TC520A. Serial Interface Adapter for TC500 A/D Converter Family. General Description. Features. Applications. Device Selection Table.

Similar documents
TC623. 3V, Dual Trip Point Temperature Sensor. Package Type. Features. Applications. General Description. Device Selection Table

TC52. Dual Channel Voltage Detector. Features. General Description. Typical Applications. Functional Block Diagram. Device Selection Table

M TC3682/TC3683/TC3684

PIC14C000. Errata Sheet for PIC14C000 Revision A. USING THE I 2 C MODULE IN SMBus MODE USING AN1 AND AN5 AS ANALOG INPUTS

TC51. 1µA Voltage Detector with Output Delay TC51. General Description. Features. Applications. Device Selection Table. Functional Block Diagram

TC mA Charge Pump Voltage Converter with Shutdown. Features. Package Type. Applications. General Description. Device Selection Table

TC1221/TC1222. High Frequency Switched Capacitor Voltage Converters with Shutdown in SOT Packages. 6-Pin SOT-23A. Features. General Description

M TC1426/TC1427/TC1428

AN820. System Supervisors in ICSP TM Architectures CIRCUITRY BACKGROUND INTRODUCTION. MCP120 Output Stage. Microchip Technology Inc.

AN562. Using Endurance Predictive Software. Using the Microchip Endurance Predictive Software INTRODUCTION TOTAL ENDURANCE PREDICTIVE SOFTWARE

1.5A Dual Open-Drain MOSFET Drivers. 8-Pin PDIP/SOIC/CERDIP IN A A BOTTOM IN B B TOP A TOP B BOTTOM IN A B TOP IN B

TC620/TC621. 5V, Dual Trip Point Temperature Sensors. Features. Package Type. Applications. Device Selection Table. General Description

TC Low Power, Quad Input, 16-Bit Sigma-Delta A/D Converter Features Package Type 16-Pin PDIP 16-Pin QSOP TC3402 Applications

1.5A Dual High-Speed Power MOSFET Drivers. Temp. Range

AN603. Continuous Improvement THE EEPROM TECHNOLOGY TEAM INTRODUCTION TO MICROCHIP'S CULTURE. Continuous Improvement is Essential

Using the TC1142 for Biasing a GaAs Power Amplifier. CTL High-Side. FET Switch GND V IN V OUT TC GND. Inductorless Boost/Buck Regulator

TC7662A. Charge Pump DC-to-DC Converter. Features. Package Type. General Description. Applications. Device Selection Table. 8-Pin PDIP 8-Pin CERDIP

TC1225 TC1226 TC1227. Inverting Dual ( V IN, 2V IN ) Charge Pump Voltage Converters FEATURES GENERAL DESCRIPTION TYPICAL APPLICATIONS

rfpic Development Kit 1 Quick Start Guide

TC1029. Linear Building Block Dual Low Power Op Amp. General Description. Features. Applications. Device Selection Table. Functional Block Diagram

AN797. TC4426/27/28 System Design Practice INTRODUCTION. FIGURE 1: TC4426 output. FIGURE 2: Output stage IC layout.

TC mA Fixed Low Dropout Positive Regulator TC2117. General Description. Features. Applications. Typical Application Device Selection Table

TC4426 TC4427 TC A DUAL HIGH-SPEED POWER MOSFET DRIVERS GENERAL DESCRIPTION FEATURES ORDERING INFORMATION

MCP100/101. Microcontroller Supervisory Circuit with Push-Pull Output FEATURES PACKAGES DESCRIPTION BLOCK DIAGRAM

PIC16C622A PIC16F628 Migration

AN566. Using the PORTB Interrupt on Change as an External Interrupt USING A PORTB INPUT FOR AN EXTERNAL INTERRUPT INTRODUCTION

AN765. Using Microchip's Micropower LDOs INTRODUCTION APPLICATIONS. Optimizing Output Voltage Accuracy of 1070/1071 Adjustable LDOs

TCM828 TCM829. Switched Capacitor Voltage Converters FEATURES GENERAL DESCRIPTION APPLICATIONS ORDERING INFORMATION

TC652 Fan Control Demo Board User s Guide

TC1034/TC1035 Linear Building Block Single Operational Amplifiers in SOT Packages Features General Description Applications Device Selection Table

HCS410/WM. Crypto Read/Write Transponder Module FEATURES PACKAGE TYPES BLOCK DIAGRAM HCS410 IMMOBILIZER TRANSPONDER. Security. Operating.

