RFID circuit with read/write functions

Similar documents
Contactless card IC 2802-A, 6602(C)

H4102 EM MICROELECTRONIC-MARIN SA. Read Only Contactless Identification Device H4102. Typical Operating Configuration

EM4069 EM4169 EM MICROELECTRONIC - MARIN SA. 128 bit Read/Write Contactless Identification Device with OTP function EM4069. Description.

MCRF200. Contactless Programmable Passive RFID Device

2014 New Product. The Best Partner for your Success

EM4170 EM MICROELECTRONIC - MARIN SA. 125kHz CRYPTO READ/WRITE Contactless Identification Device EM4170

IN1307N/D/IZ1307 CMOS IC of Real Time Watch with Serial Interface, 56 Х 8 RAM

EM4150 EM4350 EM MICROELECTRONIC - MARIN SA. 1 KBit READ / WRITE CONTACTLESS IDENTIFICATION DEVICE EM4150 EM4150

1 KBit Read/Write Contactless Identification Device

IZ602 LCD DRIVER Main features: Table 1 Pad description Pad No Pad Name Function

NCD1015-IC 17 February 2011 Data sheet status: Product Data. NCD1015-IC HDX RFID IC. Product data February 2011 Production 1/14

512 bit Read/Write Multi-purpose Contactless Identification Device

EM4056 EM MICROELECTRONIC - MARIN SA. 2KBIT Read/Write with ANTICOLLISION Contactless Identification Device EM4056

RFID ACCESS CONTROL. SRðAN LALE FACULTY OF ELECTRICAL ENGINEERING EASTERN SARAJEVO

IZ7150, IZ7150A Microcircuit IZ7150, IZ7150A Main features: Table 1 Contact pad description

6.115 Final Project Proposal: An RFID Access Control System

HF-RFID. References. School of Engineering

1W-H3-05 (K)* M12. * Letter K refers to a reader with a common cathode. RFID reader 125 khz Unique. Product Card

I n t e l l i g e n t 1 k B y t e M e m o r y C h i p w i t h M i f a r e c o m p a t i b i l i t y a n d 4 - b y t e U I D

Atmel ATA5577C. Read/Write LF RFID IDIC 100 to 150kHz DATASHEET. Features

e5560 Standard Read/Write Crypto Identification IC Description Features

U2270B replacement by EM4095 reader chip

ISSCC 2006 / SESSION 15 / ORGANIC DEVICES AND CIRCUITS / 15.2

Wireless Keyboard Without Need For Battery

The Design of Tag-ItTM Compatible MHz Passive RFID Transponder IC Employing TSMC 0.18µm Process

Battery Powered Tags for ISO/IEC Klaus Finkenzeller

NCD1025-IC HDX RFID IC WITH TEMPERATURE SENSOR. NCD1025-IC 16 December 2013 Data sheet status: Preliminary Data. Preliminary data 2012 February 2012

Design of Adaptive RFID Reader based on DDS and RC522 Li Yang, Dong Zhi-Hong, Cong Dong-Sheng

The CYF115 transmitter solution is ideal for industrial and consumer applications where simplicity and form factor are important.

Read-only Transponder TK5530

UM-005 UM005-doc In reference to UM005-c-01.04

OEM 100. User Manual. Figure 1: OEM 100 Module with HG Rectangular Antenna Board

Nuvoton MFID Transponder W55MID15. Data Sheet

ST25TA product presentation. June 2018

MCRF450/ MHz Read/Write Passive RFID Devices. Features. Applications. Typical Configuration for Applications

AN Low Frequency RFID Card Reader. Application Note Abstract. Introduction. Working Principle of LF RFID Reader

SD2085 Low Power HART TM Modem

RFID Reader Module (#28140) RFID 54 mm x 85 mm Rectangle Tag (#28141) RFID 50 mm Round Tag (#28142)

NCD RO HDX Robust 50mm Transponder

Operational Description

Preface to the Third Edition. List of Abbreviations

DS28EL15 DeepCover Secure Authenticator with 1-Wire SHA-256 and 512-Bit User EEPROM 1.8V (I 2 C PORT)

AN1954 APPLICATION NOTE

32mm Glass Transponder Eco-Line Read Only, Read/Write. Reference Guide

SYN113 Datasheet. ( MHz ASK Transmitter) Version 1.0

Multifunctional 330-bit Read/Write RF Identification IC ATA5567

MCRF450/451/452/ MHz Read/Write Passive RFID Device. Features. Applications. Typical Configuration for Applications

