TARIF IFTEC ES NORMES IPC (TOUS LES SONT SUSCEPTIBLES 'ÉVOLUER EN FONCTION E LA PARITÉ EURO/OLLAR) MAJ : 3/10/2017 Validité : 06/11/17 IFTEC : 33 rue Ravon - 92340 BOURG-LA-REINE - France Tel : +33 01 45 47 02 00 Fax : +33 01 45 47 39 79 Mail : iftec@iftec.fr Site : www.iftec.fr SAS CAPITAL 62.500 - RCS Nanterre 324 047 174 00028 - Id. TVA FR 65 324 047 178
Colissimo Expert France : poids < 2 kg 18 poids > 2kg < 4 kg 24 poids > 4kg < 6 kg 30 poids > 6kg < 8 kg 36 poids > 8kg < 10 kg 42 1071B 1072 1601A 1782 2141A 2152 2220 2221B 2221B-FR 2222A 2222A-FR 2223 2225 2226 LIV = Livre version papier C = licence individuelle, PF sur C = licence individuelle, PF téléchargeable Coût transport / emballage Colissimo Expert étranger : 35 poids < 3 kg 69 poids > 3kg < 6 kg 78 poids > 6kg < 10 kg 103 poids > 10kg < 15 kg 129 poids > 15kg < 20 kg LIV IPC-1071B 80 75 C IPC-1071B(E)1 54 84 IPC-1071()1 LIV IPC-1072 75 75 C IPC-1072(E)1 54 84 IPC-1072()1 LIV IPC-1601A 100 75 C IPC-1601A(E)1 54 84 Printed Board Handling and Storage Guidelines IPC-1601A()1 LIV IPC-1782 150 133 LIV IPC-1782()1 IPC-2141A()1 IPC-2152()1 IPC-2220-FAM (SERIE 2221B + 2222A + 2223 + 2225 + 2226) LIV IPC-2221B 422 133 821 500 IPC 2220 Family of esign ocuments C IPC-2221B(E)1 54 143 Generic Standard on Printed Board esign IPC-2221B()1 LIV IPC-2221B-FR 540 196 C IPC-2221B-FR(E)1 54 206 IPC-2221B-FR()1 LIV IPC-2222A 99 104 IPC-2222A()1 LIV IPC-2222A-FR 120 152 C IPC-2222A-FR(E)1 54 162 IPC-2222A-FR()1 LIV IPC-2223 91 133 C IPC-2223(E)1 54 143 IPC-2223()1 IPC-2225()1 IPC-2226()1 TARIF IFTEC NORMES IPC AU 3 OCTOBRE 2017 Intellectual Property Protection in Printed Board Manufacturing Intellectual Property Protection in Electronic Assembly Manufacturing Standard for Manufacturing and Supply Chain Traceability of Electronic Products esign Guide for High-Speed Controlled Impedance Circuit Boards Standard for etermining Current Carrying Capacity in Printed Board esign Norme Générique de Conception du Circuit Imprimé (French Language) Sectional esign Standard for Rigid Organic Printed Boards Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides (French Language) Sectional esign Standard for Flexible Printed Boards Sectional esign Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies Sectional esign Standard for High ensity Interconnect (HI) Boards
2251 2291 2611 IPC-2251()1 LIV IPC-2291 125 75 C IPC-2291(E)1 54 84 esign Guideline for Printed Electronics IPC-2291()1 IPC-2611()1 esign Guide for the Packaging of High Speed Electronic Circuits Generic Requirements for Electronic Product ocumentation 2612 IPC-2612()1 Sectional Requirements for Electronic iaamming ocumentation (Schematic and Logic escriptions) 2612-1 IPC-2612-1()1 Sectional Requirements for Electronic iaamming Symbol Generation Methodology 2614 IPC-2614()1 Sectional Requirements for Board Fabrication ocumentation 2615 IPC-2615()1 Printed Board imensions and Tolerences 4101E 4103A-WAM1 4202B 4203A 4204A-WAM1 4412B 4552-WAM1-2 4553A 4554 4556 4562A-WAM1 LIV IPC-4101E 490 142 IPC-4101E()1 LIV IPC-4103A-WAM1 160 104 C IPC-4103A-WAM1(E)1 54 114 IPC-4103A-WAM1()1 LIV IPC-4202B 83 78 IPC-4202B()1 LIV IPC-4203A 