Chulsoon Hwang EMC Laboratory, Missouri University Science and Technology Tel: +1-573-578-7447 4000 Enterprise rd, Rolla, MO 65401 hwangc@mst.edu RESEARCH INTEREST Signal and power integrity of IC/package/PCB system including electromagnetic modeling, time and frequency domain simulation/measurement techniques. WORK EXPERIENCE Assistant Professor Aug 2016 Present Visiting Assistant Research Professor June 2015 Aug 2016 - Analysis of receiver sensitivity degradation caused by digital noise modulation into RF band and its coupling to an antenna in smart-phones - Development of a continuous time invariant equalizer (CTIE) for high speed serial links. - Characterization of high-speed traces in flex printed circuit boards - Analysis of power supply induced jitter for IBIS IC models and PAM4 Senior Engineer July 2012 June 2015 High-speed Interconnect & Advanced Electromagnetic Compatibility Lab., Samsung Electronics Co., Ltd, Suwon, Korea - EM leakage analysis and improved shielding design for a next generation connector. - IC evaluation methodology development from radio frequency interference (RFI) perspective based on equivalent dipole moments and TIS correlations. - Estimation of EMI chamber measurement results due to the IC radiation based on near field to far field transformation techniques. - Project manager for university research collaborations with Missouri S&T, IHPC (Singapore), and several domestic universities. Visiting Scholar July 2011 January 2012 EMC Laboratory, Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, MO, USA - Development of transfer function of power supply induced jitter at CMOS output buffer and design of 0.13um test silicon IC for validation. - Design of capacitance enhanced through-silicon via (TSV) structure for the power vias. - Test IC design for TSV measurements with de-embedding.
- Theoretical analysis and development of target impedance for power distribution network designs Consultant 2008 2010 Silicon Image Inc., Sunnyvale, CA, USA - Simulation and re-design of the HDMI/MHL packages for signal and power integrity. Graduate Research Assistant March 2007 Jun 2012 Terahertz Laboratory, KAIST, Daejon, Korea - Modeling of on-chip power/ground meshed structures for power integrity analysis based on conformal mapping and closed-form expressions. - Modeling and characterization of TSV based 3D stacked DRAM structure in point of signal integrity and power integrity. Stacked DRAM on a silicon interposer is investigated and design guidelines for the silicon interposer are introduced. - Design of on-chip Electromagnetic Bandgap (EBG) structure in silicon IC and interposer based on CMOS decoupling capacitors and on-chip metal interconnects. EDUCATION B.S. Electrical Engineering, KAIST, Daejeon, Korea, 2007 M.S. Electrical Engineering, KAIST, Daejeon, Korea, 2009 Ph. D. Electrical Engineering, KAIST, Daejeon, Korea, 2012 - Dissertation Topic: On-Chip Electromagnetic Bandgap Structures for Suppression of Simultaneous Switching Noise Coupling in On-Chip Power Distribution Networks - Advisor: Prof. Joungho Kim ACADEMIC ACTIVITIES TPC member - IEEE EDAPS Symposium 2015 - IEEE EMC SC5 Power Electronics EMC, Secretary (2016 ~ present) Reviewer - IEEE Transactions on Electromagnetic compatibility (2013 ~ present) - IEEE Transactions on Components, Packaging and Manufacturing Technology (2013 ~ present) - IEEE Microwave and Wireless Components Letters (2016~present) - IEEE International symposium on EMC (2013 ~ present) - IEEE Electrical Design and Advanced Packaging & systems (EDAPS) (2015) - IEEE EMC Magazine (2013 ~ present) TEACHING EXPERIENCE Invited Lecturer
Advanced signal integrity, Graduate course, Missouri S&T, 2015 Fall Lecture title: Power supply induced jitter Invited Tutorial Advanced EMC/SI Design, Samsung Advanced Technology Training Institute, 2015 Feb. 15 Seminar title: Measurement based Simulation Techniques and Examples TEHCHNICAL SKILLS (Skill level: E Expert, I Intermediate) Measurement Instruments: Vector Network Analyzer E, TDR E, Oscilloscope E, Spectrum analyzer E, Microprobing for IC/package/board measurement E Design/Simulation Tools: Agilent ADS E, Ansys HFSS E, Maxwell E, Q3D E, SIwave I, Designer I Cadence Allegro I, APD I, Opus I, Virtuso E, Synopsys HSPICE I, Calibre LVS & DRC E, Star-RC I Programming Language: MATLAB E, C++ I PUBLICATION JOURNALS Chulsoon Hwang, Sunkyu Kong, Takashi Enomoto, Junji Maeshima, Kenji Araki, David Pommerenke, and Jun Fan, Estimation of LCD Modulation Noise Coupling to an Antenna for RF Interference Analysis, to be submitted to IEEE Transactions on Electromagnetic Compatibility. Chulsoon