TS3011. Rail-to-rail high-speed comparator. Applications. Description. Features

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Rail-to-rail high-speed comparator Datasheet - production data Applications Telecoms Instrumentation Signal conditioning High-speed sampling systems Portable communication systems Features Propagation delay: 8 ns Low current consumption: 470 μa typ. at 5 V Rail-to-rail inputs Push-pull outputs Supply operation from 2.2 to 5 V Wide temperature range: -40 C to 125 C ESD tolerance: 2 kv HBM/200 V MM Latch-up immunity: 200 ma SMD packages Automotive qualification Description The TS3011 single comparator features a highspeed response time with rail-to-rail inputs. Specified for a supply voltage of 2.2 to 5 V, this comparator can operate over a wide temperature range from -40 C to 125 C. The TS3011 offers micropower consumption as low as a few hundred microamperes, thus providing an excellent ratio of power consumption current versus response time. The TS3011 includes push-pull outputs and is available in tiny packages to overcome space constraints. December 2017 DocID022078 Rev 5 1/20 This is information on a product in full production. www.st.com

Contents TS3011 Contents 1 Pin configuration... 3 2 Absolute maximum ratings and operating conditions... 4 3 Electrical characteristics... 5 4 Electrical characteristic curves... 9 5 Application recommendation... 13 6 Package information... 14 6.1 SOT23-5 package information... 15 6.2 SC70-5 (or SOT323-5) package information... 16 6.3 DFN8 2x2 mm package information... 17 7 Ordering information... 18 8 Revision history... 19 2/20 DocID022078 Rev 5

Pin configuration 1 Pin configuration DocID022078 Rev 5 3/20

Absolute maximum ratings and operating conditions TS3011 2 Absolute maximum ratings and operating conditions Table 1: Absolute maximum ratings Symbol Parameter Value Unit VCC Supply voltage (1) 5.5 VID Differential input voltage (2) ±5 VIN Input voltage range (VCC - ) - 0.3 to (VCC + ) + 0.3 RTHJA Thermal resistance junction-to-ambient (3) RTHJC Thermal resistance junction-to-case (3) SOT23-5 250 SC70-5 205 SOT23-5 81 SC70-5 172 TSTG Storage temperature -65 to 150 TJ Junction temperature 150 TLEAD Lead temperature (soldering 10 seconds) 260 ESD Notes: Human body model (HBM) (4) 2000 Machine model (MM) (5) 200 Charged device model (CDM) (6) SOT23-5 1500 SC70-5 1300 Latch-up immunity 200 ma (1) All voltage values, except the differential voltage, are referenced to VCC -. (2) The magnitude of input and output voltages must never exceed the supply rail ±0.3 V. (3) Short-circuits can cause excessive heating. These values are typical. (4) Human body model: a 100 pf capacitor is charged to the specified voltage, then discharged through a 1.5 kω resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. V C/W (5) Machine model: a 200 pf capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected pin combinations while the other pins are floating. (6) Charged device model: all pins and package are charged together to the specified voltage and then discharged directly to ground. C V Table 2: Operating conditions Symbol Parameter Value Unit TOper Operating temperature range -40 to 125 C VCC Supply voltage (VCC + - VCC - ), -40 C < Tamb < 125 C 2.2 to 5 VICM Common mode input voltage range, -40 C < Tamb < 125 C (VCC - ) - 0.2 to (VCC + ) + 0.2 V 4/20 DocID022078 Rev 5

