PACKAGE DIMENSIONS.63 (1.6).55 (1.4).35 (.9).28 (.7).31 (.8).47 (1.2) TOP SIDE.12 (.3) FEATURES AllnGaP technology Ultra-miniature Industrial standard footprint Water clear optics Moisture-proof packaging Available in.315 (8mm) width tape on 7 (178mm) diameter.39 () BOTTOM NOTE: Dimensions for all drawings are in inches (mm). CATHODE MARK DESCRIPTION These surface mount lamps are designed to fit industry standard profile and footprint for the ultraminiature chip type 63. The low profile package and 1 viewing angle make this chip type LED ideal for panel illumination, push button lighting and membrane switch applications. ABSOLUTE MAXIMUM RATINGS (T A = 25 C unless otherwise specified) Parameter RED ORANGE YELLOW QTLP6C-R QTLP6C-E QTLP6C-Y Units Continuous Forward Current - I F 3 3 2 ma Peak Forward Current - I F (f = KHz, Duty Factor = 1/1) 16 16 2 ma Reverse Voltage - V R (I R = 1 µa) 5 5 5 V Power Dissipation - P D 85 1 1 mw Operating Temperature - T OPR -4 to +85 C Storage Temperature - T STG -4 to +1 C Lead Soldering Time - T SOL Wave 26 for 5 sec C Reflow 26 for 1 sec 1 of 5 6/14/ 368A
ELECTRICAL / OPTICAL CHARACTERISTICS (TA =25 C) Part Number RED ORANGE YELLOW QTLP6C-R QTLP6C-E QTLP6C-Y Condition Luminous Intensity (mcd) I F = 2mA Minimum 2 2 2 Typical 4 4 4 Forward Voltage (V) I F = 2mA Maximum 2.4 2.8 2.8 Typical 2. 2.1 2.1 Peak Wavelength (nm) 63 62 59 I F = 2mA Spectral Line Half Width (nm) 2 18 15 I F = 2mA Viewing Angle ( ) 1 1 1 I F = 2mA TYPICAL PERFORMANCE CURVES 1 2.5 IF - FORWARD CURRENT (ma) 9 8 7 6 5 4 3 2 1 RELATIVE LUMNOUS INTENSITY (NORMALIZED AT 2 ma) 2. 1.5.5. 1.5 2. 2.5 3. V F - FORWARD VOLTAGE (V) Fig. 1 Forward Current vs. Forward Voltage 1 2 3 4 5 I F - DC FORWARD CURRENT (ma) Fig. 2 Relative Luminous Intensity vs. DC Forward Current 2 of 5 6/14/ 368A
YELLOW ORANGE RED 1 2 3 RELATIVE INTENSITY.5.9.8 4 5 6 55 6 65 7.7 7 8 9.5.3.1.2.4.6 WAVELENGTH - nm Fig. 3 Relative Intensity vs Peak Wavelength REL. LUMINOUS INTENSITY (%) Fig. 4 Radiation Diagram 5 IF - FORWARD CURRENT (ma) 4 3 2 1 RED, ORANGE YELLOW -25 25 5 75 1 AMBIENT TEMPERATURE T A ( C) Fig.5 Forward Current vs. Ambient Temperature 3 of 5 6/14/ 368A
RECOMMENDED PRINTED CIRCUIT BOARD PATTERN.33 (.85).31 (.8).31 (.8).39 () RECOMMENDED IR REFLOW SOLDERING PROFILE 5 sec MAX soldering time 24 C MAX +5 C/s MAX -5 C/s MAX 6-12 sec Preheating 12-15 C MAX 4 of 5 6/14/ 368A
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 2 Fairchild Semiconductor Corporation 5 of 5 6/14/ 368A