MPR kHz Reader

Read/Write Transponder TK5552

Physics of RFID. Pawel Waszczur McMaster RFID Applications Lab McMaster University

UHF RFID Micro Reader Reference Design Hardware Description

DS1267 Dual Digital Potentiometer Chip

A 13.56MHz RFID system based on organic transponders

RFID HANDBOOK THIRD EDITION

Standard Read/Write ID Transponder with Anticollision TK5551

HD44102D. (Dot Matrix Liquid Crystal Graphic Display Column Driver) Features. Description. Ordering Information

DOCSIS 3.0 Upstream Amplifier

Read/Write Crypto Transponder for Short Cycle Time TK5561A-PP

SD2017 Low Power HART TM Modem

1 kbit Read/Write, ISO C / EPC C-1 G-2 Passive / Battery-assisted Contactless IC

WJM1000. Next Generation RFID Reader Module Based on the WJC200 Gen2 RFID reader chipset. Key Features

TONE DECODER IC. Fig. 1 Views of ICs in DIP & SO packages IL567СN, IL567СD. N-suffix DIP-package. D-suffix SO-package

DS1867 Dual Digital Potentiometer with EEPROM

HITAG µ RO64 transponder IC

Multi Frequency RFID Read Writer System

32mm Glass Transponder. Read Only, Read/Write. Reference Guide

IC for Electronic Ballasts

DATA SHEET CORE ID-SERIES COMPONENT READERS (ID2, ID2RW, ID12, ID12RW, ID20, ID20RW)

64 bit Read Only ISO15693 Standard Compliant Contactless Identification Device

AIR-INTERFACE COMPATIBILITY & ISO-CERTIFICATION

DS1065 EconOscillator/Divider

Oscillator fail detect - 12-hour Time display 24-hour 2 Time Century bit - Time count chain enable/disable -

RFID Door Unlocking System

U2270B. Read / Write Base Station IC. Description. Applications. Features

Multiplexer for Capacitive sensors

P14155A: 128 Channel Cross-correlator ASIC Datasheet Rev 2.1

Low-Jitter, Precision Clock Generator with Two Outputs

Volterra. VT1115MF Pulse Width Modulation (PWM) Controller. Partial Circuit Analysis

DIGITAL BASEBAND PROCESSOR DESIGN OF PASSIVE RADIO FREQUENCY IDENTIFICATION TAG FOR ULTRA WIDEBAND TRANSCEIVER

ST25DV-PWM product presentation. July 2018

Functional Description / User Manual of SIEMENS VDO

NFC OpenSense & NFC SpeedTap 128- & 256-bit NFC Tags

ABRIDGED DATA SHEET. DeepCover Secure Authenticator with 1-Wire ECDSA and 1Kb User EEPROM. General Description

DS1202, DS1202S. Serial Timekeeping Chip FEATURES PIN ASSIGNMENT. ORDERING INFORMATION DS pin DIP DS1202S 16 pin SOIC DS1202S8 8 pin SOIC

DS1075. EconOscillator/Divider PRELIMINARY FEATURES PIN ASSIGNMENT FREQUENCY OPTIONS

Contents. Product Overview. Module Introduction APPLICATION INFORMATION. 1. TAGcore Features Interface Description Characteristics..

DS1075 EconOscillator/Divider

NCD1015ZP 50mm Half Duplex Read-Only RFID Transponder Features Description Applications Ordering Information Part # Description Block Diagram

Application Circuits 3. 3V R2. C4 100n G PI O. 0 G PI O S e t u p d a ta G PI O. 5 G PI O M o t i o n I n t G PI O. 4 G PI O.

