NE/SA5090 Addressable relay driver INTEGRATED CIRCUITS. Product data Supersedes data of 1994 Aug 31 File under Integrated Circuits; IC11 Data Handbook

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INTEGRATE CIRCUITS Supersedes data of 1994 Aug 31 File under Integrated Circuits; IC11 ata Handbook 2001 Aug 03

ESCRIPTION The addressable relay driver is a high-current latched driver, similar in function to the 9934 address decoder. The device has 8 open-collector arlington power outputs, each capable of 150 ma load current. The outputs are turned on or off by respectively loading a logic 1 or logic 0 into the device data input. The required output is defined by a 3-bit address. The device must be enabled by a input line which also serves the function of further address decoding. A common clear input,, turns all outputs off when a logic 0 is applied. The device is packaged in a 16-pin plastic IP or SO package. FEATURES 8 high-current outputs Low-loading bus-compatible inputs Power-on clear ensures safe operation Will operate in addressable or demultiplex mode Allows random (addressed) data entry Easily expandable Pin-compatible with 9334 (Philips or Fairchild) PIN CONFIGURATION 1, N Packages A 0 1 2 0 1 2 3 GN 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 V CC 7 6 5 4 TOP VIEW 1. SOL - Released in Large SO package only. Figure 1. Pin Configuration APPLICATIONS Relay driver Indicator lamp driver Triac trigger LE display digit driver Stepper motor driver SL00234 BLOCK IAGRAM Q 1 A 0 Q 2 A 1 A 2 1 OF 8 ECOER CONTROL GATE Q 3 Q 4 Q 5 Q 6 Q 7 INPUT STAGE OUTPUT STAGE V CC SL00235 Figure 2. Block iagram 2001 Aug 03 2 853-0892 26833

PIN ESIGNATION PIN NO. SYMBOL NAME AN FUNCTION 1-3 A 0 -A 2 A 3-bit binary address on these pins defines which of the 8 output latches is to receive the data. 4-7, 9-12 -Q 7 The 8 device outputs. 13 The data input. When the chip is enabled, this data bit is transferred to the defined output such that: 1 turns output switch ON 0 turns output switch OFF 14 The chip enable. When this input is low, the output latches will accept data. When goes high, all outputs will retain their existing state, regardless of address of data input condition. 15 The clear input. When goes low all output switches are turned OFF. The high data input will override the clear function on the addressed latch. ORERING INFORMATION ESCRIPTION TEMPERATURE RANGE ORER COE WG # 16-Pin Plastic Small Outline Large (SOL) Package 0 C to +70 C NE5090 SOT162 1 16-Pin Plastic ual In-Line Package (IP) 0 C to +70 C NE5090N SOT38 4 16-Pin Plastic Small Outline Large (SOL) Package 40 C to +85 C SA5090 SOT162 1 16-Pin Plastic ual In-Line Package (IP) 40 C to +85 C SA5090N SOT38 4 TRUTH TABLE INPUTS OUTPUTS MOE A 0 A 1 A 2 Q 1 Q 2 Q 3 Q 4 Q 5 Q 6 Q 7 L H X X X X H H H H H H H H Clear L L L L L L H H H H H H H H L L H L L L L H H H H H H H L L L H L L H H H H H H H H L L H H L L H L H H H H H H L L L H H H H H H H H H H H L L H H H H H H H H H H H L emultiplex H H X X X X Q N-1 Memory H L L L L L H Q N 1 H L H L L L L Q N 1 H L L H L L Q N 1 H Q N 1 Addressable Latch H L H H L L Q N 1 L Q N 1 H L L H H H Q N 1 H H L H H H H Q N 1 L NOTES: X=on t care condition Q N-1 =Previous output state L=Low voltage level/ ON output state H=High voltage level/ OFF output state 2001 Aug 03 3