Electrical characteristics 3 Electrical characteristics In the electrical characteristic tables below, all values over the temperature range are guaranteed through correlation and simulation. No production tests are performed at the temperature range limits. Table 3: VCC = 2.2 V, VICM = VCC/2,Tamb = 25 C (unless otherwise specified) Symbol Parameter Test conditions Min. Typ. Max. Unit VIO Input offset voltage (1) -7-0.2 7-40 C < Tamb < 125 C -8 8 ΔVIO Input offset voltage drift -40 C < Tamb < 125 C 5 20 µv/ C VHYST Input hysteresis voltage (2) 2 mv IIO Input offset current (3) IIB ICC ISC VOH VOL Input bias current Supply current Short circuit current Output voltage high Output voltage low 1 20-40 C < Tamb < 125 C 100 1 20-40 C < Tamb < 125 C 100 No load, output high 0.52 0.64 No load, output high, -40 C < Tamb < 125 C DocID022078 Rev 5 5/20 0.9 No load, output low 0.65 0.88 No load, output low, -40 C < Tamb < 125 C Source 14 18 Sink 11 14 Isource = 4 ma 1.94 1.97-40 C < Tamb < 125 C 1.85 1.1 Isink = 4 ma 150 190-40 C < Tamb < 125 C 250 CMRR Common-mode rejection ratio 0 < VICM < 2.7 V 50 68 db TPLH TPHL Propagation delay, low to high output level (4) Propagation delay, high to low output level (5) TR Rise time (10 % to 90 %) TF Fall time (90 % to 10 %) overdrive = 5 mv overdrive = 15 mv overdrive = 50 mv overdrive = 5 mv overdrive = 15 mv overdrive = 50 mv overdrive = 100 mv overdrive = 100 mv 16 12 10 15 16 12 10 15 3.0 2.5 mv pa ma V mv ns

Electrical characteristics TS3011 Notes: (1) The offset is defined as the average value of positive (VTRIP+) and negative (VTRIP-) trip points (input voltage differences) requested to change the output state in each direction. (2) Hysteresis is a built-in feature of the TS3011. It is defined as the voltage difference between the trip points. (3) Maximum values include unavoidable inaccuracies of the industrial tests. (4) Overdrive is measured with reference to the VTRIP+ point. (5) Overdrive is measured with reference to the VTRIP- point. Table 4: VCC = 2.7 V, VICM = VCC/2, Tamb = 25 C (unless otherwise specified) Symbol Parameter Test conditions Min. Typ. Max. Unit VIO Input offset voltage (1) -7-0.1 7-40 C < Tamb < 125 C -9 9 ΔVIO Input offset voltage drift -40 C < Tamb < 125 C 5 20 µv/ C VHYST Input hysteresis voltage (2) 2 mv IIO Input offset current (3) IIB ICC ISC VOH VOL Input bias current Supply current Short circuit current Output voltage high Output voltage low 1 20-40 C < Tamb < 125 C 100 1 20-40 C < Tamb < 125 C 100 No load, output high 0.52 0.65 No load, output high, -40 C < Tamb < 125 C 0.9 No load, output low 0.66 0.89 No load, output low, -40 C < Tamb < 125 C Source 24 27 Sink 19 22 Isource = 4 ma 2.48 2.52-40 C < Tamb < 125 C 2.40 1.1 Isink = 4 ma 130 170-40 C < Tamb < 125 C 220 mv pa ma V mv CMRR TPLH TPHL Common-mode rejection ratio Propagation delay, low to high output level (4) Propagation delay, high to low output level (5) 0 < VICM < 2.7 V 52 70 db overdrive = 5 mv overdrive = 15 mv overdrive = 50 mv overdrive = 5 mv overdrive = 15 mv overdrive = 50 mv 16 11 9 13 16 11 9 13 ns ns 6/20 DocID022078 Rev 5

Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Notes: TR Rise time (10 % to 90 %) TF Fall time (90 % to 10 %) overdrive = 100 mv overdrive = 100 mv (1) The offset is defined as the average value of positive (VTRIP+) and negative (VTRIP-) trip points (input voltage differences) requested to change the output state in each direction. (2) Hysteresis is a built-in feature of the TS3011. It is defined as the voltage difference between the trip points. (3) Maximum values include unavoidable inaccuracies of the industrial tests. (4) Overdrive is measured with reference to the VTRIP+ point. (5) Overdrive is measured with reference to the VTRIP- point. 2.3 1.8 ns Table 5: VCC = 5 V, VICM = VCC/2, Tamb = 25 C (unless otherwise specified) Symbol Parameter Test conditions Min. Typ. Max. Unit VIO Input offset voltage (1) -7-0.4 7-40 C < Tamb < 125 C -9 9 ΔVIO Input offset voltage drift -40 C < Tamb < 125 C 10 30 µv/ C VHYST Input hysteresis voltage (2) 2 mv IIO Input offset current (3) IIB ICC ISC VOH VOL Input bias current Supply current Short circuit current Output voltage high Output voltage low 1 20-40 C < Tamb < 125 C 100 1 20-40 C < Tamb < 125 C 100 No load, output high 0.47 0.69 No load, output high, -40 C < Tamb < 125 C 0.9 No load, output low 0.60 0.91 No load, output low, -40 C < Tamb < 125 C Source 58 62 Sink 58 64 Isource = 4 ma 4.84 4.89-40 C < Tamb < 125 C 4.80 1.1 Isink = 4 ma 90 120-40 C < Tamb < 125 C 180 CMRR Common-mode rejection ratio 0 < VICM < 2.7 V 57 74 SVR Supply voltage rejection ΔVCC = 2.2 V to 5 V 79 TPLH Propagation delay, low to high output level (4) overdrive = 5 mv overdrive = 15 mv overdrive = 50 mv 14 10 8 11 mv pa ma V mv db ns DocID022078 Rev 5 7/20

