FEAURES SYMBOL QUCK REFERENCE DAA Low forward volt drop Fast switching Soft recovery characteristic Reverse surge capability High thermal cycling performance Low thermal resistance a1 a2 1 3 k 2 V R = 15 V/ 2 V V F.85 V O(AV) = 3 A RRM =.2 A t rr 28 ns GENERAL DESCRPON Dual, ultrafast, epitaxial rectifier diodes intended for use as ouut rectifiers in high frequency switched mode power supplies. he BYV42E series is supplied in the SO78 conventional leaded package. he BYV42EB series is supplied in the SO44 surface mounting package. PNNNG SO78 (O22AB) SO44 PN DESCRPON 1 anode 1 (a) 2 cathode (k) 1 3 anode 2 (a) tab tab 2 tab cathode (k) 123 1 3 LMNG VALUES Limiting values in accordance with the Absolute Maximum System (EC 134). SYMBOL PARAMEER CONDONS MN. MAX. UN BYV42E / BYV42EB 15 2 V RRM Peak repetitive reverse voltage 15 2 V V RWM Crest working reverse voltage 15 2 V V R Continuous reverse voltage mb 144 C 15 2 V O(AV) Average rectified ouut current square wave 3 A (both diodes conducting) δ =.5; mb 8 C FRM Repetitive peak forward current t = 25 µs; δ =.5; 3 A per diode mb 8 C FSM Nonrepetitive peak forward t = ms 15 A current per diode t = 8.3 ms sinusoidal; with reapplied 16 A V RWM() RRM Repetitive peak reverse current per diode t p = 2 µs; δ =.1.2 A RSM Nonrepetitive peak reverse t p = µs.2 A current per diode stg Storage temperature 4 15 C j Operating junction temperature 15 C 1. t is not possible to make connection to pin 2 of the SO44 package 2. SO78 package, For ouut currents in excess of 2 A, the cathode connection should be made to the mounting tab. July 1998 1 Rev 1.2
ESD LMNG VALUE SYMBOL PARAMEER CONDONS MN. MAX. UN V C Electrostatic discharge Human body model; 8 kv capacitor voltage C = 25 pf; R = 1.5 kω HERMAL RESSANCES SYMBOL PARAMEER CONDONS MN. YP. MAX. UN R th jmb hermal resistance junction to mounting base per diode both diodes 2.4 1.4 K/W K/W R th ja hermal resistance junction to SO78 package, in free air 6 K/W ambient SO44 and SO428 packages, pcb mounted, minimum foorint, 5 K/W FR4 board ELECRCAL CHARACERSCS characteristics are per diode at j = 25 C unless otherwise stated SYMBOL PARAMEER CONDONS MN. YP. MAX. UN V F Forward voltage F = 15 A; j = 15 C.78.85 V F = 15 A.95 1.5 V F = 3 A 1. 1.2 V R Reverse current V R = V RWM ; j = C.5 1 ma V R = V RWM µa Q s Reverse recovery charge F = 2 A; V R 3 V; d F /dt = 2 A/µs 6 15 nc t rr1 Reverse recovery time F = 1 A; V R 3 V; 2 28 ns d F /dt = A/µs t rr2 Reverse recovery time F =.5 A to R = 1 A; rec =.25 A 13 22 ns V fr Forward recovery voltage F = 1 A; d F /dt = A/µs 1 V July 1998 2 Rev 1.2
F d F dt.5a F t rr A time rec =.25A Q s % % R trr2 R rrm = 1A R Fig.1. Definition of t rr1, Q s and rrm Fig.4. Definition of t rr2 F PF / W 2 Vo =.75 V Rs =.97 Ohms BYV42 mb() / C 2 D = 1. 15.5 114 time.1.2 126 V F V fr 5 D = 138 Fig.2. Definition of V fr V F time t 5 15 2 15 25 F(AV) / A Fig.5. Maximum forward dissipation P F = f( F(AV) ) per diode; square current waveform where F(AV) = F(RMS) x D. Voltage Pulse Source R D.U.. PF / W 15 Vo =.75 V Rs =.97 Ohms 4 BYV42 2.8 2.2 mb() / C 114 a = 1.57 1.9 126 Current shunt to scope 5 138 Fig.3. Circuit schematic for t rr2 15 5 15 F(AV) / A Fig.6. Maximum forward dissipation P F = f( F(AV) ) per diode; sinusoidal current waveform where a = form factor = F(RMS) / F(AV). July 1998 3 Rev 1.2
trr / ns Qs / nc F=2A F=2A A 5A 2A 1A F=1A 1 1 df/dt (A/us) Fig.7. Maximum t rr at j = 25 C; per diode 1. 1. df/dt (A/us) Fig.. Maximum Q s at j = 25 C; per diode rrm / A ransient thermal impedance, Zth jmb (K/W) F=2A 1 1 F=1A.1.1.1 P D D =.1 1 df/dt (A/us) Fig.8. Maximum rrm at j = 25 C; per diode t.1 1us us us 1ms ms ms 1s s pulse width, (s) BYV42E Fig.11. ransient thermal impedance; per diode; Z th jmb = f(t p ). 5 4 F / A j = 15 C j = 25 C 3 2 typ.5 1. 1.5 VF / V Fig.9. ypical and imum forward characteristic F = f(v F ); parameter j July 1998 4 Rev 1.2
MECHANCAL DAA Dimensions in mm Net Mass: 2 g 4,5,3 3,7 1,3 2,8 5,9 min 15,8 3, not tinned 1,3 (2x) 1 2 3 2,54 2,54 3, 13,5 min,9 (3x),6 2,4 Notes 1. Refer to mounting instructions for SO78 (O22) envelopes. 2. Epoxy meets UL94 V at 1/8". Fig.12. SO78 (O22AB); pin 2 connected to mounting base. July 1998 5 Rev 1.2
MECHANCAL DAA Dimensions in mm Net Mass: 1.4 g.3 4.5 1.4 11 15.4 2.5 2.54 (x2).85 (x2) Fig.13. SO44 : centre pin connected to mounting base..5 MOUNNG NSRUCONS Dimensions in mm 11.5 9. 17.5 2. 3.8 5.8 Fig.14. SO44 : soldering pattern for surface mounting. Notes 1. Epoxy meets UL94 V at 1/8". July 1998 6 Rev 1.2
DEFNONS Data sheet status Objective specification his data sheet contains target or goal specifications for product development. Preliminary specification his data sheet contains preliminary data; supplementary data may be published later. his data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (EC 134). Stress above one or more of the limiting values may cause permanent damage to the device. hese are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. he information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LFE SUPPOR APPLCAONS hese products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1998 7 Rev 1.2