Design for Embedded Testing of a LNA

Similar documents
SP 22.3: A 12mW Wide Dynamic Range CMOS Front-End for a Portable GPS Receiver

An Asymmetrical Bulk CMOS Switch for 2.4 GHz Application

RF Integrated Circuits

433MHz front-end with the SA601 or SA620

CHAPTER 4 ULTRA WIDE BAND LOW NOISE AMPLIFIER DESIGN

ALTHOUGH zero-if and low-if architectures have been

Fully integrated CMOS transmitter design considerations

i. At the start-up of oscillation there is an excess negative resistance (-R)

Aspemyr, Lars; Jacobsson, Harald; Bao, Mingquan; Sjöland, Henrik; Ferndal, Mattias; Carchon, G

A High Gain and Improved Linearity 5.7GHz CMOS LNA with Inductive Source Degeneration Topology

CMOS LNA Design for Ultra Wide Band - Review

High Gain Low Noise Amplifier Design Using Active Feedback

Designing a 960 MHz CMOS LNA and Mixer using ADS. EE 5390 RFIC Design Michelle Montoya Alfredo Perez. April 15, 2004

DESIGN ANALYSIS AND COMPARATIVE STUDY OF RF RECEIVER FRONT-ENDS IN 0.18-µM CMOS

Introduction to CMOS RF Integrated Circuits Design

Session 3. CMOS RF IC Design Principles

760 IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 37, NO. 6, JUNE A 0.8-dB NF ESD-Protected 9-mW CMOS LNA Operating at 1.23 GHz

California Eastern Laboratories

RF CMOS 0.5 µm Low Noise Amplifier and Mixer Design

A 2.6GHz/5.2GHz CMOS Voltage-Controlled Oscillator*

Hot Topics and Cool Ideas in Scaled CMOS Analog Design

ISSCC 2006 / SESSION 33 / MOBILE TV / 33.4

Chapter 6. Case Study: 2.4-GHz Direct Conversion Receiver. 6.1 Receiver Front-End Design

Linearization Method Using Variable Capacitance in Inter-Stage Matching Networks for CMOS Power Amplifier

Quiz2: Mixer and VCO Design

Design of a Low Noise Amplifier using 0.18µm CMOS technology

Designing a fully integrated low noise Tunable-Q Active Inductor for RF applications

RF2418 LOW CURRENT LNA/MIXER

A HIGH FIGURE-OF-MERIT LOW PHASE NOISE 15-GHz CMOS VCO

LF to 4 GHz High Linearity Y-Mixer ADL5350

PART MAX2605EUT-T MAX2606EUT-T MAX2607EUT-T MAX2608EUT-T MAX2609EUT-T TOP VIEW IND GND. Maxim Integrated Products 1

Streamlined Design of SiGe Based Power Amplifiers

Low Flicker Noise Current-Folded Mixer

Design of a Current-Mode Class-D Power Amplifier in RF-CMOS

A 2.4 GHZ RECEIVER IN SILICON-ON-SAPPHIRE MICHAEL PETERS. B.S., Kansas State University, 2009 A REPORT

Single-Objective Optimization Methodology for the Design of RF Integrated Inductors

RF/IF Terminology and Specs

A 5 GHz CMOS Low Power Down-conversion Mixer for Wireless LAN Applications

Tutorial 2 Test Techniques for RFIC and Embedded Passives

6.776 High Speed Communication Circuits and Systems Lecture 14 Voltage Controlled Oscillators

DESCRIPTIO FEATURES APPLICATIO S. LT GHz to 2.7GHz Receiver Front End TYPICAL APPLICATIO

RFIC DESIGN EXAMPLE: MIXER

Evaluating and Optimizing Tradeoffs in CMOS RFIC Upconversion Mixer Design. by Dr. Stephen Long University of California, Santa Barbara

1 of 7 12/20/ :04 PM

LINEARIZED CMOS HIGH EFFECIENCY CLASS-E RF POWER AMPLIFIER

Technical Article A DIRECT QUADRATURE MODULATOR IC FOR 0.9 TO 2.5 GHZ WIRELESS SYSTEMS

