SFF 2x10 GPON Class B+ ONU Transceiver 2.488Gbps Downstream/1.244Gbps Upstream

SFF 2x10 GPON Class B+ ONU Transceiver 2.488Gbps Downstream/1.244Gbps Upstream FEATURES OPGP-34-A4B3ZV(T) ITU-T G.984.2 compliant GPON ONU Class B+ Support Digital Diagnostic Monitoring Interface 2x10 pin SFF package with 900mm pigtail fiber and SC/APC connector 1310nm Transmitter, 1490nm Receiver Integrated with WDM filter to cut 1550nm and 1650nm optical signal off for Voice/Data FTTx ONT/ONU applications Single +3.3V power supply with LVTTL Bias Control input and Rx Signal Detect output Description DELTA s high capacity GPON ONU transceiver module is designed for Passive Optical Network (PON) application, 2.488Gbps downstream and 1.244Gbps upstream. It is compliant with ITU-T G.984.2 standard. The GPON ONU transceiver is provided with SC pigtail connector complied with SC connector industry standard. The module consists 1310nm un-cool DFB laser, InGaAs/InP APD, Preamplifier and WDM filter in a high-integrated optical sub-assembly, and it receives up to 2.488Gbps of continuous data at 1490nm, and transmits 1.244Gbps of burst-mode data at 1310nm. Application GPON ONU Class B+ Burst mode application FTTx WDM Broadband Access Performance OPGP-34-A4B3ZV(T) data link up to 20km in 9/125um single mode fiber. The pre-bias time is less than 16bits. 1 Revision: S4

1. Absolute Maximum Ratings Parameter Symbol Min. Typ. Max. Unit Note Storage Temperature Ts -40 85 ºC Storage Ambient Humidity HA 5 95 % Power Supply Voltage VCC 0 5 V Signal Input Voltage -0.3 Vcc+0.3 V Optical Input Power (Peak) 7 dbm Lead Soldering Temperature T SOLD 260 ºC Lead Soldering Time t SOLD 10 sec 2. Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Unit Note Operating Case Temperature OPGP-34-A4B3ZV TC 0 +70 ºC OPGP-34-A4B3ZVT -40 +85 Ambient Humidity HA 5 90 % Non-condensing Power Supply Voltage VCC 3.13 3.3 3.47 V Power Supply Off Voltage Voff 0 0.8 V Power Supply Current ICC 400 ma Power Supply Noise Rejection 100 mvp-p 100Hz to 1MHz Data Rate of Transmitter 1244.16 Mbps Data Rate of Receiver 2488.32 Mbps Line Code Scrambled NRZ Transmission Distance 20 km 3. Specification of Transmitter Parameter Symbol Min. Typ. Max. Unit Note Average Launched Power P O +0.5 +5 dbm Note (1) Optical Extinction Ratio ER 10 db Center Wavelength λ C 1290 1310 1330 nm DFB Laser -20dB Spectrum Width (RMS) σ 1 nm Side Mode Suppression Ratio SMSR 30 db Transmitter OFF Output Power P Off -45 dbm Tx Enable Ton 16 bits 12.8ns Tx Disable Toff 16 bits 12.8ns Transmitter Reflectance (1260 to 1360nm) -6 db Tolerance to the Transmitter s -15 db incident Light Power Jitter Generation 0.33 UIp-p 4KHz~10MHz Output Eye Mask Compliant with ITU-T G.984.2 Note (3) ORL of ODN at Oru and Ord 32 db Time to Initialize, Including Soft TX disable t_init 300 ms Note(4) Note (1). Launched power (avg.) is end-of-life power coupled into a single mode fiber. Note (2). Transmitter eye mask definition 2 Revision: S4

Upstream Bit rate (Mbps) 1244.16Mbit/s x1/x4 0.22/0.78 x2/x3 0.40/0.60 y1/y4 0.17/0.83 y2/y3 0.20/0.80 Eye Mask Test Setup Optical Transmitter Attenuator O/E Converter 4 th order Thomson Filter* Waveform Monitor * f -3dB = 0.75 times the nominal bit rate. Note (3). Time to Initialize V cc>3.135v Soft TX Disable BEN Optical Output t_init 3 Revision: S4

