Smart Integrated Systems (and more) - Integrating the European Digital Industrial Strategy - Nikolaos Kyrloglou, Henri RAJBENBACH European Commission DG CONNECT 39 th OE-A Working Group Meeting 11-Oct-2016 - Frankfurt 10 th EPoSS Annual Forum 13-Oct-2016 Lecce SEMICON Europa-Flex Europe - 25-Oct-2016 - Grenoble
Outline Policy context The 10 priorities, the Digital Single Market (DSM) priority Digitising European Industry (DEI) Rationale, Impact, driving technologies Smart and Hard(ware) Road to Next generation of objects Nanoelectronics, Smart Integrated Systems, Flexible electronics H2020 project portfolio Upcoming funding opportunities Preparing for WP 2018-2020 Conclusions
The political environment 10 priorities for Europe SOTEU = State of the Union 2015 2016 actions: #DSM - A connected Digital Single Market A Digital Single Market Package
The EU Digital Single Market
DEI: Digitising European Industry Driving Technologies IoT CPS, sensors, connectivity, smart systems, Cloud, HPC servers, Big data Analytics, storage, HPC,.. Digital Products Transformation Processes Business models AI and Robotics Robotics, automation, machine learning
Public Private Partnerships at the centre More than 23 B of investment! CyberSecurity Big Data High Performance Computing Robotics 5G Services Automotive, Industrial, Defence, Medical, Space Digital Products & Services ECSEL Nanoelectronics SSI CPS Factories of the Future & Process Industry Electronics Photonics Electronic Systems Internet of Things focus area Large Scale Pilots
The Smart and Hard(ware) road to Next Generation Objects nm µm mm cm Nanoelectronics Smart System Integration "Conventional": CMOS, MOSFET Si-Ge, III-V compound SC Nanowires, CNT, Graphene "Non-Conventional": Spintronics Single e- trans 3-D monolithic @ transistor scale) Everything On-CMOS: Photonics, RF µ-fluidics µ-bio-sensors µ-mechanics - MEMS µ- batteries : µ-harvesters µ- Antenna Next Generation Objects The "T" of IoT Autonomous smart object Plastic and wearable electronics - TOLAE "Hybrid": Si chips mounted on flexible substrates "Monolithic": thin film transistors, thin film / large area sensors /labels
H2020 Project Portfolio (1/2) Nanoelectronics and Smart System Integration Medical Water Food Telecom Low-power electronics Smart System Integration Application specific SSI PROTEUS (Water quality monitoring) SNIFFPHONE (Health screening from exhaled breath) MEDILIGHT (Smart textile and wearable electronics) SocketMaster (Sockets for amputees) 44 M MNBS heterogeneous integration & Packaging TIPS (Thermal management in photonic devices) TOP HIT (Micro-transfer printing) smart-memphis (MEMS energy harvester) M3TERA (Micromachined TeraHz systems) Nanonets2Sense (biosensors, functionalised CNT) STREAMS (µfluidic active cooling integration) Thermic in SSI 38 M Energy (management /harvesting) Neuromorphic and Quantum computing "Non-conventional" electronics IONS4SET (SET-Single electron transistor/cmos RF/mm) PETMEM (line voltage reduction (with electro-acoustic ) PHRESCO (photonic/cmos) CONNECT (CNT for on-chip interconnect) NeuRAM3 (3-D monolithic FDSOI) MOS-QUITO (cryo-cmos - Quantum) (Beyond CMOS/Spintronics) IoT Nanoelectronics SC equipment/ processes METRO4-3D (3-D nanoprobes) SoC, IC Design GREAT (RF+Sensor / CMOS) manufacturing "Conventional" electronics REMINDER (Si/SiGe & III-V materials / CMOS) INSIGHT (III-V nanowires RF MOSFET amplifiers on Si) IC design SUPERAID7 (7nm design)
H2020 Project Portfolio (2/2) Plastic and wearable electronics - TOLAE Displays Lighting Sensors Automotive Medical Entertainment Smart home manufacturing LOMID - flexible OLED-CMOS large microdisplays Wafer thinning 200 mm wafers Optintegral - LED displays for advertisement In-mould hybrid integration 10 M HAPPINESS Haptic interface for automotive dashboards with EAP Electo Active Polymers - Printed LORIX Large area organic X-Ray Flat-Panel detectors Printed Organic Photo Diode (OPD) + Thin Film Transistors active matrices (TFT), PING Flexible NFC techno embedded in paper Game cards and Packaging 21 M LUMENTILE Lighting and sensing tiles PHEBE Efficient blue emitters for white OLEDs LEO Low cost energy efficient OLEDs for lighting SOLEDLIGHT Solution processed OLEDs for lighting FLEXOLIGHTING Flexible OLEDs for lighting 66 M RIA IA TransFlexTeg large area distributed sensors transparent thin film thermoelectric devices and sensors Smart windows ALABO - Laser scribing OPV ROLL-OUT - Roll-to-Roll automotive, packaging, textile 7.7 M
