DATA SHEET SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE

Similar documents
DATA SHEET SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE

MOS FIELD EFFECT TRANSISTOR 2SK3304

MOS FIELD EFFECT TRANSISTOR 2SK3058

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

DATA SHEET SWITCHING P-CHANNEL POWER MOS FET

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

MOS FIELD EFFECT TRANSISTOR 2SK2415, 2SK2415-Z

MOS FIELD EFFECT TRANSISTOR 2SK3577

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

2SK2483 MOS FIELD EFFECT TRANSISTOR DATA SHEET SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE DESCRIPTION FEATURES

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

SWITCHING N-CHANNEL POWER MOS FET

MOS FIELD EFFECT TRANSISTOR

MOS FIELD EFFECT TRANSISTOR 2SK3377

MOS FIELD EFFECT TRANSISTOR

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

2SK2141 MOS FIELD EFFECT TRANSISTOR DATA SHEET SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE DESCRIPTION PACKAGE DIMENSIONS FEATURES

MOS FIELD EFFECT TRANSISTOR µ PA2700GR

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

MOS FIELD EFFECT TRANSISTOR

DATA SHEET SWITCHING N- AND P-CHANNEL POWER MOS FET. Gate. Protection Diode

MOS FIELD EFFECT POWER TRANSISTORS 2SJ495

2SK2369/2SK2370 MOS FIELD EFFECT TRANSISTORS DATA SHEET SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE 查询 K2370 供应商 DESCRIPTION FEATURES

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

MOS FIELD EFFECT POWER TRANSISTORS

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET

MOS FIELD EFFECT TRANSISTOR 2SK3663

MOS FIELD EFFECT TRANSISTOR

Old Company Name in Catalogs and Other Documents

Old Company Name in Catalogs and Other Documents

Old Company Name in Catalogs and Other Documents

MOS FIELD EFFECT TRANSISTOR

Old Company Name in Catalogs and Other Documents

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET. The 2SK4145 is N-channel MOS Field Effect Transistor designed for high current switching applications.

MOS FIELD EFFECT TRANSISTOR 2SK3664

Old Company Name in Catalogs and Other Documents

DATA SHEET SWITCHING N-CHANNEL MOS FET

DATA SHEET SWITCHING N-CHANNEL POWER MOSFET

Old Company Name in Catalogs and Other Documents

DATA SHEET SWITCHING N-CHANNEL MOS FET 2.0± ±0.1

DATA SHEET SWITCHING P-CHANNEL POWER MOS FET

Old Company Name in Catalogs and Other Documents

MOS FIELD EFFECT TRANSISTOR 2SJ462

Old Company Name in Catalogs and Other Documents

Old Company Name in Catalogs and Other Documents

MOS FIELD EFFECT TRANSISTOR 2SJ353

Old Company Name in Catalogs and Other Documents

MOS FIELD EFFECT TRANSISTOR 2SK2159

Old Company Name in Catalogs and Other Documents

MOS FIELD EFFECT TRANSISTOR

Old Company Name in Catalogs and Other Documents

JUNCTION FIELD EFFECT TRANSISTOR 2SK660

JUNCTION FIELD EFFECT TRANSISTOR 2SK2552

MOS FIELD EFFECT TRANSISTOR 2SJ205

Old Company Name in Catalogs and Other Documents

MOS FIELD EFFECT TRANSISTOR NP110N04PDG

DATA SHEET N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR FOR IMPEDANCE CONVERTER OF ECM

MOS FIELD EFFECT TRANSISTOR 3SK206

DATA SHEET PNP SILICON EPITAXIAL TRANSISTOR FOR HIGH-SPEED SWITCHING

SILICON POWER TRANSISTOR 2SC3632-Z

2SA1743 SILICON POWER TRANSISTOR DATA SHEET PNP SILICON EPITAXIAL TRANSISTOR FOR HIGH-SPEED SWITCHING. PACKAGE DRAWING (UNIT: mm) FEATURES

DATA SHEET. on-chip resistor NPN silicon epitaxial transistor For mid-speed switching

DATA SHEET NPN SILICON TRIPLE DIFFUSED TRANSISTOR FOR HIGH-SPEED HIGH-VOLTAGE SWITCHING 15 A

MOS FIELD EFFECT TRANSISTOR 3SK252

DATA SHEET NPN SILICON EPITAXIAL TRANSISTOR (DARLINGTON CONNECTION) FOR LOW-FREQUENCY POWER AMPLIFIERS AND LOW-SPEED SWITCHING ±8.