4. Specification of Receiver Parameter Symbol Min. Typ. Max. Unit Note Input Optical Wavelength λ IN 1480 1500 nm APD Receiver Sensitivity P IN -28 dbm Note (1) Input Saturation Power (Overload) P SAT -8 dbm Signal Detect- Assert Power P A -28 dbm Signal Detect- Deassert Power P D -44 dbm Note (2) Signal Detect- Hysteresis P A -P D 0.5 2 6 db Receiver Reflectance -20 db Note (3) (1480 to 1500nm) Optical Isolation of Receiver 40 db (1260 to 1360nm) Note (1). Measured with 1490nm, ER=10dB; BER =<10-10 @PRBS=2 23-1 NRZ without FEC Note (2). When Signal Detect Deasserted, the data output is Low-level (fixed) Note (3). When the terminal is viewed from the optical path, the reflection toward the optical path of the optical signal with a central wavelength of 1480nm to 1500nm transmitted to terminal. 5. Electrical Interface Characteristics Parameter Symbol Min. Typ. Max. Unit Note Transmitter Total Supply Current I CC A ma Note (1) Differential line input Impedance R IN 90 100 110 Ohm Differential Data Input Swing VDT 200 1800 mv p-p DC-Coupled BiasCNT Input Voltage- High V BCNTH 2 V CC BiasCNT Input Voltage- Low V BCNTL 0 0.8 LVTTL Receiver Total Supply Current I CC B ma Note (1) Differential Data Output Swing VDR 400 1200 mv p-p Note (2) Signal Detect Output Voltage-High V LOSH 2 V CC +0.3 V Signal Detect Output Voltage-Low V LOSL 0 0.8 V LVTTL Note (1). A (TX)+ B (RX) = 400mA (Not include termination circuit) Note (2). CML Interface, AC coupled to 100ohm differential Load. 4 Revision: S4

6. Transmitter Burst Mode Timing Characteristics VccT BiasCNT Data Input Optical Output VccT < 0.8V X X OFF VccT > 3.13V Low/NC X OFF High No Other Yes Laser bias and modulation signal output X = Don t care Other = Less than +8dBm (peak) High = Logic high level, Low = logic low level No = Data NOT Present, Yes = Data Present, OFF = Optical Power is less than 45dBm BiasCNT Preamble Payload TD (p) Optical Output Ton<16 bits Within 15% of steady state Toff<16 bits Tx Enable Ton/Toff Time Definition Tx Disable 7. Digital Diagnostic Monitor Accuracy Parameter Accuracy Calibration Note Transceiver Internal Temperature ± 3 Internal TA=0~+70 / -40~85 Power Supply Internal Voltage ± 3% Internal VCC=3.13~3.47V TX Optical Power ± 3dB Internal +0.5~5dBm TX Bias Current ± 10% Internal Specified by nominal bias value RX Optical Power ± 3dB Internal -28 to -8dBm Note. Temperature and Voltage is measured internal to the transceiver. 5 Revision: S4

8. Enhanced Digital Diagnostic Interface The memory map in the following describes an extension to the memory map defined in SFF-8472 MSA. The enhanced interface uses the two wire serial bus address 1010001X(A2h) to provide diagnostic information about the module s present operating conditions. 2 wire address 1010000 X (A0h) 2 wire address 1010001 X (A2h) 0 0 Serial ID Defined by SFP MSA 55 (96 bytes) 56 95 95 96 96 127 Vender Specific (32 bytes) 119 120 127 Alarm and Warning Thresholds (56 bytes) Cal Constants (40 bytes) Real Time Diagnostic Interface (24 bytes) Vender Specific 6 Revision: S4

