Challenges in Reliability Prediction of Aircraft Subsystems

Similar documents
Best practices in product development: Design Studies & Trade-Off Analyses

Homework 11: Reliability and Safety Analysis Due: Friday, April 10, at NOON

DATASHEET. SMT172 Preliminary. Features and Highlights. Application. Introduction

DATASHEET SMT172. Features and Highlights. Application. Introduction

4 Maintaining Accuracy of External Diode Connections

Radiation and Reliability Considerations in Digital Systems for Next Generation CubeSats

AN3008 Application note

An Interview with Ian McClelland. Senior Director of Systems and Software at Thales Inflight Entertainment and Connectivity (IFEC)

SPECIAL FEATURE. Supporting Food Demands and Driving Business Growth FUJITSU. Mansour Zadeh, Global CIO, Smithfield Foods, Inc.

NZQA registered unit standard version 1 Page 1 of 8

ACCELERATING TECHNOLOGY VISION FOR AEROSPACE AND DEFENSE 2017

GaN Reliability Report 2018

Global Gender Gap Report 2011 Acknowledgments 363

in SC70 Packages Features General Description Ordering Information Applications

Electronics Reliability Prediction Using the Product Bill of Materials. Cheryl Tulkoff Jim Lance National Instruments

FAN5345 Series Boost LED Driver with Single-Wire Digital Interface

Using a Pulse Width Modulated Output with Semiconductor Pressure Sensors

REINVENT YOUR PRODUCT

Low-Cycle Shock Fatigue of Electronic Components Revision A

A unique 3D Silicon Capacitor with outstanding performances in terms of DC leakage and reliability performances. Catherine Bunel R&D Director

Realizing Augmented Reality

Description of a Function Generator Instrument

STV8172A. Vertical deflection booster for 3 App TV/monitor applications with 70 V flyback generator. Features. Description STV8172A.

Thank you for downloading one of our ANSYS whitepapers we hope you enjoy it.

The Sherwin-Williams Company

ACCENTURE INDONESIA HELPS REALIZE YOUR

Private Equity Market Update. February 2013

EEC 118 Lecture #12: Dynamic Logic

Productivity Pixie Dust

Addressing Tooling and Casting Requirements at the Design Stage. Whitepaper. Bhaskar Sinha

AN1441 Application note

Pin-Out Information Pin Function. Inhibit (30V max) Pkg Style 200

Driving 2W LEDs with ILD4120

The PT6300 Series is a line of High-Performance 3 Amp, 12-Pin SIP (Single In-line Package) Integrated. Pin-Out Information Pin Function

The Design and Characterization of an 8-bit ADC for 250 o C Operation

Digital Government Experience Centre. Accelerate your digital transformation

Obsolete Product(s) - Obsolete Product(s)

Fujitsu Technology and Service Vision Copyright 2014 FUJITSU LIMITED

Ultra-Low-Noise Amplifiers

Successful Qi Transmitter Implementation (making things go right for a change) Dave Wilson 16November2017 v1.

Comparing the Benefits of Using an Integrated Power Module versus a Discrete Regulator

AN2333 Application note

Description. Order code Package Packaging. M74HC4538B1R DIP-16 Tube M74HC4538RM13TR SO-16 Tape and reel M74HC4538TTR TSSOP16 Tape and reel

EVALUATION KIT AVAILABLE 10MHz to 1050MHz Integrated RF Oscillator with Buffered Outputs. Typical Operating Circuit. 10nH 1000pF MAX2620 BIAS SUPPLY

Brief to the. Senate Standing Committee on Social Affairs, Science and Technology. Dr. Eliot A. Phillipson President and CEO

Obsolete Product(s) - Obsolete Product(s)

3.1 ignored. (a) (b) (c)

SEMICONDUCTOR INDUSTRY ASSOCIATION FACTBOOK

HP Unveils Future of 3D Printing and Immersive Computing as Part of Blended Reality Vision

LM10 Operational Amplifier and Voltage Reference

CV SERIES. 1.8 to 45 Watts VDC, VDC, 10-30VDC Input Ranges Adjustable Output Voltage Non-Isolated DC/DC Converters

Understanding MOSFET Data. Type of Channel N-Channel, or P-Channel. Design Supertex Family Number TO-243AA (SOT-89) Die

About NEC. Co-creation. Highlights for social value creation. Telecommunications. Safety. Internet of Things. AI/Big Data.