TC4423 TC4424 TC4425 3A DUAL HIGH-SPEED POWER MOSFET DRIVERS GENERAL DESCRIPTION FEATURES ORDERING INFORMATION

TC Bit Digital-to-Analog Converter with Two-Wire Interface TC1321. General Description. Features. Applications. Device Selection Table

HCS362. HCS362 Data Sheet Errata. Clarifications/Corrections to the Data Sheet: 1. Module: Low Voltage Detector LOW VOLTAGE DETECTOR

AN763. Latch-Up Protection For MOSFET Drivers INTRODUCTION. CONSTRUCTION OF CMOS ICs PREVENTING SCR TRIGGERING. Grounds. Equivalent SCR Circuit.

TB059. Using The MCP2150 Developer s Board With The MCP2155 INTRODUCTION MCP2150 DEVELOPER S BOARD LAYOUT

TC1030. Linear Building Block Quad Low Power Op Amp with Shutdown Modes. General Description. Features. Applications. Device Selection Table

TC643 INTEGRATED FAN / MOTOR DRIVER GENERAL DESCRIPTION FEATURES APPLICATIONS ORDERING INFORMATION

27LV K (32K x 8) Low-Voltage CMOS EPROM FEATURES PACKAGE TYPES DESCRIPTION PDIP

Design Alternatives To The TC682 For Performing Inverting Voltage Doubler Functions. DC/DC Converter +5V 6 V IN V OUT TC682 NC GND 5

TC115. PFM/PWM Step-Up DC/DC Converter. Package Type. Features. Applications. General Description. Device Selection Table. Functional Block Diagram

AN867. Temperature Sensing With A Programmable Gain Amplifier INTRODUCTION INTERFACING THE PGA TO THERMISTORS

TC7652. Low Noise, Chopper Stabilized Operational Amplifier. General Description. Features. Applications. Device Selection Table.

TC7650. Chopper Stabilized Operational Amplifier. Package Type. Features. Applications. Device Selection Table. 8-Pin DIP TC7650CPA.

TC1240/TC1240A. Positive Doubling Charge Pumps with Shutdown in a SOT-23 Package. Features. General Description. Applications

TC1026. Linear Building Block Low Power Comparator with Op Amp and Voltage Reference. General Description. Features. Applications

AN798. TC4420/4429 Universal Power MOSFET Interface IC INTRODUCTION PARAMETERS AND ATTRIBUTES OF THE TC4420/4429 TIMING. Rise and Fall Times

SUPER CHARGE PUMP DC-TO-DC VOLTAGE CONVERTER

AN528. Implementing Wake-Up on Key Stroke. Implementing Wake-Up on Key Stroke INTRODUCTION IMPLEMENTATION FIGURE 1 - TWO KEY INTERFACE TO PIC16C5X

PICmicro Microcontroller Firmware Flow Chart of DV Demo Reader for MCRF3XX and MCRF4XX Devices. RFID Top-Level MAIN INITIALIZE

2-Wire Serial Temperature Sensor and Thermal Monitor

TC1044S. Charge Pump DC-TO-DC Voltage Converter FEATURES GENERAL DESCRIPTION ORDERING INFORMATION

PIC16C65A. PIC16C65A Rev. A Silicon Errata Sheet. 2. Module: CCP (Compare Mode) 1. Module: CCP (Compare Mode) SWITCHING

TC /2 Digit Analog-to-Digital Converters with On-Chip LCD Drivers. Features. General Description. Applications. Device Selection Table

MCP1252/3. Low Noise, Positive-Regulated Charge Pump. Description. Features. Applications. Package Types

TC4467 TC4468 TC4469 LOGIC-INPUT CMOS QUAD DRIVERS GENERAL DESCRIPTION FEATURES APPLICATIONS ORDERING INFORMATION

PFM/PWM Step-Down DC/DC Controller. Operating Temp. Range C SS SHDN TC105333ECT EXT GND. 3.3V Regulated Supply Using 6V NiMH Battery Pack Input

TC7116/A/TC7117/A. 3-1/2 Digit Analog-to-Digital Converters with Hold. General Description. Features. Applications. Device Selection Table

TB081. Soft-Start Controller For Switching Power Supplies IMPLEMENTATION OVERVIEW. Hardware SCHEMATIC. Keith Curtis Microchip Technology Inc.

