Quartz Crystal Devices

Quartz Crystal Devices

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Frequency range 32.768 khz 1 MHz 3 MHz 10 MHz 30 MHz 50 MHz 100 MHz There may be unavailable frequency even if it is in the above frequency range. please inquire for availability of the specific frequency. : Fundamental, : 3rd Overtone 2

TYPES OF CRYSTAL CUT Crystal Cut Mode of vibration Frequency range (khz) Capacitance ratio (C0/C1) Thickness shear Fundamental 800~5,000 450~300 2,000~80,000 220 AT BT XY 3rd overtone 5th overtone 7th overtone Thickness shear Fundamental Flexural (Tuning fork) Extensional 20,000~90,000 n 2 x 250 40,000~150,000 70,000~210,000 n: Overtone order 3,000~30,000 650 16~150 425~800 600~3,000 400 DT CT SL Face shear 100~500 400 150~850 350 180~700 400 CRYSTAL UNIT EQUIVALENT CIRCUIT A quartz crystal unit in the main resonance frequency, may be expressed as an electrical equivalent circuit-a circuit ordinarily composed of a series circuit consisting of an inductance, capacitance and resistance, and a capacitance connected in parallel to the series circuit as shown in the drawing. Here, C0, which is commonly known as the shunt capacitance, comprises an inter-electrode static capacitance to which the inter-terminal stray capacitance is added. L1 and C1 are the equivalent constants of the quartz crystal unit viewed as an electrical and mechanical oscillation system. Since both constants are determined by such factors as the type of cut, cutting angle, dimensions of the crystal piece, and construction of the electrodes, and are thus reproducible, quartz crystal units, can be manufactured to high precisions. R1, which denotes oscillation loss, is governed by such conditions as the cutting, mounting, and dimensions of the quartz crystal. L1 : Motional inductance C1 : Motional capacitance R1 : Motional (Series) resistance C0 : Shunt capacitance The electrical equivalent circuit, composed of L1, C1, R1 and C0, all of which are correlated, may be expressed by the following equation. f0 1 Shown below are some equations by which the performances of quartz crystal units are expressed. 1 Q 2f0C1 R1 C0 ratio) (Capacitance C1 2f0L1 R1 L1 C1 C0 R1 3

CRYSTAL CUT AND FREQUENCY vs. TEMPERATURE CHARACTERISTICS Fig. 1: Correlation between Crystal cut and Frequency vs. temperature characteristics f f To = Fig. 2: Frequency vs. temperature characteristic of Tuning Fork Crystal Unit f f Fig. 3: Correlation between Crystal cutting angles and Frequency vs. temperature characteristics of AT-cut Crystal Units f f 4

GLOSSARY Description Description Crystal unit equivalent circuit Load capacitance (CL) Nominal frequency (f0) The electrical circuit which has the same impedance as the unit in the immediate neighborhood of resonance The effective external capacitance associated with the crystal unit which determines the load resonance frequency (fl). The frequency assigned by the specification of the crystal unit. Drive level, (Level of drive) Insulation resistance Q value The level of power or current in the crystal unit when in the operating state. Resistance between leads, or between lead and case. In a resonance circuit composed of an L, C and R, a quantity that represents the sharpness of a resonance curve-a curve that shows the relationship between the circuit current and power frequency. Resonance frequency (fr) The lower of the two frequencies of the crystal unit alone, under specified conditions, at which the electrical impedance of the crystal unit is resistive. Frequency stability Within operating temperature, operating voltage and output load range, deviation in actual frequency from nominal frequency. Load resonance frequency (fl) Resonance resistance (R1) Load resonance resistance (RL) Motional inductance (L1) Motional capacitance (C1) Shunt capacitance (C0) Capacitance ratio (C0/C1) Overtone order Unwanted response Frequency tolerance (f/f0) Operating temperature range Storage temperature range One of the two frequencies of a crystal unit in association with a series or with a parallel load capacitance, under specified conditions, at which the electrical impedance of the combination is resistive. The frequency is the lower of the two frequencies when the load capacitance is in series. The resistance of the crystal unit alone at the resonance frequency. The resistance of the crystal unit in series with a stated external capacitance at the load resonance frequency. The inductance in the motional (series) arm of the equivalent circuit. The capacitance of the motional (series) arm of the equivalent circuit. The static capacitance between the electrodes, together with stray capacitances of the mounting system. The ratio of the shunt capacitance to the motional capacitance. The numbers allotted to the successive overtones of a given mode of vibration from the integral numbers commencing with the fundamental as unity. Frequency responses other than the main, or desired response, which the crystal elements have. The permissible deviation from the nominal frequency at the reference temperature (usually 25 C). The range of temperatures over which the crystal unit shall function. The temperature range over which the standard characteristics of the crystal unit can be maintained when the crystal unit is not in operation. Supply current Duty Output load Rise time Fall time Start up time Output enable function Frequency adjustment range Phase noise Harmonic distortion Allan variance fractional frequency fluctuation The electric current to supply (VDD) pin with no output load when output is enabled. The 1/2 cycle to 1 cycle ratio (as expressed in percentages) of an output waveform at the specified voltage level. The load that can be connected to the oscillator. The time interval required for the leading edge of a pulse wave form to change from specified L voltage level to specified H voltage level. The time interval required for the trailing edge of a pulse wave form to decay from specified H voltage level to specified L voltage level. The time interval between power on and supply voltage becomes the specified voltage until the output waveform becomes stable. The function to change the output signal. When pins OE are at H level or open : Specified frequency is output. (Enable) When pins OE are at L level : Output has high impedance. (Disable) Frequency adjustment (pulling) range of a crystal oscillator which enable to change the frequency with a variable component. Unit of measurement of frequency sphere in short-term frequency stability of a crystal oscillator. Non-linear distortion by occurrence of the needless spectral element in a higher harmonic wave of the requisite signal frequency. Each harmonic element is generally expressed in power ratio (db) to output power of a requiring signal. Objective evaluation is defined by timedomain in short-term frequency stability of a crystal oscillator 5