8.1 EEPROM Serial ID Memory Contents (2-Wire Address A0h) Address Name of Field Hex Description Base ID Fields 00 Identifier 02 SFF physical device (soldered device) 01 Ext. Identifier 04 Serial ID module supported 02 Connector 0B Optical pigtail 03-10 Transceiver Codes 00 Undefined for GPON 11 Encoding 03 Compatible with NRZ encoding code 12 BR, Nominal 0C Nominal 1244Mbps (indicate transmitter data rate) 13 Reserved 00 14 Length (9um)-km 14 20km @9/125um fiber 15 Length (9um)-100m C8 20000m @9/125um fiber 16-18 Length for MMF 00 Undefined for GPON 19 Reserved 00 20-35 Vendor Name 44 45 4C 54 DELTA (ASCII character) 41 20 36 Channel Spacing 00 Undefined 37-39 Vendor OUI 00 Undefined 40-55 Vendor P/N 4F 50 47 50 2D 33 34 2D 41 34 42 33 OPGP-34-A4B3ZV(T) (ASCII character) 5A 56 20 (54) 20 56-59 Vendor P/N Rev. 53 30 20 20 S0 (ASCII character) 60-61 Laser Wavelength 05 1E 1310nm in Hex byte 62 DWDM Wavelength Fraction 00 Undefined 63 CC_BASE XX Check sum of bytes 0-62 Extended ID Fields 64-65 Options 00 04 Signal Detect is implemented 66 BR, Max. 00 Undefined 67 BR, Min. 00 Undefined 68-83 Vendor SN SN Vendor serial number in ASCII character 84-91 Date Code DC Vendor date code in ASCII character 92 Diagnostic Monitoring Type 28 Implemented with internal calibration and received power measurement type by Avg. power 93 Enhanced options F0 Alarm/Warning flags monitor are implemented 94 SFF-8472 compliant 02 SFF-8472 compliant with revision 9.5 95 CC_EXT XX Check sum of bytes 64-94 Vendor Specific ID Fields 96-127 Vendor Specific 00 Vendor specific EEPROM 128-256 Reserved 00 Reserved for future use 7 Revision: S4

8.2 Digital Diagnostic Monitoring Interface (2-Wire Address A2h) Alarm and Warning Thresholds (2 Wire Address A2h) OPGP-34-A4B3ZV(T) Address # Bytes Name of Field HEX Real Value Unit 00-01 2 Temp High Alarm 55 00 (64 00)* 85 (100)* 02-03 2 Temp Low Alarm FB 00 (D8 00)* -5 (-40)* 04-05 2 Temp High Warning 50 00 (5F 00)* 80 (95)* 06-07 2 Temp Low Warning 00 00 (E2 00)* 0 (-30)* 08-09 2 Voltage High Alarm 94 70 3.8 V 10-11 2 Voltage Low Alarm 6D 60 2.8 V 12-13 2 Voltage High Warning 87 8C 3.47 V 14-15 2 Voltage Low Warning 7A 44 3.13 V 16-17 2 Bias High Alarm 75 30 60 ma 18-19 2 Bias Low Alarm 05 DC 3 ma 20-21 2 Bias High Warning 61 A8 50 ma 22-23 2 Bias Low Warning 07 D0 4 ma 24-25 2 TX Power High Alarm F6 78 8 dbm 26-27 2 TX Power Low Alarm 1F 07-1 dbm 28-29 2 TX Power High Warning 7B 87 5 dbm 30-31 2 TX Power Low Warning 2B D4 0.5 dbm 32-33 2 RX Power High Alarm 0C 5A -5 dbm 34-35 2 RX Power Low Alarm 00 08-31 dbm 36-37 2 RX Power High Warning 06 31-8 dbm 38-39 2 RX Power Low Warning 00 10-28 dbm 40-55 16 Reserved FF FF Calibration Constants (2 Wire Address A2h) Address # Bytes Name of Field HEX Description 56-59 4 Rx_PWR (4) 00 00 00 00 Set to zero for internally calibrated devices. 60-63 4 Rx_PWR (3) 00 00 00 00 Set to zero for internally calibrated devices. 64-67 4 Rx_PWR (2) 00 00 00 00 Set to zero for internally calibrated devices. 68-71 4 Rx_PWR (1) 3F 80 00 00 Set to 1 for internally calibrated devices. 72-75 4 Rx_PWR (0) 00 00 00 00 Set to zero for internally calibrated devices. 76-77 2 Tx_I (Slope) 01 00 Set to 1 for internally calibrated devices. 78-79 2 Tx_I (Offset) 00 00 Set to zero for internally calibrated devices. 80-81 2 Tx_PWR (Slope) 01 00 Set to 1 for internally calibrated devices. 82-83 2 Tx_PWR (Offset) 00 00 Set to zero for internally calibrated devices. 84-85 2 T (Slope) 01 00 Set to 1 for internally calibrated devices. 86-87 2 T (Offset) 00 00 Set to zero for internally calibrated devices. 88-89 2 V (Slope) 01 00 Set to 1 for internally calibrated devices. 90-91 2 V (Offset) 00 00 Set to zero for internally calibrated devices. 92-94 3 Reserved 00 00 00 Reserved 95 1 Checksum XX Checksum of bytes 0 94. 8 Revision: S4