Using External RAM with PIC17CXX Devices PIC17C42 PIC17C43 PIC17C Microchip Technology Inc. DS91004A-page 1

TC57 Series. Linear Regulator Controller GENERAL DESCRIPTION FEATURES TYPICAL APPLICATIONS ORDERING INFORMATION PART CODE TC57 XX 02 ECT XX

FACT002. Mastering the PIC16C7X A/D Converter BASICS. General. Step by Step. Specifications

Connecting Sensor Buttons to PIC12CXXX MCUs

AN513. Analog to Digital Conversion Using a PIC16C54 INTRODUCTION THEORY OF OPERATION VOLTMETER A/D CONVERTER VOLTMETER MEASUREMENT CYCLE CYCLE

AN677. Designing a Base Station Coil for the HCS410 INTRODUCTION OVERVIEW FEATURES. Overview of Inductive Communication.

MCP V 10-Bit A/D Converter with SPI Serial Interface FEATURES PACKAGE TYPES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM DESCRIPTION

27C K (32K x 8) CMOS EPROM FEATURES PACKAGE TYPES DESCRIPTION

Single Cell Lithium-Ion Charge Management Controller with Mode Indicator and Charge Current Monitor. + Single Lithium-Ion

AN824. KEELOQ Encoders Oscillator Calibration OVERVIEW WHY CALIBRATION? CALIBRATION BASICS. Microchip Technology Inc.

TC7136/TC7136A. Low Power 3-1/2 Digit Analog-to-Digital Converter. General Description. Features. Applications. Device Selection Table

TCM680 +5V TO ±10V VOLTAGE CONVERTER GENERAL DESCRIPTION FEATURES APPLICATIONS ORDERING INFORMATION

TC32M. ECONOMONITOR 3-Pin System Supervisor with Power Supply Monitor and Watchdog. Features: General Description: Applications:

MCP V Dual Channel 12-Bit A/D Converter with SPI Serial Interface PACKAGE TYPES FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM DESCRIPTION

Voltage-To-Frequency/Frequency-To-Voltage Converters

MCP3204/ V 4-Channel/8-Channel 12-Bit A/D Converters with SPI Serial Interface FEATURES PACKAGE TYPES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM

TC1047/TC1047A. Precision Temperature-to-Voltage Converter. General Description. Applications. Block Diagram. Features.

AN872. Upgrading from the MCP2510 to the MCP2515 MCP2515 ENHANCEMENTS AND DIFFERENCES INTRODUCTION. Enhancements. Differences

Single Cell Lithium-Ion Charge Management Controller with Charge Complete Indicator and Temperature Monitor. + Single - Lithium-Ion Cell

TC Bit, Fast Integrating CMOS A/D Converter. Package Types. Features. Applications. Device Selection Table

Optical Pyrometer. Functions

Ultra Small Temperature Switches with Pin Selectable Hysteresis. 100 pf T UNDER TC6503 T UNDER TC6504 TC6502

FACT003. Care and Feeding of the PIC16C74 and Its Peripherals. A/D Converter Mysteries. Assumptions

M TC4423/TC4424/TC4425

PIC16F818/819. PIC16F818/819 Rev. B0 Silicon Errata Sheet

TC620/TC621. 5V, Dual Trip Point Temperature Sensors. Features: Package Type. Applications: Device Selection Table. General Description:

TC115. PFM/PWM Step-Up DC/DC Converter. Features. Package Type. General Description. Applications. Functional Block Diagram TC115

AN232. Low Frequency Magnetic Transmitter Design ABOUT THIS APPLICATION NOTE INTRODUCTION LFMC LINK COMPONENTS

Linear Building Block Low-Power Comparator with Op Amp and

4-1/2 Digit Analog-To-Digital Converter with On-Chip LCD Drivers

MIC5528. High Performance 500 ma LDO in Thin and Extra Thin DFN Packages. General Description. Features. Applications.

AN861. Smart Air Handler using ProMPT and the PIC18F2539 APPLICATION OVERVIEW INTRODUCTION. Microchip Technology Inc.

27C64. 64K (8K x 8) CMOS EPROM PACKAGE TYPES FEATURES DESCRIPTION. This document was created with FrameMaker 404

MCP3221. Low Power 12-Bit A/D Converter with I 2 C Interface. Features. Description. Applications. Functional Block Diagram.

AN762. Applications of the TC62X Solid-State Temperature Sensors INTRODUCTION. FIGURE 1: Block Diagram of the TC620 Temperature Sensor.