TUNING FORK CRYSTAL UNIT (SMD Ceramic Package) RoHS compliant / Pb free CM2012H 3000pcs/reel FEATURES Tuning fork crystal with ceramic packaged type. High-density SMD type Ultra-light weight with ultra-miniature packaging. High-stability assured with tight vacuum sealing. Most appropriate for portable devices and mobile telecommunications devices. DIMENSION [mm] SOLDER PAD LAYOUT [mm] STANDARD SPECIFICATIONS CM2012H Conditions Nominal Frequency Load capacitance Turnover Temperature Temperature Coefficient Motional (series) resistance Level of drive Aging (first year) Shunt capacitance

TUNING FORK CRYSTAL UNIT (SMD Ceramic Package) RoHS compliant / Pb free CM315D 3000pcs/reel FEATURES 7Tuning fork crystal with ceramic packaged type. 7High-density SMD type Ultra-light weight with ultra-miniature packaging. High-stability assured with tight vacuum sealing. 7Most appropriate for portable devices and mobile telecommunications devices. DIMENSION [mm] SOLDER PAD LAYOUT [mm] STANDARD SPECIFICATIONS CM315D Conditions Nominal Frequency Load capacitance Need to specify your requirement Turnover Temperature Temperature Coefficient Motional (series) resistance Level of drive Aging (first year) Shunt capacitance

TUNING FORK CRYSTAL UNIT (SMD Ceramic Package) RoHS compliant / Pb free CM315DL 3000pcs/reel FEATURES Tuning Tuning fork crystal with ceramic packaged type. SMD type for low current consumption IC. High-density SMD type Reduced Ultra-light motional weight with resistance ultra-miniature by 30% packaging. compared High-stability with existing assured models. with tight vacuum sealing. Most appropriate for portable devices, mobile Most appropriate for portable devices and mobile telecommunication devices and wearable devices. telecommunications devices. DIMENSION [mm] SOLDER PAD LAYOUT [mm] STANDARD SPECIFICATIONS Nominal Frequency CM315DL Conditions Load capacitance Need to specify your requirement Turnover Temperature Temperature Coefficient Motional (series) resistance Level of drive Aging (first year) Shunt capacitance 7

TUNING FORK CRYSTAL UNIT (SMD Ceramic Package) CM415 3000pcs/reel FEATURES 7Tuning fork crystal with ceramic packaged type High-density SMD type. 7Light weight with small and thin packaging High-stability assured with tight vacuum sealing. 7Most appropriate for portable devices, automotive applications and mobile telecommunication devices. 7Complete Pb free product. DIMENSION [mm] SOLDER PAD LAYOUT [mm] STANDARD SPECIFICATIONS CM415 Conditions Nominal Frequency Load capacitance Need to specify your requirement Turnover Temperature Temperature Coefficient See figure 2 in P4 Motional (series) resistance Level of drive Aging (first year) Quality Factor Shunt capacitance 8