Hwang, Muqi Ouyang, and Jun Fan, Bandwidth Estimation for an Edge Mount SMA Launch Structure in Muti-layer Boards, to be submitted to IEEE Microwave and Wireless Components Letters. Chulsoon Hwang, Brice Achkir, and Jun Fan, Capacitance Enhanced Though-Silicon Via for Power Distribution Networks in 3D-ICs, IEEE Electron Device Letters, vol. 37, No. 4, pp. 478-481, Mar 2016. Chulsoon Hwang, Jae-Deok Lim, Gyu Yeong Cho, Hark-Byeong Park, and Hyun Ho Park, A Novel Shielding Effectiveness Matrix of Small Shield Cans Based on Equivalent Dipole Moments for RF Interference Applications. IEEE Transactions on Electromagnetic Compatibility, vol. 58, No. 3, pp. 766-775, June 2016. Chulsoon Hwang, Hark-Byeong Park, and Hyun Ho Park, A Simple Estimation of TRP and Radiation Pattern for Mobile Antennas Using Planar Near-Field Scanning Method" Microwave and Optical Technology Letters, Vol. 58, No. 6, pp.1437-1443, June 2016. Chulsoon Hwang, Woocheon Park, and Dong Gun Kam, Complex Permittivity Extraction from PCB Stripline Measurement Using Recessed Probe Launch, IEICE Electronics Express, vol. 12, No. 5, Mar 2015. Chulsoon Hwang, Jingook Kim, Brice Achkir, and Jun Fan, Analytical Transfer Functions relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, no. 1, pp.113-125, Jan. 2013. Chulsoon Hwang, Kiyeong Kim, Jun So Pak, and Joungho Kim, Modeling of an On-Chip Power/Ground Meshed Plane Using Frequency Dependent Parameters, Journal of Electromagnetic Engineering and Science, vol. 11, no. 3, pp. 192-200, Sep 2011. Chulsoon Hwang, Yujeong Shim, Kyoungchoul Koo, Myunghoi Kim, Jun So Pak, and Joungho Kim,
An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor, IEEE Microwave and Wireless Components Letters, vol.21, no.8, pp.439-441, Aug. 2011. Chulsoon Hwang, Jaemin Kim, Eakhwan Song, Yujeong Shim, and Joungho Kim, A Wideband and Compact Partial Electromagnetic Bandgap Structure With a Narrow Via Pitch for a Signal Via Shield, IEEE Transactions on Electromagnetic Compatibility, vol.53, no.1, pp.241-244, Feb. 2011. Qian Wang, Novel De-embedding Metrology and Broadband Microprobe Measurement for Through- Silicon Via Pair in Silicon Interposer, submitted to IEEE Transactions on Microwave Theory and Techniques. Baekseok Ko, Joowon Kim, Jaemin Ryoo, Chulsoon Hwang, Junyoung Song, and Soo-Won Kim, Simplified Chip Power Modeling Methodology Without Netlist Information in Early Stage of SoC Design Process, accepted to IEEE Transactions on Components, Packaging and Manufacturing Technology. Baekseok Ko, Joowon Kim, Jaemin Ryoo, Chulsoon Hwang, Chan-Keun Kwon, and Soo-Won Kim, Practical approach to power integrity-driven design process for power-delivery networks IET Circuits, Devices & Systems, Apr. 2016. Jingnan Pan, Hanfeng Wang, Xu Gao, Jun Fan, Chulsoon Hwang, Eakhwan Song, and Hark-Byeong Park, Radio-Frequency Interference Estimation Using Equivalent Dipole-Moment Models and Decomposition Method Based on Reciprocity, IEEE Transactions on Electromagnetic Compatibility, vol. 58, no. 1, pp. 75-84, Feb. 2016. Eakhwan Song, Hark-Byeong Park, Chulsoon Hwang, and Hyun Ho Park, Placement Optimization of Integrated Circuits for Reduced Radio-Frequency Interferences in Mobile Devices, Microwave and Optical Technology Letters, vol. 58, no. 1, pp.31-37, Jan. 2016. Hyun-Ho Park, Chulsoon Hwang, Kyung-Young Jung, and Yong-Bae Park, "Mode Matching Analysis of Via-Plate Capacitance in Multilayer Structures with Finite Plate Thickness, IEEE Transactions on Electromagnetic Compatibility, vol.57, no.5, pp.1188-1196, Oct. 2015 Jingook Kim, Junho Lee, Sunki Cho, Chulsoon Hwang, Changwook Yoon, and Jun Fan, Analytical Probability Density Calculation for Step Pulse Response of a Single-Ended Buffer with Arbitrary Power- Supply Voltage Fluctuations, IEEE Transactions on Circuits and Systems I, July 2014. Seungyoung Ahn, Chulsoon Hwang, and Hyun Ho Park, Optimized shield design for reduction of EMF from wireless power transfer systems IEICE Electronics Express 2014. Myunghoi Kim, Kyoungchoul Koo, Chulsoon Hwang, Yujeong Shim, Jun So Pak, Seungyoung Ahn, and Joungho Kim, Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multi-layer PCBs, IEEE Transaction on Electromagnetic Compatibility, vol. 55, no. 2, pp. 307-314, Apr. 2013. Kiyeong Kim, Chulsoon Hwang, Kyoungchoul Koo, Jonghyun Cho, Heegon Kim, Joungho Kim, Junhoo Lee, Hyungdong Park, and Jun So Pak, Modeling and Analysis of a Power Distribution Network in TSVbased 3D IC including P/G TSVs, On-chip Decoupling Capacitors, and Silicon Substrate Effects, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 12, pp.2057-2070, Dec. 2012.
