Bridgelux SMD W 9V Gen 2

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Bridgelux SMD 5050 5W 9V Gen 2 Product Data Sheet DS71 BXEP-27X 30X 35X 40X 45X 50X 57X 65X

Introduction SMD 5050 The Bridgelux SMD 5050 Gen2 high power LED is hot-color targeted, which ensures that the LEDs fall within their specified color bin at the typical application conditions of 85 C. With its broad lumen coverage and wide range of CCT options, the SMD 5050 provides unparalleled design-in flexibility for indoor and outdoor lighting applications. The SMD 5050 is ideal as a drop-in replacement for emitters with an industry standard 5.0mm x 5.0mm footprint. Features Industry-standard 5050 footprint 3 bin color control enables tight color control Hot-color targeting ensures that color is within the ANSI bin at the typical application conditions of 85 C Enables 3- and 5-step MacAdam ellipse custom binning kits RoHS compliant and lead free Multiple CCT configurations for a wide range of lighting applications Benefits Lower operating and manufacturing cost Ease of design and rapid go-to-market Uniform consistent white light Reliable and constant white point Environmentally friendly, complies with standards Design flexibility

Contents Product Feature Map 2 Product Nomenclature 2 Product Test Conditions 2 Product Selection Guide 3 Performance at Commonly Used Drive Currents 5 Electrical Characteristics 8 Absolute Maximum Ratings 9 Product Bin Definitions 10 Performance Curves 13 Typical Radiation Pattern 16 Typical Color Spectrum 17 Mechanical Dimensions 18 Reliability 19 Reflowing Characteristics 20 Packaging 21 Design Resources 23 Precautions 23 Disclaimers 23 About Bridgelux 24 1

Product Feature Map Bridgelux SMD LED products come in industry standard package sizes and follow ANSI binning standards. These LEDs are optimized for cost and performance, helping to ensure highly competitive system lumen per dollar performance while addressing the stringent efficacy and reliability standards required for modern lighting applications. Yellow phosphor Light Emitting Surface (LES) Cathode Mark Product Nomenclature The part number designation for Bridgelux SMD 5050 is explained as follows: 1 2 3 4 5 6 7 8 9 10 11 12 1314 15 16 BXEP 30 E 4 3 5 09 B 00 00 o Product Family Nominal CCT 27 = 2,700K 30 = 3,000K 35 = 3,500K 40 = 4,000K 45 = 4,500K 50 = 5,000K 57 = 5,700K 65 = 6,500K Minimum CRI C = 70 CRI E = 80 CRI G = 90 CRI Flux Bins Product Version Typical Forward Voltage Power 5 = 4.4W Die count in series Die count in parallel Color Bin Options Forward Voltage Bins Product Test Conditions Bridgelux SMD 5050 Gen2 LEDs are tested and binned with a 10ms pulse of 500mA at T j (junction temperature)= (solder point temperature) =25 C. Forward voltage and luminous flux are binned at a T j = =25 C, while color is hot targeted at a of 85 C. 2

