Weidong Zhang, May.9, 2016 Development of Pre-Insertion Resistor for an 800kV GIS Circuit Breaker. ABB Group May 11, 2016 Slide 1

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Weidong Zhang, May.9, 2016 Development of Pre-Insertion Resistor for an 800kV GIS Circuit Breaker Group Slide 1

Background & Objects EHV/UHV system: Widely application for long distance transmission from large power plants to remote load centres; Demand more insulation distance in case of the clearance for switching impulse voltage. Mostly, a combination of mitigation technologies to reduce the switching overvoltage more effectively: application of closing and opening resistors, MOSA and shunt reactor in the substation or the application of controlled switching; To development GCB with Pre-Insertion Resistor; No load OH Line overvoltage: reduction (p.u) of SOV by CB 400Ω Closing Resistor in 800kV system 1.93 1.3 1.99 1.52 1.87 1.55 No load OH Line overvoltage: (90km) Mitigation No mitigation 146km TL MOSA in both end and middle of line 305km TL MOSA in both end of line 224km TL MOSA in both end of line, and CB with 600Ω Max overvoltage 2.54 1.79 1.83 1.23 Slide 2

Design PIR and PIS Features comparison of scheme Parallel connection of PIR and CB in EHV/UHV No. Item Series Connection of PIR and CB Parallel Connection of PIR and CB 1 Layout with CB 2 Current flow 3 Thermal capacity Larger single enclosure to accommodate PIR and interrupter; cost lower; but capacity limited PIS carries rated current and short circuit current Limited by enclosure dimensions (length). Only applicable for high resistance values. Smaller but may needs a separate enclosure; larger capacity for all application when enclosure separated. PIS does not carry current after closing operation Allows large variation of thermal capacity. 4 Dielectric insulation level of PIS contact gap Comparable to disconnector gap, withstand BIL, Out of Phase level Comparable to disconnector gap, withstand BIL, Out of Phase level 5 PIS function switch full short circuit current 6 PIS mech. linkage 7 Safety Mechanical linkage connected with CB s drive during closing & opening. Small particles from PIR could impact on dielectric stress switch several thousand A depending on PIR resistance value Mechanical linkage connected with CB s drive for closing; Disconnected after CB closed Individual tank avoids the interference between CB and PIR Slide 3

Design PIR Thermal capacity - 1 Required operation consequence (CN): CO 3min- CO -30min CO -3min CO under 1.3p.u. CO-30min-CO at phase opposition (180 phase shift between source and line side) - Most demanding duty cycle Resistor s performance is defined by following characteristics: Thermal capacity Voltage withstand ability Mechanical withstand ability Dimension tolerance To accommodate Resistor disc in constrained space while satisfy requirement Resistance, e.g. 300Ω Dielectric stress; Absorbed energy; Mechanical structure Slide 4

Design PIR Thermal capacity 2 Electric instant of energy injection *one example of electric pre-insertion time 11ms at 400Ω Max voltage peak vs zero point of applied voltage (for test purpose) 16% Slide 5

Design PIS Design Requirement Insulation of PIS Mechanical operation consequence to satisfy PIR pre-insertion requirement; Check pre-arcing time (electric insertion time) with RDDS of PIS, CB; BIL POLOPT simulation show design satisfy electric stress requirement Inject energy in different electric instant for mechanical pre-insertion times, 8ms, 10ms, 11ms for a 300Ω Slide 6

Verification PIS Making Test Test condition Severe condition of out of phase situation, 1306kVpeak; At max current - 3080A in min closing resistance; Good performance - dielectric and visual contact erosion after making Test Pole in KEMA lab Pre-arcing during making test Slide 7

Verification PIR Thermal Capability Test -1 Test condition CO 30min CO under 2p.u.; Pre-insertion time: 11ms and 400Ω - representative application; Actual test pole and test procedure Proportional reduced resistance at typical test pole with 111.1 Ω under 256.6 kv and 2310 A; Remain unchanged in PIR structure and thermal feature and dielectric stress by replacement material of the same heat capacity Insert initiated at voltage zero point. PIR Thermal Capability Test in PEHLA Slide 8

Verification PIR Thermal Capability Test -2 Analysis Result - Adjust and comparison by simulation and Test measurement Environment factor: 11ºC test environment vs 70ºC serious application Max. energy injection: 1.16; Safety margin: >1.2 Temperature rise Dielectric stress analysis >1.2 safety margin; Dielectric stress of each PIR disc layer Slide 9

Conclusion Parallel PIR - shows great performance achieved in compact footprint, high thermal and making capacity. Dielectric stress, thermal performance key elements to PIR design, and non-linear behaviour of resistor material should be taken into consideration.. PIS features - determines the insertion instant and pre-insertion time. electric pre-insertion time. Making test results shows that PIS has high making withstand ability. Verification demonstrate design performance to meet specification; special test must be considered except conventional practice: Thermal test of PIR; PIS making test; Typical 800kV CB with PIR development show all specification has been reached; and design, verification process are comprehensive and effective. Slide 10

Slide 11

Group Slide 12 Slide 12