TUNING FORK CRYSTAL UNIT (SMD Ceramic Package) CM519 3000pcs/reel FEATURES 7Tuning fork crystal with ceramic packaged type. 7Small & thin packaging and light weight. 7Most appropriate for portable devices and mobile telecommunications devices. 7Complete Pb free product. DIMENSION [mm] SOLDER PAD LAYOUT [mm] STANDARD SPECIFICATIONS CM519 Conditions Nominal Frequency Load capacitance Need to specify your requirement Turnover Temperature Temperature Coefficient See figure 2 in P4 Motional (series) resistance Level of drive Aging (first year) Quality Factor Shunt capacitance 9

TUNING FORK CRYSTAL UNITS (SMD Plastic Package) CM200C. CM250C 3000pcs/reel FEATURES 7Embeded with heat resistant cylinder type crystal bring highly stable characteristics. 7Automatic mounting and reflowable type. 7Most appropriate for clock source for portable and autmotive equipment with low power consumption. DIMENSION [mm] SOLDER PAD LAYOUT [mm] STANDARD SPECIFICATIONS Nominal Frequency CM200C CM250C Conditions Need to contact us for the available frequency in CM250C Load capacitance Need to specify your requirement Turnover Temperature Temperature Coefficient See figure 2 in P4 Motional (series) resistance Level of drive Aging (first year) Quality Factor Shunt capacitance 10

TUNING FORK CRYSTAL UNIT (SMD Jacket Type) CMJ206 3000pcs/reel FEATURES 7High-density mounting SMD with jacket. 7Automatic mounting and reflowable type. 7Most appropriate for clock source for portable and other various equipment with low power consumption. DIMENSION [mm] SOLDER PAD LAYOUT [mm] STANDARD SPECIFICATIONS CMJ206 Conditions Nominal Frequency Load capacitance Need to specify your requirement Turnover Temperature Temperature Coefficient See figure 2 in P4 Motional (series) resistance Level of drive Aging (first year) Quality Factor Shunt capacitance 11

TUNING FORK CRYSTAL UNITS (SMD Cylinder Type) CMR200T 2000pcs/reel FEATURES 7Lead formed SMD type with embossed tape. Automatic mounting and reflowable type. 7Most appropriate for clock source for portable and other various equipment with low power consumption. DIMENSION [mm] SOLDER PAD LAYOUT [mm] 0.3 0.1 6.0 ø1.90.1 2.540.3 0.3 0.3 CMR200T CMR200T STANDARD SPECIFICATIONS CMR200T Conditions Nominal Frequency Load capacitance Turnover Temperature Temperature Coefficient See figure 2 in P4 Motional (series) resistance Level of drive Aging (first year) Quality Factor Shunt capacitance 12

TUNING FORK CRYSTAL UNITS (Cylinder Type) RoHS compliant / Pb free CFS-206. CFS-145. CFV-206 FEATURES Best suited for portable devices with low current consumption. For a clock source in digital equipment. DIMENSION [mm] CFS-206, CFV-206 CFS-145 STANDARD SPECIFICATIONS Nominal Frequency CFS-206 CFS-145 CFV-206 Conditions Load capacitance Turnover Temperature Temperature Coefficient Motional (series) resistance Level of drive Aging (first year) Shunt capacitance 13

AT-CUT CRYSTAL UNIT (SMD Ceramic Package) CS325S 3000pcs/reel FEATURES 7High-density SMD type. 7Reliable ceramic package and excellent environmental characteristics. 7Suitable for various applications such as communication devices, AV devices and other equipment. 7Complete Pb free product. DIMENSION [mm] SOLDER PAD LAYOUT [mm] 1.3 1.0 1.3 1.1 (Top View) 1.1 0.8 STANDARD SPECIFICATIONS CS325S Conditions Nominal Frequency over Motional (series) resistance Load capacitance Shunt capacitance Level of drive Insulation Resistance Aging (first year) MOTIONAL (SERIES) RESISTANCE (R1) Frequency Range ESR 14

AT-CUT CRYSTAL UNIT (SMD Plastic Package) RoHS compliant CM309E 1000pcs/reel FEATURES Embeded with heat resistant cylinder type crystal bring highly stable characteristics. Automatic mounting and reflowable type. Suitable for various applications such as communication devices, AV devices, and measuring instruments. DIMENSION [mm] SOLDER PAD LAYOUT [mm] STANDARD SPECIFICATIONS CM309E Conditions Nominal Frequency over Operating Temperature Range Motional (series) resistance Load capacitance Shunt capacitance Level of drive Insulation Resistance Aging (first year) MOTIONAL (SERIES) RESISTANCE (R1) Frequency Range Mode R1 15

