C (dashed line). Test Voltage in V 3K 1K 1 1R R 1K 1K K Resistance in Ω Single-Pulse High Voltage Overload Test 1.2/5 μs EN 14 4.27 Pulse Load P^ max. 1 1.1 1 1R R 1K 1K K Resistance in Ω Single-Pulse High Voltage Overload Test 1/7 μs EN 14 4.27.1 1-5 1-4 1-3 1-2 1-1 1 1 Pulse Duration t i Single Pulse Maximum pulse load, single pulse; applicable if P and n and Û Û max. ; for permissible resistance change equivalent to 8 h operation in standard operation mode Continuous Pulse Load P^ max. 1 1.1.1 1-5 1-4 1-3 1-2 1-1 1 1 Pulse Duration t i Pulse Voltage Û max. 5 4 3 2 Secondary conditions: a) P see diagram (Pulse Rating) b) ϑu 7 C 1-5 1-4 1-3 1-2 1-1 1 1 Pulse Duration t i Maximum pulse load, continuous pulses; Maximum pulse voltage, single and continuous pulses; applicable if P P ( amb ) and Û Û max. ; applicable if Pˆ Pˆ max.; for permissible resistance change equivalent to 8 h for permissible resistance change equivalent to 8 h operation in standard operation mode operation in standard operation mode Continuous Pulse Pulse Voltage Revision: 24-Jan-14 5 Document Number: 36
TEST AND REQUIREMENTS All tests are carried out in accordance with the following specifications: IEC 115-1, generic specification (includes tests) EN 144, sectional specification (includes schedule for qualification approval) EN 1441-81, detail specification (includes schedule for conformance inspection) The testing also covers most of the requirements specified by EIA/ECA-73 and JIS-C-521-1. The tests are carried out under standard atmospheric conditions in accordance with IEC 68-1, 5.3. A climate category is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the number of days of the damp heat, steady-state test (56). Unless otherwise specified the following values apply: Temperature: 15 C to 35 C Relative humidity: 45 % to 75 % Air pressure: 86 kpa to 16 kpa (8 mbar to 1 mbar). The components are mounted for testing on boards in accordance with EN115-1, 4.31 unless otherwise specified. The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN1441-81. TEST PROCEDURES AND REQUIREMENTS EN 115-1 CLAUSE IEC 68-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE ( R) Stability for product type: 42 121 1 to < to 3.1 M 1 to 3.1 M 4.5 - Resistance - ±.1 % ± 1 %; 4.8.4.2 - Temperature coefficient At (2/- 55/2) C and (2/125/2) C ± 25 ppm/k; ± 15 ppm/k; ± 1 ppm/k ± 5 ppm/k; ± 25 ppm/k 4.25.1-4.25.3 - Endurance at 7 C Endurance at upper category temperature U = P 7 x R or U max. ; 1.5 h on;.5 h off; 7 C; h ± (.1 % R +.2 ) ± (.5 % R +.1 ) ± (.25 % R +.5 ) 125 C; h ± (.1 % R +.2 ) ± (.5 % R +.1 ) ± (.5 % R +.5 ) 4.13 - Short time overload U = 2.5 x P 7 x R 2 x U max. ; 2 s ± (.5 % R +.1 ) ± (.2 % R +.1 ) ± (.1 % R +.2 ) 4.24 78 (Cab) Damp heat, steady state (4 ± 2) C; (93 ± 3) % RH; 56 days ± (.1 % R +.2 ) ± (.5 % R +.1 ) ± (.5 % R +.5 ) 4.19 14 (Na) Rapid change of temperature 3 min at - 55 C: 3 min at 125 C; 5 cycles ± (.5 % R +.1 ) ± (.2 % R +.1 ) ± (.1 % R +.2 ) 4.18.2 58 (Td) Resistance to soldering heat Solder bath method; (2 ± 5) C; (1 ± 1) s ± (.5 % R +.1 ) ± (.2 % R +.1 ) ± (.1 % R +.2 ) 4.35 - Flammability, needle flame test IEC 695-11-5; 1 s No burning after 3 s Revision: 24-Jan-14 6 Document Number: 36
DIMENSIONS L T t H W T b DIMENSIONS AND MASS TYPE H L W T t T b MASS (mg) 42.35 ±.5 1. ±.5.5 ±.5.2 ±.1.2 ±.1.65.45 ±.1 1.6 ±.1.85 ±.1.3 ±.2.3 ±.2 2.45 ±.1 2. ±.15 1.25 ±.15.4 ±.2.4 ±.2 5.5.55 ±.1 3.2 ±.15 1.6 ±.15.5 ±.25.5 ±.25 1 121. ±.15 3.2 ±.15 2.45 ±.15.5 ±.25.5 ±.25 16 SOLDER PAD DIMENSIONS G X Y SOLDER PAD DIMENSIONS REFLOW SOLDERING WAVE SOLDERING TYPE Y X G Y X G 42.4.6.5 - - -.5.9 1..9.9 1..7 1.3 1.2.9 1.3 1.3.9 1.7 2. 1.1 1.7 2.3 121.9 2.5 2. 1.1 2.5 2.3 Revision: 24-Jan-14 7 Document Number: 36
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