AN1995 APPLICATION NOTE Serial Flash Memory Device Marking The market trend is for ever greater package miniaturization. Today s small packages already have very limited space for the device marking. The need to be readable sets a lower limit on the character size. This, along with the upper limit on the printable space, defines the number of characters that can be printed on a given package. This document explains how the package marking for Serial Flash Memory devices is composed, for each type of package, and what type of information can be found in the various marking fields. SO8 NARROW BODY: IN HOUSE ASSEMBLY Table 1. SO8 Narrow Body: Codes MN O7 SO 08.15 JEDEC Figure 1. SO8 Narrow Body: Top-Side Marking DDDDDDDD PYWWT AI09777 On the top-side (Figure 1.), the DDDDDDDD field (8 characters) contains the commercial name of the product. It is truncated if the name is too long for the field length. The remaining fields contain the traceability code, in accordance with the current double-digit coding: The P field (1 character) contains the assembly plant identifier. The T field contains the process technology code. January 2005 1/11
TABLE OF CONTENTS SO8 NARROW BODY: IN HOUSE ASSEMBLY.......................................... 1 Table 1. SO8 Narrow Body: Codes................................................. 1 Figure 1. SO8 Narrow Body: Top-Side Marking........................................ 1 SO8 NARROW BODY: SUBCONTRACTOR ASSEMBLY.................................. 3 Table 2. SO8 Narrow Body: Codes................................................. 3 Figure 2. SO8 Narrow Body: Top-Side Marking........................................ 3 Figure 3. SO8 Narrow Body: Back-Side Marking....................................... 3 SO8 WIDE BODY.................................................................. 4 Table 3. SO8 Wide Body: Codes...................................................4 Figure 4. SO8 Wide Body: Top-Side Marking.......................................... 4 Figure 5. SO8 Wide Body: Back-Side Marking......................................... 4 SO16 WIDE BODY................................................................. 5 Table 4. SO16 Wide Body: Codes.................................................. 5 Figure 6. SO16 Wide Body: Top-Side Marking......................................... 5 MLP 5X6......................................................................... 6 Table 5. MLP 5x6: Codes........................................................ 6 Figure 7. MLP 5x6: Top-Side Marking............................................... 6 MLP 8X6......................................................................... 7 Table 6. MLP 8x6: Codes........................................................ 7 Figure 8. MLP 8x6: Top-Side Marking............................................... 7 TSSOP8: IN HOUSE ASSEMBLY..................................................... 8 Table 7. TSSOP8: Code......................................................... 8 Figure 9. TSSOP8: Top-side Marking................................................ 8 TSSOP8: SUBCONTRACTOR ASSEMBLY............................................. 9 Table 8. TSSOP8: Code......................................................... 9 Figure 10.TSSOP8: Top-side Marking............................................... 9 Figure 11.TSSOP8: Back-side Marking............................................... 9 REVISION HISTORY............................................................... 10 Table 9. Document Revision History............................................... 10 2/11
SO8 NARROW BODY: SUBCONTRACTOR ASSEMBLY Table 2. SO8 Narrow Body: Codes MN O7 SO 08.15 JEDEC Figure 2. SO8 Narrow Body: Top-Side Marking DDDDDDDD PYWWT AI09777 On the top-side (Figure 1.), the DDDDDDDD field (8 characters) contains the commercial name of the product (truncated if the name is too long for the field length). The remaining fields contain the traceability code in accordance with the current double-digit coding. The P field (1 character) contains the assembly plant identifier. The T field contains the process technology code. Figure 3. SO8 Narrow Body: Back-Side Marking AAAAAAA BBBBBBB AI09778 On the back-side (Figure 3.): The A field (7 characters) contains the last seven digits of the die code. The B field (7 characters) contains the first seven digits of the wafer lot number. 3/11
SO8 WIDE BODY Table 3. SO8 Wide Body: Codes MW 6L SO 08 WIDE.208 (EIAJ) Figure 4. SO8 Wide Body: Top-Side Marking DDDDDDDD PP LLL WX COO YWWT B AI09779 On the top-side (Figure 4.): The B field (1 character) contains the ECOPACK level. If this field contains E, the product is Pbfree and RoHS-compliant. The DDDDDDDD field (8 characters) contains the commercial name of the product (truncated if the name is too long for the field length). The remaining fields contain the traceability code in accordance with the current double-digit coding. The PP field (2 characters) contains the assembly plant identifier. The LLL field (3 characters) contains the chronological sequence. The WX field (2 characters) contains the diffusion plant identifier. The COO field (3 characters) contains the country of origin code. The T field contains the process technology code. Figure 5. SO8 Wide Body: Back-Side Marking AAAAAAA BBBBBBB AI09778 On the back-side (Figure 5.): The A field (7 characters) contains the last seven digits of the die code. The B field (7 characters) contains the first seven digits of the wafer lot number. 4/11