AT-CUT CRYSTAL UNIT (SMD Plastic Package) CM309S 1000pcs/reel FEATURES 7Embeded with heat resistant cylinder type crystal bring highly stable characteristics. 7Automatic mounting and reflowable type. 7Suitable for various applications such as communication devices, AV devices, automotive devices and measuring instruments. DIMENSION [mm] SOLDER PAD LAYOUT [mm] STANDARD SPECIFICATIONS CM309S Conditions Nominal Frequency over Operating Temperature Range Motional (series) resistance Load capacitance Shunt capacitance Level of drive Insulation Resistance Aging (first year) MOTIONAL (SERIES) RESISTANCE (R1) Frequency Range Mode R1 15

AT-CUT CRYSTAL UNIT (SMD Metal-can Type) HCM49 1000pcs/reel FEATURES 7Surface mount type of metal-can HC-49/U-S. High performance with the resistance weld sealing. 7Automatic mounting and reflowable type. 7Suitable for various applications such as communication devices, AV devices, automotive devices and measuring instruments. DIMENSION [mm] SOLDER PAD LAYOUT [mm] 10.5 Max. 12.40.4 11.40.2 3.81 Max. 4.3 Max. 1.5 3.6 Max. 5.5 3 5.5 4.70.2 STANDARD SPECIFICATIONS HCM49 Conditions Nominal Frequency over Operating Temperature Range Motional (series) resistance Load capacitance Shunt capacitance Level of drive Insulation Resistance Aging (first year) MOTIONAL (SERIES) RESISTANCE (R1) Frequency Range Mode R1 16

AT-CUT CRYSTAL UNITS (Cylinder Type) CSA-310. CSA-309 FEATURES 7High performance miniature crystal units with Citizen's ultra-precise processing technology. 7High-stability assured with tight vacuum sealing. 7Suitable for various applications. DIMENSION [mm] SOLDER PAD LAYOUT [mm] ø3.00.2 ø3.00.2 +0.07 ø0.32 0.03 +0.07 ø0.32 0.03 0.2 1.10.2 0.5 0.2 1.10.2 0.5 CSA-310 CSA-309 STANDARD SPECIFICATIONS CSA-310 CSA-309 Conditions Nominal Frequency over Operating Temperature Range Motional (series) resistance Load capacitance Shunt capacitance Level of drive Insulation Resistance Aging (first year) MOTIONAL (SERIES) RESISTANCE (R1) Frequency Range Mode R1 17

AT-CUT CRYSTAL UNIT (Metal-can Type) HC-49/U-S FEATURES 7High performance miniature crystal units with Citizen's ultra-precise processing technology. 7Available in Tape and reel form. 7Suitable for various applications such as communication, AV, automotive and measurement devices. DIMENSION [mm] Taping dimension : 2000pcs/Ammo pack [mm] STANDARD SPECIFICATIONS HC-49/U-S Conditions Nominal Frequency over Operating Temperature Range Motional (series) resistance Load capacitance Shunt capacitance Level of drive Insulation Resistance Aging (first year) MOTIONAL (SERIES) RESISTANCE (R1) Frequency Range Mode R1 18

CRYSTAL CLOCK OSCILLATORS (SMD Ceramic Package) RoHS compliant CSX-750F SERIES 2000pcs/reel FEATURES 7Available to supply voltage 5.0V or 3.3V. 7Low current consumption with output enable function (OE) or stand by function (STAND-BY). 7Suitable for various applications such as communication devices, AV devices and measuring instruments. DIMENSION [mm] SOLDER PAD LAYOUT [mm] 5.08 4.20 2.00 1.80 STANDARD SPECIFICATIONS Frequency Range Supply Voltage Frequency Stability Current consumption Duty Output Voltage Output Load Rise and Fall Time Start-up time Input Voltage Disable current Stand-by current CSX-750 FC CSX-750 FB CSX-750 FJ

CRYSTAL CLOCK OSCILLATORS (SMD Ceramic Package) RoHS compliant CSX-750F (Low Voltage Ver.) 2000pcs/reel FEATURES 7Available to supply voltage 1.8V to 2.8V. 7Low current consumption type. 7Suitable for various applications such as communication devices, AV devices and measuring instruments. DIMENSION [mm] SOLDER PAD LAYOUT [mm] 5.08 4.20 2.00 1.80 STANDARD SPECIFICATIONS Frequency Range Supply Voltage Frequency Stability Current consumption Duty Output Voltage Output Load Rise and Fall Time Start-up time Input Voltage Disable current Stand-by current CSX-750 FM CSX-750 FH CSX-750 FN

