NE/SE5539 High frequency operational amplifier

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Transcription:

INTEGRATED CIRCUITS Supersedes data of 2001 Aug 03 File under Integrated Circuits, IC11 Data Handbook 2002 Jan 25

DESCRIPTION The is a very wide bandwidth, high slew rate, monolithic operational amplifier for use in video amplifiers, RF amplifiers, and extremely high slew rate amplifiers. Emitter-follower inputs provide a true differential input impedance device. Proper external compensation will allow design operation over a wide range of closed-loop gains, both inverting and non-inverting, to meet specific design requirements. FEATURES Bandwidth Unity gain: 350 MHz Full power: 48 MHz GBW: 1.2 GHz at 17 db Slew rate: 600/Vµs A VOL : 52 db typical Low noise: 4 nv Hz typical PIN CONFIGURATION D, N Packages + INPUT NC V SUPPLY GROUND 1 2 3 NC 4 V OS ADJ/ A V ADJ 5 NC 6 7 + TOP VIEW 14 13 12 11 10 9 8 INPUT NC FREQUENCY COMPENS. NC +V NC OUTPUT Figure 1. Pin Configuration SL00570 APPLICATIONS High speed datacom Video monitors & TV Satellite communications Image processing RF instrumentation & oscillators Magnetic storage ORDERING INFORMATION DESCRIPTION TEMPERATURE RANGE ORDER CODE DWG # 14-Pin Plastic Dual In-Line Package (DIP) 0 C to +70 C NE5539N SOT27-1 14-Pin Plastic Small Outline (SO) package 0 C to +70 C NE5539D SOT108-1 14-Pin Plastic Dual In-Line Package (DIP) 55 C to +125 C SE5539N SOT27-1 ABSOLUTE MAIMUM RATINGS 1 SYMBOL PARAMETER RATING UNITS V CC Supply voltage ±12 V P D(max) Maximum power dissipation; T amb = 25 C (still-air) 2 N package 1.45 W D package 0.99 W Operating temperature range T amb NE5539D, NE5539N 0 to +70 C SE5539N 55 to +125 C T stg Storage temperature range 65 to +150 C T j Max junction temperature +150 C T sld Lead soldering temperature (10 sec max) +230 C NOTES: 1. Differential input voltage should not exceed 0.25 V to prevent excessive input bias current and common-mode voltage 2.5 V. These voltage limits may be exceeded if current is limited to less than 10 ma. 2. Derate above 25 C, at the following rates: N package at 11.6 mw/ C D package at 7.9 mw/ C 2002 Jan 25 2 853-0814 27610

EQUIVALENT CIRCUIT (12) FREQUENCY COMP. (10) +V CC R 18 R 19 R 3 R 5 ( ) 14 INVERTING INPUT (+) 1 NON INVERTING INPUT Q 1 R 2 Q 4 Q R 6 6 R 8 Q 5 Q 2 Q 3 R 20 R 1 R 4 R 21 Q 7 Q 8 R 9 R 10 2.2k (8) OUTPUT (7) GRD R 13 Q 9 R 11 Q 10 R 12 R 14 Q 11 R 15 R 16 R 17 R 7 (3) V CC 5 SL00571 Figure 2. Equivalent Circuit 2002 Jan 25 3

DC ELECTRICAL CHARACTERISTICS V CC = ±8 V, T amb = 25 C; unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS SE5539 NE5539 MIN TYP MA MIN TYP MA UNITS V = 0 V; Over temp. 2 5 V OS Input offset voltage O R S = 100 Ω T amb = 25 C 2 3 2.5 5 V OS / T 5 5 µv/ C I OS Input offset current Over temp. 0.1 3 T amb = 25 C 0.1 1 2 I OS / T 0.5 0.5 na/ C I B Input bias current Over temp. 6 25 T amb = 25 C 5 13 5 20 I B / T 10 10 na/ C CMRR Common mode rejection ratio F = 1 khz; R S = 100 Ω; V CM ±1.7 V 70 80 70 80 Over temp. 70 80 R IN Input impedance 100 100 kω R OUT Output impedance 10 10 Ω R = 150 Ω to GND +Swing +2.3 +2.7 L V and 470 Ω to V CC Swing 1.7 2.2 R = 25 Ω to GND +Swing +2.3 +3.0 V OUT Output voltage swing L Over temp. Swing 1.5 2.1 mv µa µa db V R = 25 Ω to GND +Swing +2.5 +3.1 L Tamb = 25 C Swing 2.0 2.7 V I CC+ Positive supply current I CC Negative supply current PSRR Power supply rejection ratio A VOL Large signal voltage gain V O = 0 V, R 1 = ; Over temp. 14 18 V O = 0 V, R 1 = ; T amb = 25 C 14 17 14 18 V O = 0 V, R 1 = ; Over temp. 11 15 V O = 0 V, R 1 = ; T amb = 25 C 11 14 11 15 V CC = ±1 V; Over temp. 300 1000 V CC = ±1 V; T amb = 25 C 200 1000 ma ma µv/v V O = +2.3 V, 1.7 V; R L = 150 Ω to GND, 470 Ω to V CC 47 52 57 db V = +2.3 V, 1.7 V; Over temp. O R L = 2 Ω to GND T amb = 25 C 47 52 57 V O = +2.5 V, 2.0 V; Over temp. 46 60 R L = 2 Ω to GND T amb = 25 C 48 53 58 db db 2002 Jan 25 4