Product Selection Guide The following product configurations are available: Table 1: Selection Guide, Pulsed Measurement Data at 500mA (T j = =25 C) Part Number 1,6 Nominal CCT 2 (K) CRI 3, 5 Nominal Drive Current (ma) Forward Voltage 4, 5 (V) Min Typical Max Typical Pulsed Flux (lm) 4, 5 Typical Power (W) Typical Efficacy (lm/w) BXEP-27C-435-09B-00-00-0 2700 70 500 8.5 8.9 10 694 4.5 156 BXEP-27E-435-09B-00-00-0 2700 80 500 8.5 8.9 10 631 4.5 142 BXEP-27G-435-09B-00-00-0 2700 90 500 8.5 8.9 10 543 4.5 122 BXEP-30C-435-09B-00-00-0 3000 70 500 8.5 8.9 10 712 4.5 160 BXEP-30E-435-09B-00-00-0 3000 80 500 8.5 8.9 10 647 4.5 145 BXEP-30G-435-09B-00-00-0 3000 90 500 8.5 8.9 10 556 4.5 125 BXEP-35C-435-09B-00-00-0 3500 70 500 8.5 8.9 10 729 4.5 164 BXEP-35E-435-09B-00-00-0 3500 80 500 8.5 8.9 10 663 4.5 149 BXEP-40C-435-09B-00-00-0 4000 70 500 8.5 8.9 10 747 4.5 168 BXEP-40E-435-09B-00-00-0 4000 80 500 8.5 8.9 10 679 4.5 153 BXEP-45C-435-09B-00-00-0 4500 70 500 8.5 8.9 10 747 4.5 168 BXEP-45E-435-09B-00-00-0 4500 80 500 8.5 8.9 10 679 4.5 153 BXEP-50C-435-09B-00-00-0 5000 70 500 8.5 8.9 10 747 4.5 168 BXEP-50E-435-09B-00-00-0 5000 80 500 8.5 8.9 10 679 4.5 153 BXEP-57C-435-09B-00-00-0 5700 70 500 8.5 8.9 10 744 4.5 167 BXEP-57E-435-09B-00-00-0 5700 80 500 8.5 8.9 10 676 4.5 152 BXEP-65C-435-09B-00-00-0 6500 70 500 8.5 8.9 10 744 4.5 167 BXEP-65E-435-09B-00-00-0 6500 80 500 8.5 8.9 10 676 4.5 152 Notes for Table 1 : 1. The last 7 characters (including hyphens - ) refer to flux bins, forward voltage bins, and color bin options, respectively. 00-00-0 denotes the full distribution of flux, forward voltage, and 7 SDCM color. Example: BXEP-30E-435-09B-00-00-0 refers to the full distribution of flux, forward voltage, and color within a 3000K 7-step ANSI standard chromaticity region with a minimum of 80CRI, 4x3 die configuration, 4.4w power, 8.9V typical forward voltage. 2. Product CCT is hot targeted at = 85 C. Nominal CCT as defined by ANSI C78.377-2011. 3. Listed CRIs are minimum values and include test tolerance. 4. Products tested under pulsed condition (10ms pulse width) at nominal drive current where T =T =25 C. j sp 5. Bridgelux maintains a ±7.5% tolerance on luminous flux measurements, ±0.1V tolerance on forward voltage measurements, and ±2 tolerance on CRI measurements for the SMD 5050 Gen2. 6. Refer to Table 6 and Table 7 for Bridgelux SMD 5050 Gen2 Luminous Flux Binning and Forward Voltage Binning information. 3