Electrical characteristics TS3011 Symbol Parameter Test conditions Min. Typ. Max. Unit overdrive = 5 mv 16 TPHL Propagation delay, high to low output level (5) overdrive = 15 mv 11 overdrive = 50 mv 9 12 ns TR Rise time (10 % to 90 %) TF Fall time (90 % to 10 %) overdrive = 100 mv overdrive = 100 mv 1.1 1.0 Notes: (1) The offset is defined as the average value of positive (VTRIP+) and negative (VTRIP-) trip points (input voltage differences) requested to change the output state in each direction. (2) Hysteresis is a built-in feature of the TS3011. It is defined as the voltage difference between the trip points. (3) Maximum values include unavoidable inaccuracies of the industrial tests. (4) Overdrive is measured with reference to the VTRIP+ point. (5) Overdrive is measured with reference to the VTRIP- point. 8/20 DocID022078 Rev 5

Electrical characteristic curves 4 Electrical characteristic curves Figure 1: Current consumption vs. power supply voltage - output low Figure 2: Current consumption vs. power supply voltage - output high Figure 3: Current consumption vs. temperature Figure 4: Output voltage vs. sinking current, output low, VCC = 2.7 V DocID022078 Rev 5 9/20

Electrical characteristic curves Figure 5: Output voltage vs. sinking current, output low, VCC = 5 V TS3011 Figure 6: Output voltage drop vs. sourcing current, output high, VCC = 2.7 V Figure 7: Output voltage drop vs. sourcing current, output high, VCC = 5 V Figure 8: Input offset voltage vs. common mode voltage Figure 9: Input offset voltage vs. temperature Figure 10: Propagation delay vs. common mode voltage with negative transition 10/20 DocID022078 Rev 5

Figure 11: Propagation delay vs. common mode voltage with positive transition Electrical characteristic curves Figure 12: Propagation delay vs. power supply voltage with negative transition Figure 13: Propagation delay vs. power supply voltage with positive transition Figure 14: Propagation delay vs. overdrive with negative transition, VCC = 2.7 V Figure 15: Propagation delay vs. overdrive with positive transition, VCC = 2.7 V Figure 16: Propagation delay vs. overdrive with negative transition, VCC = 5 V DocID022078 Rev 5 11/20

Electrical characteristic curves Figure 17: Propagation delay vs. overdrive with positive transition, VCC = 5 V TS3011 Figure 18: Propagation delay vs. temperature 12/20 DocID022078 Rev 5

Application recommendation 5 Application recommendation When high speed comparators are used, it is strongly recommended to place a capacitor as close as possible to the supply pins. Decoupling has two main advantages for this application: it helps to reduce electromagnetic interference and rejects the ripple that may appear on the output. A bypass capacitor combination, composed of 100 nf in addition to 10 nf and 1 nf in parallel is recommended because it eliminates spikes on the supply line better than a single 100 nf capacitor. Each millimeter of the PCB track plays an important role. Bypass capacitors must be placed as close as possible to the comparator supply pin. The smallest value capacitor should be preferably placed closer to the supply pin. In addition, important values of input impedance in series with parasitic PCB capacity and input comparator capacity create an additional RC filter. It generates an additional propagation delay. For high speed signal applications, PCB must be designed with great care taking into consideration low resistive grounding, short tracks and quality SMD capacitors featuring low ESR. Bypass capacitor stores energy and provides a complementary energy tank when spikes occur on the power supply line. If the input signal frequency is far from the resonant frequency, impedance strongly increases and the capacitor loses bypassing capability. Placing different capacitors with different resonant frequencies allows a wide frequency bandwidth to be covered. It is also recommended to implement an unbroken ground plane with low inductance. Figure 19: High speed layout recommendation DocID022078 Rev 5 13/20