SO16 WIDE BODY Table 4. SO16 Wide Body: Codes MF Y7 SO16.30 LARGE JEDEC MS - 013 Figure 6. SO16 Wide Body: Top-Side Marking B CCCC DDDDDDDDDD PPLLL WX COO YWW AI09780 On the top-side (Figure 6.): The B field (1 character) contains the ECOPACK level. If this field contains E, the product is Pbfree and RoHS-compliant. The CCCC field (4 characters) contains additional information (not defined in the present case). The DDDDDDDDDD field (10 characters) contains the commercial name of the product (truncated if the name is too long for the field length). The remaining fields contain the traceability code in accordance with the current double-digit coding. The PP field (2 characters) contains the assembly plant identifier. The LLL field (3 characters) contains the chronological sequence. The WX field (2 characters) contains the diffusion plant identifier. The COO field (3 characters) contains the country of origin code. 5/11
MLP 5X6 Table 5. MLP 5x6: Codes MP 70 VFQFPN 8 6x5x1 PITCH 1.27 Figure 7. MLP 5x6: Top-Side Marking DDDDDDDD PP LLL WX COO YWWT B AI09781 On the top-side (Figure 7.): The B field (1 character) contains the ECOPACK level. If this field contains E, the product is Pbfree and RoHS-compliant. The DDDDDDDD field (8 characters) contains the commercial name of the product eventually truncated if the name is too long for the field length. The remaining fields contain the traceability code in accordance with the current double-digit coding. The PP field (2 characters) contains the assembly plant identifier. The LLL field (3 characters) contains the chronological sequence. The WX field (2 characters) contains the diffusion plant identifier. The COO field (3 characters) contains the country of origin code. The T field contains the process technology code. The, below left of the ST logo, indicates the location of Pin 1. 6/11
MLP 8X6 Table 6. MLP 8x6: Codes ME EP VDFPN 8x6x1 PITCH 1.27 Figure 8. MLP 8x6: Top-Side Marking DDDDDDDD PP LLL WX COO YWWT B AI09781 On the top-side (Figure 8.): The B field (1 character) contains the ECOPACK level. If this field contains E, the product is Pbfree and RoHS-compliant. The DDDDDDDD field (8 characters) contains the commercial name of the product (truncated if the name is too long for the field length). The remaining fields contain the traceability code in accordance with the current double-digit coding. The PP field (2 characters) contains the assembly plant identifier. The LLL field (3 characters) contains the chronological sequence. The WX field (2 characters) contains the diffusion plant identifier. The COO field (3 characters) contains the country of origin code. The T field contains the process technology code. The, below left of the ST logo, indicates the location of Pin 1. 7/11
TSSOP8: IN HOUSE ASSEMBLY Table 7. TSSOP8: Code DW 6P TSSOP 8 BODY 4.4 PITCH 0.65 Figure 9. TSSOP8: Top-side Marking AAAAA PYWW ai10726 On the top-side (Figure 9.): The " " field indicates the location of Pin 1 The "AAAAA" field (5 characters) contains the truncated device reference. The "P" field (1 character) contains the assembly plant identifier (the last character of "PP", the assembly plant identifier) The "Y" field (1 character) contains the last digit of the year during which the parts were manufactured The "WW" field (2 characters) contains the week code (assembly week) 8/11
TSSOP8: SUBCONTRACTOR ASSEMBLY Table 8. TSSOP8: Code DW 6P TSSOP 8 BODY 4.4 PITCH 0.65 Figure 10. TSSOP8: Top-side Marking AAAA BBB ai10727 On the top-side (Figure 10.): The " " field indicates the location of Pin 1 The "AAAA" field (4 characters) contains the truncated device reference. The "BBB" field (3 characters) contains the truncated device reference. Figure 11. TSSOP8: Back-side Marking PPYWW LLL T ai10728 On the back-side (Figure 11.): The "PP" field (2 characters) contains the assembly plant identifier The "Y" field (1 character) contains the last digit of the year during which the parts were manufactured The "WW" field (2 characters) contains the week code (assembly week) The "LLL" field (3 characters) contains the chronological sequence The "T" field contains the process technology code 9/11
REVISION HISTORY Table 9. Document Revision History Date Version Revision Details 29-Jun-2004 1.0 First Issue 12-Jan-2005 2.0 TSSOP8: IN HOUSE ASSEMBLY and TSSOP8: SUBCONTRACTOR ASSEMBLY sections added. 10/11
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