Product Emulator Group Chair Role & Reponibilitie inemi Roadmap Summary The objective of the inemi product emulator group (PEG) i to update inemi roadmap key attribute for product emulator; identify gap with product need and available technology, and revie the latet trend and buine information for the emulator to guide the inemi technology working group. There are everal benefit for thoe erving a PEG Chair, uch a: An early look at the reult of the 2019 Roadmap a it i being finalized. A free copy of the entire inemi 2019 Roadmap ($3500.00 value) Experience leading an international group of contributor that alo build a network of valuable contact. The opportunity to help drive the indutry over the 10-year horizon of the inemi Roadmap and inure your company need are repreented. Timeframe: PEG roadmap development cycle i October 2017 May 2018 Primary PEG Chair and Co-Chair Role: Lead working group team of ubject matter expert during team call Preent team update during Roadmap workhop and webinar Interface directly with Roadmap manager Serve a team editor to collect content for the PEG report Serve a conultant for PEG information and content for the Roadmap Executive Summary Chair and Co-Chair Tak Produce the PEG roadmap chapter: o Review and revie Key Attribute for the PEG o Gather data that repreent the cla of product for the PEG o Provide table of information on repreentative metric o Identify technology gap between product need and technology evolution o Engage or delegate a PEG-member() to engage with other related-topic PEG or TWG team a needed for roadmap content conitency Time Commitment 2-3 hour per month Attend face-to-face (F2F) workhop 2-3 time/year, 2-day duration Attend virtual PEG progre check workhop 2-3 time/year, ½ day duration Lead monthly team teleconference* 1-2 hour Edit final PEG report* 16-24 hour over one-month *Time commitment during the chapter writing and editing phae will be higher
PEG Team Deliverable: Key attribute preadheet update PEG preentation material of roadmap reviion for workhop and progre check webinar PEG final report. o Interim due May 22, 2018 for TWG input o Final due September 24, 2018 PEG Team Meeting Calendar: Q4 17 Q1 18 Q2 18 Q3 18 Date: Oct. 19, 2017 Event: PEG/TC Emulator development meeting (emulator trend preentation for inemi Technical Committee) Location: WebEx Date: Feb. 25-26, 2018 Event: Roadmap TWG kick-off meeting/ PEG workhop Meeting type: Face-toface, with WebEx Location APEX, San Diego, CA (Updated emulator preentation for TWG Chair) Date: April TBD, 2018 Event: PEG Chapter Technical Committee (TC) review Location WebEx Date: Augut TBD, 2018 Event: PEG Chapter Technical Committee review meeting Location: TBD PEG Chair Role and Reponibilitie Decription The inemi Roadmap encompa more than jut a projection of the evolution of manufacturing technology. Large end uer companie provide an outlook on what their technology Product Need are going to be over the time frame of the roadmap. Thi i accomplihed by providing information on Product Emulator to the Technology Working Group. Thee product emulator are not pecific product but are repreentative of the technology need of a cla of product. inemi ha defined even emulator product clae: Portable/Wirele Product; Conumer/Office Sytem; Automotive; Defene/Aeropace Product; Medical Product; IoT/Wearable and High-End Computing, Storage (Network, Datacom, Telecom Product). The Product Emulator Group Chair i expected to gather data that repreent the cla of product to which he i aigned. The data hould indicate the manufacturing technology and infratructure need of thi cla of product over the time frame of the Roadmap. Thi require pecialized knowledge on the product expectation, new product feature that will be needed (related to technology rather than product function), market volume (e.g. to analyze degree of automated tooling), and other manufacturing iue. The emulator chair will be aked to provide table of information on repreentative metric; for example, technology performance requirement, packaging ize and volume, normalized cot and anything ele that hi emulator will need or be dependent on in the 21 area that are roadmapped. The Product Emulator are key to the whole inemi Roadmapping exercie. The emulator help the TWG chair to reflect real life need againt the evolution of technology. When thi i done, we uually find mimatche or Gap between product need and the normal evolution of technology. Thee Gap are where inemi project are focued. In ome cae, GAP require invention to reolve and become guide to Univerity Reearch or Government funding. By focuing reource on the indutry Gap, the Global Supply chain i able to more rapidly cloe thee gap and move manufacturing competitivene forward. Ideally, repreentative from everal companie will pool their generic knowledge on emulator aigned. That way, an overall indutry view i provided to the TWG chair. If concern over haring confidential information arie, the inemi taff can arrange for the data to be collected and pooled in a blind tudy where individual company information i not dicloed. Starting in 2011, we alo aked knowledgeable
TWG participant to help populate the data table in Q411 in partnerhip with the PEG. We found in 2009 that they had better acce to detailed knowledge in ome area than the PEG. The PEG are till relied upon a the primary group to provide the trend and buine information for the emulator. Interaction with other related PEGS or TWG throughout the proce i encouraged, too, with the Chair/Co-chair erving a a primary point of contact with thee engagement. inemi contract with a market forecat company to provide key market growth tatitic and text around each of the 7 product ector o that third party data can be hared from a number of ource and included in each of the PEG Chapter. The typical product emulator group chair ha a broad background that encompae both technology development a well a product development. Ideal candidate are thoe that perform integration function between product development group and manufacturing technology or operation function (both internal and external to the company). Much of the work i done within the individual normal work environment and virtual meeting. Two to three meeting are required over the nine-month roadmap development cycle for Product Emulator Chair. In 2017/18, thoe meeting are expected to be a follow: PEG/TC Emulator development meeting October 19, 2017 WebEx (emulator trend preentation for inemi Technical Committee) Roadmap TWG kick-off meeting/ PEG Workhop Feb. 25-26, 2018 Location APEX EXPO (Updated emulator preentation for TWG Chair) Face-to-Face/WebEx PEG Chapter TC review April TBD, 2018 WebEx In addition to thi time, effort will be required to conduct conference call and edit the document/preadheet during the period from October through completion of chapter (preliminary chapter outline/preadheet i due by May 22, 2018). The final chapter i due September 24, 2018. While each group et their own work pattern, the following i a reaonable etimate of time required: PEG conference call: 1-2 time per month for 1-2 hour. At end of cycle (lat few week), time may be more frequent a chapter i aembled. Effective PEG leader will uually break up writing aignment and development of attribute to member of committee. Chair and Co-chair of committee can then focu on editing chapter and writing ummary/concluion. Editing time etimate: 16-24 hour over one-month period. After chapter i ubmitted (working draft chapter/preadheet May 22, 2018), PEG Chair/Co-chair may be conulted from time to time a overall roadmap i integrated and overall executive ummary i created. Thi i uually limited to a few phone call and, potentially, mall clarification/addition to chapter. Final chapter/preadheet i due September 24, 2018 for inemi Staff editing. Minor change can be made by the PEG Chair to their preliminary and working draft work between February and September while TWG are uing them to develop their chapter. An example of a partial Medical Product Emulator (from the 2004 Roadmap) i attached a an illutration of the type of attribute that are forecated.