Myunghoi Kim, Kyoungchoul Koo, Chulsoon Hwang, Yujeong Shim, Joungho Kim, and Jonghoon Kim, A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs, IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 3, pp. 689-695, Jun. 2012. CONFERENCES Chulsoon Hwang, Sunkyu Kong, David Pommerenke, Takashi Enomoto, Junji Maeshima, Kenji Araki, and Jun Fan, Noise Coupling Path Analysis for RF Interference caused by a LCD Noise Modulation, accepted to IEEE International Symposium on Electromagnetic Compatibility. Chulsoon Hwang, Muqi Ouyang, and Jun Fan, A Bandwidth Improvement Technique for An Edge Mount SMA Launch Structure in Multi-layer Boards, accepted to IEEE International Symposium on Electromagnetic Compatibility. Chulsoon Hwang, Kiyeong Kim, Jun So Pak, and Joungho Kim, Protection of a Delay-Locked Loop from Simultaneous Switching Noise Coupling using an On-Chip Electromagnetic Bandgap Structure, in IEEE International Symposium on Electromagnetic Compatibility, pp.544-548, Pittsburgh, PA, 6-10 Aug. 2012. (Best Symposium Paper Finalist) Chulsoon Hwang, Minchul Shin, Jun So Pak, and Joungho Kim, Differential Signal Via Shield with Narrow Via Pitch Partial Electromagnetic Bandgap Structure, in IEEE International Symposium on Electromagnetic Compatibility, Fort Lauderdale, FL, 26-30 July 2010. Chulsoon Hwang, Jaemin Kim, Yujeong Shim, and Joungho Kim, "Analytical modeling of power distribution network with embedded electromagnetic bandgap structure," in IEEE International Symposium on Electromagnetic Compatibility, pp.69-73, Austin, TX, 17-21 Aug. 2009. Chulsoon Hwang, Jongbae Park, Jaemin Kim, Kyoungchoul Koo, and Joungho Kim, "Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-layer Backplane Board," in 2009 20th International Zurich Symposium on Electromagnetic Compatibility, pp.197-200, Zurich, 12-16 Jan. 2009. Jiayi He, Chulsoon Hwang, Gyuyeong Cho, Hark Byeong Park, Bumhee Bae, and Jun Fan, Extracting Characteristic Impedance of a Transmission Line Referenced to a Meshed Ground Plane, accepted to 2016 IEEE International Symposium on Electromagnetic Compatibility. Liang Li, Jingnan Pan, Chulsoon Hwang, Gyuyeong Cho, Hark Byeong Park, Yaojiang Zhang, and Jun Fan, Radio-Frequency Interference Estimation by Reciprocity Theorem with Noise Source Characterized by Huygens's Equivalent Source accepted to 2016 IEEE International Symposium on Electromagnetic Compatibility. Qian Wang, Nicholas Erickson, Jonghyun Cho, Chulsoon Hwang, Francesco de Paulis, Stefano Piersanti, Brice Achkir, Antonio Orlandi, and Jun Fan Electrical Performance Analysis and Modeling Optimization of Test Patterns Used in De-embedding Method for Through Silicon Via (TSV) Pair in Silicon Interposer accepted to 2016 IEEE International Symposium on Electromagnetic Compatibility. Liang Li, Jingnan Pan, Chulsoon Hwang, Gyuyeong Cho, Harkbyeong Park and Jun Fan, Application of Reciprocity Theorem in Radio Frequency Interference Estimation' accepted to 2016 Asia-Pacific