DATA SHEET PNP SILICON EPITAXIAL TRANSISTOR FOR HIGH-SPEED SWITCHING 4.0 A

MOS FIELD EFFECT TRANSISTOR 3SK223

MOS FIELD EFFECT TRANSISTOR

MOS FIELD EFFECT TRANSISTOR 3SK230

SMP3003. P-Channel Power MOSFET 75V, 100A, 8.0mΩ, TO-263-2L/TO-263. Features. Specifications TO-263

DATA SHEET NPN SILICON POWER TRANSISTOR. 55 to +150 C 150 C Maximum

TO-3P. φ3.2± max 10 ± 0.2 3± ± ±0.2

Features. Description. Table 1: Device summary Order code Marking Package Packing STP5N80K5 5N80K5 TO-220 Tube

TO-247-P2. Description Symbol Characteristics Unit Remarks VDS 600 V VDSX 600 V VGS=-30V. Description Symbol Conditions min. typ. max.

Prerelease Product(s) - Prerelease Product(s)

Old Company Name in Catalogs and Other Documents

Features. Description. AM15572v1_no_tab. Table 1: Device summary Order code Marking Package Packing STWA48N60DM2 48N60DM2 TO-247 long leads Tube

2SK4124. SANYO Semiconductors DATA SHEET 2SK4124. Features. Specifications. N-Channel Silicon MOSFET General-Purpose Switching Device Applications

N-channel 600 V, 0.68 Ω typ., 10 A, SuperMESH Power MOSFET in a TO-220FP ultra narrow leads package. Features. Description

Features. Description. Table 1: Device summary Order code Marking Package Packaging STW56N60M2-4 56N60M2 TO247-4 Tube

MTM761110LBF MTM761110LBF. Silicon P-channel MOSFET. for Switching. Internal Connection. Pin name

2SK4177. N-Channel Power MOSFET 1500V, 2A, 13Ω, TO-263-2L. Features. Specifications. ON-resistance RDS(on)=10Ω(typ.) 10V drive

Features. Order code. Description. Table 1: Device summary Order code Marking Package Packing STL28N60DM2 28N60DM2 PowerFLAT 8x8 HV Tape and reel

Features. Table 1: Device summary Order code Marking Package Packing STW75NF30 75NF30 TO-247 Tube

Features. Description. AM15572v1_no_tab. Table 1: Device summary Order code Marking Package Packing STF4N90K5 4N90K5 TO-220FP Tube

2SK3815 2SK3815. Features. Specifications. SANYO Electric Co.,Ltd. Semiconductor Company

DATA SHEET. 6, 8-PIN DIP, 200 V BREAK DOWN VOLTAGE 1-ch, 2-ch Optical Coupled MOS FET

STP3LN80K5, STU3LN80K5

Maintenance/ Discontinued

Features. Description. Table 1: Device summary. Order code Marking Package Packing STW75N60M6 75N60M6 TO-247 Tube

N-channel 30 V, 2.15 mω typ., 120 A Power MOSFET in a TO-220 package. Features. Order code. Description. AM01475v1_Tab

Features. Description. AM01476v1. Table 1: Device summary Order code Marking Package Packaging STWA40N95K5 40N95K5 TO-247 Tube

BBS3002. P-Channel Power MOSFET 60V, 100A, 5.8mΩ, TO-263-2L/TO-263. Features. Specifications TO-263

Automotive-grade N-channel 400 V, Ω typ., 38 A MDmesh DM2 Power MOSFET in a TO-220 package. Features. Description. Table 1: Device summary

3 000 pcs / reel (standard) ± to Tch Tstg Rth(ch-a)