TC682. Inverting Voltage Doubler. General Description: Features: Applications: Functional Block Diagram. Device Selection Table. Package Type TC682

TYPICAL SEGMENT OUTPUT. 0.5mA. 2mA INTERNAL DIGITAL GROUND C AZ C INT V INT INTEGRATOR TO DIGITAL SECTION A/Z COMPARATOR

PIC16F818/819. PIC16F818/819 Rev. A4 Silicon Errata Sheet. 2. Module: PORTB FIGURE 1: 1. Module: Internal RC Oscillator

AN1085. Using the Mindi Power Management Simulator Tool INTRODUCTION ACCESSING MINDI ON MICROCHIP S WEB SITE

TC7106/A/TC7107/A. 3-1/2 Digit Analog-to-Digital Converters. General Description. Features. Applications. Device Selection Table

HCS101. Fixed Code Encoder FEATURES PACKAGE TYPES HCS101 BLOCK DIAGRAM DESCRIPTION. Operating. Other. Typical Applications

Transcription:

Serial Interface Adapter for TC500 A/D Converter Family Features Converts TC500/TC500A/TC510/TC514 to Serial Operation Programmable Conversion Rate and Resolution for Maximum Flexibility Supports up to 17-Bits of Accuracy Plus Polarity Bit Low Power Operation: Typically 7.5mΩ 14-Pin PDIP or 16-Pin SOIC Packages Polled or Interrupt Mode Operation Applications Computer Peripheral Interface Portable Instruments Data Acquisition System Interface Device Selection Table Part Number Package Temperature Range TC520ACOE 16-Pin SOIC (Wide) 0 C to +70 C TC520ACPD 14-Pin PDIP 0 Cto +70 C Package Type General Description The TC520A serial interface adapter provides logic control for Microchip's TC500/TC500A/TC510/TC514 family of dual slope, integrating A/D converters. It directly manages TC500 converter phase control signals A, B and CMPTR, thereby reducing host processor task loading and software complexity. Communication with the TC520A is accomplished over a 3 wire serial port. Key converter operating parameters are programmable for complete user flexibility. Data conversion is initiated when the CE input is brought low. The converted data (plus overrange and polarity bits) are held in an 18-bit shift register until read by the processor or until the next conversion is completed. Data may be clocked out of the TC520A at any time, and at any rate, the user prefers. A Data Valid (DV)output is driven active at the start of each conversion cycle, indicating the 18-bit shift register update has just been completed. This signal may be polled by the processor or can be used as data ready interrupt. The TC520A timebase can be derived from an external frequency source of up to 6MHz or can operate from its own external crystal. It requires a single 5V logic supply and dissipates less than 7.5mΩ. V DD DGND CMPTR B A OSC OUT OSC IN 14-Pin PDIP 1 14 2 13 3 12 TC520A 4 11 5 10 6 9 7 8 CE DV D IN DCLK D OUT READ 16-Pin SOIC V DD 1 16 CE DGND 2 15 DV CMPTR 3 14 B A 4 5 TC520A 13 12 D IN DCLK OSC OUT 6 11 D OUT OSC IN 7 10 READ N/C 8 9 N/C 2002 Microchip Technology Inc. DS21431B-page 1

Functional Block Diagram V DD GND 1 2 8-Bit Shift Reg. 8 Gate 8-Bit Counter 256 Gate Pinout of 14-Pin Package 11 D IN A B CMPTR CE DV OSC IN OSC OUT 5 4 3 14 13 7 6 Logic Control SYSCLK 4 Gate Timeout Force Auto Zero Polarity Bit Clear Count 18-Bit Shift Register 16 16-Bit Counter Overrange Bit Gate 12 9 10 8 D OUT DCLK READ DS21431B-page 2 2002 Microchip Technology Inc.

