Q (quad) Package type descriptive code LQFP32. LQFP (low profile quad flat package) Package body material type. P (plastic) IEC package outline code

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Transcription:

LQFP32 plastic low profile quad flat package; 32 leads; body 7 mm x 7 mm x 1.4 mm 19 July 2017 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code LQFP32 Package type industry code LQFP32 Package style descriptive code LQFP (low profile quad flat package) Package body material type P (plastic) IEC package outline code 136E03 JEDEC package outline code MS-026 Mounting method type S (surface mount) Issue date 9-11-2005 Manufacturer package code SOT358 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 6.9-7 7.1 mm E package width 6.9-7 7.1 mm seated height - - 1.6 1.6 mm 2 package height 1.35-1.4 1.45 mm e nominal pitch - - 0.8 - mm n 2 actual quantity of termination - - 32 -

2. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm c y X 24 17 25 16 Z E e E HE 2 1 ( ) 3 w M θ 32 1 pin 1 index 8 9 b p detail X L L p e b p w M Z D v M D B H D v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT max. mm 1.6 1 2 3 b p c D (1) E (1) e H H E L L p v w y (1) Z (1) D ZD E 0.20 0.05 1.45 1.35 0.25 0.4 0.3 0.18 0.12 7.1 6.9 7.1 6.9 0.8 9.15 8.85 9.15 8.85 1 0.2 0.45 0.25 0.1 0.9 0.5 0.9 0.5 θ o 7 o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT358-1 136E03 MS-026 EUROPEN PROJECTION ISSUE DTE 03-02-25 05-11-09 Fig. 1. Package outline LQFP32 () ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2017. ll rights reserved Package information 19 July 2017 2 / 6

3. Soldering Fig. 2. Reflow soldering footprint for LQFP32 () ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2017. ll rights reserved Package information 19 July 2017 3 / 6

x 6.50 C 1/2 D1 Bx P((N- x)x) solder lands C solder resist occupied area y By P((Ny- 1)x) THD (6x) solder thief 6.50 0.40 (2x) D2 (8x) D1 P((Nx- 1)x) 0.50 2.00 (2x) 45 o direction board MLC750 Fig. 3. Wave soldering footprint for LQFP32 () ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2017. ll rights reserved Package information 19 July 2017 4 / 6

4. Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2017. ll rights reserved Package information 19 July 2017 5 / 6

5. Contents 1. Package summary...1 2. Package outline... 2 3. Soldering... 3 4. Legal information... 5 NXP Semiconductors N.V. 2017. ll rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 July 2017 ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2017. ll rights reserved Package information 19 July 2017 6 / 6

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