Table 1. Key Parameter for Medical Product Sector Parameter Metric 2003 2005 2007 2009 2015 PWB Cot (FR4) 2 layer flexible $ per cm2 4 layer flexible $ per cm2 4 layer conventional $ per cm2 0.013 0.013 6 layer conventional $ per cm2 0.018 0.018 12 layer conventional (Aramid) with buried $ per cm2 0.14 0.13 and m-via 14 layer, no blind/buried $ per cm2 0.45 0.43 28 layer, blind & buried via $ per cm2 1.17 1.1 Aembly Cot Board Aembly Cot per I/O 0.28 0.25 Final Product Aembly Cot $/unit 12 10 Package Cot Buine Cot PLIM cot to add EMS $ 200,000 100,000 50,000 50,000 25,000 B2Bi Gateway cot $ 25,000 10,000 8,000 5,000 5,000 Cycle Time Time to add EMS Week 12 8 6 6 4 NPI Cycle Time Week 16 14 12 10 6 Reliability Temperature Range Deg C - Deg C "-40 to 85 "-40 to 85 "-40 to 85 "-40 to 85 "-40 to 85 Number of Cycle Cycle to Pa 2500 2500 2500 2500 2500 Vibrational Environment (PWB level) G²/Hz Ue Shock Environment G & m to Pa Altitude Feet Device DRAM ½ Pitch (nm) nm 90 65 45 30 10 MPU/ASIC ½ Pitch (nm) nm 90 65 45 30 10 MPU Printed Gate Length (nm) nm 180 130 90 60 20 MPU Phyical Gate Length (nm) nm 190 140 95 65 32 Number of tack die Max # Number of Die in SiP max # Paive Component Paive Device: Type/Size 0201 cae 0201 cae 0201 cae 0201 cae 0201 cae Embedded Paive # per q. cm NA NA NA NA NA Max. Ohm ohm / q. Max. Capacitance μf / q.
Parameter Metric 2003 2005 2007 2009 2015 Min. % tolerance % 5% 5% 5% 5% 5% RF Component Quality Factor Q 20 125 400 1000 5000 Capacitance denity nf/q. cm 0.3 1 10 100 500 Inductance req. nh Inertion lo maximum db/in/ghz Diplay Type Reolution 1600X1200 1800x1600 1800x1600 2000x1800 2400x2000 Technology Type LCD LCD LCD LCD LCD Color Type UXGA VXGA VXGA VXGA VXGA Cot $ per unit 180 200 Average Diplay Size q. mm 17 19 Memory Main Memory Type Type Main Memory Size MB 256 512 1024 1024 2048 Storage Memory Type Type ATA SATA SATA SATA SATA Storage Memory Size MB 80,000 120,000 240000 360000 5120000 Component/ Package Max Component I/O denity I/O/q.cm 240 400 630 630 630 Average Component I/O denity I/O/q.cm 14 16 18 20 20 Average Component Denity #/q.cm 2.1 2.4 2.8 2.8 2.8 Maximum I/O per package I/O per part Average I/O per package I/O per part Max Component/q. cm. #/q.cm Max I/O for 50 mm quare SCM w/ full area # array Max I/O for 100 mm quare MCM w/ full area # array Interconnect Memory Type DIMM DIMM 2 Pc 2 Pc 2 Pc Printed Circuit Type Card Edge CardEdge CardEdge BGA-Mez BGA-Mez IO Type Circ Circ Circ Circ Circ IC Card Type PCMCIA PCMCIA PCMCIA PCMCIA PCMCIA Connector Minimum Mated Ht. (Board- mm Board) Minimum Connector Pin Pitch mm Electrical Frequency on Board MHz 2000 3000-4000 5000-6000 8000-10K 12000 Impedance Tolerance % 10 7 7 5 5 Number of Voltage # 10 10 10 10 10 Power