CWDM 10G DFB BOSA The BOSA with CWDM Laser is for the application of 10Gbps analog transmission Features Coaxial Package InGaAsP/InP MQW-DFB Laser Diode Low threshold, high slope efficiency and high output power Operating Case temperature: 0 to +85 Single-mode fiber pigtailed with SC, FC, ST or LC connector Low return loss Applications Long distance digital transmission system Private optical networks Fiber-optic transceiver Cable television system WDM systems Absolute maximum ratings Parameter Symbol Min. Max. Unit Storage Temperature Tstg -40 85 Operating Case Temperature Topr 0 85 Reverse Voltage(LD) VRL --- 2 V Reverse Voltage(PD) VRD --- 20 V Photodiode Forward Current(PD) IFD --- 2 ma Lead Soldering (Temperature)/(Time) --- --- 260/10 /Sec Page 1 of 7
Electrical and optical characteristics - Transmitter *Note2 3 Parameter Symbol Min. Typ. Max. Unit Note Output Optical Power Pf 0.5-2.5 mw CW, Iop=Ith+20mA, Tc=25 8 12 ma at Tc=25 Threshold Current Ith -- 30 ma at Tc=85 Center Wavelength λc λ0-3 λ0 λ0+3 nm CW, Iop=Ith+20mA, Tc=25 Wavelength/Temperature Coefficient Side Mode Suppression Dλ/dT 0.09 nm/oc T = -5oC to 85oC SMSR 30 db CW,Tc=0~85 Operating RatioVoltage Vop 1.3 1.6 V CW, Pop=Pf min Monitor Current Imon 0.1 -- 1.0 ma VR=5V, CW, Pop=Pf min Monitor Dark Current Id -- -- 25 na VRD=5V Monitor Capacitance C 5 7 pf VrP = 5V, f = 1MHz Rise Time Tr --- 35 ps 20%~80%,ER=5dB Relative Intensity Noise RIN -140 db/hz If = 30mA 50MHz 12GHz Bandwidth BW 9 Ith + 36mA Fall Time Tf 45 ps 80%~20%,ER=5dB Tracking Error TE -1.5 -- 1.5 db APC, -0 /+25, +25 /+85 Connector repeatability -1 1 db 20 Single Stage Optical Isolation db 30 Dual Stage Electrical / Optical Specifications - Receiver Description Symbol Min Typ Max Unit Note Operating Wavelength λ 1260 1620 nm Supply Voltage Vcc 2.97 3.3 3.63 V Supply Current Icc 34 45 62 ma RSSI slope ma/ma 0.9 1.0 1.1 ma/ma Sensitivity Sen 17 16 dbm Bandwidth BW 10 GHz Optical cross talk CT -40 db Page 2 of 7 λ =1310nm, PRBS=23 1-1, BER=10-12,ER=5.0, Speed=10.3125G
Pin Assignment Pigtail CWDM 10G DFB-LD BOSA Series TYPE: 5 (GND) PD(+) LD(+) NC LD PD GND PD(+) LD(-) PD(-) LD(-) LD-pin-5 / TYPE: G 1 LD(+) 5 4 NC 2 3 PD(-) TYPE: D 3 4 2 5 1 Vpd 3 PD PIN-TIA-pin-D Vcc 4 1 GND 5 Dout 2 Dout Pigtail Package series series *Note4 B A VIEW A LD(-) PD(-) NC LD(+) (GND) PD(+) B VIEW DOUT + VCC SC/APC GND DOUT - VPd Note4: PIN direction and laser mark can be customized. Pigtail is standard SM fiber; the length also can be customized. Page 3 of 7
TX Pin Order Code *Note5 6 7 Launch A Type B Type C Type D Type E Type F Type G Type H Type 5 This picture is for pluggable, pigtail BIDI chip PIN package direction s reference 6 This picture is suitable for RX Pin direction comparison. 7 The package direction is described as " - " For example "A-B", A is TX chip Pin direction, B is RX chip Pin direction. Page 4 of 7
RX Pin Order Code Pigtail CWDM 10G DFB-LD BOSA Series Receive A Type B Type C Type D Type E Type F Type G Type H Type Page 5 of 7
Ordering information (Standard version) *Note8 Pigtail CWDM 10G DFB-LD BOSA Series Part No Laser type Data rate Transmitter/Receiver TRPDAT15GCDT3ELSEEG CWDM 10G 1270T/1330R TRPDDT15GCAT3ELSEEG CWDM 10G 1330T/1270R Note8: For more ordering information, please refer to nomenclature or contact EOPTOLINK sales. TRP - A B C D E F G H I J K L M N O P Q R Code Parameter Detailed Description A Laser Type D=DFB LD B Launch Wavelength A=1270 B=1290 C=1310 D=1330 C Launch Data rate T=10Gbps D Output Power 08=0.5~0.99 15=1~1.59mW 25=1.6~2.99mW E TX Pin Type G=LD-pin-5 F TX Chip Type C G Receiver Wavelength A=1270 D=1330 H Receiver Data rate T=10Gbps I Receiver Voltage 3=3V J RX Pin Type E= pin-e K RX Chip Type L L Connector F=FC/PC S= SC/PC T=ST/PC L=LC/PC FA=FC/APC SA= SC/APC N=without connector M TX Pin Package Direction A B C D E F G H N RX Pin Package Direction A B C D E F G H O RX TO Insulated With Shell Blank= Insulation N=NO Insulation P Isolator Blank=None G=withⅠ G2=withⅡ Q Fiber diameter Blank=SM White M=MM White B=SM Blue Y=SM Yellow R Fibre length Blank=50cm 035=35cm 100=100cm XXX=Customized Precaution (1) The modules should be handled in the same manner as ordinary semiconductor devices to prevent the electro-static damages. For safe keeping and carrying, the modules should be packaged with ESD proof material. To assemble the modules on PCB, the workbench, the soldering iron and the human body should be grounded. Page 6 of 7
(2) Please pay special attention to the atmosphere condition because the dew on the module may cause some electrical damages. (3) Under such a strong vibration environment as in automobile, the performance and reliability are not guaranteed. Obtaining Document You can visit our website: http://www.eoptolink.com Or contact listed at the end of the documentation to get the latest documentation. Revision History Verision Initiated Reviewed Approved Release Date Yinchun, Zhao Kelly.Cao 2011--6-11 Notice: Eoptolink reserves the right to make changes or discontinue any product or service identified in this publication, without notice, in order to improve design and/or performance. Applications that are described herein for any of the products are for illustrative purposes only. Eoptolink makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Contact: Add: Floor 5 Building 2 No. 21 Gaopeng Avenue High-Tech District CHENGDU, SICHUAN 610041 P.R. CHINA Tel: (+86) 028-85122709 ext 816 & 809 Fax: (+86) 028-85121912 Postal: 610041 E-mail:sales@eoptolink.com http://www.eoptolink.com Page 7 of 7