DC ELECTRICAL CHARACTERISTICS V CC = ±6 V, T amb = 25 C; unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS V OS I OS I B Input offset voltage Input offset current Input bias current SE5539 MIN TYP MA UNITS Over temp. 2 5 T amb = 25 C 2 3 Over temp. 0.1 3 T amb = 25 C 0.1 1 Over temp. 5 20 T amb = 25 C 4 10 CMRR Common-mode rejection ratio V CM = ±1.3 V; R S = 100 Ω 70 85 db I CC+ I CC Positive supply current Negative supply current PSRR Power supply rejection ratio V CC = ±1 V Over temp. R = 150 Ω to GND V OUT Output voltage swing L and 390 Ω to V CC T amb =25 C Over temp. 11 14 T amb = 25 C 11 13 Over temp. 8 11 T amb = 25 C 8 10 Over temp. 300 1000 T amb = 25 C +Swing +1.4 +2.0 Swing 1.1 1.7 +Swing +1.5 +2.0 Swing 1.4 1.8 mv µa µa ma ma µv/v V 2002 Jan 25 5

AC ELECTRICAL CHARACTERISTICS V CC = ±8 V, R L = 150 Ω to GND and 470 Ω to V CC, unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS SE5539 NE5539 MIN TYP MA MIN TYP MA BW Gain bandwidth product A CL = 7, V O = 0.1 V P-P 1200 1200 MHz Small signal bandwidth A CL = 2, R L = 150 Ω 1 110 110 MHz t S Settling time A CL = 2, R L = 150 Ω 1 15 15 ns SR Slew rate A CL = 2, R L = 150 Ω 1 600 600 V/µs t PD Propagation delay A CL = 2, R L = 150 Ω 1 7 7 ns Full power response A CL = 2, R L = 150 Ω 1 48 48 MHz Full power response A V = 7, R L = 150 Ω 1 20 20 MHz UNITS Input noise voltage R S = 50 Ω, 1 MHz 4 4 nv/ Hz Input noise current 1 MHz 6 6 pa/ Hz NOTE: 1. External compensation. AC ELECTRICAL CHARACTERISTICS V CC = ±6 V, R L = 150 Ω to GND and 390 Ω to V CC, unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS BW SE5539 MIN TYP MA Gain bandwidth product A CL = 7 700 Small signal bandwidth A CL = 2 1 120 t S Settling time A CL = 2 1 23 ns SR Slew rate A CL = 2 1 330 V/µs t PD Propagation delay A CL = 2 1 4.5 ns Full power response A CL = 2 1 20 MHz NOTE: 1. External compensation. UNITS MHz TYPICAL PERFORMANCE CURVES NE5539 Open-Loop Phase 60 NE5539 Open-Loop Gain 0 50 PHASE (DEG) 90 180 270 GAIN (db) 40 30 20 10 360 1 MHz 10MHz 100MHz 1GHz SL00572 Figure 3. NE5539 Open-Loop Phase 0 1 MHz 10MHz 100MHz 1GHz SL00573 Figure 4. NE5539 Open-Loop Gain 2002 Jan 25 6