DS1307ZN. 64 X 8 Serial Real Time Clock PIN ASSIGNMENT FEATURES

PT7C4502 PLL Clock Multiplier

DOCSIS 3.0 Upstream Amplifier

Contactless snooping: Assessing the real threats

Low current consumption : 0.4 ma typ. Driver output current : 70 ma max. 5 MHz (cascade connection) Selectable H/L for latch and driver enable

Rubidium Frequency Standard Model AR133A Ruggedized Low Profile

PT7C4511. PLL Clock Multiplier. Features. Description. Pin Configuration. Pin Description

KEY FEATURES. Immune to Latch-UP Fast Programming. ESD Protection Exceeds 2000 V Asynchronous Output Enable GENERAL DESCRIPTION TOP VIEW A 10

DS1073 3V EconOscillator/Divider

HT2x. 1. General description. 2. Features and benefits. HITAG 2 transponder IC. Product short data sheet COMPANY PUBLIC

NM93C56 2K-Bit Serial CMOS EEPROM (MICROWIRE Bus Interface)

Transcription:

RFID circuit with read/write functions IZ2803-5 The IZ2803-5 (equivalent of EM4100 EM Microelectronic Marin SA) is chip for multifunction contactless read/write cards with 64 bit EEPROM The IZ2803-5 is intended for application in the RF identification systems. External coil has to be connected to chip to create contactless ID tag. Build-in radio channel receives signal induced in antenna. This signal is used by power supply unit to generate supply voltage & by control unit to separate clocking signal. Data exchange is performed by means of modulation of the carrier frequency Application areas: access control systems in buildings, restricted areas, industrial RFID tags. Read/write operations of 64K EEPROM is performed via built-in radio channel with the frequency of 100-150 khz Main features: Contactless data exchange. Power supply from the external aerial (coil), placed in the electromagnetic field, (electromagnetic oscillations with the frequency of 125 khz) Internal DC voltage limitation to prevent identifier tag fail in power electromagnetic field 64 bit EEPROM. data storage without power supply (nonvolatile memory); Data transfer by means of amplitude modulation; Data transfer ratio RF/64; Manchester coding of data. 100,000 memory program/erase cycles; Temperature range from minus 45 to plus 85 C; ESD protection up to 2000 V; Table 1 Contact pad description Contact pad number Symbol Function 01 COIL1 Coil connection I/O 02 COIL2 Coil connection I/O 03 GND Common 04 U CC Power supply Note Contact pads U CC, GND are purposed only for testing during IC manufacturing and are not used by customer 1

Fig. 1 Block diagram Table.2 Maximum ratings Symbol Parameter Target min max Unit I I Input current - 30 ma T Ambient temperature - 60 125 o C Table. 3 Recommended operation modes Symbol Parameter Target min max Unit I I Input current 10 ma f COIL Operating frequency 100 150 khz T Operating ambient temperature - 45 85 o C 2

Table. 4 Electric parameters Symbol Parameter Mode of testing I CC C RES Consumption current Resonance capacity Output voltage of modulator Value Ambient temperature, o C Unit min max U CC = 1,7 V 1,45-25±10 ua 1,50 85-40 f COIL = 125 khz 460 490 pf U Umod CC = 4,0 V 1,65 2,90 V Imod = 1,0 ma 1,50 3,00 8,0 r* Reading range f COIL = 125 khz - sm 9,0 * For readers 6H10D, ATAK 2270 refer Fig. 2. inductance coil and aerial of reader have be placed in alignment IZ2803-5 D1 integrated circuit L1 inductance coil 3,38 uh (S = 70 x 42 mm) P1 reader ATAK-2270 Fig. 2 Recommended application 3

Operation Tag being placed in the field of the reader switches over to READ mode and transmits the EEPROM content continuously. On receiving Write instruction tag switches over to WRITE mode and after Write operation completed returns to Read mode. Data from the tag to a reader transferred by means of amplitude modulation of carrier frequency. Manchester coding used to represent data bits Write/read operations of ROM are performed in accordance with the time diagram shown in Figures 3-5. W gap Read mode Write modeи Read mode T RST Instruction code Bloking bit Data Address EEPROM programming S gap T 1 T 0 T PROG Parameter Value Comment Min Max t RST >50 μs - Reset time S gap 10 T CLK 50 T CLK Start gap W gap 8 T CLK 30 T CLK Neighbor bit gap (transmitted) T 1 48 T CLK 63 T CLK Pulses number at delivery of 1 T 0 16 T CLK 31 T CLK Pulses number at delivery of 0 T PROG >2ms - EEPROM programming cycle T CLK (Т ОС ) - one clock cycle 125 khz Fig 3 Write mode timing diagramm At write operation most significant bit follows fist (high-order bit left bit). Instruction code: 10 L- memory lock bit («1» - 32 bit row is locked). Once set lock bit to «1» irreversibly disable memory write function. Address of page: 001 first page 010 second page Fig. 4 Write instruction format 4