115 104 C IPC-4203A(E)1 54 114 IPC-4203A()1 LIV IPC-4204A-WAM1 125 108 C IPC-4204A-WAM1(E)1 54 114 IPC-4204A-WAM1()1 LIV IPC-4412B 70 75 C IPC-4412B(E)1 54 84 IPC-4412B()1 LIV IPC-4552-WAM1-2 125 133 C IPC-4552-WAM1-2(E)1 54 143 IPC-4552-WAM1-2()1 IPC-4553A()1 IPC-4554()1 LIV IPC-4556 320 133 C IPC-4556(E)1 54 144 IPC-4556()1 LIV IPC-4562A-WAM1 83 108 C IPC-4562A-WAM1(E)1 54 114 Metal Foil for Printed Board Applications IPC-4562A-WAM1()1 Specification for Base Materials for Rigid and Multilayer Printed Boards Specification for Base Materials for High Speed / High Frequency Applications Flexible Base ielectrics for Use in Flexible Printed Circuitry Cover and Bonding Material for Flexible Printed Circuitry Flexible Metal-Clad ielectrics for Use in Fabrication of Flexible Printed Circuitry - With Amendment 1 Specification for Finished Fabric Woven from "E" Glass for Printed Boards Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Specification for Immersion Silver Plating for Printed Boards Specification for Immersion Tin Plating for Printed Circuit Boards - includes Amendment 1 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
5704 6010 6011 6012 6012-FR LIV IPC-5704()1 IPC-6010-FAM (SERIE 6011 + 6012 + 6013C + 6015 + 6017 + 6018C) IPC-6011()1 613 535 LIV IPC-6012 134 133 C IPC-6012(E)1 54 143 IPC-6012()1 LIV IPC-6012-FR 210 196 C IPC-6012-FR(E)1 54 206 IPC-6012-FR()1 Cleanlisness Requirements for Unpopulated Printed Board IPC-6010 Family of Board Performance ocuments Generic Performance Specification for Printed Boards Qualification and Performance Specification for Rigid Printed Boards Spécification de la Qualification et des Performances des Circuits Imprimés Rigides 6012A LIV IPC-6012A 120 75 C IPC-6012A(E)1 54 84 Automotive Applications Addendum to IPC-6012 IPC-6012A()1 6012S-FR LIV IPC-6012S-FR 60 108 C IPC-6012S-FR(E)1 54 114 IPC-6012S-FR()1 Avenant pour les Applications Spatiales et Aéronautiques Militaires de l'ipc-6012 6013 6015 6016 LIV IPC-6013 165 143 IPC-6013()1 IPC-6015()1 IPC-6016()1 6017 IPC-6017()1 6018C LIV IPC-6018C 180 133 C IPC-6018C(E)1 54 143 IPC-6018C()1 Qualification and Performance Specification for Flexible Printed Boards Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures Qualification & Performance Specification for High ensity Interconnect (HI) Layers or Boards Qualification and Performance Specification for Printed Boards Containing Embedded Passive evices Qualification and Performance Specification for High Frequency (Microwave) Printed Boards 7090 LIV IPC-7090-FAM (SERIE 7092 + 7093 + 7094 + 7095C) 1740 468 IPC-7090 Packages for PCBs and Assemblies 7091 7092 7093 7094 7095C LIV IPC-7091 165 143 IPC-7091()1 LIV IPC-7092 490 133 C IPC-7092(E)1 54 143 IPC-7092()1 IPC-7093()1 IPC-7094()1 LIV IPC-7095C 520 133 C IPC-7095C(E)1 54 143 IPC-7095C()1 esign and Assembly Process Implementation of 3 Components esign and Assembly Process Implementation for Embedded Components esign and Assembly Process Implementation for Bottom Termination Components esign and Assembly Process Implementation for Flip Chip and ie Size Components esign and Assembly Process Implementation for BGAs 7351B LIV IPC-7351B 289 133 IPC-7351B()1 Generic Requirements for Surface Mount esign and Land Pattern Standard