Upcoming funding opportunities Nanoelectronics Smart Integrated Systems ICT-31 - Micro- and nanoelectronics technologies NMBP-13 - Cross-cutting KETs for diagnostics @ point-of-care ICT-04 Smart Anything Everywhere Area 3 (micro-nanoelectronics and SSI) Plastic and wearable electronics - TOLAE ICT-04 Smart Anything Everywhere Area 4 (TOLAE) PILOTS-05-2017 Paper-based electronics + ICT-30 - Photonics KET 2017 http://ec.europa.eu/research/participants/portal/desktop/en/opportunities/index.html
ICT-31 - Micro- and nanoelectronics technologies Overview RIA Research and Innovation Scale the functional performance ultra-low power, integration, manufacturability System solutions Increase functionalities and capabilities 3D sequential integration (@ transistor scale) 3D parallel integration (@ circuit level) IA Innovation actions Equipment Assessment Experiments With Supplier and end-user (install, assess, validate) CSA Coordination and Support Actions Sustainable Pan-European event Promoting careers in micro/nanoelectronics Showcase in hardware technologies 19 M TRL 2-3 3 M TRL 6-7 1 M
ICT-04 Smart Anything Everywhere Area 3: Micro-nanoelectronics and SSI Area 4: TOLAE IA Innovation actions Proposals to address 3 aspects: 1. Establish a network of competence centres Access to technology Service for developing products Brokers between suppliers and users 2. Carrying out a critical mass of cross-border experiments Bring together key actors across the full value chain Enable new users to develop novel products and of services 3. Activities to achieve long-term sustainability one-stop shop/market place services by competence centres and the eco-system
ICT-04 Smart Anything Everywhere Area 3: Micro-nanoelectronics and SSI Area 4: TOLAE Goals Area 3: Micro-nanoelectronics and SSI to support electronic components, sensors, smart objects and system access to advanced design and manufacturing for academia, research institutes and SMEs To support rapid prototyping targeting SMEs up to 7 M per project Area 4: TOLAE To help businesses in further maturing, innovating and validating their products Access to design, technology and prototyping which are mature and ready to use, Application experiments driven by concrete user requirements and business cases up to 3.5 M per project
ICT-30 Photonics KET Overview RIA Research and Innovation 41 M Technology developments for agile Petabit/s Optical Core and Metro Networks Photonic integrated circuit (PIC) technology Disruptive approaches to optical manufacturing by 2 and 3 D opto-structuring IA Innovation actions 43 M Innovation Incubator for SMEs Application driven core photonic devices integrated in systems Focus: Biophotonics: imaging systems for in-depth disease diagnosis Sensing for process and product monitoring and analysis CSA Coordination and Support Actions 3 M
NMBP-13 Cross-cutting KETs for diagnostics at the point-of-care Objective Provide novel technological MNBS platforms Enhance the ability to: sense, detect, analyse, monitor act on phenomena from macro to nano scale (e.g. from body, organ, tissues to molecules, genes) RIA Research and Innovation Prototyping Design and pilot manufacturing Small series manufacturing Pre-clinical and clinical testing Clinical data harvesting Validation in pre-clinical and clinical settings Validation addressing real needs In vitro/in vivo diagnostics Therapy monitoring Include a business case and an exploitation strategy Activities of direct clinical and industrial relevance Medium time to market 15 M 3-5M per project
What's next? WP2018-2020 Supporting the Digitization of industry in Electronics Micro and nanoelectronics Beyond CMOS devices Low-power computing solutions Miniaturisation mm-wave technologies System integration TOLAE Advancing readiness level Enhancing manufacturability Demonstrations in selected applications (including smart wearables?) Smart Anything Everywhere (SAE) Digital Innovation Hubs for TOLAE Cyber-Physical Systems Smart System Integration SSI Micro and nanoelectronics
System integration? System integration Heterogeneous component technologies Cost-effective miniaturisation and manufacturing Safe, reliable, energy-efficient Heterogeneous systems for IoT MNBS Micro Nano Bio Systems Comprehensive Design + Integration + Packaging
Conclusions The EU Digital Industrial Strategy (DSM and DEI) provide Nanoelectronics, SSI and TOLAE technologies with a solid policy base Continuous support throughout FP7 and H2020 Some funding opportunities in WP16-17 WP 2018-20 under discussion
Thank you for your attention Digitising European Industry http://ec.europa.eu/digital-agenda/en/digitising-european-industry Digital Agenda for Europe Components and Systems: https://ec.europa.eu/digital-agenda/en/science-and-technology/components-systems DG CONNECT (Communications Networks, Content and Technology): http://ec.europa.eu/dgs/connect/index_en.htm Horizon 2020 on the web: http://ec.europa.eu/research/horizon2020/index_en.cfm