Product Selection Guide The following product configurations are available: Table 2: Selection Guide, Stabilized DC Performance (T sp = 85 C)6,7 Part Number 1,5 Nominal Drive Forward Voltage 4 Nominal CCT 2 CRI (K) Current (V) Typical DC Flux Typical Power Typical Efficacy (lm) (ma) (W) (lm/w) Min Typical Max BXEP-27C-435-09B-00-00-0 2700 70 500 8.2 8.6 9.7 616 4.3 143 BXEP-27E-435-09B-00-00-0 2700 80 500 8.2 8.6 9.7 560 4.3 130 BXEP-27G-435-09B-00-00-0 2700 90 500 8.2 8.6 9.7 482 4.3 111 BXEP-30C-435-09B-00-00-0 3000 70 500 8.2 8.6 9.7 632 4.3 146 BXEP-30E-435-09B-00-00-0 3000 80 500 8.2 8.6 9.7 574 4.3 133 BXEP-30G-435-09B-00-00-0 3000 90 500 8.2 8.6 9.7 493 4.3 114 BXEP-35C-435-09B-00-00-0 3500 70 500 8.2 8.6 9.7 647 4.3 150 BXEP-35E-435-09B-00-00-0 3500 80 500 8.2 8.6 9.7 588 4.3 136 BXEP-40C-435-09B-00-00-0 4000 70 500 8.2 8.6 9.7 663 4.3 153 BXEP-40E-435-09B-00-00-0 4000 80 500 8.2 8.6 9.7 602 4.3 139 BXEP-45C-435-09B-00-00-0 4500 70 500 8.2 8.6 9.7 663 4.3 153 BXEP-45E-435-09B-00-00-0 4500 80 500 8.2 8.6 9.7 602 4.3 139 BXEP-50C-435-09B-00-00-0 5000 70 500 8.2 8.6 9.7 663 4.3 153 BXEP-50E-435-09B-00-00-0 5000 80 500 8.2 8.6 9.7 602 4.3 139 BXEP-57C-435-09B-00-00-0 5700 70 500 8.2 8.6 9.7 660 4.3 153 BXEP-57E-435-09B-00-00-0 5700 80 500 8.2 8.6 9.7 600 4.3 139 BXEP-65C-435-09B-00-00-0 6500 70 500 8.2 8.6 9.7 660 4.3 153 BXEP-65E-435-09B-00-00-0 6500 80 500 8.2 8.6 9.7 600 4.3 139 Notes for Table 2: 1. The last 7 characters (including hyphens - ) refer to flux bins, forward voltage bins, and color bin options, respectively. 00-00-0 denotes the full distribution of flux, forward voltage, and 7 SDCM color. Example: BXEP-30E-435-09B-00-00-0 refers to the full distribution of flux, forward voltage, and color within a 3000K 7-step ANSI standard chromaticity region with a minimum of 80CRI, 4x3 die configuration, 4.4w power, 8.9V typical forward voltage. 2. Product CCT is hot targeted at = 85 C. Nominal CCT as defined by ANSI C78.377-2011. 3. Listed CRIs are minimum values and include test tolerance. 4. Bridgelux maintains a ±7.5% tolerance on luminous flux measurements, ±0.1V tolerance on forward voltage measurements, and ±2 tolerance on CRI measurements for the SMD 5050 Gen2. 5. Refer to Table 6 and Table 7 for Bridgelux SMD 5050 Gen2 Luminous Flux Binning and Forward Voltage Binning information. 6. Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance. 7. Typical performance is estimated based on operation under DC (direct current) with LED emitter mounted onto a heat sink with thermal interface material and the solder point temperature maintained at 85 C. Based on Bridgelux test setup, values may vary depending on the thermal design of the luminaire and/or the exposed environment to which the product is subjected. 4

Performance at Commonly Used Drive Currents SMD 5050 LEDs are tested to the specifications shown using the nominal drive currents in Table 1. SMD 5050 may also be driven at other drive currents dependent on specific application design requirements. The performance at any drive current can be derived from the current vs. voltage characteristics shown in Figure 2 and the relative luminous flux vs. current characteristics shown in Figure 3. The performance at commonly used drive currents is summarized in Table 3. Table 3: Performance at Commonly Used Drive Currents Part Number CRI BXEP-27C-435-09B-00-00-0 70 BXEP-27E-435-09B-00-00-0 80 BXEP-27G-435-09B-00-00-0 90 BXEP-30C-435-09B-00-00-0 70 BXEP-30E-435-09B-00-00-0 80 BXEP-30G-435-09B-00-00-0 90 Drive Current 1 (ma) Typical V f = 25 C (V) Typical Power = 25 C (W) Typical Pulsed Flux 2 = 25 C (lm) Typical DC Flux 3 = 85 C (lm) Typical Efficacy = 25 C (lm/w) 125 8.1 1.0 186 153 184 250 8.4 2.1 365 294 174 375 8.7 3.2 535 425 165 500 8.9 4.5 694 616 156 640 9.2 5.9 864 669 147 960 9.6 9.3 1206 901 130 125 8.1 1.0 169 139 168 250 8.4 2.1 332 267 159 375 8.7 3.2 486 387 150 500 8.9 4.5 631 560 142 640 9.2 5.9 786 608 134 960 9.6 9.3 1096 819 118 125 8.1 1.0 146 119 144 250 8.4 2.1 286 230 136 375 8.7 3.2 419 333 129 500 8.9 4.5 543 482 122 640 9.2 5.9 676 523 115 960 9.6 9.3 943 705 102 125 8.1 1.0 191 156 189 250 8.4 2.1 375 302 179 375 8.7 3.2 549 436 169 500 8.9 4.5 712 632 160 640 9.2 5.9 886 686 151 960 9.6 9.3 1237 924 134 125 8.1 1.0 174 142 172 250 8.4 2.1 341 274 163 375 8.7 3.2 499 396 154 500 8.9 4.5 647 574 145 640 9.2 5.9 806 624 137 960 9.6 9.3 1124 840 121 125 8.1 1.0 149 122 148 250 8.4 2.1 293 236 140 375 8.7 3.2 429 341 132 500 8.9 4.5 556 493 125 640 9.2 5.9 692 536 118 960 9.6 9.3 966 722 104 Notes for Table 3: 1. Alternate drive currents in Table 3 are provided for reference only and are not a guarantee of performance. 2. Bridgelux maintains a ± 7.5% tolerance on flux measurements. 3. Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance. 5