2000pcs/reel Function 1 input 3 Output condition Oscillation out H Oscillation out Open Oscillation stop L 7.0±0.15 1.4 5.08 FEATURES #1 #2 1.6 Max. SSX-750P SERIES RoHS compliant / Pb free Pin Assignment Pin No. Connection OE or Stand By 1 GND 2 OUT 3 Vdd 4 5.0±0.15 PROGRAMMABLE OSCILLATORS (SMD Ceramic Package) 2.6 Wide range of output frequency by PLL technology. Quick sample delivery and short lead time in mass production. Low current consumption with output enable #3 function (OE)#4or stand by function (STAND-BY). Suitable for various applications such as communication devices, AV devices and measuring instruments. DIMENSION [mm] 2.00 #2 4.20 5.08 2.6 #1 5.08 1.6 Max. 5.0±0.20 Function 1 input 3 Output condition Oscillation out H Oscillation out Open Oscillation stop L 7.0±0.20 1.4 SOLDER PAD LAYOUT [mm] Pin Assignment Pin No. Connection OE or Stand By 1 GND 2 OUT 3 Vdd 4 1.80 #3 #4 STANDARD SPECIFICATIONS OE STAND-BY Frequency Range is determined by the selection for the output enable or stand-by function, the frequency stability and the supply voltage. SSX-750 PT SSX-750 PK SSX-750 PC SSX-750 PD 1.000MHz 125.000MHz Vdd : 5.0V±0.5V Supply Voltage 20 70 40 85 5.08 55 125 45mA Max. Current consumption Output Load 40 60% VOH VOL TTL CMOS 1.80 Vdd 4.0V Min. 0.4V Max. 5TTL Max. 25pF Max. 15pF Max. 4 nsec Max. Rise and Fall Time 10 msec Max. Start-up time Input Voltage 28mA Max. 40 60% 2.00 4.20 TTL level 1.4V CMOS level 1/2 Vdd Output Voltage Vdd : 3.3V±0.3V B : ±50ppm, C : ±100ppm, E : ±50ppm 40 85, F : ±100ppm 40 85 Frequency Stability Duty SSX-750 PB SSX-750 PJ VIH VIL Disable current Stand-by current http://cfm.citizen.co.jp/english/product/pr02.html 2.0V Min. 0.7Vdd Min. 0.8V Max. 0.2Vdd Max. 30mA Max. 16mA Max. 50μA Max. 20

VOLTAGE CONTROLLED CRYSTAL OSCILLATORS (SMD Ceramic Package) CSX-750V SERIES 2000pcs/reel FEATURES 7Available to supply voltage 5.0V or 3.3V. 7Automatic mounting and reflowable type. 7Most appropriate for communication devices and other equipment. 7Output enable function (OE) can be used for low power consumption. DIMENSION [mm] SOLDER PAD LAYOUT [mm] 4.2 2.54 2.54 2.0 1.8 STANDARD SPECIFICATIONS CSX-750 VJM CSX-750 VKL Frequency Range Supply Voltag Frequency Stability Pulling range Frequency control voltage Current consumption Disable current Linearity Duty Output Voltage Output Load Rise and Fall Time Start-up time Modulation band width Phase Noise 21

TEST CIRCUIT CSX-750F/P SERIES : 390 : CSX-750 (FC) 820 : CSX-750 (PT, PK) : 50pF : CSX-750 FC *1 : 30pF : CSX-750 (FB, FJ) *1 : 25pF : CSX-750 (PC, PD) *1 : 15pF : CSX-750 (PB, PJ) CSX-750V SERIES TEST POINT VDD VDD A 0.1F 6 5 4 VDD OE OUT CL= 30pF 0.1F 6 5 4 VDD OE OUT Vdd/2 Vc GND 1 2 3 Vdd/2 Vc GND 1 2 3 GND GND OUTPUT WAVE-FORMCSX-750 SERIESCSX-325 SERIES Measurement conditions: 1. Oscilloscope Impedance: No less than 1MΩ Capacitance: No more than 15pF Band width: No less than 500MHz 2. The CL includes the probe capacitance. 3. Grounding should be single-point grounding. 4. Supply impedance should be as low as possible. 0V 0.9Vdd rise time is No less than 150µs 5. use an ammeter with small internal impedance. tr tf tr tf VOH 80%VDD VOH 2.4V 50%VDD 1.4V 20%VDD 0.4V VOL Th T DUTY=Th/T VOL Th T DUTY=Th/T 22

