ISM 868 MHz Ceramic Chip Antenna Model: AA701 TELA chip antenna Product Number: H2U64U1H2B0200 REFERENCE SPECIFICATION

Similar documents
ISM 915 MHz Ceramic Chip Antenna Model: AA702 TELA chip antenna Product Number: H2U64U1H2C0200 REFERENCE SPECIFICATION

WiFi/Bluetooth Ceramic Chip Antenna Model: AA055A TELA chip antenna Product Number: H2U34W1H1Z0400 REFERENCE SPECIFICATION

LTE Full-Band Ceramic Chip Antenna Model: CC35D8 Product Number: H2UE3P2D2G0100 REFERENCE SPECIFICATION

GNSS Ceramic Chip Antenna Model: AA099 TELA chip antenna Product Number: H2UC4W1H2D0300 REFERENCE SPECIFICATION

WiFi / Bluetooth Chip Antenna Model: AA029. Product Number: H2U262GKBA0100 REFERENCE SPECIFICATION

LTE Full-Band Ceramic Chip Antenna Model: CC40D9 Product Number: H2UE3P1D2G0100 REFERENCE SPECIFICATION

WiFi Dual Band PCB Substrate Antenna Model: AA258 Product Number: H2B1PC1A1C0100 REFERENCE SPECIFICATION

WiFi Dual Band PCB Substrate Antenna Model: AA222 Product Number: H2B1PD1A1C305L REFERENCE SPECIFICATION

RFID Chip Antenna ACAJ-110- ACAJ-110-T Moisture Sensitivity Level (MSL) MSL = 1. SPECIFICATION Frequency Range. 868/915MHz VSWR

Part No ISM or ISM & BT or GPS Stamp Metal Embedded Antenna

ISM 868 or 915 MHz Embedded Ceramic Antenna

Part No. P Broadband FR4 Embedded Cellular Antenna. Low Band MHz High Band MHz

Universal Broadband FR4 Embedded LTE Antenna. Low Band MHz High Band MHz

1. Explanation of Product Number

Dual Band Monopole Ceramic Chip Antenna

SPECIFICATION. : MHz Ceramic Loop antenna WLAN/ Wi-Fi/ HDMI

Ceramic Wi-Fi / Bluetooth Antenna

DATASHEET. It needs tuning process for customer s device. AMOTECH

Part No. M Ceramic Wi-Fi / Bluetooth Antenna

SPECIFICATION. Product Name : TheStripe Penta-band GSM 850/900/1800/1900 & UMTS/WCDMA 2100 MHz 80mm*30mm PCB Antenna for Murata GSC Connections

Application Note no.015

1. Explanation of Product Number

Weii 2.4 GHz Ceramic Antenna Part no: SRCW004 ceriiant Product Specification

Grandis Antenna for ISM applications Part No. SR42I010-L & SR42I010-R lamiiant Product Specification

M-BT-0911-PC Chip Antenna datasheet

Ceramic Monopole Antenna Ground cleared under antenna. Pulse Part Number: W3000

SPECIFICATION. Product Name : Dual-Band 2.4/5GHz Wi-Fi Ceramic SMD Antenna

AMCA R450G-S1F-T3 Pb

Application note and implementation guideline OnBoard SMD 434 MHz

OnBoard SMD WLAN antenna

SPECIFICATION. Product Name : Dual-Band 2.4/5GHz Wi-Fi Ceramic SMD Antenna

OnBoard SMD GSM/NB-IoT antenna

OnBoard SMD GSM/UMTS antenna

OnBoard SMD WLAN antenna

OnBoard SMD GSM/NB-IoT antenna

Technologies Corp. Antenna Catalog. Connect with Sense

Indica 2.4 GHz Chip Antenna Part No. A10381 giganova Product Specification

CubII 2.4GHz SMD Antenna Part No. GA123408BL03

SPECIFICATION. Product Name : 2.4GHz Band Dielectric Ceramic PIFA SMT Antenna for Bluetooth/WLAN/Zigbee Applications

SPECIFICATION. Patent Pending

Anaren 0805 (B0809J50ATI) balun optimized for Texas Instruments CC1100/CC1101 Transceiver