Performance at Commonly Used Drive Currents Table 3: Performance at Commonly Used Drive Currents (Continued) Part Number CRI BXEP-35C-435-09B-00-00-0 70 BXEP-35E-435-09B-00-00-0 80 BXEP-40C-435-09B-00-00-0 70 BXEP-40E-435-09B-00-00-0 80 BXEP-45C-435-09B-00-00-0 70 BXEP-45E-435-09B-00-00-0 80 Drive Current 1 (ma) Typical V f = 25 C (V) Typical Power = 25 C (W) Typical Pulsed Flux 2 = 25 C (lm) Typical DC Flux 3 = 85 C (lm) Typical Efficacy = 25 C (lm/w) 125 8.1 1.0 196 160 194 250 8.4 2.1 384 309 183 375 8.7 3.2 562 447 173 500 8.9 4.5 729 647 164 640 9.2 5.9 908 703 155 960 9.6 9.3 1266 946 137 125 8.1 1.0 178 146 176 250 8.4 2.1 349 281 167 375 8.7 3.2 511 406 157 500 8.9 4.5 663 588 149 640 9.2 5.9 825 639 141 960 9.6 9.3 1152 860 124 125 8.1 1.0 201 164 199 250 8.4 2.1 393 317 188 375 8.7 3.2 576 458 177 500 8.9 4.5 747 663 168 640 9.2 5.9 930 720 159 960 9.6 9.3 1298 969 140 125 8.1 1.0 182 149 180 250 8.4 2.1 357 288 171 375 8.7 3.2 523 416 161 500 8.9 4.5 679 602 153 640 9.2 5.9 845 654 144 960 9.6 9.3 1180 881 127 125 8.1 1.0 201 164 199 250 8.4 2.1 393 317 188 375 8.7 3.2 576 458 177 500 8.9 4.5 747 663 168 640 9.2 5.9 930 720 159 960 9.6 9.3 1298 969 140 125 8.1 1.0 182 149 180 250 8.4 2.1 357 288 171 375 8.7 3.2 523 416 161 500 8.9 4.5 679 602 153 640 9.2 5.9 845 654 144 960 9.6 9.3 1180 881 127 Notes for Table 3: 1. Alternate drive currents in Table 3 are provided for reference only and are not a guarantee of performance. 2. Bridgelux maintains a ± 7.5% tolerance on flux measurements. 3. Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance. 6