1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* DC Supply Voltage (V DD )... +6.0V Input Voltage (All Inputs V IN ):... - 0.3V to (V DD +0.3V) Operating Temperature Range (T A )... 0 C to 70 C Storage Temperature Range... -65 C to +150 C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC520A ELECTRICAL SPECIFICATIONS Electrical Characteristics: V DD =5V,F OSC =1MHz,T A = +25 C, unless otherwise specified. Symbol Parameters Min Typ Max Unit Test Conditions Supply V DD Operating Voltage Range 4.5 5 5.5 V I DD Supply Current 0.8 1.5 ma Input Characteristics V IL Low Input Voltage 0.8 V V IH High Input Voltage 2.0 V I IL Input Leakage Current 10 µa I PD Pull-down Current (CE) 5 µa I PU Pull-up Current (READ, ) 5 µa Output Characteristics (I OUT =250µA, V DD =5V) V OL Low Output Voltage 0.2 0.3 V V OH High Output Voltage 3.5 4.3 V T R,T F C L = 10pF, Rise/Fall Times 250 nsec Oscillator (OSC IN,OSC OUT ) F XTL Crystal Frequency 1.0 4.0 MHz F OSC External Frequency (OSC IN ) 6.0 MHz Timing Characteristics T RD READ Delay Time 250 nsec T RS Data Read Setup Time 1 µsec T DRS D CLK to D OUT Delay 450 nsec T LS Setup Time 1 µsec T DLS Data Load Setup Time 50 nsec T PWL D CLK Pulse Width Low Time 150 nsec T PWH D CLK Pulse Width High Time 150 nsec T LDL Load Default Low Time 250 nsec T LDS Load Default Setup Time 250 nsec Parameter T IZ Integrator ZERO Time 0.5 msec T AZI Auto zero (RESET) Time at Power-Up 100 msec 2002 Microchip Technology Inc. DS21431B-page 3

2.0 PIN DESCRIPTIONS ThedescriptionsofthepinsarelistedinTable2-1 TABLE 2-1: PIN FUNCTION TABLE Pin Number 14-Pin PDIP Pin Number 16-Pin SOIC Symbol Description 1 1 V DD Input. +5V ±10% power supply input with respect to DGND. 2 2 DGND Input. Digital Ground. 3 3 CMPTR Input, active high or low (depending on polarity of the voltage input to A/D converter). This pin connects directly to the zero crossing comparator output (CMPTR) of the TC5XX A/D converter. A high-to-low state change on this pin causes the TC520A to terminate the de-integrate phase of conversion. 4 4 B Output, active high. The A and B outputs of the TC520A connect directly to the A and B inputs of the TC5XX A/D converter connected to the TC520A. The binary code on A, B determines the conversion phase of the TC5XX A/D converter: (A, B) = 01 places the TC5XX A/D converter into the Auto Zero phase; (A, B) =10 for Integrate phase (INT); (A, B) =11 for De-integrate phase (DINI) and (A, B) = 00 for Integrator Zero phase (IZ). Please see the TC500/TC500A/TC510/TC514 family data sheets for a complete description of these phases of operation. 5 5 A Output, active high. See pin 4 description above. 6 6 OSC OUT Input. This pin connects to one side of an AT-cut crystal having a effective series resistance of 100Ω (typ.) and a parallel capacitance of 20pF (typ.). If an external frequency source is used to clock the TC520A, this pin must be left floating. 7 7 OSC IN Input. This pin connects to the other side of the crystal described in pin 6 above. The TC520A may also be clocked from an external frequency source connected to this pin. The external frequency source must be a pulse train having a duty cycle of 30% (minimum); rise and fall times of 15nsec and a min/max amplitude of 0 to V IH.Ifanexternal frequency source is used, pin 6 must be left floating. A maximum operating frequency of 4MHz (crystal) or 6MHz (external clock source) is permitted. 8 N/C No connection on 16 pin package version. 9 N/C No connection on 16 pin package version. 8 10 READ Input, active low, level and negative edge triggered. A high-to-low transition on READ loads serial port output shift register with the most recent converted data. Data is loaded such that the first bit transmitted from the TC520A to the processor is the OVERRANGE bit (OVR), followed by the POLARITY bit (POL) (high = input positive; low = input negative). This is followed by a 16-bit data word (MSB first). OVR is available at the D OUT as soon as READ is brought low. This bit may be used as the 17th data bit, if so desired. The D OUT pin of the serial port is enabled only when READ is held low. Otherwise, D OUT remains in a high impedance state. A serial port read access cycle is terminated at any time by bringing READ high. 9 11 D OUT Output, logic level. Serial port output pin. This pin is enabled only when READ is low (see READ pin description). 10 12 D CLK Input, positive and negative edge triggered. Serial port clock. With READ low, serial data is clocked into the TC520A at each low-to-high transition of D CLK, and clocked out of the TC520A on each high-to-low transition of D CLK.AmaximumserialportD CLK frequency of 3MHz is permitted. 11 13 D IN Input, logic level. Serial port input pin. The TC5XX A/D converter integration time (T INT ) and Auto Zero time (TAZ) values are determined by the VALUE byte clocked into this pin. This initialization must take place at power up and can be rewritten (or modified and rewritten) at any time. The VALUE is clocked into D IN MSB first. DS21431B-page 4 2002 Microchip Technology Inc.