TAPE & REEL SPECIFICATION Taping & reel form is conforming to JIS C 0806 and EIAJ RC-1009B and a unit in quantity per reel shall be 1,000pcs, 2000pcs or 3,000pcs. A "Label" on which necessary information is clearly written is on the surface of the packing box and the reel. Goods will be ship out after packing some taping reels into the shipping box. Taping dimensions (Conforming to JIS C 0806 TB1208NEIAJ and RC-1009B TE1208N) Reel dimensions (Conforming to JIS C 0806 R12R and EIAJ RC-1009B R15) Tape lead-out direction f 4.00.1 2.00.1 0.1 0 0.1 e b a h g l n m C d k j Unit : mm Unit : mm CM200C Quantity a b c d e f g h j k l m n CM250C CM519 CM415 CM315 HCM49 CM309S CS325 CMR200T CMJ206 CSX-750F CSX-750P CSX-750V 23

HANDLING INSTRUCTIONS The following instructions and information are provided for the purpose of having the user understand the proper way to handle the Citizen crystal products to prevent problems prior to use and enhance the reliability of equipment to which they are applied. I. When dropped by mistake: < All products > The crystal products are designed and manufactured to resist physical shocks. However, in the event the crystal is subjected to excessive impact such as being dropped onto the floor or giving shocks during mounting. Need to make sure its satisfactory performance before using it. II. Soldering: < Lead Type products > (1) Lead wires should be soldered within 3 seconds with the iron heated to a temperature no higher than 380 C. (2) In solder-dip mounting, it should be within 10 seconds with a temperature no higher than 260 C. And beware not to heat the whole crystal unit in the dip mounting process. Mounting in upright bearing is recommendable (prevent heat conduction directly to the body of a crystal unit). (3) Heating the whole crystal unit, for example, in a reflow oven may deterioration of the performance. Because the holder is quite small and it is sealed by solder material with press sealing so that such reflow process not allowed to be proceeded. < SMD Type products > (1) Eutectic solder (2) Pb free solder III. Bending Lead: < Cylinder Type products > (1) When the lead of cylinder type crystal units need to be bent, leave more than 1.5mm (3.0mm is recommendable) of lead from the case in order to prevent from occurrence of any cracks of the hermetic seal glass at the root of the lead and use a jig for bending if possible. (2) When bending the lead of cylinder type crystal units, do not scrape off the solder plating from the lead surface. IV. Mounting: < Cylinder Type products > (1) Soldering on the body of the cylinder type crystal unit must be strictly avoided due to deteriorate the characteristics or damage the products. Rubber adhesive is recommended. 1.5mm Min. (2) When the lead needs to be bent by hand, follow the next instructions. Hold the body of the Cylinder type crystal unit in fingers. Pick at the part with tweezers, which you intend to bend. There should be more than 1.5mm (3.0mm is recommendable) from the body case. Bend the lead 90 by tweezers without pulling the lead strongly. If pulling the lead strongly may cause any cracks of the hermetic seal glass at the root of the lead and may cause the airtightness and the characteristics to deteriorate. 24

< SMD Type products > When using an automatic loading machine, test and confirm to cause no damage to the crystal products before mounting. Bending the circuit board in the process of cleaving boards after mounting and soldering crystal products may cause peeling off the soldering or package cracks by mechanical stress. Please be sure that the layout of crystal products position is on the less stressed and the cleaving process is under less stressed for the crystal products. < Crystal Oscillators > Please be sure to confirm that the pin location is proper with electric wiring on the circuit board prior to mounting the crystal oscillators. Mounting to the wrong pin position will cause malfunction and damage to the crystal oscillator and the circuit board. V. Cleaning: < All products > (1) Crystal products may be affected and destroyed at worst by ultrasonic cleaning. Please be sure to check if your cleaning process affects any damage to crystal products prior to use. (2) Some kind of cleaning fluid may cause any damage to crystal products. Please be sure to check suitability of the cleaning fluid in advance. VI. Thermal shock: < Crystal Oscillators > Repetitive rapid changes with a great amplitude in temperature may cause deteriorate the crystal unit and break the wires inside the package. The condition must be avoided. IX. Power supply lines: < Crystal Oscillators > Line impedance of a power supply should be as low as possible. To maintain stable operation, power supplies to the Crystal Oscillator should have by-pass capacitor (0.01µF ~ 0.1µF). Place the capacitor as close as possible to the Crystal Oscillator supply pins (VDD and GND). Supply lines (VDD, GND) should be as wide as possible. X. Output line: < Crystal Oscillators > To reduce the line impedance of the Output line and reduce the electromagnetic radiation, output load should be installed as close as possible to the Crystal Oscillator. XI. Input line: < Crystal Oscillators > Input pin (OE) is pulled up with an internal resister, but if it is not used, connect it to VDD. XII. Storage: < All products > Storage of Crystal products under higher temperature or high humidity for a long term may affect frequency stability or solderability. Please store the Crystal products under the normal temperature and humidity without exposing to direct sunlight and dew condensation, and avoid the storage of Crystal products for more than 6 months, and mount them as soon as possible after unpacking. VII. Static electricity: < Crystal Oscillators > Excessive levels of electricity may cause damage of IC inside of a Crystal oscillator even if an anti static electricity protection circuit is provided in the circuit board. Please be sure to use conductive packing materials and transport containers, and use the soldering gun and the measuring circuit free from high-voltage leakage and provide grounding connection while using crystal oscillators. VIII. Noise: < Crystal Oscillators > Applying excessive levels of extraneous noise to power supply or input pin may cause latch-up or spurious phenomenon, which results in malfunction and breakdown. Do not permit any objects, which emit a high level of noise in a location near the Crystal Oscillator. 25