Performance at Commonly Used Drive Currents Table 3: Performance at Commonly Used Drive Currents (Continued) Part Number CRI BXEP-50C-435-09B-00-00-0 70 BXEP-50E-435-09B-00-00-0 80 BXEP-57C-435-09B-00-00-0 70 BXEP-57E-435-09B-00-00-0 80 BXEP-65C-435-09B-00-00-0 70 BXEP-65E-435-09B-00-00-0 80 Drive Current 1 (ma) Typical V f = 25 C (V) Typical Power = 25 C (W) Typical Pulsed Flux 2 = 25 C (lm) Typical DC Flux 3 = 85 C (lm) Typical Efficacy = 25 C (lm/w) 125 8.1 1.0 201 164 199 250 8.4 2.1 393 317 188 375 8.7 3.2 576 458 177 500 8.9 4.5 747 663 168 640 9.2 5.9 930 720 159 960 9.6 9.3 1298 969 140 125 8.1 1.0 182 149 180 250 8.4 2.1 357 288 171 375 8.7 3.2 523 416 161 500 8.9 4.5 679 602 153 640 9.2 5.9 845 654 144 960 9.6 9.3 1180 881 127 125 8.1 1.0 200 163 198 250 8.4 2.1 392 315 187 375 8.7 3.2 574 456 177 500 8.9 4.5 744 660 167 640 9.2 5.9 926 717 158 960 9.6 9.3 1293 966 140 125 8.1 1.0 182 149 180 250 8.4 2.1 356 286 170 375 8.7 3.2 521 414 161 500 8.9 4.5 676 600 152 640 9.2 5.9 842 652 143 960 9.6 9.3 1174 877 127 125 8.1 1.0 200 163 198 250 8.4 2.1 392 315 187 375 8.7 3.2 574 456 177 500 8.9 4.5 744 660 167 640 9.2 5.9 926 717 158 960 9.6 9.3 1293 966 140 125 8.1 1.0 182 149 180 250 8.4 2.1 356 286 170 375 8.7 3.2 521 414 161 500 8.9 4.5 676 600 152 640 9.2 5.9 842 652 143 960 9.6 9.3 1174 877 127 Notes for Table 3: 1. Alternate drive currents in Table 3 are provided for reference only and are not a guarantee of performance. 2. Bridgelux maintains a ± 7.5% tolerance on flux measurements. 3. Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance. 7

Electrical Characteristics Table 4: Electrical Characteristics Part Number 1 Drive Current (ma) Forward Voltage (V) 2,3 Minimum Typical Maximum Typical Temperature Coefficient of Forward Voltage V f / T (mv/ºc) Typical Thermal Resistance Junction to Solder Point 4 R j-sp (ºC/W) BXEP-xxx-435-09B-00-00-0 500 8.5 8.9 10-4.3 1.9 Notes for Table 4: 1. The last 7 characters (including hyphens - ) refer to flux bins, forward voltage bins, and color bin options, respectively. 00-00-0 denotes the full distribution of flux, forward voltage, and 7 SDCM color. Example: BXEP-30E-435-09B-00-00-0 refers to the full distribution of flux, forward voltage, and color within a 3000K 7-step ANSI standard chromaticity region with a minimum of 80CRI, 4x3 die configuration, 4.4w power, 8.9V typical forward voltage. 2. Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements. Voltage minimum and maximum values at the nominal drive current are guaranteed by 100% test. 3. Products tested under pulsed condition (10ms pulse width) at nominal drive current where = 25 C. 4. Thermal resistance value was calculated using total electrical input power; optical power was not subtracted from input power. 8

Absolute Maximum Ratings Table 5: Maximum Ratings Parameter Maximum Rating LED Junction Temperature (T j ) 125 C Storage Temperature -40 C to +105 C Operating Solder Point Temperature (T Sp ) -40 C to +105 C Soldering Temperature 260 C or lower for a maximum of 10 seconds Maximum Drive Current 1 960 ma Maximum Peak Pulsed Forward Current 2 1200 ma Maximum Reverse Voltage Bridgelux LEDs are not designed to be driven in reverse bias Moisture Sensitivity Rating MSL 3 Electrostatic Discharge 2kV HBM. JEDEC-JS-001-HBM and JEDEC-JS-001-2012 Notes for Table 5: 1. The condition of the maximum drive current is limited, Figure 7 can be reference. 2. Bridgelux recommends a maximum duty cycle of 10% and pulse width of 10 ms when operating LED SMD at maximum peak pulsed current specified. Maximum peak pulsed current indicate values where LED SMD can be driven without catastrophic failures. 3. The maximum drive current for LM80 test results is based on 120% nominal drive current listed. 9