International Symposium on Electromagnetic Compatibility. Li, Jingnan Pan, Chulsoon Hwang, Gyuyeong Cho, Harkbyeong Park, Yaojiang Zhang, and Jun Fan, Measurement validation for radio-frequency interference estimation by reciprocity theorem IEEE International Symposium on Electromagnetic Compatibility 2015. Jingnan Pan, Liang Li, Xu Gao, Jun Fan, Chulsoon Hwang, Gyuyeong Cho, and Harkbyeong Park, Application of dipole-moment model in EMI estimation, IEEE International Symposium on Electromagnetic Compatibility 2015. Liang Li, Jingnan Pan, Chulsoon Hwang, Gyuyeong Cho, Hark Byeong Park, Jun Fan, and YaoJiang Zhang, Near-field Coupling Estimation by Source Reconstruction and Huygens's Equivalence Principle IEEE International Symposium on Electromagnetic Compatibility & Signal Integrity, Mar. 2015. (Best Student paper) Beakseok Ko, Joowon Kim, Jaemin Ryo, Chulsoon Hwang, and Soo-Won Kim, Practical Verification of Power Networks for Smart TV Applications, IEEE Consumer Electronics 2015. Qian Wang, Ketan Shringarpure, Chulsoon Hwang, Siming Pan, Brice Achkir, and Jun Fan, Effectiveness Analysis of De-embedding Method for Typical TSV Pairs in a Silicon Interposer, IEEE EPEPS 2014. Qian Wang, Ketan Shringarpure, Jun Fan, Chulsoon Hwang, Siming Pan, and Brice Achkir, Designing Test Patterns for Effective Measurement of Typical TSV Pairs in a Silicon Interposer, in EMC Tokyo 2014. N. Erickson, K. Shringarpure, J. Fan, B. Achkir, Siming Pan, and Chulsoon Hwang, "De-embedding techniques for transmission lines: An exploration, review, and proposal," in IEEE International Symposium on Electromagnetic Compatibility, pp.840-845, Denver, CO, 5-9 Aug. 2013. Jingook Kim, Dongil Shin, Junho Lee,Sunki Sho, Chulsoon Hwang, and Jun Fan, Statistical BER Analysis due to Supply Voltage Fluctuations at a Single-Ended Buffer, DesignCon, Santa Clara, CA, 2013. Liang Li, Chulsoon Hwang, Tao Wang, Yuzo Takita, Hayato Takeuchi, Kenji Araki, and Jun Fan, Switching-current Measurement for Multiple ICs Sharing a Common Power Island Structure, in IEEE International Symposium on Electromagnetic Compatibility, 6-10 Aug 2012. (Nominated for Best Student paper) Jingook Kim, Chulsoon Hwang, and Seungyoung Ahn, Spatial Distribution of Mutual Inductance between Coils for Wireless Power Transfer, in Proc. of 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), May 18-19, 2012, Seoul, Korea. Sunkyu Kong, Chulsoon Hwang, Kiyeong Kim, Heegon Kim, Leehyuk Park, Unkyoo Park, Jiseong Kim, and Joungho Kim, Analytical model for predicting the electromagnetic fields intensity in wireless power transfer systems, in 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, Hanzhou, China, 12-14 Dec. 2011. Myunghoi Kim, Changwook Yoon, Kyoungchoul Koo, Chulsoon Hwang, Hajin Sung, and Joungho Kim, Suppression of Power/Ground Noise Using Meshed-Planar Electromagnetic Bandgap (MP-EBG) Structure for Ultra-Wideband (UWB) System-in-Package (SiP), in IEEE International Symposium on Electromagnetic Compatibility, Fort Lauderdale, FL, 26-30 July 2010. Minchul Shin, Jongjoo Shim, Jaemin Kim, Jun So Pak, Chulsoon Hwang, Changwook Yoon, Joungho Kim, Hyungsoo Kim, Kunwoo Park, Yongju Kim, "A 6.4Gbps on-chip eye opening monitor circuit for
signal integrity analysis of high speed channel," in IEEE International Symposium on Electromagnetic Compatibility, pp.1-6, Detroit, MI, 18-22 Aug. 2008. PATENT Eakhwan Song, Youngkun Kwon, Wonseob Kim, Harkbyeong Park, Hyunsik Yun, Eun-Seok Hong, Chulsoon Hwang, Passive Equalizer Design for High-speed Digital Signal Transmission, U.S. patent. US9094240, April 21, 2014 Chulsoon Hwnag, Jungsu Ha, Kihyen Kim, Kilsu Go, Wireless charging apparatus, Korea patent, P2013-0064890, June 5, 2013.