HEXFRED Ultrafast Soft Recovery Diode, A VS-HFAFA SOT-7 PRIMARY CHARACTERISTICS V R V V F (typical).68 V t rr (typical) 58 ns I F(AV) per module at T C A at 38 C Package SOT-7 FEATURES Fast recovery time characteristic Electrically isolated base plate Large creepage distance between terminal Simplified mechanical designs, rapid assembly Designed and qualified for industrial level UL approved file E78996 Material categorization: for definitions of compliance please see www.vishay.com/doc?999 DESCRIPTION / APPLICATIONS The dual diode series configuration (VS-HFAFA) is used for output rectification or freewheeling/clamping operation and high voltage application. The semiconductor in the SOT-7 package is isolated from the copper base plate, allowing for common heatsinks and compact assemblies to be built. These modules are intended for general applications such as HV power supplies, electronic welders, motor control and inverters. ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS Cathode to anode voltage V R V Continuous forward current () I F T C = 68 C Single pulse forward current I FSM T J = 5 C 7 A T C = 5 C 5 Maximum power dissipation per leg P D T C = C 4 W RMS isolation voltage V ISOL Any terminal to case, t = minute 5 V Operating junction and storage temperature range T J, T Stg -55 to +5 C ELECTRICAL SPECIFICATIONS (T J = 5 C unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Cathode to anode breakdown voltage V BR I R = μa - - I F = A -.68 3.6 Forward voltage V FM I F = A - 3.4 4.7 V I F = A, T J = 5 C -.6.89 I F = A, T J = 5 C - 3.59 3.89 Reverse leakage current I RM V R = V R rated - 75 μa T J = 5 C, V R = V R rated - - ma T J = 5 C, V R = V R rated - 6 5 Note () Maximum continuous forward current must be limited at A to do not exceed the maximum temperature of power terminals. Revision: 6-Sep-7 Document Number: 93636 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
VS-HFAFA DYNAMIC RECOVERY CHARACTERISTICS (T J = 5 C unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Reverse recovery time t rr T J = 5 C - 57 - ns I F = A; di F /dt = - A/μs; V R = 3 V - 58 - T J = 5 C - 55 - Peak recovery current I RRM I F = 5 A T J = 5 C - 5 - di F /dt = - A/μs T J = 5 C -.5 - A T J = 5 C - 5 - Reverse recovery charge Q rr T J = 5 C - 85 - nc Junction capacitance C T - 53 - pf THERMAL - MECHANICAL SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Junction to case, single leg conducting - -.5 R thjc Junction to case, both legs conducting - -.5 C/W Case to heatsink R thcs Flat, greased surface -. - Weight - 3 - g Mounting torque Torque to terminal - -. (9.7) Nm (lbf.in) Torque to heatsink - -.8 (5.9) Nm (lbf.in) Case style SOT-7 I F - Instantaneous Forward Current (A) T J = 5 C T J = 5 C T J = 5 C.5.5.5 3 3.5 4 V F - Forward Voltage Drop (V) Fig. - Typical Forward Voltage Drop Characteristics (Per Leg) I R - Reverse Current (μa) T J = 5 C T J = 5 C... T J = 5 C. 4 6 8 V R - Reverse Voltage (V) Fig. - Typical Values of Reverse Current vs. Reverse Voltage Revision: 6-Sep-7 Document Number: 93636 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
VS-HFAFA Z thjc - Thermal Impedance Junction to Case ( C/W). DC.75.5.33.5. P DM Notes:. Duty factor D = t /t. Peak T J = P DM x Z thjc + T C t t..... t - Rectangular Pulse Duration (s) Fig. 3 - Maximum Thermal Impedance Z thjc Characteristics (Per Leg) Allowable Case Temperature ( C) 75 5 5 75 5 5 Square wave (d =.5) Rated V R applied DC 4 6 8 4 6 8 t rr (ns) 3 5 I F = 5 A, T J = 5 C I F = 5 A, T J = 5 C 5 5 I F(AV) - Average Forward Current (A) di F /dt (A/μs) Fig. 4 - Maximum Allowable Case Temperature vs. Average Forward Current (Per Leg) Fig. 6 - Typical Reverse Recovery Time vs. di F /dt Average Power Loss (W) 8 7 6 5 4 3 DC RMS Limit D =. D =.5 D =.33 D =.5 D =.75 Q rr (ns) 4 35 3 5 5 5 I F = 5 A, T J = 5 C I F = 5 A, T J = 5 C 4 8 6 I F(AV) - Average Forward Current (A) di F /dt (A/μs) Fig. 5 - Forward Power Losses Characteristics (Per Leg) Fig. 7 - Typical Stored Charge vs. di F /dt Revision: 6-Sep-7 3 Document Number: 93636 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
VS-HFAFA www.vishay.com I RR (A) 5 4 3 I F = 5 A, T J = 5 C I F = 5 A, T J = 5 C C T - Junction Capacitance (pf) di F /dt (A/μs) V R - Reverse Voltage (V) Fig. 8 - Typical Peak Recovery Current vs. di F /dt Note () Formula used: T C = T J - (Pd + Pd REV ) x R thjc ; Pd = Forward power loss = I F(AV) x V FM at (I F(AV) /D) (see fig. 5); Pd REV = Inverse power loss = V R x I R ( - D); I R at V R = Rated V R Fig. 9 - Typical Junction Capacitance vs. Reverse Voltage L = 7 μh. Ω di F /dt adjust G D IRFP5 D.U.T. S Fig. - Reverse Recovery Parameter Test Circuit (3) t rr I F t a tb () I RRM (4) Q rr.5 I RRM di (rec)m /dt (5).75 I RRM () di F /dt () di F /dt - rate of change of current through zero crossing (4) Q rr - area under curve defined by t rr and I RRM () I RRM - peak reverse recovery current (3) t rr - reverse recovery time measured from zero crossing point of negative going I F to point where a line passing through.75 I RRM and.5 I RRM extrapolated to zero current. Q rr = t rr x I RRM (5) di (rec)m /dt - peak rate of change of current during t b portion of t rr Fig. - Reverse Recovery Waveform and Definitions Revision: 6-Sep-7 4 Document Number: 93636 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
VS-HFAFA ORDERING INFORMATION TABLE Device code VS- HF A F A 3 4 5 6 7 3 4 5 6 7 - product - HEXFRED family - Process designator (A = electron irradiated) - Average current ( = A) - Circuit configuration ( separate diodes, parallel pin-out) - Package indicator (SOT-7 standard insulated base) - Voltage rating ( = V) CIRCUIT CONFIGURATION CIRCUIT CIRCUIT CONFIGURATION CODE CIRCUIT DRAWING Lead Assignment separate diodes, parallel pin-out F 4 3 4 3 Dimensions Packaging information LINKS TO RELATED DOCUMENTS www.vishay.com/doc?9543 www.vishay.com/doc?9545 Revision: 6-Sep-7 5 Document Number: 93636 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
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