TYPICAL PERFORMANCE CURVES (Continued) Power Bandwidth (SE) Power Bandwidth (NE) 5 4 p p OUTPUT (V) 4 3 2 1 GAIN ( 2) V CC = +8V R L = 2kΩ 3dB B.W 1 MHz 10MHz 100MHz 300Mhz p p OUTPUT (V) 3 2 1 V CC = +6V R L = 150kΩ GAIN ( 2) 3dB B.W. 0 1 MHz 10MHz 100MHz 300Mhz SE5539 Open-Loop Gain vs Frequency Power Bandwidth 50 REF 3.04V P-P GAIN (db) 40 30 20 10 V CC = +6V R L = 126Ω 0 o 1 MHz 10MHz 100MHz 300Mhz db BELOW REF 2 4 6 8 GAIN ( 7) 10 R L = 150Ω 12 1MHz 10MHz 100MHz 300MHz SE5539 Open-Loop Phase vs Frequency Gain Bandwidth Product vs Frequency PHASE (DEG) 0 45 90 135 V CC = ±6V R L = 126Ω 180 1MHz 10MHz 100MHz 300MHz GAIN (db) 22 20 18 A V = 10 V CC = ±6V A V = 7.5 3dB BANDWIDTH R L = 150Ω 16 3dB BANDWIDTH 14 12 1MHz 10MHz 100MHz 300MHz NOTE: Indicates typical distribution 55 C T amb 125 C SL00574 Figure 5. Typical Performance Curves 2002 Jan 25 7

CIRCUIT LAYOUT CONSIDERATIONS As may be expected for an ultra-high frequency, wide-gain bandwidth amplifier, the physical circuit is extremely critical. Bread-boarding is not recommended. A double-sided copper-clad printed circuit board will result in more favorable system operation. An example utilizing a 28 db non-inverting amp is shown in Figure 6. OPTIONAL OFFSET ADJ. +V V R 5 R F +V 1nF R 4 R 1 75 14 NE5539 7 RFC 10 8 3 1nF 470 R 3 75 V OUT 75Ω TERM V IN +1 R 6 R 2 75 RFC 1nF V 1nF R 1 = 75Ω 5% CARBON R 2 = 75Ω 5% CARBON R 3 = 75Ω 5% CARBON R 4 = 36K 5% CARBON R 5 = 20k TRIMPOT (CERMET) R F = 1.5k (28dB GAIN) R 6 = 470Ω 5% CARBON RFC 3T # 26 BUSS WIRE ON FERROCUBE VK 200 09/3B CORE BYPASS CAPACITORS 1nF CERAMIC (MEPCO OR EQUIV.) Top Plane Copper 1 (Component Side) Component Side (Component Layout) Bottom Plane Copper 1 V R 5 RFC R 2 (1) V IN R 6 R 4 R 1 +V C C RFC R F R 5 Figure 6. 28dB Non-Inverting Amp Sample PC Layout SL00575 2002 Jan 25 8

NE5539 COLOR VIDEO AMPLIFIER The NE5539 wideband operational amplifier is easily adapted for use as a color video amplifier. A typical circuit is shown in Figure 7 along with vector-scope1 photographs showing the amplifier differential gain and phase response to a standard five-step modulated staircase linearity signal (Figures 8, 9 and 10). As can be seen in Figure 9, the gain varies less than 0.5% from the bottom to the top of the staircase. The maximum differential phase shown in Figure 10 is approximately +0.1. The amplifier circuit was optimized for a 75 Ω input and output termination impedance with a gain of approximately 10 (20 db). NOTE: 1. The input signal was 200 mv and the output 2 V. V CC was ±8 V. 750 75 V 22nF V IN 75 + 14 1 7 10 3 V 8 22nF 470 V 1 6dB LOSS 1 Z O = 75Ω 75 75 Figure 9. Differential Gain <0.5% SL00578 NOTE: Instruments used for these measurements were Tektronix 146 NTSC test signal generator, 520A NTSC vectorscope, and 1480 waveform monitor. Figure 7. NE5539 Video Amplifier SL00576 Figure 8. Input Signal SL00577 2002 Jan 25 9

SL00579 Figure 10. Differential Gain +0.1 o +2V 8V Z IN = 500 Ω 820 220 1 2 10pF 14 + NE5539 470 8 118 87 Z O = 50 Ω 1K 2K C LEAD 1.5pF Figure 11. Non-Inverting Follower SL00580 +8V 8V 1K 1 320 2 20pF 14 + NE5539 470 8 118 87 50 1K 3.3pF Figure 12. Inverting Follower SL00581 2002 Jan 25 10

DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 2002 Jan 25 11

SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 2002 Jan 25 12

NOTES 2002 Jan 25 13

Data sheet status Data sheet status [1] Product status [2] Definitions Objective data Preliminary data Development Qualification This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Production Definitions Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. Koninklijke Philips Electronics N.V. 2002 All rights reserved. Printed in U.S.A. Date of release: 01-02 Document order number: 9397 750 09382 2002 Jan 25 14