Specification Patent Pending PA.711.A. Part No. PAD.71X.A. Product Name

Cyaneus GPS Co-planar Antenna

Technologies Corp. Antenna Catalog. Connect with Sense

"High Frequency Ceramic Solutions"

Surface Mount Ceramic Chip Antennas for 2.4 GHz

Brevis GNSS SMD Antenna Part No. A giganova Product Specification

Cyaneus GPS Co-planar Antenna Part No. A10137 giganova Product Specification

Brevis GPS SMD Antenna

Brevis GNSS SMD Antenna Part No. A giganova Product Specification

SPECIFICATION. Patent Pending

"High Frequency Ceramic Solutions"

Specification. Model : 2.4GHz High Efficiency Loop Antenna. Description : 2.5dBi 2400MHz to 2500MHz WLAN/WIFI/Bluetooth/Zigbee

Rufa 2.4 GHz SMD Antenna Part No. 3030A5839 / 3030A5887 Product Specification

"High Frequency Ceramic Solutions"

SPECIFICATION. Description : GPS/GALILEO & Dual-Band Wi-Fi Ceramic Loop Antenna Embedded 2in1 Structure

Rubra Penta-band SMD Antenna

Clarki Quad-band M2M Antenna Part No. A10464 giganova Product Specification

Specification. Patent Pending

Impexa 2.4 GHz SMD Antenna Part No. A6150 giganova Product Specification

Mica 2.4 GHz SMD Antenna Part No. A5645 giganova Product Specification

ANT162442DT-2001A2. Multilayer Antenna (Dual Band type) For MHz / MHz. 1.6x0.8mm [EIA 0603]* September 2016

Fusca 2.4 GHz SMD Antenna

Mica 2.4 GHz SMD Antenna

Rufa 2.4 GHz SMD Antenna

Pin Configuration. Surface Mount 7.00 x 5.50 x 1.24 mm

Model BD4859L50100A00 Rev A

MAGICSTRAP Application Note Murata part number : LXMS31 series

Rufa 2.4 GHz SMD Antenna Part No. A5839 / A5887 giganova Product Specification

TQQ7399 DC 2700 MHz Through Line

OnBoard SMD 868/915 antenna

Specification. Atom FXP B. Patent Pending. Product Name FXP.75 Atom 2.4GHz Series Ultra-Miniaturized 2dBi Bluetooth Antenna.

Reflexus Penta-band SMD Antenna Part No. A10315 giganova Product Specification

"High Frequency Ceramic Solutions"

2.4 GHz ISM Band Working Frequency

Picea 2.4 GHz Swivel Antenna Part No. B5771 giganova Product Specification

MULTILAYER CERAMIC ANTENNA (LINEAR POLARIZATION MODE) FOR 400MHz~500MHz. Product Specification 1 (Preliminary)

SPECIFICATION Patent Pending

VI TELEFILTER Filter Specification TFS 246 H4 1/5

GPS Antenna Datasheet

SPECIFICATION. Low Profile Stacked Patch Antenna. Highest Accuracy, Lowest Profile Low Axial Ratio. Wideband GNSS Antenna. GPS L1+L2 Band Operation

Reflexus Penta-band SMD Antenna

Tfs248e.doc version VI TELEFILTER Filter specification TFS 248 E 1/5. D a t a typ. Value Limit

"High Frequency Ceramic Solutions"

EZConnect TM (FR05-S1-R-0-105) AN for Zigbee 868 MHz

Mixtus Dual-band Wi-Fi SMD Antenna Part No. A10194 giganova Product Specification

WLAN/BT/Zigbee/Wi-Fi/Embedded Stamp Metal Antenna

Leading antenna solution provider

Model BD3238N5050AHF. Ultra Low Profile 0404 Balun

OBSOLETE HMC915LP4E. GaAs MMIC MIXER w/ INTEGRATED LO AMPLIFIER, GHz. Typical Applications. Features. Functional Diagram. General Description

Vectron International Filter specification TFS 1575AA 1/5

APPLICATION NOTES AN-CERAMIC-MS

Vectron International Filter specification TFS /5

February Multilayer Antenna. For MHz ANT165550ST-1003A1. 1.6x0.8mm [EIA 0603]* * Dimensions Code JIS[EIA]

(FR05-S1-N-0-110) Bluetooth, Micro Reach Xtend TM. Zigbee, b/g/n WLAN. Micro Reach Xtend TM (FR05-S1-N-0-110)

400 MHz 4000 MHz Low Noise Amplifier ADL5521

Pin Configuration. Surface Mount x 6.50 x 1.75 mm SMP-75B

"High Frequency Ceramic Solutions"

MC-1010 Hardware Design Guide

Model B0922N7575AHF Rev B. Ultra Low Profile 0404 Balun

Transcription:

ISM 868 MHz Ceramic Chip Antenna Model: AA701 TELA chip antenna Product Number: H2U64U1H2B0200 REFERENCE SPECIFICATION Version: 10510A_rev-H

Table of Contents 1 Introduction... 3 2 Electrical Characteristics... 4 2.1 Table with electrical properties:... 4 2.2 Return Loss (S11)... 5 2.3 VSWR (S11)... 5 2.4 Efficiency Table... 6 2.5 Efficiency vs. Frequency... 6 2.6 Radiation Pattern (with 80x40mm 2 Evaluation Board)... 7 3 Layout... 8 3.1 Antenna Dimensions... 8 3.2 Evaluation Board with Antenna... 9 3.3 Solder Land Pattern... 10 4 Frequency tuning... 11 4.1 Reference for frequency tuning element... 12 5 Packing... 13 6 Notes... 14 6.1 Typical Soldering Profile for Lead-free Process... 14 6.2 Operating and storage conditions:... 15 6.3 Installation guide:... 15 6.4 Reminders for users of Unictron s AA055A ceramic chip antennas... 15 Page 2 / 16

1 Introduction Unictron s AA701 ceramic chip antenna is designed for ISM 868MHz band applications, covering frequencies 863~870 MHz. Fabricated with proprietary design and processes, AA701 shows excellent performance and is fully compatible with SMT processes which can decrease the assembly cost and improve device s quality and consistency. Features * Stable and reliable in performances * Low profile, compact size * RoHS compliance Applications * Short Range Devices (SRD) * IoT applications *Alarm system * SMT processes compatible Page 3 / 16

2 Electrical Characteristics 2.1 Table with electrical properties: Characteristics Specifications Unit Outline Dimensions 5.0 x 3.0 x 0.5 mm Ground Plane 80x40 mm Working Frequency 863~870 MHz VSWR (@center frequency)* 2 Max. Characteristic Impedance 50 Ω Polarization Linear Polarization Peak Gain -0.9 (typical) dbi ( @868 MHz) Efficiency 52 (typical) % *Center frequency means the frequency with the lowest value in return loss of the chip antenna on the evaluation board. Page 4 / 16

2.2 Return Loss (S 11 ) 2.3 VSWR (S 11 ) Page 5 / 16

2.4 Efficiency Table Datasheet: AA701-H2U64U1H2B0200 Frequency(MHz) 863 864 865 866 867 868 869 870 871 872 873 Efficiency(dB) -3.4-3.2-3.0-2.8-2.8-2.8-2.9-2.9-3.0-3.1-3.2 Efficiency(%) 45.9 48.4 50.3 52.2 52.5 52.8 51.8 50.8 50.3 49.2 47.7 Gain(dBi) -1.5-1.3-1.1-0.9-0.9-0.9-1.0-1.0-1.1-1.2-1.3 2.5 Efficiency vs. Frequency Page 6 / 16

2.6 Radiation Pattern (with 80x40mm 2 Evaluation Board) 3D Gain Pattern @ 868 MHz (unit: dbi) +Y +Y +X +X +Z +X X Z Y Page 7 / 16

3 Layout 3.1 Antenna Dimensions Top View Left View Front View Right View Unit: mm PIN Definitions Bottom View NOTE: 1. All materials are RoHS compliant 2. A - C Critical dimensions 3. ( ) Reference dimensions PIN3 PIN1 PIN2 Top View Bottom View PIN 1 2 3 Soldering Pad Signal Tuning/Ground N/C Page 8 / 16

3.2 Evaluation Board with Antenna Unit: mm Page 9 / 16

3.3 Solder Land Pattern The solder land pattern (gold marking areas) is shown below. Recommendation on matching circuit will be provided according to customer s installation conditions. Grounding pin Signal input Transmission line with 50 Ohm impedance characteristics. TOP VIEW BOTTOM VIEW Page 10 / 16

4 Frequency tuning Datasheet: AA701-H2U64U1H2B0200 Chip antenna tuning scenario Signal Input 4. Fine tuning element 3 2 1 For PIN 3 5. Fine tuning element Matching circuit With the following recommended values of matching and tuning components, the center frequencies will be about 868 MHz at out standard 80x40 mm 2 evaluation board. System Matching Circuit Component Location Description Vendor Tolerance 1 N/A - - 2 2.7nH (0402) DARFON ±0.1 nh 3 0.2 pf (0402) DARFON ±0.1 pf 18 pf (0402) DARFON ±2% 4 Fine tuning element 5 Fine tuning element 1.5 pf (0402) DARFON ± 0.1 pf If you are using a PCB board of different dimensions, the values of suitable matching and tuning components may differ. Feel free to contact a Unictron s representative at e-sales@unictron.com for further assistance adjusting these components, optimizing PCB layout and antenna s performance. Page 11 / 16

4.1 Reference for frequency tuning element When this tuning element is kept at 1 pf 22pF, 850MHz 8pF, 920MHz 4.7pF, 981MHz 20pF, 860MHz 12pF, 885MHz 6.2pF, 946MHz Page 12 / 16

5 Packing 1. Quantity/Reel: 6000 pcs/reel 2. Plastic tape: a) Tape drawing: b) Tape dimensions (unit: mm) Feature Specifications Tolerances W 12.00 ±0.30 P 8.00 ±0.10 E 1.75 ±0.10 F 5.50 ±0.10 P2 2.00 ±0.10 D 1.20 +0.10-0.00 Po 4.00 ±0.10 10Po 40.00 ±0.20 Page 13 / 16

6 Notes 6.1 Typical Soldering Profile for Lead-free Process 260 C 20-40s Temperature ( C) 217 C 150-200 C Pre-heating 60-180s 60-150s Time (s.) Page 14 / 16

6.2 Operating and storage conditions: Datasheet: AA701-H2U64U1H2B0200 Operating: Maximum Input Power: 2W Operating Temperature: -40 C to +85 C 6.3 Installation guide: Storage: Storage Temperature -5 C to +40 C Relative Humidity: 20% to 70% Shelf Life: 1 year Request Unictron s application notes General guidelines for the installation of Unictron s chip antennas for further information at e-sales@unictron.com. 6.4 Reminders for users of Unictron s AA055A ceramic chip antennas 6.4.1. This chip antenna is made of ceramic materials which are relatively more rigid and brittle compared to printed circuit board materials. Bending of circuit board at the locations where chip antenna is mounted may cause the cracking of solder joints or antenna itself. 6.4.2. Punching/cutting of the break-off tab of PCB panel may cause severe bending of the circuit board which may result in cracking of solder joints or chip antenna itself. Therefore break-off tab shall be located away from the installation site of chip antenna. 6.4.3. Be cautious when ultrasonic welding process needs to be used near the locations where chip antennas are installed. Strong ultrasonic vibration may cause the cracking of chip antenna solder joints. Page 15 / 16

Presented data were measured on reference PCB (ground) as shown in this specification. When the antenna placement or size of the PCB is changed, antenna performance and values of matching components may differ from data shown here. Information presented in this Reference Specification is believed to be correct as of the date of publishing. Unictron Technologies Corporation reserves the rights to change the Reference Specification without notice due to technical improvements, etc. Please consult with Unictron s engineering team about the latest information before using this product. Per request, we may provide advice and assistance in implementing this antenna to a customer s device by simulation or real measurement of the interested device in our testing facilities. Unictron Technologies Corporation No. 41 Shuei-Keng, Guan-Si Hsinchu 30648 Taiwan (R.O.C.) Tel: +886-3-547-5550 Email: e-sales@unictron.com Web: www.unictron.com Page 16 / 16