7525B IPC-7525B()1 Stencil esign Guidelines LIV IPC-7527 101 133 7527 C IPC-7527(E)1 54 143 Requirements for Solder Paste Printing 7530A 7711/21C 7711/21B-FR IPC-7527()1 LIV IPC-7530A 56 143 IPC-7530A()1 LIV IPC-7711/21C 1350 299 C IPC-7711/21C(E)1 54 299 IPC-7711/21C()1 LIV IPC-7711/21B-FR 1770 395 C IPC-7711/21B-FR(E)1 54 414 LIV IPC-9121 950 292 9121 C IPC-9121(E)1 54 309 Troubleshooting for PCB Fabrication Processes IPC-9121()1 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) Rework, Modification and Repair of Electronic Assemblies Reprise, modification et réparation des assemblages électroniques 9201A IPC-9201A()1 Surface Insulation Resistance Handbook 9202 IPC-9202()1 9203 9252B 9641 9691B 9701A 9704A 9709 A-600J LIV IPC-9203 150 133 C IPC-9203(E)1 54 143 IPC-9203()1 LIV IPC-9252B 80 75 C IPC-9252B(E)1 54 84 IPC-9252B()1 LIV IPC-9641 110 75 C IPC-9641(E)1 54 84 High Temperature Printed Board Flatness Guideline IPC-9641()1 LIV IPC-9691B 130 133 C IPC-9691B(E)1 54 143 IPC-9691B()1 IPC-9701A()1 LIV IPC-9704A 100 133 C IPC-9704A(E)1 54 143 IPC-9704A()1 LIV IPC-9709 59 133 C IPC-9709(E)1 54 143 IPC-9709()1 LIV IPC-A-600J 610 160 C IPC-A-600J(E)1 54 169 Acceptability of Printed Boards IPC-A-600J()1 Material and Process Characterization / Qualification Test Protocol for Assessing Electrochemical Performance Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle Requirements for Electrical Testing of Unpopulated Printed Boards User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Miation Testing) Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments Printed Circuit Assembly Strain Gage Test Guideline Test Guidelines for Acoustic Emission Measurements during Mechanical Testing
A-600J-FR A-610F-WAM1 A-610F-FR A-620C A-620C-FR A-630 LIV IPC-A-600J-FR 620 236 C IPC-A-600J-FR(E)1 54 253 IPC-A-600J-FR()1 LIV IPC-A-610F-WAM1 1260 150 C IPC-A-610F-WAM1(E)1 54 143 IPC-A-610F-WAM1()1 LIV IPC-A-610F-FR 1380 196 C IPC-A-610F-FR(E)1 54 206 IPC-A-610F-FR()1 LIV IPC-A-620C 1460 169 C IPC-A-620C(E)1 54 169 IPC-A-620C()1 LIV IPC/WHMA-A-620C-FR 1530 245 IPC/WHMA-A-620C-FR()1 LIV IPC-A-630 115 133 C IPC-A-630(E)1 54 143 IPC-A-630()1 Acceptabilité des Circuits Imprimés (French language) Acceptability of Electronic Assemblies - with Amendment 1 Acceptabilité des assemblages électroniques (French Language) Requirements and Acceptance for Cable and Wire Harness Assemblies Exigences et Critères d'acceptabilité pour l'interconnexion des Faisceaux de Fils et de Câbles (French Language) Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures AJ-820A LIV IPC-AJ-820A 1028 133 C IPC-AJ-820A(E)1 54 143 Assembly & Joining Handbook CC-830B- WAM1 CH-65B -620-K IPC-AJ-820A()1 IPC-CC-830B-WAM1()1 IPC-CH-65B()1 LIV IPC--620-K 400 133 C IPC--620(E)1 54 143 IPC--620()1 RM-18H LIV IPC-RM-18H 183 55 RM-PTH-F LIV IPC-RM-PTH-F 87 55 RM-SMT-F LIV IPC-RM-SMT-F 107 55 Component Identification Training and Reference Guide Through-Hole SolderJoint Evaluation Training & Reference Guide Surface Mount Solder Joint Evaluation Training & Reference Guide RM-WHA-B LIV IPC-RM-WHA-B 152 55 Wire Harness Assembly Training & Reference Guide LIV IPC-HBK-001F 283 133 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes Amendment 1 Guidelines for Cleaning of Printed Boards and Assemblies esign and Critical Process Requirements for Cable and Wiring Harnesses (kit products : WP-113, WP- 114, WP-116) HBK-001F C IPC-HBK-001F(E)1 54 143 Handbook and guide to supplement IPC-J-ST-001 IPC-HBK-001F()1 HBK-005 IPC-HBK-005()1 Guide to Solder Paste Assessment HBK-630 LIV IPC-HBK-630 200 133 C IPC-HBK-630(E)1 54 143 IPC-HBK-630()1 Guidelines for esign, Manufacture, Inspection and Testing of Electronic Enclosures
HBK-830A LIV IPC-HBK-830A 560 133 C IPC-HBK-830A(E)1 54 143 IPC-HBK-830A()1 Guidelines for esign, Selection and Application of Conformal Coatings HBK-840 IPC-HBK-840()1 Solder Mask Handbook HBK-850 J-ST-001F- WAM1 J-ST-001F- FR J-ST-002 J-ST-003C- WAM1 J-ST-004B J-ST-005A J-ST-006C J-ST-020E J-ST-030A J-ST-033C-1 J-ST-075 SM-784 SM-785 LIV IPC-HBK-850 169 133 C IPC-HBK-850(E)1 54 143 IPC-HBK-850()1 LIV IPC-J-ST-001F-WAM1 230 150 C IPC-J-ST-001F-WAM1(E)1 54 143 IPC-J-ST-001F-WAM1()1 LIV IPC-J-ST-001F-FR 260 196 C IPC-J-ST-001F-FR(E)1 54 206 IPC-J-ST-001F-FR()1 LIV IPC-J-ST-002 150 108 C IPC-J-ST-002(E)1 54 114 IPC-J-ST-002()1 LIV IPC-J-ST-003C-WAM1 130 133 C IPC-J-ST-003C-WAM1(E)1 54 143 Solderability Tests for Printed Boards IPC-J-ST-003C-WAM1()1 IPC-J-ST-004B()1 LIV IPC-J-ST-005A 57 75 C IPC-J-ST-005A(E)1 54 84 Requirements for Soldering Pastes IPC-J-ST-005A()1 LIV IPC-J-ST-006C 83 75 C IPC-J-ST-006C(E)1 54 84 IPC-J-ST-006C()1 LIV IPC-J-ST-020E 56 75 C IPC-J-ST-020E(E)1 54 84 IPC-J-ST-020E()1 LIV IPC-J-ST-030A 113 133 C IPC-J-ST-030A(E)1 54 143 IPC-J-ST-030A()1 LIV IPC-J-ST-033C-1 65 75 C IPC-J-ST-033C-1(E)1 54 84 IPC-J-ST-033C-1()1 IPC-J-ST-075()1 46 84 IPC-SM-784()1 IPC-SM-785()1 Guidelines for esign, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly Requirements for Soldered Electrical and Electronic Assemblies - with Amendment 1 Exigences des Assemblages Electriques et Electroniques Brasés (French Language) EIA/IPC/JEEC J-ST-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires Requirements for Soldering Fluxes - includes Amendment 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC/JEEC Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount evices Selection and Application of Board Level Underfill Materials Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount evices Classification of Non-IC Electronic Components for Assembly Processes Guidelines for Chip-on-Board Technology Implementation Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
SM-817A SM-840E T-50M T-50M-FR LIV IPC-SM-817A 79 75 C IPC-SM-817A(E)1 54 84 IPC-SM-817A()1 IPC-SM-840E()1 LIV IPC-T-50M 330 133 C IPC-T-50M(E)1 54 143 IPC-T-50M()1 LIV IPC-T-50M-FR 810 196 C IPC-T-50M-FR(E)1 54 206 IPC-T-50M-FR()1 General Requirements for ielectric Surface Mount Adhesives Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials Terms and efinitions for Interconnecting and Packaging Electronic Circuits Termes et éfinitions pour les Circuits Electroniques Imprimés et Assemblés (French Language)