TABLE 2-1: PIN FUNCTION TABLE (CONTINUED) Pin Number 14-Pin PDIP Pin Number 16-Pin SOIC Symbol Description 12 14 Input, active low; level and edge triggered. The VALUE is clocked into the 8-bit shift register on board the TC520A while is held low. The VALUE is then transferred into the TC520A internal timebase counter (and becomes effective) when is returned high. If so desired, can be momentarily pulsed low, eliminating theneedtoclockavalueintod IN. In this case, the current state of D IN is clocked into the TC520A timebase counter selecting either a count of 65536 (D IN = High), or count of 32768, (D IN =Low). 13 15 DV Output, active low. DV is brought low any time the TC520A is in the AZ phase of conversion. This occurs when, either the TC520A initiates a normal AZ phase by setting A, B, equal to 01, or when CE is pulled high, which overrides the normal A, B sequencing andforcesanazstate.dvis returned high when the TC520A exits AZ. 14 16 CE Input, active low, level triggered. Conversion will be continuously performed as long as CE remains low. Pulling CE high causes the conversion process to be halted and forces the TC520A into the AZ mode for as long as CE remains high. CE should be taken high whenever it is necessary to momentarily suspend conversion (for example: to change the address lines of an input multiplexer). CE should be pulled high only when the TC520A enters an AZ phase (i.e. when DV is low). This is necessary to avoid excessively long integrator discharge times, which could result in erroneous conversion. This pin should be grounded if unused. It should be left floating if a 0.01µF RESET capacitor is connected to it (see Section 4.0, Typical Applications). 2002 Microchip Technology Inc. DS21431B-page 5

3.0 DETAILED DESCRIPTION 3.1 TC520A Timing The TC520A consists of a serial port and state machine. The state machine provides control timing to the TC5xx A/D converter connected to the TC520A as well as providing sequential timing for TC520A internal operation. All timing is derived from the frequency source at OSC IN and OSC OUT. This frequency source can be either an externally provided clock signal or external crystal. If an external clock is used, it must be connected to the OSC IN pin and OSC OUT must remain floating. If a crystal is used, it must be connected between the OSC IN and OSC OUT and be physically located as close to the OSC IN and OSC OUT pins as possible. The incoming frequency is internally divided by 4 and the resulting clock (SYSCLK) controls all timing functions. 3.2 TC5XX A/D Converter Control Signals The TC520A control outputs (A, B) and control input (CMPTR) connect directly to the corresponding pins of the TC5XX A/D converter. A conversion is consummated when A, B have been sequenced through the required 4 phases of conversion: Auto Zero (AZ), Integrate (INT), De-integrate (D INT ) and Integrator Zero (IZ) (see Figure 4-1). The Auto Zero phase compensates for offset errors in the TC5XX A/D converter. The Integrate phase connects the voltage to be converted to the TC5XX A/D converter input, resulting in an integrator output dv/dt directly proportional to the magnitude of the applied input voltage. Actual A/D conversion (counting) is initiated at the start of the DINT phase and terminates when the integrator output crosses 0V. The integrator output is then forced to 0V during the IZ phase and the converter is ready for another cycle. Please see the TC500/TC500A/TC510/TC514 data sheet for a complete description of these phases. The number of SYSCLK periods (counts) for the AZ and INT phases is determined by the VALUE. The VALUE is a single byte that must be loaded into the most significant byte of 16-bit counter on board the TC520A during initialization. The lower byte of this counter is pre-loaded to a value of 0FFH (256 10 )and cannot be changed. The VALUE (upper 8 bits of the counter) can be programmed over a range of 0FFH to 00H (corresponding to a range of AZ = INT = 256 counts to 65536 counts). (See Figure 3-2). The VALUE sets the number of counts for both the AZ and INT phases and directly affects resolution and speed of conversion. The greater the number of counts allowed for AZ and INT, the greater the A/D resolution (but the slower the conversion speed). The time period required for the DINT phase is a function of the amount of voltage stored on the integrator during the INT phase and the value of V REF. The DINT phase is initiated by the TC520A immediately after the INT phase and terminated when the TC5XX A/D converter changes the state of the CMPTR input of the TC520A, indicating a zero crossing. In general, the maximum number of counts chosen for DINT is twice that of INT (with V REF chosen at V ININ(MAX) /2). Choosing these values guarantees a full count (maximum resolution) during D INT when V IN =V IN(MAX). The IZ phase is initiated immediately following the D INT phase and is maintained until the CMPTR input transitions high. This indicates the integrator is initialized and ready for another conversion cycle. This phase typically takes 2msec. 3.3 Serial Port Control Signals Communication to and from the TC520A is accomplished over a 3 wire serial port. Data is clocked into D IN on the rising edge of D CLK and clocked out of D OUT on the falling edge of D CLK. READ must be low to read from the serial port and can be taken high at any time, which terminates the read cycle and releases D OUT to a high impedance state. Conversion data is shifted to the processor from D OUT in the following order: OVERRANGE (which can also be used as the 17th data bit), POLARITY, conversion data (MSB first). DS21431B-page 6 2002 Microchip Technology Inc.