Product Bin Definitions Table 6 lists the standard photometric luminous flux bins for Bridgelux SMD 5050 LEDs. Although several bins are listed, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all CCTs. Table 6: Luminous Flux Bin Definitions at 500mA, =25 C Bin Code Minimum Maximum Unit Condition A7 470 505 A8 505 545 A9 545 590 B1 590 635 B2 635 685 B3 685 740 B4 740 800 B5 800 865 lm I F =500mA Note for Table 6: 1. Bridgelux maintains a tolerance of ± 7.5% on luminous flux measurements. Table 7: Forward Voltage Bin Definition at 500mA, =25 C Bin Code Minimum Maximum Unit Condition CD 8.5 9.0 CE 9.0 9.5 CF 9.5 10.0 V I F =500mA Note for Table 7: 1. Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements. 10

Product Bin Definitions Table 8: 3- and 5-step MacAdam Ellipse Color Bin Definitions CCT Color Space X Center Point Y Major Axis Minor Axis Ellipse Rotation Angle Color Bin 2700K 3000K 3500K 4000K 4500K 5000K 5700K 6500K 3 SDCM 0.4578 0.4101 0.00810 0.00420 53.70 3 5 SDCM 0.4578 0.4101 0.01350 0.00700 53.70 5 3 SDCM 0.4338 0.4030 0.00834 0.00408 53.22 3 5 SDCM 0.4338 0.4030 0.01390 0.00680 53.22 5 3 SDCM 0.4103 0.3961 0.00927 0.00414 54.00 3 5 SDCM 0.4103 0.3961 0.01545 0.00690 54.00 5 3 SDCM 0.3818 0.3797 0.00939 0.00402 53.72 3 5 SDCM 0.3818 0.3797 0.01565 0.00670 53.72 5 3 SDCM 0.3611 0.3658 0.00756 0.00338 57.58 3 5 SDCM 0.3611 0.3658 0.01260 0.00563 57.58 5 3 SDCM 0.3447 0.3553 0.00822 0.00354 59.62 3 5 SDCM 0.3447 0.3553 0.01370 0.00590 59.62 5 3 SDCM 0.3287 0.3417 0.00746 0.00320 59.09 3 5 SDCM 0.3287 0.3417 0.01243 0.00533 59.09 5 3 SDCM 0.3123 0.3282 0.00669 0.00285 58.57 3 5 SDCM 0.3123 0.3282 0.01115 0.00475 58.57 5 Notes for Table 8: 1. Color binning at =85 C 2. Bridgelux maintains a tolerance of ± 0.007 on x and y color coordinates in the CIE 1931 color space. 11

Product Bin Definitions Figure 1: C.I.E. 1931 Chromaticity Diagram (3 Color Bin Structure, hot-color targeted at =85 C) 12

Performance Curves Figure 2: Drive Current vs. Voltage ( =25 C) 1000 900 800 Forward Current (ma) 700 600 500 400 300 200 100 0 7.5 8.0 8.5 9.0 9.5 10.0 Forward Voltage (V) Figure 3: Typical Relative Luminous Flux vs. Drive Current ( =25 C) Relative Luminous Flux 200% 180% 160% 140% 120% 100% 80% 60% 40% 20% 0% 0 200 400 600 800 1000 Forward Current (ma) Note for Figure 3: 1. Bridgelux does not recommend driving high power LEDs at low currents. Doing so may produce unpredictable results. Pulse width modulation (PWM) is recommended for dimming effects. 13

