PACKAGE DIMENSIONS.87 (2.2).71 (1.8).57 (1.45).41 (1.5) R.8 (.2) TOP CATHODE.55 (1.4).12 (.3) 2X.47 (1.2).41 (1.5).24 (.6) SIDE.16 (.4) 2X.47 (1.2) BOTTOM NOTE: + - POLARITY Dimensions for all drawings are in inches (mm). APPLICATIONS Keypad backlighting Push-button backlighting LCD backlighting DESCRIPTION These surface mount chip LEDs are designed to fit industry standard footprint. Low profile and wide viewing angle make these LEDs ideal choices for backlighting applications and panel illumination. FEATURES Small footprint - 2.(L) X 1.25(W) X 1.1(H) mm AllnGaP technology for -R, -E, -O, -Y and -AG InGaN/SiC technology for -IG and -IB Wide viewing angle of 14 Water clear optics Moisture-proof packaging Available in.315 (8mm) width tape on 7 (178mm) diameter reel; 2, units per reel 21 Fairchild Semiconductor Corporation DS394 8/3/1 1 OF 8 www.fairchildsemi.com
ABSOLUTE MAXIMUM RATINGS (TA =25 C Unless otherwise specified) Parameter Symbol QTLP63C -R -E -O -Y -AG Continuous Forward Current I F 3 3 3 25 3 ma Peak Forward Current (f = 1. KHz, Duty Factor = 1/1) I FM 16 16 16 12 16 ma Reverse Voltage V R 5 5 5 5 5 V Power Dissipation P D 72 72 72 6 72 mw Operating Temperature T OPR -4 to +85 C Storage Temperature T STG -4 to +9 C Lead Soldering Time T SOL 26 for 5 sec C Units ABSOLUTE MAXIMUM RATINGS (TA =25 C Unless otherwise specified) Parameter Symbol -IB QTLP63C Continuous Forward Current I F 3 3 ma Peak Forward Current (f = 1. KHz, Duty Factor = 1/1) I FM 1 1 ma Reverse Voltage V R 5 5 V Power Dissipation P D 12 12 mw Operating Temperature T OPR -4 to +85 C Storage Temperature T STG -4 to +9 C Lead Soldering Time T SOL 26 for 5 sec C -IG Units www.fairchildsemi.com 2 OF 8 8/3/1 DS394
ELECTRICAL / OPTICAL CHARACTERISTICS (TA =25 C) Part Number Symbol QTLP63C -R -E -O -Y -AG Condition Luminous Intensity (mcd) Minimum I V 15 15 15 15 1 I F = 2mA Typical 4 4 4 4 15 Forward Voltage (V) Maximum V F 2.4 2.4 2.4 2.4 2.4 I F = 2mA Typical 2. 2. 2. 2. 2. Wavelength (nm) Peak P 63 62 61 59 575 I F = 2mA Dominant D 624 615 65 589 573 Spectral Line Half Width (nm) 2 18 18 15 2 I F = 2mA Viewing Angle ( ) 2 1/ 2 14 14 14 14 14 I F = 2mA ELECTRICAL / OPTICAL CHARACTERISTICS (TA =25 C) Part Number Symbol -IB QTLP63C -IG Condition Luminous Intensity (mcd) Minimum I V 2 75 I F = 2mA Typical 25 12 Forward Voltage (V) Maximum V F 4. 4. I F = 2mA Typical 3.5 3.5 Wavelength (nm) Peak P 465 52 I F = 2mA Dominant D 47 525 Spectral Line Half Width (nm) 25 35 I F = 2mA Viewing Angle ( ) 2 1/ 2 14 14 I F = 2mA DS394 8/3/1 3 OF 8 www.fairchildsemi.com
TYPICAL PERFORMANCE CURVES (QTLP63C-R, -E, -O, -Y and -AG) Fig. 1 Forward Current vs. Forward Voltage IF - FORWARD CURRENT (ma) 1 9 8 7 6 5 4 3 2 1 1. 1.5 2. 2.5 3. VF - FORWARD VOLTAGE (V) RELATIVE LUMNOUS INTENSITY (NORMALIZED AT 2 ma) Fig. 2 Relative Luminous Intensity vs. DC Forward Current 2.5 2. 1.5 1..5. 1 2 3 4 5 I F - DC FORWARD CURRENT (ma) Fig. 3 Relative Intensity vs. Peak Wavelength 1. AG Y O E R RELATIVE INTENSITY.5 5 55 6 65 7 WAVELENGTH (nm) Fig.4 Radiation Diagram -2-1 1 2-3 3-4 4-5 5-6 6-7 7-8 8-9 9 1..8.6.4.2.2.4.6.8 1. IF - FORWARD CURRENT (ma) 5 4 3 2 1 Fig.5 Maximum Forward Current vs. Ambient Temperature R, E, O and AG Y 25 5 75 1 REL. LUMINOUS INTENSITY (%) AMBIENT TEMPERATURE T A ( C) www.fairchildsemi.com 4 OF 8 8/3/1 DS394
TYPICAL PERFORMANCE CURVES (QTLP63C-IG and IB) IF - FORWARD CURRENT (ma) Fig. 1 Forward Current vs. Forward Voltage 1 9 8 7 6 5 IG 4 IB 3 2 1 2. 2.5 3. 3.5 4. 4.5 5. V F - FORWARD VOLTAGE (V) RELATIVE LUMNOUS INTENSITY (NORMALIZED AT 2 ma) Fig. 2 Relative Luminous Intensity vs. DC Forward Current 2.5 2. 1.5 1..5. 1 2 3 4 5 I F - DC FORWARD CURRENT (ma) Fig. 3 Relative Intensity vs. Peak Wavelength 1. IB IG RELATIVE INTENSITY.5 4 45 5 55 6 65 WAVELENGTH (nm) Fig.4 Radiation Diagram -2-1 1 2-3 3-4 4-5 5-6 6-7 7-8 8-9 9 1..8.6.4.2.2.4.6.8 1. IF - FORWARD CURRENT (ma) 5 4 3 2 1 Fig.5 Maximum Forward Current vs. Ambient Temperature 25 5 75 1 REL. LUMINOUS INTENSITY (%) AMBIENT TEMPERATURE T A ( C) DS394 8/3/1 5 OF 8 www.fairchildsemi.com
RECOMMENDED PRINTED CIRCUIT BOARD PATTERN.35 (.9).47 (1.2).47 (1.2) 2X RECOMMENDED IR REFLOW SOLDERING PROFILE 5 sec MAX soldering time 24 C MAX +5 C/s MAX -5 C/s MAX 6-12 sec Preheating 12-15 C MAX www.fairchildsemi.com 6 OF 8 8/3/1 DS394
TAPE AND REEL DIMENSIONS 2.5±.5 +1.5 8.4 -. 11. +.5 -. Ø18±1 Ø62.±.5 2.5±.5 +.25 Ø12.75 -. Progressive direction 1.75 2.±.5 4. Ø1.55.±5.25±.1 3.5±.5 8. 2.39±.5 1.27 4. 1.63 Polarity Dimensional tolerance is ±.1mm unless otherwise specified Angle: ±.5 Unit: mm DS394 8/3/1 7 OF 8 www.fairchildsemi.com
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 8 OF 8 8/3/1 DS394