A/D Value (2 Wire Address A2h) Address # Bytes Name of Field Description 96-97 2 Temperature (MSB, LSB) Internally measured module temperature 98-99 2 Supply Voltage (MSB, LSB) Internally measured supply voltage in module 100-101 2 Tx Bias Current (MSB, LSB) Internally measured TX Bias current 102-103 2 Tx Optical Power (MSB, LSB) Internally measured TX power 104-105 2 Rx Received Power (MSB, LSB) Measured Rx input power 106-109 4 Reserved Notes: Temperature (Signed twos complement value) A2h Byte 96 (Temperature MSB) A2h Byte 97 (Temperature LSB) S 2 6 2 5 2 4 2 3 2 2 2 1 2 0 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 Supply Voltage, Tx Bias Current, Tx Optical Power, Rx Received Power (Unsigned values) A2h Byte 98 (V cc MSB) A2h Byte 100 (TX Bias MSB) A2h Byte 102 (TX Power MSB) A2h Byte 99 (V cc LSB) A2h Byte 101 (TX Bias LSB) A2h Byte 103 (TX Power LSB) A2h Byte 104 (RX Power MSB) A2h Byte 105 (RX Power LSB) 2 15 2 14 2 13 2 12 2 11 2 10 2 9 2 8 2 7 2 6 2 5 2 4 2 3 2 2 2 1 2 0 The digital value conversions are updated every 13ms (nominal) or 20ms (max) in rotation. After getting digital value, each measurement could be obtained by multiplying digital value by corresponding LSB value: 1 Temperature = Temp (Digital Value) LSB Temp = Temp (Digital Value) 256 ; when Temperature<128 1 Temperature = Temp (Digital Value) LSB Temp = [Temp (Digital Value) 256 ]-256; when Temperature 128 V cc = V cc(digital Value) LSB Vcc=V CC(Digital Value) 100μV TX Bias Current = TX Bias Current (Digital Value) LSB TX,Bias = TX Bias Current (Digital Value) 2μA TX Power = TX Power (Digital Value) LSB TXPower = TX Power (Digital Value) 0.1μW RX Power = RX Power (Digital Value) LSB RXPower = RX Power (Digital Value) 0.1μW 9 Revision: S4

Status Bits and Alarm/Warning Flag Bits (2 Wire Address A2h) Address Bit Name Description 110 7 TX Disable State Read bit:digital state of Tx disable (1) and enabled (0) 110 6 Soft TX Disable Read/write bit that allows software disable of Tx. Writing 1 disables Tx 110 5-3 Reserved 110 2 TX Fault State Read bit :1=Tx failure state, 0=Tx normal state 110 1 Signal Detect State Read bit :Digital state of SD output pin. 1=optical signal detected, 0=no optical signal detected 110 0 Data_Ready_Bar Not implemented. 111 1-0 Soft Tx Mode Not implemented. 112 7 Temp High Alarm Set when internal temperature exceeds high alarm level. 112 6 Temp Low Alarm Set when internal temperature is below low alarm level. 112 5 Vcc High Alarm Set when internal supply voltage exceeds high alarm level. 112 4 Vcc Low Alarm Set when internal supply voltage is below low alarm level. 112 3 TX Bias High Alarm Set when TX Bias current exceeds high alarm level. 112 2 TX Bias Low Alarm Set when TX Bias current is below low alarm level. 112 1 TX Power High Alarm Set when TX power exceeds high alarm level. 112 0 TX Power Low Alarm Set when TX power is below low alarm level. 113 7 RX Power High Alarm Set when Received Power exceeds high alarm level. 113 6 RX Power Low Alarm Set when Received Power is below low alarm level. 113 5-0 Reserved Alarm 114-115 All Reserved 116 7 Temp High Warning Set when internal temperature exceeds high warning level. 116 6 Temp Low Warning Set when internal temperature is below low warning level. 116 5 Vcc High Warning Set when internal supply voltage >high warning level. 116 4 Vcc Low Warning Set when internal supply voltage < low warning level. 116 3 TX Bias High Warning Set when TX Bias current exceeds high warning level. 116 2 TX Bias Low Warning Set when TX Bias current is below low warning level. 116 1 TX Power High Warning Set when TX Power exceeds high warning level. 116 0 TX Power Low Warning Set when TX Power is below low warning level. 117 7 RX Power High Warning Set when Received Power exceeds high warning level. 117 6 RX Power Low Warning Set when Received Power is below low warning level. 117 5-0 Reserved Warning 118-119 All Reserved 10 Revision: S4