ABSOLUTE MAXIMUM RATINGS T amb = 25 C, unless otherwise specified. SYMBOL PARAMETER RATING UNIT V CC Supply voltage 0.5 to +7 V V IN Input voltage 0.5 to +15 V V OUT Output voltage 0 to +30 V I GN Ground current 500 ma I OUT Output current Each output 200 ma P Maximum power dissipation, T amb = 25 C (still-air) 1 N package 1712 mw package 1315 mw T amb Ambient temperature range 0 to +70 C T j Junction temperature 150 C T stg Storage temperature range 65 to +150 C T sld Lead soldering temperature (10 sec. max) 230 C 1. erate above 25 C at the following rates: N package at 13.7 mw/ C package at 10.5 mw/ C C ELECTRICAL CHARACTERISTICS V CC = 4.75 V to 5.25 V; 0 C T amb +70 C, unless otherwise specified. 1 SYMBOL PARAMETER TEST CONITIONS Input voltage LIMITS Min Typ Max V IH High 2.0 V V IL Low 0.8 Output voltage V OL Low I OL = 150 ma, T amb = 25 C 1.05 1.30 V Input current Over temperature 1.50 I IH High V IN = V CC <1.0 10 µa I IL Low V IN = 0 V 3.0 250 I OH Leakage current V OUT = 28 V 5 250 µa Supply current I CCL All outputs low V CC = 5.25 V 35 60 ma I CCH All outputs high 22 50 P Power dissipation No output load 315 mw 1. All typical values are at V CC = 5 V and T amb = 25 C. UNIT 2001 Aug 03 4

SWITCHING CHARACTERISTICS V CC = 5 V; T amb = 25 C; V OUT = 5 V; I OUT = 100 ma; V IL = 0.8 V; V IH = 2.0 V. SYMBOL PARAMETER TO FROM MIN TYP MAX UNIT Propagation delay time t PLH Low-to-high 1 Output 900 1800 ns t PHL High-to-low 1 130 260 t PLH Low-to-high 2 920 1850 t PHL High-to-low 2 Output ata 130 260 ns t PLH Low-to-high 3 900 1800 t PHL High-to-low 3 Output Address 130 260 ns t PLH Low-to-high 4 920 1850 t PHL High-to-low 4 Output ns Switching setup requirements t S(H) Set-up time HIGH Chip enable High data 40 Set-up time LOW Chip enable Low data 50 ns t S(A) Address set-up time Chip enable Address 40 ns t H(H) Hold time HIGH Chip enable High data 10 Hold time LOW Chip enable Low data 10 ns t PW(E) Chip enable pulse width 1 40 ns NOTES: 1. See Turn-On and Turn-Off elays, Enable-to-Output and Enable Pulse Width timing diagram. 2. See Turn-On and Turn-Off elays, ata-to-output timing diagram. 3. See Turn-On and Turn-Off elays, Address-to-Output timing diagram. 4. See Turn-Off elay, Clear-to-Output timing diagram. 5. See Set-up and Hold Time, ata-to-enable timing diagram. 6. See Set-up Time, Address-to-Enable timing diagram. FUNCTIONAL ESCRIPTION This peripheral driver has latched outputs which hold the input date until cleared. The NE5090 has active-low, open-collector outputs, all of which are cleared when power is first applied. This device is identical to the NE590, except the outputs can withstand 28 V. Addressable Latch Function Any given output can be turned on or off by presenting the address of the output to be set or cleared to the three address pins, by holding the input High to turn on the selected output, or by holding it Low to turn off, holding the input High, and bringing the input Low. Once an output is turned on or off, it will remain so until addressed again, or until all outputs are cleared by bringing the input Low while holding the input High. emultiplexer Operation By holding the and inputs Low and the input High, the addressed output will remain on and all other outputs will be off. High Current Outputs The obvious advantage of this device over other drivers such as the 9334 and N74LS259 is the fact that the outputs of the NE5090 are each capable of 200 ma and 28 V. It must be noted, however, that the total power dissipation would be over 2.5 W if all 8 outputs were on together and carrying 200 ma each. Since the total power dissipation is limited by the package to 1 W, and since power dissipation due to supply current is 0.25 W, the total load power dissipation by the device is limited to 0.75 W at room temperature, and decreases as ambient temperature rises. The maximum die junction temperature must be limited to 165 C, and the temperature rise above ambient and the junction temperature are defined as: T R = θ JA P T j = T amb +t R For example, if we are using the NE5090 in a plastic package in an application where the ambient temperature is never expected to rise above 50 C, and the output current at the 8 outputs, when on, are 100, 40, 50, 200, 15, 30, 80, and 10 ma, we find from the graph of output voltage vs load current that the output voltages are expected to be about 0.92, 0.75, 0.78, 1.04, 0.5, 0.7, 0.9, and 0.4 V, respectively. Total device power due to these loads is found to be 473.5 mw. Adding the 200 mw due to the power supply brings total device power dissipation to 723.5 mw. The thermal resistances are 83 C per W for plastic packages. Using the equations above we find: Plastic T R =83 0.7235=60 C Plastic T J =50+60=100 C Thus we find that T J is below the 165 C maximum, and either package could be used in this application. The graphs of total load power versus ambient temperature would also give us this same information, although interpreting the graphs would not yield the same accuracy. 2001 Aug 03 5