Performance Curves Figure 4: Typical Relative DC Flux vs. Solder Point Temperature Relative Flux 105% 100% 95% 90% 85% Warm White Neutral White Cool White 25 pulse 80% 75% 0 25 50 75 100 125 Tsp ( C) Figure 5: Typical DC ccx Shift vs. Solder Point Temperature ccx shift 0.002 0.000-0.002-0.004-0.006-0.008 Warm White Neutral White Cool White 25 pulse -0.010-0.012-0.014 0 25 50 75 100 125 Tsp ( C) Notes for Figures 4 & 5: 1. Characteristics shown for warm white based on 2700K and 80 CRI. 2. Characteristics shown for neutral white based on 4000K and 80 CRI. 3. Characteristics shown for cool white based on 5700K and 80 CRI. 4. For other color SKUs, the shift in color will vary. Please contact your Bridgelux Sales Representative for more information. 14

Performance Curves Figure 6: Typical DC ccy Shift vs. Solder Point Temperature ccy shift 0.005 0.000-0.005-0.010 Warm White Neutral White Cool White 25 pulse -0.015-0.020 0 25 50 75 100 125 Tsp ( C) Notes for Figure 6: 1. Characteristics shown for warm white based on 2700K and 80 CRI. 2. Characteristics shown for neutral white based on 4000K and 80 CRI. 3. Characteristics shown for cool white based on 5700K and 80 CRI. 4. For other color SKUs, the shift in color will vary. Please contact your Bridgelux Sales Representative for more information. Figure 7: Drive Current Derating Curve 1,200 1,000 Forward Current (ma) 800 640 600 400 200 0 Max drive current 105 Max drive current 0 10 20 30 40 50 60 70 80 90 100 110 Tsp ( ) 15

Typical Radiation Pattern Figure 8: Typical Spatial Radiation Pattern at 500mA, =25 C 100% 90% 80% 70% Relative Intensity 60% 50% 40% 30% 20% 10% 0% -90-75 -60-45 -30-15 0 15 30 45 60 75 90 Angular Displacement (⁰) Notes for Figure 8: 1. Typical viewing angle is 116 ⁰. 2. The viewing angle is defined as the off axis angle from the centerline where luminous intensity (Iv) is ½ of the peak value. Figure 9: Typical Polar Radiation Pattern at 500mA, =25 C 16

Typical Color Spectrum Figure 10: Typical Color Spectrum 100.00% 2700K 90.00% 4000K 80.00% 5700K 70.00% 60.00% 50.00% 40.00% 30.00% 20.00% 10.00% 0.00% 400 450 500 550 600 650 700 750 800 Relative Intensity Wavelength (nm) Notes for Figure 10: 1. Color spectra measured at nominal current for = 25 C 2. Color spectra shown for warm white is 2700K and 80 CRI. 3. Color spectra shown for neutral white is 4000K and 80 CRI. 4. Color spectra shown for cool white is 5700K and 80 CRI. 17

Mechanical Dimensions Figure 11: Drawing for SMD 5050 Notes for Figure 11: 1. Drawings are not to scale. 2. Drawing dimensions are in millimeters. 3. Unless otherwise specified, tolerances are ± 0.10mm. Recommended PCB Soldering Pad Pattern 18

Reliability Table 9: Reliability Test Items and Conditions No. Items R 而非人 eference Standard Test Conditions Drive Current Test Duration Units Failed/Tested 1 Moisture/Reflow Sensitivity J-STD-020E T sld = 260 C, 10sec, Precondition: 60 C, 60%RH, 168hr - 3 reflows 0/22 2 Low Temperature Storage JESD22-A119 T a =-40 C - 1000 hours 0/22 3 High Temperature Storage JESD22-A103D T a = 105 C - 1000 hours 0/22 4 Low Temperature Operating Life JESD22-A108D T a =-40 C 500mA 1000 hours 0/22 5 Temperature Humidity Operating Life JESD22-A101C =85 C, RH=85% 500mA 1000 hours 0/22 6 High Temperature Operating Life JESD22-A108D =105 C 640mA 1000 hours 0/22 7 Power switching IEC62717:2014 8 Thermal Shock JESD22-A106B 9 Temperature Cycle JESD22-A104E 10 Electrostatic Discharge JS-001-2012 = 105 C 30 sec on, 30 sec off T a =-40 C ~100 C; Dwell : 15min; Transfer: 10sec T a =-40 C ~100 C; Dwell at extreme temperature: 15min; Ramp rate < 105 C/min HBM, 2KV, 1.5kΩ, 100pF, Alternately positive or negative 640mA 30000 cycles 0/22-200 cycles 0/22-200 cycles 0/22 - - 0/22 Passing Criteria Item Symbol Test Condition Passing Criteria Forward Voltage Vf 500mA ΔΔVf<10% Luminous Flux Fv 500mA ΔFv<30% Chromaticity Coordinates (x, y) 500mA Δu v <0.007 Notes for Table 9: 1. Measurements are performed after allowing the LEDs to return to room temperature 2. T sld : reflow soldering temperature; T a : ambient temperature 19