9. Pin Description Tx/Rx Pin No. I/O Pin Name Description 1 NC No Function Definition 2 VeeR Receiver Ground 3 VeeR Receiver Ground 4 NC No Function Definition 5 NC No Function Definition Rx 6 VeeR Receiver Ground 7 VccR +3.3V Receiver Power Supply 8 O SD Normal Optical Input indicated by logic High, and No Optical Input indicated by logic Low. 9 O RD(n) Inverted Receiver Data Output (AC-Coupled internally) 10 O RD(p) Non-Inverted Receiver Data Output (AC-Coupled internally) 11 VccT +3.3V Transmitter Power Supply 12 VeeT Transmitter Ground 13 I BiasCNT LVTTL Logic High to Enable Burst Transmitter, and Disable Burst Transmitter by Logic Low. Floating by Low to disable Burst Transmitter. Tx 14 I TD(p) Non-Inverted Transmitter Data Input (DC-Coupled), 15 I TD(n) Inverted Transmitter Data Input (DC-Coupled), 16 VeeT Transmitter Ground (Mod-Def 0) 17 I SCL I2C Serial Clock (LVTTL) (Mod-Def 1) 18 I/O SDA I2C Serial Data (LVTTL) (Mod-Def 2) 19 I Reset Active low, the LDD is fully disabled when the pin is held low. 20 VeeT Transmitter Ground MS Mounting Studs/Connect this pin to Chassis ground 11 Revision: S4

10. Recommended Interface Circuit 3.3V 10uF 100nF 1uH 1uH 100nF 11.VccT DELTA Module TX_Burst 13. TX_Burst Z0=50ohm Z0=50ohm 14. TD(p) 15. TD(n) 100ohm Transmitter. VeeT Protocol IC SerDes IC 10uF 7. VccR 100nF Z0=50ohm 10. RD(p) 100nF 100ohm Z0=50ohm 9.. RD(n) 100nF 3.3V Receiver SD 8. SD RES VeeR 3.3V 3.3V SCL SDA RES RES 17. SCL 18. SDA 3.3V Microprocessor Reset 19. Reset RES * RES is 4.7K to 10K Ohms pull-up resistor. 12 Revision: S4

11. Outline Dimensions Parameter Unit Description Note Mechanical Dimensions mm 48.5x13.5x12.6 Connector Type - SC/APC connector Maximum Fiber Contact Temperature ºC 85 Fiber length (L) mm 900±15 SC Connector up to top the Ferrule SC Pigtail OPXX-XX-XXXXXX DEXXXXXXXXXXXX 1310 nm Tx / Rx 1490 nm Complies with 21 CFR 1040.10 and 1040.11 Class 1 Laser Product Made in X NOTE: Units: MM Unspecified tolerances is±0.2mm 13 Revision: S4

12. Order Information Part Number Case Operating Temp. Notes OPGP-34-A4B3ZV 0 to +70 degree C OPGP-34-A4B3ZVT -40 to +85 degree C 13. Regulatory Compliance Feature Test Method Reference Human Body Model (HBM) MIL-STD-883E Method 3015.7 Electrostatic Discharge (ESD) to the EIA-JESD22-A114 Electrical Pins Machine Model (MM) EIA-JESD22-A115 Electrostatic Discharge (ESD) to the Contact Discharge IEC/EN 61000-4-2 Simplex Receptacle Air Discharge IEC/EN 61000-4-2 Radio Frequency Electromagnetic IEC/EN 61000-4-3 Field Immunity Electromagnetic Interference (EMI) FCC Part 15 Class B EN 55022 Class B (CISPR 22A) FDA/CDRH FDA 21CFR 1040.10, 1040.11 Laser Eye Safety Component Recognition TUV TUV UL EN 60825-1 EN 60825-2 EN 60950 UL 60950-1 Appendix A. Document Revision Version No. Date Description S0 2011-06-14 Preliminary datasheet S1 2011-07-18 1. P11.Change the description of pin 13. Open disable the Transmitter. 2. P12. Modify the recommend interface circuit S2 2011-08-01 1. Correct the TX interface from AC to DC. S3 2011-08-26 1. Correct the TX power monitor description on A2H. S4 2012-01-02 1. P1 Remove Typo on feature. 2. P13 Change the fiber connector boot to19mm Max. 14 Revision: S4