TIMING IAGRAMS t PW t PW t PLH t PHL t PLH t PHL Q Q Other Inputs: = H, A = Stable Other Inputs: = I, = H, A = Stable Turn-On and Turn-Off elays, Enable-to-Output and Enable Pulse Width Turn-On and Turn-Off elays, ata-to-output A A t PLH t PHL t PLH Q Q Other Inputs: = L, = L, = H Turn-On and Turn-Off elays, Address-to-Output Turn-Off elays, Clear-to-Output ÉÉÉ ÉÉÉÉÉ ÉÉÉ t SH t HH t SL t HL AÉÉÉÉÉ Q ÉÉ ÉÉÉ t S Other Inputs: = H, A = Stable Other Inputs: = H Set-up and Hold Time, ata-to-enable Figure 3. Timing iagrams Set-up Time, Address-to-Enable SL00236 2001 Aug 03 6

TYPICAL APPLICATIONS + 5V +5V TO 28V µp IQ CONTROL + 5V A 2 A 1 A 0 5090 Q 1 Q 2 Q 3 Q 5 Q 6 Q 7 + 5V A 2 A 1 A 0 5090 ATA BUS Q 1 Q 2 Q 3 Q 5 Q 6 Q 7 4 5090 Q 1 Q 2 Q 3 Q 5 Q 6 Q 7 R L riving Simple Loads +28V RELAY LOA CLEAR +5V +5V +5V A 0, A 1, A 2 may be connected to the address bus if permitted by system design. Interfacing With a Microprocessor System 555 3 BIT COUNTER A 0 A 1 A 2 5090 Q 1 Q 2 Q 3 Q 5 Q 6 Q 7 Operating in emultiplex Mode SL00237 Figure 4. Typical Applications TYPICAL PERFORMAN CHARACTERISTICS Output Voltage vs Load Current Total Load Power vs Temperature 1.2 1.0 OUTPUT VOLTAGE (V) 1.0 0.8 0.6 0 C 25 C 70 C TOTAL LOA POWER (W) 0.75 0.50 0.25 F PACKAGE N PACKAGE 0.4 0 50 100 150 200 OUTPUT LOA CURRENT (ma) 0 25 50 75 100 125 TEMPERATURE ( o C) SL00238 Figure 5. Typical Performance Characteristics 2001 Aug 03 7

SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 2001 Aug 03 8

IP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 2001 Aug 03 9

ata sheet status ata sheet status [1] Product status [2] efinitions Objective data Preliminary data evelopment Qualification This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Production efinitions Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. isclaimers Life support These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. Koninklijke Philips Electronics N.V. 2001 All rights reserved. Printed in U.S.A. ate of release: 12-01 ocument order number: 9397 750 09176 2001 Aug 03 10