PRECAUTIONS IN OSCILLATION CIRCUIT DESIGN To utilize Crystal units characteristics fully, is necessary to design a oscillation circuit with optimal conditions. Based on Citizen's experience accumulated over the year, Citizen offers such service as checking the oscillation circuit designed by a customer with regard to items mentioning following to ensure optimal matching between the crystal units and the oscillation circuit. The results of investigation with regard to items will be reported to the customer as Citizen's "Circuit Investigation Report". 1. MOS Fundamental Crystal Oscillation Circuit CL : Load capacitance -R : Negative resistance Le : Effective Inductance Re : Effective resistance Rf Crystal unit Oscillation Circuit 5. Frequency-Voltage coefficient Represents the rate of frequency change against variations in the supply voltage. The cause of frequency changing by the power supply variation attributes to factors on the oscillation circuit side (especially IC) than the Crystal unit. It is normally desirable to keep within ±5ppm in the rate of frequency change against ±10% variation in the supply voltage. 6. Frequency tolerance over operating temperature range Represents the rate of frequency change against various in operating temperature. There may be a large difference between the oscillation circuit and the crystal unit in Frequency tolerance over operating temperature range. (Example) Frequency tolerance over operating temperature range C1 Xtal Rd C2 If required Le Re CL R f/f ppm 10 Crystal unit MOS Fundamental Crystal Oscillation Circuit 2. Load capacitance (CL) The Load capacitance (CL) refers to an effective external series capacitance in an assuming oscillation circuit that is viewed from the crystal unit side. Resonance frequency will be determined with the Load capacitance and the crystal unit. For this reason, differences in the load capacitance of the oscillation circuit may cause the frequency deviations (result in a different resonance frequency from the required one). Equation of Load capacitance in Oscillation Circuit C1 C2 CL = + CIC + C C1 + C2 External capacitance Internal capacitance of IC Correlation crystal unit and Oscillation Circuit Stray capacitance of PCB 3. Negative resistance (-R) The Negative resistance reflects the allowance and margin for oscillation motility. An insufficient negative resistance may cause unexpected trouble such as No-Oscillation or slow start-up time. 4. Drive Current (i) The drive current refers to the current flows through a crystal unit. An excessive drive current that is applying a crystal unit may cause the following trouble and phenomenon. Increase in the electromagnetic wave noise. Crystal element of T/F breaking off Get worse the characteristics of the crystal unit such as frequency Tolerance, over Operating Temperature Range, Motional resistance (Series resistance) 7. How to Check a margin for oscillation motility To know a margin for oscillation motility should check the negative resistance (-R) of a oscillation circuit. Connect a variable resistor (VR) to the oscillation circuit in series with the crystal unit. To turn down the value resistor of VR from the NO- OSCILLATION in abeyance to the oscillation START-UP. The value shall be the negative resistance (-R) at the oscillation starts up. Adjust value of C1, C2 and Rd as the negative resistance to be 5 times larger than the effective resistance in order to get enough margins for oscillation motility. And to get 10 times of -R to the effective resistance is recommended for equipment that is required the high quality and reliability such as auto-motive etc. C1 25 60 Xtal Rf VR Oscillation circuit for checking -R Rd C2 Oscillation circuit with the Crystal unit 26

