CD54/74HC74, CD54/74HCT74

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CD54/74HC74, CD54/74HCT74 Data sheet acquired from Harris Semiconductor SCHS124A January 1998 - Revised May 2000 Dual D Flip-Flop with Set and Reset Positive-Edge Trigger Features Description [ /Title (CD54H C74, CD74H C74, CD74H CT74) /Subject Dual D liplop ith Set Hysteresis on Clock Inputs for Improved Noise Immunity and Increased Input Rise and Fall Times Asynchronous Set and Reset Complementary Outputs Buffered Inputs Typical f MAX = 50MHz at = 5V, C L = 15pF, T A = 25 o C Fanout (Over Temperature Range) - Standard Outputs............... 10 LSTTL Loads - Bus Driver Outputs............. 15 LSTTL Loads Wide Operating Temperature Range... -55 o C to 125 o C Balanced Propagation Delay and Transition Times Significant Power Reduction Compared to LSTTL Logic ICs HC Types - 2V to 6V Operation - High Noise Immunity: N IL = 30%, N IH = 30% of at = 5V HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, V IL = 0.8V (Max), V IH = 2V (Min) - CMOS Input Compatibility, I l 1µA at V OL, V OH The HC74 and HCT74 utilize silicon gate CMOS technology to achieve operating speeds equivalent to LSTTL parts. They exhibit the low power consumption of standard CMOS integrated circuits, together with the ability to drive 10 LSTTL loads. This flip-flop has independent DATA, SET, RESET and inputs and Q and Q outputs. The logic level present at the data input is transferred to the output during the positive-going transition of the clock pulse. SET and RESET are independent of the clock and are accomplished by a low level at the appropriate input. The HCT logic family is functionally as well as pin compatible with the standard LS logic family. Ordering Information PART NUMBER TEMP. RANGE ( o C) PACKAGE CD54HC74F -55 to 125 14 Ld CERDIP CD54HC74F3A -55 to 125 14 Ld CERDIP CD74HC74E -55 to 125 14 Ld PDIP CD74HC74M -55 to 125 14 Ld SOIC CD54HCT74F -55 to 125 14 Ld CERDIP CD54HCT74F3A -55 to 125 14 Ld CERDIP CD74HCT74E -55 to 125 14 Ld PDIP CD74HCT74M -55 to 125 14 Ld SOIC NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Die is available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright 2000, Texas Instruments Incorporated 1

Pinout CD54HC74, CD54HCT74 (CERDIP) CD74HC74, CD74HCT74 (PDIP, SOIC) TOP VIEW 1R 1 14 1D 2 13 2R 1CP 3 12 2D 1S 4 11 2CP 1Q 5 10 2S 1Q 6 9 2Q 7 8 2Q Functional Diagram RESET 1 DATA SET RESET 2 3 4 13 R D F/F 1 CP S 5 6 Q Q DATA SET 12 11 10 D CP R F/F 2 9 8 Q Q S = PIN 7 = PIN 14 TRUTH TABLE S OUTPUTS SET RESET CP D Q Q L H X X H L H L X X L H L L X X H (Note 3) H (Note 3) H H H H L H H L L H H H L X Q0 Q0 NOTE: H = High Level (Steady State) L = Low Level (Steady State) X = Don t Care = Low-to-High Transition Q0 = the level of Q before the indicated input conditions were established. 3. This configuration is nonstable, that is, it will not persist when set and reset inputs return to their inactive (high) level. 2