SC L Asymmetric Dual Silicon N-ch Power MOS FET

Features. Description. Table 1: Device summary Order code Marking Package Packing STF5N60M2 5N60M2 TO-220FP Tube

Transcription:

DATA SHEET SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE MOS FIELD EFFECT TRANSISTOR 2SK34 DESCRIPTION The 2SK34 is N-channel DMOS FET device that features a low gate charge and excellent switching characteristics, and designed for high voltage applications such as switching power supply, AC adapter. ORDERING INFORMATION PART NUMBER PACKAGE 2SK34 Isolated TO-22 FEATURES Low on-state resistance: RDS(on) = 2.2 Ω MAX. (VGS = V, ID = 2. A) Low gate charge: QG = 5 nc TYP. (VDD = 45 V, VGS = V, ID = 4. A) Gate voltage rating: ±3 V Avalanche capability ratings Isolated TO-22 package (Isolated TO-22) ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Drain to Source Voltage (VGS = V) VDSS 6 V Gate to Source Voltage (VDS = V) VGSS ±3 V Drain Current (DC) (TC = 25 C) ID(DC) ±4. A Drain Current (pulse) Note ID(pulse) ±6 A Total Power Dissipation (TC = 25 C) PT 3 W Total Power Dissipation (TA = 25 C) PT2 2. W Channel Temperature Tch 5 C Storage Temperature Tstg 55 to +5 C Single Avalanche Current Note2 IAS 4. A Single Avalanche Energy Note2 EAS.7 mj Notes. PW µs, Duty cycle % 2. Starting Tch = 25 C, VDD = 5 V, RG = 25 Ω, VGS = 2 V The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. Date Published Printed in Japan D3337EJ2VDS (2nd edition) January 2 NS CP(K) The mark shows major revised points. 998

ELECTRICAL CHARACTERISTICS (TA = 25 C) Characteristics Symbol Test Conditions MIN. TYP. MAX. Unit Zero Gate Voltage Drain Current IDSS VDS = 6 V, VGS = V µa Gate Leakage Current IGSS VGS = ±3 V, VDS = V ± µa Gate Cut-off Voltage VGS(off) VDS = V, ID = ma 2.5 3.5 V Forward Transfer Admittance yfs VDS = V, ID = 2. A. 5 S Drain to Source On-state Resistance RDS(on) VGS = V, ID = 2. A.6 2.2 Ω Input Capacitance Ciss VDS = V 55 pf Output Capacitance Coss VGS = V 5 pf Reverse Transfer Capacitance Crss f = MHz 3 pf Turn-on Delay Time td(on) VDD = 5 V, ID = 2. A 2 ns Rise Time tr VGS(on) = V 6 ns Turn-off Delay Time td(off) RG = Ω 35 ns Fall Time tf RL = Ω 2 ns Total Gate Charge QG VDD = 45 V 5 nc Gate to Source Charge QGS VGS = V 4 nc Gate to Drain Charge QGD ID = 4. A 4.4 nc Body Diode Forward Voltage VF(S-D) IF = 4. A, VGS = V.9 V Reverse Recovery Time trr IF = 4. A, VGS = V.3 µs Reverse Recovery Charge Qrr di/dt = 5 A/µs 4.3 µc TEST CIRCUIT AVALANCHE CAPABILITY TEST CIRCUIT 2 SWITCHING TIME D.U.T. RG = 25 Ω PG. 5 Ω VGS = 2 V BVDSS IAS ID VDD VDS L VDD VGS PG. τ RG D.U.T. RL VDD VGS Wave Form ID Wave Form VGS ID % % 9% VGS(on) ID 9% 9% td(on) tr td(off) t f % Starting Tch τ = µ s Duty Cycle % ton toff TEST CIRCUIT 3 GATE CHARGE D.U.T. IG = 2 ma RL PG. 5 Ω VDD 2 Data Sheet D3337EJ2VDS