THE BASIC BUILDING BLOCKS OF 1.8 GHZ PLL

BLUETOOTH devices operate in the MHz

Christopher J. Barnwell ECE Department U. N. Carolina at Charlotte Charlotte, NC, 28223, USA

THE INTERNATIONAL JOURNAL OF SCIENCE & TECHNOLEDGE

Reconfigurable and Simultaneous Dual Band Galileo/GPS Front-end Receiver in 0.13µm RFCMOS

A New Topology of Load Network for Class F RF Power Amplifiers

1 MHz to 2.7 GHz RF Gain Block AD8354

HIGH-GAIN CMOS LOW NOISE AMPLIFIER FOR ULTRA WIDE-BAND WIRELESS RECEIVER

CHAPTER 3 CMOS LOW NOISE AMPLIFIERS

An Inductor-Based 52-GHz 0.18 µm SiGe HBT Cascode LNA with 22 db Gain

Highly Linear GaN Class AB Power Amplifier Design

Downloaded from edlib.asdf.res.in

4-Bit Ka Band SiGe BiCMOS Digital Step Attenuator

RF MEMS for Low-Power Communications

The Design of E-band MMIC Amplifiers

L/S-Band 0.18 µm CMOS 6-bit Digital Phase Shifter Design

ISSCC 2006 / SESSION 11 / RF BUILDING BLOCKS AND PLLS / 11.9

Design and optimization of a 2.4 GHz RF front-end with an on-chip balun

A 25-GHz Differential LC-VCO in 90-nm CMOS

INVENTION DISCLOSURE- ELECTRONICS SUBJECT MATTER IMPEDANCE MATCHING ANTENNA-INTEGRATED HIGH-EFFICIENCY ENERGY HARVESTING CIRCUIT

ETI , Good luck! Written Exam Integrated Radio Electronics. Lund University Dept. of Electroscience

ACMOS RF up/down converter would allow a considerable

Methodology for MMIC Layout Design

A High Level Test Processor and Test Program Generator

A GHz MICROWAVE UP CONVERSION MIXERS USING THE CONCEPTS OF DISTRIBUTED AND DOUBLE BALANCED MIXING FOR OBTAINING LO AND RF (LSB) REJECTION

The Schottky Diode Mixer. Application Note 995

THERE is currently a great deal of activity directed toward

Wafer-scale 3D integration of silicon-on-insulator RF amplifiers

The New England Radio Discussion Society electronics course (Phase 4, cont d) Introduction to receivers

Low-Power RF Integrated Circuit Design Techniques for Short-Range Wireless Connectivity

PRODUCT APPLICATION NOTES

Chapter X Measuring VSWR and Gain in Wireless Systems By Eamon Nash

RF9986. Micro-Cell PCS Base Stations Portable Battery Powered Equipment

High-Linearity CMOS. RF Front-End Circuits

1 MHz to 2.7 GHz RF Gain Block AD8354

ISSCC 2002 / SESSION 17 / ADVANCED RF TECHNIQUES / 17.2

InGaP HBT MMIC Development

Low Cost Mixer for the 10.7 to 12.8 GHz Direct Broadcast Satellite Market

Signal Integrity Design of TSV-Based 3D IC

First Integrated Bipolar RF PA Family for Cordless Telephones

Performance Comparison of RF CMOS Low Noise Amplifiers in 0.18-µm technology scale

1P6M 0.18-µm Low Power CMOS Ring Oscillator for Radio Frequency Applications

ISSCC 2006 / SESSION 20 / WLAN/WPAN / 20.5

Design of the Low Phase Noise Voltage Controlled Oscillator with On-Chip Vs Off- Chip Passive Components.

ISSCC 2003 / SESSION 20 / WIRELESS LOCAL AREA NETWORKING / PAPER 20.5

Surface Mount SOT-363 (SC-70) Package. Pin Connections and Package Marking GND. V dd. Note: Package marking provides orientation and identification.