Package information TS3011 6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 14/20 DocID022078 Rev 5

6.1 SOT23-5 package information Figure 20: SOT23-5 package outline Package information Table 6: SOT23-5 mechanical data Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.20 1.45 0.035 0.047 0.057 A1 0.15 0.006 A2 0.90 1.05 1.30 0.035 0.041 0.051 B 0.35 0.40 0.50 0.014 0.016 0.020 C 0.09 0.15 0.20 0.004 0.006 0.008 D 2.80 2.90 3.00 0.110 0.114 0.118 D1 1.90 0.075 e 0.95 0.037 E 2.60 2.80 3.00 0.102 0.110 0.118 F 1.50 1.60 1.75 0.059 0.063 0.069 L 0.10 0.35 0.60 0.004 0.014 0.024 K 0 degrees 10 degrees 0 degrees 10 degrees DocID022078 Rev 5 15/20

Package information 6.2 SC70-5 (or SOT323-5) package information Figure 21: SC70-5 (or SOT323-5) package outline TS3011 DIMENSIONS IN MM SIDE VIEW GAUGE PLANE COPLANAR LEADS SEATING PLANE TOP VIEW Table 7: SC70-5 (or SOT323-5) mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.80 1.10 0.032 0.043 A1 0.10 0.004 A2 0.80 0.90 1.00 0.032 0.035 0.039 b 0.15 0.30 0.006 0.012 c 0.10 0.22 0.004 0.009 D 1.80 2.00 2.20 0.071 0.079 0.087 E 1.80 2.10 2.40 0.071 0.083 0.094 E1 1.15 1.25 1.35 0.045 0.049 0.053 e 0.65 0.025 e1 1.30 0.051 L 0.26 0.36 0.46 0.010 0.014 0.018 < 0 8 0 8 16/20 DocID022078 Rev 5

6.3 DFN8 2x2 mm package information Figure 22: DFN8 2x2 mm package outline Package information Table 8: DFN8 2x2 mm package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.70 0.75 0.80 0.027 0.029 0.031 A1 0.10 0.003 b 0.20 0.25 0.30 0.007 0.009 0.011 D 1.95 2.00 2.05 0.076 0.078 0.080 D1 0.80 0.90 1.00 0.031 0.035 0.039 E 1.95 2.00 2.05 0.076 0.078 0.080 E1 1.50 1.60 1.70 0.059 0.062 0.066 e 0.50 0.019 F 0.05 0.001 G 0.25 0.30 0.35 0.009 0.011 0.013 aaa 0.10 0.003 DocID022078 Rev 5 17/20

Ordering information TS3011 7 Ordering information Table 9: Order code Order code Temperature range Package Packaging Marking TS3011ILT K540 SOT23-5 TS3011IYLT (1) K541-40 C to 125 C Tape and reel TS3011ICT SC70-5 K54 TS3011IYQ3T (1) DFN8 2x2 K5N Notes: (1) Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001 and Q 002 or equivalent. 18/20 DocID022078 Rev 5

Revision history 8 Revision history Table 10: Document revision history Date Revision Changes 03-Oct-2011 1 Initial release. 18-Feb-2014 2 27-May-2016 3 25-Aug-2017 4 07-Dec-2017 5 Updated Table 8: Order codes to add the order code TS3011IYLT. Added: Automotive qualification among the Features in the cover page. Updated document layout Section 3: "Electrical characteristics": updated unit of "Input offset voltage drift" parameter to µv/ C (not mv/ C). Section 4: "Electrical characteristic curves": X-axes changed to mv (not V) in figures 15, 16, 17, and 18. Table 6: added K values for inches Table 7: updated A and A2 min values for inches and added "<" values for inches. Updated cover page image and description. Updated Figure 1: "Pin connections (top view)" and Table 9: "Order codes". Added Section 5.3: "TS3011 DFN package information". Updated Section 1: "Pin configuration". Added Section 5: "Application recommendation". DocID022078 Rev 5 19/20

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2017 STMicroelectronics All rights reserved 20/20 DocID022078 Rev 5