TYPICAL CHARACTERISTICS (TA = 25 C ) dt - Percentage of Rated Power - % 8 6 4 2 DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 2 4 6 8 2 4 6 Tch - Channel Temperature - C PT - Total Power Dissipation - W 4 3 2 TOTAL POWER DISSIPATION vs. CASE TEMPERATURE 2 4 6 8 2 4 6 TC - Case Temperature - C FORWARD BIAS SAFE OPERATING AREA RD(on) Limited ID(DC) Power Dissipation Limited ID(pulse) 3 ms ms ms ms PW = ms ms. TC = 25 C Single Pulse VDS - Drain to Source Voltage - V TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH rth(t) - Transient Thermal Resistance - C/W.. m m m m Rth(CH-A) = 62.5 C/W Rth(CH-C) = 4.7 C/W Single Pulse m PW - Pulse Width - s Data Sheet D3337EJ2VDS 3

DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE FORWARD TRANSFER CHARACTERISTICS 5 VGS = V 8 V 6 V.. Tch = 25 C 75 C 25 C -25 C VDS = V 2 3 4 VDS - Drain to Source Voltage - V 5 VGS - Gate to Source Voltage - V 5 VGS(off) - Gate to Source Cutoff Voltage - V 5. 4. 3. 2.. GATE TO SOURCE CUTOFF VOLTAGE vs. CHANNEL TEMPERATURE VDS = V ID = ma -5 5 5 yfs - Forward Transfer Admittance - S. FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT Tch = -25 C 25 C 75 C 25 C VDS = V... Tch - Channel Temperature - C RDS (on) - Drain to Source On-State Resistance - W DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 3. 2.. ID = 4. A 5 5 VGS - Gate to Source Voltage - V 2. A RDS(on) - Drain to Source On-State Resistance - W 3. 2.. DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT VGS = V VGS = 2 V. 4 Data Sheet D3337EJ2VDS

RDS (on) - Drain to Source On-State Resistance - W 4. 3. 2.. DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE -5 ID = 4. A 2. A VGS = V 5 5 Tch - Channel Temperature - C ISD - Diode Forward Current - A.. SOURCE TO DRAIN DIODE FORWARD VOLTAGE VGS = V.5 V. VSD - Source to Drain Voltage - V.5 Ciss, Coss, Crss - Capacitance - pf. CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE VGS = V f = MHZ VDS - Drain to Source Voltage - V Ciss Coss Crss td(on), tr, td(off), tf - Switching Time - ns SWITCHING CHARACTERISTICS td(off) tf td(on) VDD = 5 V VGS = V RG = W.. tr trr - Reverse Recovery Time - ns REVERSE RECOVERY TIME vs. DRAIN CURRENT di/dt = 5 A/mS VGS = V VDS - Drain to Source Voltage - V 6 4 2 DYNAMIC INPUT/OUTPUT CHARACTERISTICS 6 ID = 4 A 4 VDD = 45 V 3 V 5 V VDS VGS 2 8 6 4 2 VGS - Gate to Source Voltage - V.. 4 8 2 6 Qg - Gate Charge - nc Data Sheet D3337EJ2VDS 5

IAS - Single Avalanche Current - A. SINGLE AVALANCHE CURRENT vs. INDUCTIVE LOAD IAS = 4 A RG = 25 W VDD = 5 V VGS = 2 V Starting Tch = 25 C. m m m m L - Inductive Load - H EAS =.7 mj Energy Derating Factor - % 2 8 6 4 2 25 SINGLE AVALANCHE ENERGY DERATING FACTOR VDD = 5 V RG = 25 W VGS = 2 V IAS 4 A 5 75 25 5 Starting Tch - Starting Channel Temperature - C PACKAGE DRAWINGS (Unit: mm) EQUIVALENT CIRCUIT Isolated TO-22 (MP-45F) Drain.±.3 φ 3.2±.2 4.5±.2 2.7±.2 Gate Body Diode 5.±.3 3±. 2.±.2 Gate Protection Diode Source 4±.2 3.5 MIN..7±..3±.2.5±.2 2.54 TYP. 2.54 TYP. 2.5±..65±..Gate 2.Drain 3.Source 2 3 Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device. 6 Data Sheet D3337EJ2VDS

[MEMO] Data Sheet D3337EJ2VDS 7

The information in this document is current as of January, 2. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) () "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E. 4

This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.