Highly linear common-gate mixer employing intrinsic second and third order distortion cancellation

Design of low phase noise InGaP/GaAs HBT-based differential Colpitts VCOs for interference cancellation system

A Volterra Series Approach for the Design of Low-Voltage CG-CS Active Baluns

Noise Reduction in Transistor Oscillators: Part 3 Noise Shifting Techniques. cross-coupled. over other topolo-

22. VLSI in Communications

Radio-Frequency Circuits Integration Using CMOS SOI 0.25µm Technology

Quadrature GPS Receiver Front-End in 0.13μm CMOS: The QLMV cell

Lecture 20: Passive Mixers

Transcription:

Design for Embedded Testing of a José Machado da Silva, Gabriel Pinho, José S. Matos Abstract In-circuit testing methodologies are required to tackle the evaluation of embedded radio-frequency circuits. This paper presents design considerations for the test circuitry proposed to implement a methodology for on-chip testing a low-noise amplifier. The scheme being proposed includes an oscillator as the stimulus generator, the re-design of the input switch for test controllability, and an RMS-DC converter to measure the s output power. Simulation results for 1dB compression and third-order intercept points show a good agreement with the expected ones. Index Terms RF, testability and test techniques, low noise amplifier. N I. INTRODUCTION ew on-chip test methodologies are required to tackle the difficulties found when testing the new generation of integrated systems comprising radiofrequency (RF) circuits. This is particularly true at production stages where the test requirements are not as exhaustive as those required at the developing phase. Lower test equipment cost is enabled by partitioning test resources between on-chip and external equipment. However, new highly structured design for testability (DfT) approaches are necessary to improve accessibility to deeply embedded cores including the RF ones [1]. Different methodologies have been proposed addressing the testing of RF front-ends [2 7]. These can be divided in two groups of approaches: - introduction of test resources within each one of the transceiver blocks - treating the entire RF front-end as a single block seen from the base-band input and output elements, after creating a loop-back signal path by connecting the PA output into the input. The techniques in the first group allow diagnosing which blocks in a RF front-end are defective, and to propagate test signals without being affected by the other blocks inserted in the signal path, but imply a higher overhead in test circuitry. The work presented herein has been partly supported by the Portuguese government, Fundação para a Ciência e a Tecnologia, and carried-out under the framework of projects NanoTEST (2A702 - MEDEA+, phase 2) and Network of Excellence IST-1-507893-NOE TARGET (Top Amplifier Research Groups in a European Team). J. Machado da Silva, Gabriel Pinho, and J. S. Matos are with Universidade do Porto, Faculdade de Engenharia, and INESC Porto, Campus FEUP, Rª Dr. Roberto Frias nº 378, 4200-465, Porto, Portugal (phone:+351225081400; fax:+351225081443; e-mail: {jms, gabriel, jsm}@fe.up.pt). On the other hand, the ones in the second group minimize the circuitry overhead but don t allow identifying which block(s) are behaving incorrectly. Furthermore, some architectures and secondary effects, such as an increase in power consumption, may impair the use of loop-back techniques [7]. In [8] techniques to measure different performance characterization parameters of the low-noise amplifier () were presented, which rely both on the inclusion of test auxiliary resources and on reusing the functionality of already existing blocks. One of those techniques consists on applying to the a sequence of stimuli with different amplitudes and measuring the output amplitude for each input level. The obtained set of coordinates (V in, V out ) allows finding the 3 rd order polynomial that best fits the s transfer function, i.e., coefficients a 0, a 1, a 2 and a 3 in (1). 2 3 ν a + a ν + a ν + a ν... (1) out = 0 1 in 2 in 3 in + The input voltages which lead to the 1dB compression (P 1dB ) and third-order intercept (IP 3 ) points are then calculated after the polynomial coefficients using, respectively, and a1 4 A1 db = a 1 1 3a 20 (2) 3 10 4a A 1 IP = (3) 3a3 T/R S T PA O RMS-DC Mixer Mixer Power LO IFA RSSI Fig. 1. Transceiver architecture with s test infrastructure.