Tос 64 Toc periods СОIL1 Serial data out BITn BIT n +1 BIT n +2 Fig. 5 - Data reading EM-Marin format code structure The memory contains 64 bits divided in five groups: - 9 bits are used for the header, ROM area ( 111111111 ); - 10 row parity bits (P0-P9); - 4 column parity bits (PC0-PC3); - 40 data bits (D00-D93); - 1 stop bit set to logic 0. The header is composed of the 9 first bits which are all programmed to "1". The header is followed by 10 data rows each consist of 4 data bits and 1 row parity bit. The last row consists of 4 column parity bits and 1 stop-bit S0 which is written to "0". Row parity bit is set to "0" if row contain even number of bits programmed to 1. otherwise row parity bit is set to "1, so data array is arrange in such way that dataflow never contain more than 4 1 -bits (except header) The exception - 9 bits of header programmed to "1" divides continuous dataflow to 64 bits units and serves to organize the synchronization with the reader. Bits D 00 -D 03, D 10 -D 13 (8 bits) define version and customer identification code. The rest of bits D 20 -D 93 (32 bits) data bits, define «unique code» of chip. Structure of code under EM-Marin format is shown at Fig. 6. 5

Header Customer code Unique code (number) of the chip Column parity control 00 08 (Cell number) 111111111 (Cell state) 09 10 11 12 13 P D 0 = 00 D (Cell address) 01 D 02 D 03 D 00^D 01^D 02^D 14 15 16 17 18 P 1 = D 10 D 11 D 12 D 13 D 10^D 11^D 12^D 19 20 21 22 23 P 2 = D 20 D 21 D 22 D 23 D 20^D 21^D 22^D 24 25 26 27 28 P 3 = D 30 D 31 D 32 D 33 D 30^D 31^D 32^D 29 30 31 32 33 P 4 = D 40 D 41 D 42 D 43 D 40^D 41^D 42^D 34 35 36 37 38 P 5 = D 50 D 51 D 52 D 53 D 50^D 51^D 52^D 39 40 41 42 43 P 6 = D 60 D 61 D 62 D 63 D 60^D 61^D 62^D 44 45 46 47 48 P 7 = D 70 D 71 D 72 D 73 D 70^D 71^D 72^D 49 50 51 52 53 P 8 = D 80 D 81 D 82 D 83 D 80^D 81^D 82^D 54 55 56 57 58 P 9 = D 90 D 91 D 92 D 93 D 90^D 91^D 92^D 59 60 61 62 63 PC PC 0 = D 1 = PC 2 = PC 3 = 00^D 10^ D ^D 01^D 11^ D 02^D 12^ D 03^D 13^ 20^D 30^D 40^ ^D ^D 21^D 31^D 41^ ^D 22^D 32^D 42^ ^D 23^D 33^D 43^ S0 = 0 50^D 60^ ^D ^D 51^D 61^ ^D 52^D 62^ ^D 53^D 63^ 70^D 80^D 90 ^D 71^D 81^D 91 ^D 72^D 82^D 92 ^D 73^D 83^D 93 03 13 23 33 43 53 63 73 83 93 Row parity control Stop bit Note - ^ - «XOR» logic operation Fig 6 Structure of data memory 6

Manchester code At Manchester data coding there is a transition in the middle of each bit period from from LOW to HIGH ( logic bit 1 is transmitted ) or from HIGH to LOW ( logic bit 0 is transmitted). (see Fig. 7). Binary data Х 1 1 1 1 1 1 1 1 1 0 1 0 1 0 0 0 1 1 0 EEPROM output data Coder output signal «1» High level voltage «0» Low level voltage «Х» Don care (low or high level voltage) Fig. 7 Manchester code 7

1,04 0,03 1,49 0,03 Technological marking Technological mark 2803 coordinates (mm): left bottom corner x = 0,790, y =0,248. Die thickness 0,46±0,02 mm. Contact pad number Coordinates (Left bottom corner), mm Contact pad dimensions, X Y mm 01 0,229 0,127 0,092 х 0,092 02 0,719 0,127 0,092 х 0,092 03 0,114 1,225 0,072 х 0,072 04 0,116 0,922 0,072 х 0,072 Note: Contact pad coordinates and size are indicated under «Passivation» layer Fig. 8 Chip diagram and contact pad location 8