PART NUMBERING SYSTEM Tuning Fork Crystal Units When ordering or inquiring, please specify Part Number according to the following. (Example Part Number) CM315D 32 768 D Z F T CFS-206 CFS-145 CFV-206 CMR200T CMJ206 CM200C CM250C CM519 CM415 CM315D CM315DL CM2012 A B C D E F G H Z Frequency Please mention numeral of the frequency in Hz unit. (at 25) +/-30ppm +/-50ppm +/-100ppm +/-20ppm +/-10ppm +/-15ppm +/-25ppm +/-5ppm Others (STD) (STD) 32.768kHz Standard shall differ subject to frequency. TAPE & REEL SPECIFICATION T B Tape & Reel Bulk Load capacitance (CL) A B C D E F Series 6.0pF 9.0pF (STD) 9.5pF 12.0pF 12.5pF (STD) G Q S V Y Z 13.0pF 10.0pF 11.0pF 8.0pF 7.0pF Others over Z Standard Spec.

PART NUMBERING SYSTEM AT-Cut Crystal Units When ordering or inquiring, please specify Part Number according to the following. (Example Part Number) CS325S 20 000 000 A A J T HC-49/U-S HCM49 CM309S/E CS325S Frequency Please mention numeral of the frequency in Hz unit. (at 25) TAPE & REEL SPECIFICATION A B C D E F G H Z +/-30ppm +/-50ppm +/-100ppm +/-20ppm +/-10ppm +/-15ppm +/-25ppm +/-5ppm Others (STD) (STD) Standard shall differ subject to frequency. A B C D E F G H T B Series 6.0pF 9.0pF 9.5pF 12.0pF 12.5pF 13.0pF 15.0pF Tape & Reel Bulk Load capacitance (CL) I J K L M N O P 16.0pF 18.0pF 20.0pF 22.0pF 25.0pF 30.0pF 32.0pF 33.0pF Q R S T U V Y Z 10.0pF 50.0pF 11.0pF 14.0pF 17.0pF 8.0pF 7.0pF Others over A B C D E F G H I J K L +/-30ppm +/-50ppm +/-100ppm +/-20ppm +/-10ppm +/-30ppm +/-50ppm +/-100ppm +/-20ppm +/-10ppm +/-150ppm +/-200ppm (-10 to +60 C) (STD) (-10 to +60 C) (STD) (-10 to +60 C) (-10 to +60 C) (-10 to +60 C) (-40 to +85 C) (-40 to +85 C) (-40 to +85 C) (-40 to +85 C) (-40 to +85 C) (-40 to +85 C) (-40 to +85 C) Shall not be available subject to the frequency. M N O P Q R S T U V W X Z +/-60ppm +/-80ppm +/-30ppm +/-40ppm +/-50ppm +/-60ppm +/-70ppm +/-80ppm +/-80ppm +/-100ppm +/-150ppm +/-200ppm Others (-40 to +85 C) (-40 to +85 C) (-20 to +70 C) (-20 to +70 C) (-20 to +70 C) (-20 to +70 C) (-20 to +70 C) (-20 to +70 C) (-40 to +100 C) (-40 to +100 C) (-40 to +100 C) (-40 to +100 C)

PART NUMBERING SYSTEM Quartz Oscillators (Clock Oscillators, Programmable Oscillators) When ordering or inquiring, please specify Part Number according to the following. (Example Part Number) CSX-750 FC C 20 000 000 T Series SSX-750P CSX-750F TAPE & REEL SPECIFICATION T B Tape & Reel Bulk Frequency Please mention numeral of the frequency in Hz unit. Frequency Stability B C E F Z +/-50ppm +/-50ppm +/-100ppm +/-100ppm +/-50ppm +/-100ppm Others (-10 to +70 C) (-20 to +70 C) (CSX-750) (-10 to +70 C) (-20 to +70 C) (CSX-750) (STD) (-40 to +85 C) (-40 to +85 C) Shall not be available subject to the frequency. Please chose specific model by referring each detail specifications.

PART NUMBERING SYSTEM Voltage Controlled Crystal Oscillator When ordering or inquiring, please specify Part Number according to the following. (Example Part Number) CSX-750 VJ B 20 000 000 T Series CSX-750V TAPE & REEL SPECIFICATION T B Tape & Reel Bulk Frequency Please mention numeral of the frequency in Hz unit. Frequency Stability B C E F Z +/-50ppm +/-100ppm +/-50ppm +/-100ppm Others (-20 to +70 C) (STD) (-20 to +70 C) (-40 to +85 C) (-40 to +85 C) Shall not be available subject to the frequency. Please chose specific model by referring each detail specifications. 34