To embed this test scheme in the circuit a typology such the one presented in Fig.1 can be used, where an amplitude controlled oscillator is required to generate the different amplitude stimuli. The local oscillator (LO) used in the up-converter (mixer) and the power amplifier (PA) itself, can be used to provide this functionality, provided a loop-back scheme exists to connect the PA output to the input, and a scheme to control the signal amplitude is available. In this case the PA s behaviour has to be taken into account in the characterization of the test stimulus, and eventually the nonlinearities of some PA configurations may impair the viability of this solution due to the higher difficulty in obtaining low amplitude stimuli. This would imply also higher power consumption during testing. To measure the s output power, logarithmic amplifiers could be used to allow for a wide dynamic variation of the signal power to be represented within a limited voltage range. The received signal strength indicator (RSSI) block existing in typical receivers architectures associated to the intermediate frequency (IF) amplifier can also be (re)used for this purpose. But in this case either the mixer behaviour is also included in the measure path, or a switching mechanism has to be included to bypass it. However, as the intermediate frequency is usually much smaller than the s centre frequency, this approach can be compromised. One of the advantages brought in by the second group of test approaches described before relies on the testing interface being made mainly at the baseband frequency, and thus avoids interfering and dealing directly with high frequency signals. In order to include a RF test methodology within the global test strategy of the integrated system, using the same test infrastructure, it is desirable that observation and control be made at low frequencies. The work presented herein addresses the implementation of the method presented in [8], according the scheme shown in Fig.1, i. e., the design of a variable amplitude oscillator (VAO), of the switch to connect it to the input, as well as of the RMS-DC converter to measure the s output power. Section II of the paper introduces the to be tested. Sections III to V describe the oscillator, the switch, and the RMS-DC converter to be included in the circuit for testing purposes. Preliminary simulation results are presented in section VI. Finally concluding remarks are highlighted in section VII. II. THE Fig. 2 shows the scheme of the to be tested. It is a cascode with inductive source degeneration [9] designed with a 0.18 µm MOS technology, tuned at 435MHz, a frequency used in the standard European spectrum for general telemetry and telecommand applications. v i I p M 3 R 3 L 2 R 2 C 3 M 2 M 1 L 3 Fig. 2 MOS used in the simulations. Its nominal characteristics are: input reflection coefficient S 11-35 db, power gain S 21 15dB (Fig. 3), input 1dB compression point P i1db = -10 dbm, and third-order interception point IP 3 = 0.18 dbm. Fig. 3 S11 and S21 parameters of the. One of the critical aspects in RF on-chip implementations concerns the implementation of spiral inductors on silicon, both in terms of the maximum realisable inductance value and quality factor (Q). Values of L from 1nH to 20nH with Q=5 are common with conventional technologies [9]. Q values up to about 16 have been reported using newer technologies which provide a higher number of metal levels, for frequencies above 2GHz [10]. In the present work the model shown in Fig. 4 is used for the inductors considering Q values around 5. L S and R S are, respectively, the spiral inductance and the series resistance, C S models the feed-through pass created between the two terminals due to direct capacitive coupling, C OX is the oxide capacitance between the spiral and the silicon substrate, and R Si represents substrate losses. Although patterned ground

shielding [10] can be used to minimize these losses, it was decided to include them anyway. p i R S C OX R Si C S L S C OX R Si Fig. 4 Inductor model used in the simulations. III. AN AMPLITUDE CONTROLLED OSCILLATOR To implement the test stimulus generator a scheme based on the Colpitts oscillator is proposed, as it is one of the tuned schemes used in RF circuits due to its simplicity. Fig. 5 shows the scheme of the oscillator after being improved with facilities to control the amplitude of the output signal, on/off switching (M 3, M 4 ), and output buffering (M 5 ). The output voltage of the Colpitts oscillator is, in a first approach, proportional to the product of bias current (I B ) and the net tank equivalent resistance R eq (Fig. 5.b). This resistance is actually determined by the inductor s series parasitic resistance and the overall equivalent resistance seen at the LC tank terminals. p o controlled. This way a, more convenient, digital interface is allowed. Transistors M 3 and M 4 operate in switching mode and are used to switch-off the oscillator when the circuit operates in normal mission mode. This facility provides both to avoid power consumption and to create a high impedance output in normal mode (the functionality of switch S T in Fig. 1). Transistor M 5 provides output buffering. The dynamic range required for the oscillator s amplitude is determined by the s gain compression characteristic. The different oscillator s output voltage amplitudes should be distributed with uniform increments below and above the value leading to the 1dB compression point, so that the polynomial (1) that best fits the s transfer function can be found accurately. For the under consideration the P i1db corresponding input voltage value is about 200 mv (-10dBm @ 50 Ω) peak-to-peak. V C M 3 R V M 5 Fig. 6 Oscillator s lowest and highest output levels. M 1 M 2 I B V C V B M 4 a) b) 2I B sinωt Fig. 5 Scheme of the Colpitts based variable amplitude oscillator. C L R eq Fig. 6 shows the oscillator output voltage at the lowest and highest levels which correspond to about -21dBm and -2dBm, respectively, observed at the input. The variable amplitude facility could have been obtained maintaining the oscillator operating with constant amplitude, followed by a variable gain amplifier. This would lead to a larger and, eventually, more power hungry and noisier circuit. Varying I B would provide a more linear amplitude variation then that obtained varying R eq, however, it was found preferable to keep I B constant and to introduce a means to control R eq as a wider variation could be attained, namely down to lower voltage levels. This feature is provided by element R V in Fig. 5.a), which basically is a transistor operating in linear mode controlled by its gate voltage. Being the number and amplitudes of the set of stimuli levels to be applied determined, element RV can actually be implemented by a stack of transistors digitally IV. INPUT SWITCHING The transmit/receive switches used in transceivers circuits are typically implemented using discrete components such as GaAs MESFETs and PIN diodes. Designs using CMOS pass transistors and transmission gates have also been proposed [11], but have the disadvantage of presenting higher insertion loss and nonlinearity. These handicaps can be overcome if transistors are not inserted in the signal path, and are instead used in association with passive devices. A