4.0 TYPICAL APPLICATIONS 4.1 TC500 Series A/D Converter Component Selection The TC500/TC500A/TC510/TC514 data sheet details the equations necessary to calculate values for integration resistor (R INT ) and capacitor (C INT ), auto zero (C AZ ) and reference capacitors (C REF ) and voltage reference (V REF ). All equations apply when using the TC520A, except Integration time (T INT ) and Auto zero time (T AZ ), which are functions of the SYSCLK period (timebase frequency and VALUE). Microchip offers a ready-to-use TC5XX A/D converter design tool. The TC500 Design Spreadsheet is an Excel-based spreadsheet that calculates values for all components as well as the TC520A VALUE. It also calculates overall converter performance such as noise rejection, converter speed, etc. 4.2 TC520A Initialization Initialization of the TC520A consists of: 1. Power-On RESET of the TC500/TC520A (forcing the TC520A into an AZ phase). 2. Initializing the TC520A VALUE. 4.3 Power-On RESET The TC520A powers up with A,B = 00 (IZ Phase), awaiting a high logic state on CMPTR, which must be initiated by forcing the TC520A into the AZ phase. This can be accomplished in one of two ways: 1. External hardware (processor or logic) can momentarily pull or CE low for a minimum of 100msec (T AZI )or; 2. A.01µF RESET capacitor can be connected from CE to V CC to generate a power-on pulse on CE. 4.4 VALUE Initialization TheVALUEisthepresetvalue(highbyteofthe SYSCLK timing counter) which determines the number of counts allocated to the AZ and INT phases of conversion. This value can be calculated using either the TC520A spreadsheet within the TC500 Design Spreadsheet software or can be setup as shown in the following sections. 4.4.1 SELECT VREF, TDEINT Choose the TC5XX A/D converter reference voltage (V REF ) to be half of the maximum A/D converter input voltage. For example, if V IN(MAX) = 2.5V, choose V REF = 1.25V. This forces the maximum de-integration time (T DEINT ) to be equal to twice the maximum integration time (T INT ), ensuring a full count (maximum resolution) during DINT. 4.4.2 CALCULATE TINT The TC520A counter length is 16-bits (65536), allowing the full 65536 counts for T DEINT results in a maximum T INT = 65536/2 or 32768. 4.4.3 SELECT SYSCLK FREQUENCY SYSCLK frequency directly affects conversion time. The faster the SYSCLK, the faster the conversion time. The upper limit SYSCLK frequency is determined by the worst case delay of the TC500 comparator (which for the TC500 and TC500A is 3.2µsec). While a faster value for SYSCLK can be used, operation is optimized (error minimized) by choosing a SYSCLK period (1/ SYSCLK frequency) that is greater than 3.2µsec. Choosing T SYSCLK =4µsec makes the SYSCLK frequency equal to 250kHz. This makes the external crystal (or frequency source) equal to 1.0MHz, since SYSCLK = crystal frequency/4). Calculating integration time (in msec) using T SYSCLK =4µsec, T INT =4µsec x 32768 = 131msec. 4.4.4 CALCULATE VALUE Plug the T INT and T SYSCLK values into the equation and convert the resulting value to hexadecimal: EQUATION 4-1: [(65536 - (T INT /T SYSCLK )] VALUE = 256 In this example, VALUE = 128 (10) = 10H. Therefore, a VALUE of 10H is loaded into the TC520A. If the desired T INT was 100msec instead of 131msec, the VALUE would be 9EH, and so on. The TC520A VALUE must be initialized on power-up, and can be re-initialized as often as desired thereafter. This is accomplished by bringing the input low while transmitting the appropriate VALUE to the TC520A as shown in Figure 4-1 and Figure 4-2. 4.4.5 POLLED VS. INTERRUPT OPERATION The TC520A can be accessed at any time by the host processor. This makes operation in a polled environment especially easy since the most recently converted data is available to the processor as needed. The TC520A can also be used in an interrupt environment by connecting DV to the IRQ line of the processor. Since AZ is the first phase of a new conversion cycle, the most recently converted data will be available as soon as DV goes low. If so desired, the interrupt service routine can also modify the VALUE during the DV = low interval. 2002 Microchip Technology Inc. DS21431B-page 7