Absolute Maximum Ratings DC Supply,........................ -0.5V to 7V DC Input Diode Current, I IK For V I < -0.5V or V I > + 0.5V......................±20mA DC Drain Current, per Output, I O For -0.5V < V O < + 0.5V..........................±25mA DC Output Diode Current, I OK For V O < -0.5V or V O > + 0.5V....................±20mA DC Output Source or Sink Current per Output Pin, I O For V O > -0.5V or V O < + 0.5V....................±25mA DC or Ground Current, I CC.........................±50mA Thermal Information Thermal Resistance (Typical, Note 4) θ JA ( o C/W) θ JC ( o C/W) PDIP Package................... 90 - SOIC Package................... 120 - CERDIP Package................ 130 55 Maximum Junction Temperature (Hermetic Package or Die)... 175 o C Maximum Junction Temperature (Plastic Package)........ 150 o C Maximum Storage Temperature Range..........-65 o C to 150 o C Maximum Lead Temperature (Soldering 10s)............. 300 o C (SOIC - Lead Tips Only) Operating Conditions Temperature Range (T A )..................... -55 o C to 125 o C Supply Range, HC Types.....................................2V to 6V HCT Types.................................4.5V to 5.5V DC Input or Output, V I, V O................. 0V to Input Rise and Fall Time 2V...................................... 1000ns (Max) 4.5V...................................... 500ns (Max) 6V....................................... 400ns (Max) CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 4. θ JA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications HC TYPES High Level Input Low Level Input High Level Output CMOS Loads High Level Output TTL Loads Low Level Output CMOS Loads Low Level Output TTL Loads Input Leakage Current V I (V) I O (ma) (V) MIN TYP MAX MIN MAX MIN MAX V IH - - 2 1.5 - - 1.5-1.5 - V 4.5 3.15 - - 3.15-3.15 - V 6 4.2 - - 4.2-4.2 - V V IL - - 2 - - 0.5-0.5-0.5 V 4.5 - - 1.35-1.35-1.35 V 6 - - 1.8-1.8-1.8 V V OH V OL I I V IH or -0.02 2 1.9 - - 1.9-1.9 - V V IL 4.5 4.4 - - 4.4-4.4 - V 6 5.9 - - 5.9-5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84-3.7 - V -5.2 6 5.48 - - 5.34-5.2 - V V IH or 0.02 2 - - 0.1-0.1-0.1 V V IL 4.5 - - 0.1-0.1-0.1 V 6 - - 0.1-0.1-0.1 V or - - - - - - - - - V 4 4.5 - - 0.26-0.33-0.4 V 5.2 6 - - 0.26-0.33-0.4 V - 6 - - ±0.1 - ±1 - ±1 µa 3

DC Electrical Specifications (Continued) Quiescent Device Current HCT TYPES High Level Input Low Level Input High Level Output CMOS Loads High Level Output TTL Loads Low Level Output CMOS Loads Low Level Output TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load I CC or V IH - - 4.5 to 5.5 V IL - - 4.5 to 5.5 V OH V OL I I I CC I CC (Note 5) V I (V) I O (ma) (V) MIN TYP MAX MIN MAX MIN MAX 0 6 - - 4-40 - 80 µa 2 - - 2-2 - V - - 0.8-0.8-0.8 V V IH or - 4.5 4.4 - - 4.4-4.4 - V V IL -0.02 4.5 3.98 - - 3.84-3.7 - V V IH or -4 4.5 - - 0.1-0.1-0.1 V V IL and or - 2.1 0.02 4.5 - - 0.26-0.33-0.4 V 4 5.5 - ±0.1 - ±1 - ±1 µa 0 5.5 - - 4-40 - 80 µa - 4.5 to 5.5 NOTE: 5. For dual-supply systems theoretical worst case (V I = 2.4V, = 5.5V) specification is 1.8mA. - 100 360-450 - 490 µa HCT Input Loading Table UNIT LOADS D 0.5 R 0.5 CP 0.7 S 0.75 NOTE: Unit Load is I CC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25 o C. Prerequisite For Switching Specifications HC TYPES Data to CP Setup Time (Figure 5) (V) MIN TYP MAX MIN MAX MIN MAX t SU - 2 60 - - 75-90 - ns 4.5 12 - - 15-18 - ns 6 10 - - 13-15 - ns 4