switch based in this principle is proposed in [12]. However, for frequencies below 1GHz, as Q is lower, the inductance series resistance is responsible for a higher insertion loss which degrades the S 21 parameter. To minimize this effect a switch based on a series resonator is used [13]. Fig. 9 illustrates the waveforms observed at the antenna and inputs, showing that low distortion and low interference are introduced by the input switch, and the VAO. M 1 M 2 IM PA O L 2 VAO Fig. 7 Antenna switch. Fig. 7 shows the scheme of this switch, together with the interface with the VAO and the PA s output switch (IM block provides for impedance matching with the antenna). In receiving mode both M 1 and M 2 are off, leading and to create a series resonator which gives path to the antenna s signal and whose input and output impedances matches the 50 Ω requirement. In this case the oscillator s transistor M 4 is on, leading M 5 to be off and presenting a high impedance output. In test mode both M 1 and M 2 are on, leading and to form a parallel tank resonating at the transmitting frequency that creates an open circuit (actually 230 Ω). (The same happens when the PA operates in transmitting mode.) When the switch is open the oscillator can be switched on to apply the test stimulus to the input. As the switch s output impedance is essentially capacitive, inductor L 2 is included to adapt this impedance to the oscillator. Fig. 8 shows S 11 and S 21 parameters for including the switch in the receiving mode. The switch exhibits an insertion loss of 0.94 db in on mode and 10.5 db isolation in off mode. Fig. 9 Waveforms at the antenna and inputs. V. RMS-DC CONVERTER Fig. 10 shows the scheme of the RMS-DC converter being proposed to detect the s output rms voltage. Basically it is a half-wave rectifier using a diode-connected P-channel MOS transistors in a common N-well. The bias voltage V B is set to allow measurements to be performed even for the lowest voltage levels. As the test is performed using a known waveform it is easy to relate the measured DC voltage with the actual rms voltage value. output M R RMS-DC output V B Fig. 10 Schematic of the RMS-DC converter. Fig. 8 S11 and S21 s parameters, including the switch. The measured rms value would not be correct if the operation reaches deep distortion, but, to perform the proposed test it is not necessary to use to high voltage levels. For the highest voltage levels being used, the output waveform starts to compress first for the negative half-cycles. Due to this fact, to obtain a more accurate measure, the negative half-cycles are captured connecting the rectifier s reference to. A full-wave rectifier would require a more complicated circuit.

VI. TEST SIMULATION RESULTS Using the test circuitry presented before, a sequence of 11 equally spaced voltage levels spanning the entire oscillator dynamic range are generated controlling properly the oscillator. Fig. 11 shows the s power transfer functions obtained observing both the s (*) and the RMS-DC ( ) output voltages, together with the first order ideal characteristic ( ). It can be seen that the values obtained with the RMS-DC converter lead to lower output powers for the higher input voltages. This is due, as said before, to the fact that negative cycles start distorting before the positive ones. Anyway, at the point of 1dB compression this effect is still small allowing a measure of P 1dB to be obtained with a -0.5dB error. Would the positive cycles be detected instead, the curve given by the RMS-DC converter would be above the s true curve with a larger error. Fig. 11 s power transfer characteristic obtained observing its output directly (*), using the RMS-DC detector ( ), and considering only the linear ideal characteristic. VII. CONCLUSIONS Circuits for stimuli generation, switching, and power detection are proposed to implement a method to test a for 1dB compression and third-order interception points. Their development is based on criteria seeking to minimize power consumption and simplicity. Another design driving aspect addresses the facility of controlling the test operation and of observing the output measures using digital or low frequency signals, making it easier to interface this test scheme with general purpose testers. The performance of these circuits is highly dependent on the characteristics of the technology being used, as well as of the operating frequency. This is the case, namely, of the inductors quality factor which can actually be higher at frequencies higher than those considered in this work. This could lead, for example, to opt for another typology to implement the input switch. In spite of the simplicity of the circuits being proposed, good measurement results can be obtained. This concerns namely the RMS-DC converter, which is based on a simple half-wave rectifier. Alternative, eventually more accurate, RMS-DC converters or received signal strength indicator circuits would provide more accurate results at the cost of a much higher complexity and power consumption. Being a controlled oscillator available at the input, the blocks placed after the along the receiver chain can also be tested in sequence. REFERENCES [1] International Technology Roadmap for Semiconductors, 2004 Edition. http://public.itrs.net. [2] Benoît R. Veillette and Gordon W. Roberts, A Built-In Self- Test Strategy for Wireless Communication Systems, Proceedings of the International Test Conference, 1995. [3] E.A. McShane, K. Shenai, B. Blaes, A monolithic RF microsystem in SOI CMOS for low-power operation in radiation-intense environments Proceedings of the IEEE Aerospace Conference, Vol. 5, pp. 421-429, March 2000. [4] D. Lupea, U. Pursche, H.J. Jentschel, Spectral Signature Analysis BIST for RF Front-Ends, Advances in Radio Science, pp. 155-160, Vol.1, 2003. [5] R. Voorakaranam, S. Cherubal, A. Chartterjee, A Signature Test Framework for Rapid Production Testing of RF Circuits, Proceedings of the Design Automation and Test Conference in Europe, 2002. [6] Jerzy Dabrowski, BiST Model for IC RF-Transceiver Front- End, 2003, Proceedings of the 18th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (DFT 03), 2003. [7] S. Ozev, C. Olgaard, A. Orailoglu, Testability Implications in Low-cost Integrated Radio Transceivers: A Bluetooth Case Study, Proceedings of the International Test Conference, 2001. [8] G. Pinho, J. Machado Silva, H. Mendonça, and J. S. Matos, "A Test Methodology to Compute Typical Characterization Parameters ", Proceedings of the XVIII Conference on Design of Circuits and Integrated Systems, November 2004. [9] Thomas H. Lee, The Design of CMOS Radio-frequency Integrated Circuits, Cambridge University Press, 1998. [10] C. Patrick Yue, S. Simon Wong, Design Strategy of On- Chip Inductors for Highly Integrated RF Systems, Proceedings of the Design Automation Conference, 1999. [11] F. Huang, K. O, A 0.5-µm CMOS T/R Switch for 900-MHz Wireless Applications, IEEE Journal of Solid State Circuits, vol. 36, no. 3, pp. 486-492, March 2001. [12] Niranjan A. Talwalkar, C. Patrick Yue, Haitao Gan, and S. Simon Wong, Integrated CMOS Transmit Receive Switch Using LC-Tuned Substrate Bias for 2.4-GHz and 5.2-GHz Applications, IEEE Journal of Solid-state Circuits, Vol. 39, No. 6, Juns 2004. [13] T. Tokumitsu, I. Toyoda, M. Aikawa, Low Voltage High Power T/R Switch MMIC Using LC Resonators, IEEE Microwave and Millimeters-Wave Monolithic Circuits Symposium, pp. 27-30, 1993.