FIGURE 4-1: TC520 initialization & startup conversion timing relationships TC520A Conversion State AZ INT DINT IZ AZ INT DINT IZ AZ AZ INT CE is pulled high only during AZ (DV = Low) CE D IN, D CLK VALUE updated and conversion started VALUE shifted into DIN New VALUE can be loaded (if so desired) Load Value DV TC520A held in AZ phase as long as CE = HIGH FIGURE 4-2: load value modify cycle TC520A Conversion State AZ INT DINT IZ AZ INT DINT IZ AZ INT CE VALUE updated and conversion started D IN, D CLK VALUE shift into D IN DV 4.4.6 OPTO-ISOLATED APPLICATIONS The 3 wire serial port of the TC520A can be optoisolated for applications requiring isolated data acquisition. The additional control lines (, DV, READ) are normally not needed in such applications, but can also be brought across the isolation barrier with the addition of a second isolator. DS21431B-page 8 2002 Microchip Technology Inc.

FIGURE 4-3: Typical System Application +5V V IN + V IN - 10k 100k MCP1525 1µF.01µ C INT C AZ R INT.01µ 1 3 4 11 10 9 8 5 INT CAZ BUF IN+ IN REF+ REF COM TC500 V+ 16 14 CMPTR 13 B 12 A 6 CR 7 CR+ 15 GND 2 V C REF Crystal OSC 6 7 3 OUT OSC IN CMPTR V+ READ 4 D B CLK 5 D A TC520A IN 13 D DV OUT 14 CE 2 GND 1 12 8 10 11 9 LD RD SK SO SI -5V Analog Ground DGND CE DV FIGURE 4-4: TC520A timing diagram Read Timing Load Timing Load Default Timing READ DOUT DCLK T RD T DRS T RS T PWL D IN D CLK T LS T DLS T PWH D IN T LDL T LDS READ Read Format DOUT OVR POL MSB LSB D CLK Load Format D IN MSB LSB D CLK 2002 Microchip Technology Inc. DS21431B-page 9

5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking information not available at this time. 5.2 Taping Forms Component Taping Orientation for 16-Pin SOIC (Wide) Devices PIN 1 User Direction of Feed W Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 16-Pin SOIC (W) 16 mm 12 mm 1000 13 in P DS21431B-page 10 2002 Microchip Technology Inc.

5.3 Package Dimensions 14-Pin PDIP (Narrow) PIN 1.260 (6.60).240 (6.10).770 (19.56).745 (18.92).310 (7.87).290 (7.37).200 (5.08).140 (3.56).150 (3.81).115 (2.92).040 (1.02).020 (0.51).015 (0.38).008 (0.20) 3 MIN..110 (2.79).090 (2.29).070 (1.78).045 (1.14).022 (0.56).015 (0.38).400 (10.16).310 (7.87) Dimensions: inches (mm) 16-Pin SOIC (Wide) PIN 1.299 (7.59).291 (7.40).419 (10.65).398 (10.10).413 (10.49).398 (10.10).050 (1.27) TYP..019 (0.48).014 (0.36).104 (2.64).097 (2.46) 8.013 (0.33) MAX..009 (0.23).012 (0.30).004 (0.10).050 (1.27).016 (0.40) Dimensions: inches (mm) 2002 Microchip Technology Inc. DS21431B-page 11

DS21431B-page 12 2002 Microchip Technology Inc.

SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21431B-page 13

NOTES: DS21431B-page 14 2002 Microchip Technology Inc.

Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microid, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dspic, ECONOMONITOR, FanSense, FlexROM, fuzzylab, In-Circuit Serial Programming, ICSP, ICEPIC, microport, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfpic, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company s quality system processes and procedures are QS-9000 compliant for its PICmicro 8-bit MCUs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip s quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. DS21431B-page 15

WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456 Atlanta 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 New York 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 China - Hong Kong SAR Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471-6166 Fax: 81-45-471-6122 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 04/20/02 *DS21431B* DS21431B-page 16 2002 Microchip Technology Inc.