Prerequisite For Switching Specifications (Continued) (V) MIN TYP MAX MIN MAX MIN MAX Hold Time (Figure 5) t H - 2 3 - - 3-3 - ns 4.5 3 - - 3-3 - ns 6 3 - - 3-3 - ns Removal Time R, S, to CP t REM - 2 30 - - 40-45 - ns (Figure 5) 4.5 6 - - 8-9 - ns 6 5 - - 7-8 - ns Pulse Width R, S (Figure 1) t W - 2 80 - - 100-120 - ns 4.5 16 - - 20-24 - ns 6 14 - - 17-20 - ns Pulse Width CP (Figure 1) t W - 2 80 - - 100-120 - ns 4.5 16 - - 20-24 - ns 6 14 - - 17-20 - ns CP Frequency f MAX - 2 6 - - 5-4 - MHz 4.5 30 - - 25-20 - MHz 6 35 - - 29-23 - MHz HCT TYPES Data to CP Setup Time (Figure 6) t SU - 4.5 12 - - 15-18 - ns Hold Time (Figure 6) t H - 4.5 3 - - 3-3 - ns Removal Time R, S, to CP t REM - 4.5 6 - - 8-9 - ns (Figure 6) Pulse Width R, S (Figure 2) t W - 4.5 16 - - 20-24 - ns Pulse Width CP (Figure 2) t W - 4.5 18 - - 23-27 - ns CP Frequency f MAX - 4.5 25 - - 20-16 - MHz Switching Specifications Input t r, t f = 6ns HC TYPES Propagation Delay, CP to Q, Q (Figure 3) (V) MIN TYP MAX MIN MAX MIN MAX t PLH, t PHL C L = 50pF 2 - - 175-220 - 265 ns C L = 50pF 4.5 - - 35-44 - 53 ns C L = 15pF 5-14 - - - - - ns C L = 50pF 6 - - 30-37 - 45 ns Propagation Delay, t PLH, t PHL C L = 50pF 2 - - 200-250 - 300 ns R, S to Q, Q (Figure 3) C L = 50pF 4.5 - - 40-50 - 60 ns C L = 15pF 5-17 - - - - - ns C L = 50pF 6 - - 34-43 - 51 ns Transition Time (Figure 3) t TLH, t THL C L = 50pF 2 - - 75-95 - 110 ns C L = 50pF 4.5 - - 15-19 - 22 ns C L = 50pF 6 - - 13-16 - 19 ns Input Capacitance C I - - - - 10-10 - 10 pf 5

Switching Specifications Input t r, t f = 6ns (Continued) CP Frequency f MAX CL = 15pF 5-50 - - - - - MHz Power Dissipation Capacitance C PD - 5-25 - - - - - pf (Notes 6, 7) HCT TYPES Propagation Delay, CP to Q, Q (Figure 4) Propagation Delay, R, S to Q, Q (Figure 4) (V) MIN TYP MAX MIN MAX MIN MAX t PLH, t PHL C L = 50pF 4.5 - - 35-44 - 53 ns t PHL, t PLH CL = 50pF 4.5 - - 40-50 - 60 ns Transition Time (Figure 4) t TLH, t THL C L = 50pF 4.5 - - 15-19 - 22 ns Input Capacitance C I - - - - 10-10 - 10 pf CP Frequency f MAX CL = 15pF 5-50 - - - - - MHz Power Dissipation Capacitance (Notes 6, 7) C PD - 5-30 - - - - - pf NOTES: 6. C PD is used to determine the dynamic power consumption, per flip-flop. 7. P D =C PD V 2 CC fi + Σ (C L V 2 CC fo ) where f i = input frequency, f o = output frequency, C L = output load capacitance, = supply voltage. Test Circuits and Waveforms t r C L t f C L I t WL + t WH = fcl t r C L = 6ns t f C L = 6ns I t WL + t WH = fcl 2.7V 0. 0. t WL t WH t WL t WH NOTE: Outputs should be switching from to in accordance with device truth table. For f MAX, input duty cycle =. FIGURE 1. HC PULSE RISE AND FALL TIMES AND PULSE WIDTH NOTE: Outputs should be switching from to in accordance with device truth table. For f MAX, input duty cycle =. FIGURE 2. HCT PULSE RISE AND FALL TIMES AND PULSE WIDTH t r = 6ns t f = 6ns t r = 6ns t f = 6ns 2.7V 0. t THL t TLH t THL t TLH INVERTING OUTPUT t PHL t PLH INVERTING OUTPUT t PHL t PLH FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA- TION DELAY TIMES, COMBINATION LOGIC FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 6

Test Circuits and Waveforms (Continued) t r C L t f C L t r C L 2.7V 0. t f C L t H(H) t H(L) t H(H) t H(L) DATA t SU(H) t SU(L) DATA t SU(H) t SU(L) OUTPUT t TLH t THL OUTPUT t TLH t THL t PLH t PHL t PLH t PHL t REM SET, RESET OR PRESET t REM SET, RESET OR PRESET IC C L 50pF IC C L 50pF FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 7

IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI s publication of information regarding any third party s products or services does not constitute TI s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated