General Purpose Amplifier RF3376 General Purpose Amplifier Package Style: SOT8 Features DC to >6000MHz Operation Internally Matched Input and Output 22dB Small Signal Gain +2.0dB Noise Figure +11dBm Output P1dB Useable with 5V Supply GND 4 Applications Basestation Applications Broadband, Low-Noise Gain Blocks IF or RF Buffer Amplifiers Driver Stage for Power Amplifiers Final PA for Low-Power Applications High Reliability Applications Product Description 1 2 3 GND Functional Block Diagram The RF3376 is a general purpose, low-cost RF amplifier IC. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as an easily-cascadable 50 gain block. Applications include IF and RF amplification in wireless voice and data communication products operating in frequency bands up to 6000MHz. The device is self-contained with 50 input and output impedances and requires only two external DCbiasing elements to operate as specified. Ordering Information RF3376 Sample bag with 25 pieces RF3376SR 7 reel with 100 pieces RF3376TR13 13 reel with 2500 pieces RF3376PCK-410 0MHz to 6000MHz PCBA with 5-piece sample bag RF MICRO DEVICES, RFMD, Optimum Technology Matching, Enabling Wireless Connectivity, PowerStar, POLARIS TOTAL RADIO and UltimateBlue are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. 2012, RF Micro Devices, Inc. 1 of 7
Absolute Maximum Ratings Parameter Rating Unit Input RF Power +3 dbm Operating Ambient Temperature -40 to +85 C Storage Temperature -60 to +150 C I CC 50 ma Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No Specification Parameter Unit Condition Min. Typ. Max. Overall T=25 C, I CC =35mA (See Note 1.) Frequency Range DC to >6000 MHz 3dB Bandwidth 2 GHz Gain 23.5 db Freq=500MHz 22.5 db Freq=1000MHz 18.0 19.8 db Freq=2000MHz 18.0 db Freq=3000MHz 16.0 Freq=4000MHz 12.8 Freq=6000MHz Noise Figure 2.0 db Freq=2000MHz Input VSWR <2:1 In a 50 system, DC to 4500MHz Output VSWR <2:1 In a 50 system, DC to 6000MHz Output IP 3 +24.4 dbm Freq=1000MHz +21.5 +23.4 dbm Freq=2000MHz Output P 1dB +11.5 dbm Freq=1000MHz +9.5 +11.5 dbm Freq=2000MHz Reverse Isolation 22.5 db Freq=2000MHz Thermal I CC =35mA (See Note 3.) Theta JC 216 C/W Maximum Measured Junction Temperature at DC Bias Conditions 110 C T CASE =+ Mean Time To Failures >100 years T CASE =+ Power Supply With 22 bias resistor Device Operating Voltage 3.3 V At pin 3 with I CC =35mA 5.0 v At evaluation board connector, I CC =35mA Operating Current 35 50 ma See Note 2. Note 1: All specification and characterization data has been gathered on standard FR-4 evaluation boards. These evaluation boards are not optimized for frequencies above 2.5GHz. Performance above 2.5GHz may improve if a high performance PCB is used. Note 2: The RF3376 must be operated below 50mA. 35mA to 45mA is the recommended bias to ensure the highest possible reliability and electrical performance. Note 3: Because of process variations from part to part, the current resulting from a fixed bias voltage will vary. As a result, caution should be used in designing fixed voltage bias circuits to ensure the worst case bias current does not exceed 50mA over all intended operating conditions. 2 of 7
Pin Function Description Interface Schematic 1 RF input pin. This pin is NOT internally DC blocked. A DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. DC coupling of the input is not allowed, because this will override the internal feedback loop and cause temperature instability. 2 GND Ground connection. 3 RF output and bias pin. Biasing is accomplished with an external series resistor and choke inductor to V CC. The resistor is selected to set the DC current into this pin to a desired level. The resistor value is determined by the following equation: R V SUPPLY V DEVICE I CC = ------------------------------------------------------ Care should also be taken in the resistor selection to ensure that the current into the part never exceeds 40mA over the planned operating temperature. This means that a resistor between the supply and this pin is always required, even if a supply near 3.4V is available, to provide DC feedback to prevent thermal runaway. Because DC is present on this pin, a DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. The supply side of the bias network should also be well bypassed. 4 GND Ground connection. Package Drawing 1.04 0.80 0.50 0.30 1.60 1.40 3.10 2.90 4.60 4.40 0.48 0.36 2 PL 2.60 2.40 1.80 1.45 Dimensions in mm. Shaded lead is pin 1. 0.43 0.38 1.75 1.40 0.53 0.41 3 of 7
Application Schematic 4 V CC = 5.0 V 47 + 1 F P1 1 2 3 100 nh Evaluation Board Schematic P1-1 1 VCC1 2 GND 3 CON3 4 R1 47 C3 + C4 1 F VCC = 5.0 V J1 50 strip C1 337x410, r.1 1 2 3 L1 100 nh C2 50 strip J2 4 of 7
Evaluation Board Layout Board Size 1.195" x 1.000" Board Thickness 0.033, Board Material FR-4 5 of 7
25.0 Gain versus Frequency Across Temperature 16.0 Output P1dB versus Frequency Across Temperature 14.0 Gain (db) 15.0 Output Power (dbm) 12.0 8.0 5.0 6.0 4.0 30.0 Output IP3 versus Frequency Across Temperature 3.5 Noise Figure versus Frequency Across Temperature 25.0 3.0 OIP3 (dbm) 15.0 Noise Figure (db) 2.5 2.0 1.5 1.0 5.0 0.0 0.5 0.0 0.0 500.0 1000.0 1500.0 2000.0 2500.0 3000.0 3500.0 4.0 Input VSWR versus Frequency Across Temperature 2.5 Output VSWR versus Frequency Across Temperature 3.5 3.0 2.0 VSWR 2.5 VSWR 2.0 1.5 1.5 1.0 1.0 6 of 7
- Reverse Isolation versus Frequency Across Temperature 140.00 Junction Temperature versus Power Dissipated (T AMBIENT=) 130.00 Reverse Isolation (db) -15.0 - -25.0 Junction Temperature ( C) 10 10 100.00 90.00-30.0 80.00 70.00 0.07 0.08 0.09 0.10 0.11 0.12 0.13 Power Dissipated (Watts) 0.20 Power Dissipation versus Device Voltage Across Temperature (T AMBIENT=+) 60.0 Bias Current versus Supply Voltage Across Temperature (At evaluation board connector, R BIAS=22 ) 0.18 0.16 50.0 Power Dissipated (W) 0.14 0.12 0.10 0.08 0.06 ICC (ma) 40.0 30.0 0.04 0.02 0.00 3.10 3.12 3.14 3.16 3.18 3.20 3.22 3.24 3.26 3.28 3.30 V PIN (V) 0.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 V CC (V) 60.0 Bias Current versus Devices Voltage Across Temperature (At Pin 3 of the RF3376) 55.0 50.0 45.0 40.0 ICC (ma) 35.0 30.0 25.0 15.0 3.0 3.2 3.4 3.6 3.8 V PIN (V) 7 of 7