Reflowing Characteristics Figure 12 : Reflow Profile Profile Feature Lead Free Assembly Preheat: Temperature Range 180 C 200 C Preheat: Time (Maximum) 120 seconds Peak Temperature 260 C Soldering Time (Maximum) 10 seconds Allowable Reflow Cycles 2 Figure 13 : Pick and Place Is greater than LEDs emitting surface Note for Figure 13: 1. When using a pick and place machine, choose a nozzle that has a larger diameter than the LED s emitting surface. Using a Pick-and-Place nozzle with a smaller diameter than the size of the LEDs emitting surface will cause damage and may also cause the LED to not illuminate. 20

Packaging Figure 14: Emitter Reel Drawings Note for Figure 14: 1. Drawings are not to scale. Drawing dimensions are in millimeters. Figure 15: Emitter Tape Drawings Note for Figure 15: 1. Drawings are not to scale. Drawing dimensions are in millimeters. 21

Packaging Figure 16: Emitter Reel Packaging Drawings Note for Figure 16: 1. Drawings are not to scale. 22

Design Resources Please contact your Bridgelux sales representative for assistance. Precautions CAUTION: CHEMICAL EXPOSURE HAZARD Exposure to some chemicals commonly used in luminaire manufacturing and assembly can cause damage to the LED emitter. Please consult Bridgelux Application Note AN51 for additional information. CAUTION: EYE SAFETY This SMD package emits visible light, that, under certain circumstances, could be harmful to the eye. Proper safeguards must be used. CAUTION: RISK OF BURN Do not touch the SMD LED emitter during operation. Allow the emitter to cool for a sufficient period of time before handling. The SMD LED emitter may reach elevated temperatures such that could burn skin when touched. CAUTION CONTACT WITH LIGHT EMITTING SURFACE (LES) Avoid any contact with the LES. Do not touch the LES of the emitter or apply stress to the LES (yellow phosphor resin area). Contact may cause damage to the emitter Optics and reflectors must not be mounted in contact with the LES (yellow phosphor resin area). Disclaimers MINOR PRODUCT CHANGE POLICY The rigorous qualification testing on products offered by Bridgelux provides performance assurance. Slight cosmetic changes that do not affect form, fit, or function may occur as Bridgelux continues product optimization. STANDARD TEST CONDITIONS Unless otherwise stated, LED emitter testing is performed at the nominal drive current. 23

About Bridgelux: We Build Light That Transforms At Bridgelux, we help companies, industries and people experience the power and possibility of light. Since 2002, we ve designed LED solutions that are high performing, energy efficient, cost effective and easy to integrate. Our focus is on light s impact on human behavior, delivering products that create better environments, experiences and returns both experiential and financial. And our patented technology drives new platforms for commercial and industrial luminaires. For more information about the company, please visit bridgelux.com twitter.com/bridgelux facebook.com/bridgelux youtube.com/user/bridgelux WeChat ID: BridgeluxInChina 46430 Fremont Boulevard Fremont, CA 94538 Tel (925) 583-8400 www.bridgelux.com 2017 Bridgelux, Inc. All rights reserved 2017. Product specifications are subject to change without notice. Bridgelux and the Bridgelux stylized logo design are registered trademarks of Bridgelux, Inc. All other trademarks are the property of their respective owners. 24