SC4215A Very Low Input /Very Low Dropout 2 Amp Regulator With Enable

Preliminary Findings for Innovation Case Study on Canadian Fuel Cell Technology

Static Power and the Importance of Realistic Junction Temperature Analysis

AN3302 Application note

F²MC-8L/8FX/16LX/FR FAMILY

TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (L 2 -π-mos V) 2SK2963

Part Derating Parameters

SEIZING THE POWER OF VIRTUAL REALITY WITH REWIND. Your guide to the ins and outs of our business and how we can help you succeed.

DATASHEET & RELIABILITY DATA

2STC5242. High power NPN epitaxial planar bipolar transistor. Features. Application. Description


AN5058 Application note

Continuous Wave SSPAs. Version 1.6

HANDBOOK OF ACOUSTIC SIGNAL PROCESSING. BAW Delay Lines

AGN 026 Harmonic Voltage Distortion

WORKSHOP ON BASIC RESEARCH: POLICY RELEVANT DEFINITIONS AND MEASUREMENT ISSUES PAPER. Holmenkollen Park Hotel, Oslo, Norway October 2001

TL783 HIGH-VOLTAGE ADJUSTABLE REGULATOR

How to Design an R g Resistor for a Vishay Trench PT IGBT

Powering Automotive Cockpit Electronics

2STC4468. High power NPN epitaxial planar bipolar transistor. Features. Application. Description

APPLICATION NOTE. ATA6621, ATA6621N, ATA6622, ATA6622C, ATA6624, ATA6624C, ATA6626, ATA6626C Development Board ATA6621/22/24/26.

As Semiconductor Devices Shrink so do their Reliability and Lifetimes

NJM37717 STEPPER MOTOR DRIVER

Ericsson Internal. General Information Safety Specification Absolute Maximum Ratings

AN5258. Extending output performance of ST ultrasound pulsers. Application note. Introduction

ENSURING READINESS WITH ANALYTIC INSIGHT

Offshore Development Culture and User Experience

PART OBSOLETE - USE ZXGD3111N7. Features. GND GND Vcc GATE. GATE Top View Pin-Out

Features SO-7. Typical Configuration for Low-Side -ve Supply Rail DRAIN. Top View

RT A, 2MHz, Synchronous Step-Down Converter. General Description. Features. Applications. Ordering Information. Pin Configurations

R. W. Erickson. Department of Electrical, Computer, and Energy Engineering University of Colorado, Boulder

By Mark Hindsbo Vice President and General Manager, ANSYS

2STN2540. Low voltage fast-switching PNP power bipolar transistor. Features. Applications. Description

Tel: Fax:

TKEY-1. CW touch key. (no electromechanical contacts) Assembly manual. Last update: May 1,

Field Failure Rate Estimate from HALT Results

UNISONIC TECHNOLOGIES CO., LTD

Objective Questions. (a) Light (b) Temperature (c) Sound (d) all of these

UNIT-III POWER ESTIMATION AND ANALYSIS

STPS1045HR. Aerospace 2 x 10 A - 45 V Schottky rectifier. Description. Features

AN1489 Application note

CoolMOS TM. AN-CoolMOS-03 How to Select the Right CoolMOS and its Power Handling Capability. Power Management & Supply

Obsolete Product(s) - Obsolete Product(s)

Advanced Monolithic Systems

DATASHEET VXR S SERIES

TBD62308AFAG TBD62308AFAG. TOSHIBA BiCD Integrated Circuit Silicon Monolithic. 4channel Low active high current sink type DMOS transistor array

Airborne Satellite Communications on the Move Solutions Overview

Transcription:

AVIONICS Challenges in Reliability Prediction of Aircraft Subsystems Raghuram R HCL Technologies, India. D e c e m b e r 2 0 0 8

TABLE OF CONTENTS Abstract 3 Introduction 3 Reliability Prediction Improvement 4 Standby Redundancies 5 Duty Cycle Considerations 5 Sensitivity Measures 6 Limitations of MIL-217 8 References 9

Abstract As the new generation Aircraft Subsystems has more features and design advancements compared to predecessor systems, it will be increasingly complex to perform the Reliability Prediction of subsystems and maintain the compliance towards safety requirements. This paper discusses the various challenges in performing Reliability Prediction of Aircraft Subsystems during the system design phase and provides option on revising the existing reliability equations and empirical formulae based on the past experience. The Operational Reliability data obtained from previous generation Aircraft subsystems provide the first level results of reliability prediction. These results will help to identify the weak parts\ elements and provide insight into the areas, which can be improved to enhance the inherent reliability of new generation system. This paper also explores the relationship between Aircraft subsystems reliability and individual component reliability estimates. The sensitivity and redundancy studies are performed to analyze the system-level impact of component-level reliability data. Finally, this paper presents useful information to assess subsystem reliability improvement strategies Introduction The new generation Aircraft Subsystems will be designed and developed using concurrent engineering processes to reduce the aircraft development cycle time and accelerate the time to market initiatives. In order to assess the Operational and Safety performance of the aircraft, it is imperative to predict the reliability at the early stages of product development process so that customer requirements can be taken care in the product design. A new generation system will likely have some subsystems and components that have been used previously so that there

lot of reliability prediction data that can be reused. However, these systems can also have newer-technology components (e.g. 64-bit processors, Memory devices with >1 M bits) with very little reliability data available. For these components, reliability estimation can be based on extrapolated accelerated life testing or an analytic physics-offailure model. There are limitations within each of these sources. These limitations need to be analyzed to decide how limited resources should be allocated to improve reliability prediction Reliability Prediction for aircraft subsystems is often performed iteratively as the design evolves. For some systems, a preliminary reliability prediction is determined using previously used data to initially compute reliability predictions at the assembly or subsystem-level. Then, as more detailed design information becomes available, the assembly-level predictions are updated or replaced with reliability predictions based on the components within the assemblies. For other system-reliability predictions, a parts-count reliability prediction is initially determined, once the parts within the system have been identified, but prior to determining the specific stresses acting on the part. Then, when more detailed design information has been determined, the system-reliability prediction is revised, and hopefully improved, based on a parts-stress reliability prediction and part-level models. When reliability prediction is conducted in stages, it is advisable to prioritize reliability-prediction improvement activities. The uncertainty of reliability predictions for some components might have negligible effect relative to the system-reliability prediction. In these cases, it might not be efficient to devote any additional effort to improving the prediction by decreasing the estimation variance. This requires additional and more detailed analyzes or testing that might yield unimportant system-level improvements. Alternatively, the reliability predictions for some components have a relatively large effect on the variance associated with the system-reliability estimate. Then, additional analyzes or testing is warranted. Reliability Prediction Improvement The Reliability Block Diagram (RBD) is popularly used to model the complex aircraft subsystems that cannot be computed using the normal reliability prediction analysis. A reliability prediction analysis can provide important calculated values like failure rate, MTBF, reliability, and availability. These calculations are based on established reliability prediction models. As new generation aircraft subsystem configurations become more complex, more complex calculation methods are required to calculate values like failure rate, MTBF, reliability, and availability. The RBD method provides the ability to perform these complex calculations. The Reliability Block diagrams are also used to concise visual shorthand the various series-parallel block combinations (paths) that result in item success

Standby Redundancies The Standby redundancy techniques example is demonstrated using RBD modeling of secondary power subsystem of an aircraft. Standby redundancy offers the ability to protect a system through the use of cold, warm, or hot standby units and junctions. In order to improve the Reliability of subsystem, the redundancy analysis is carried out by adding redundant element to each of the existing elements of the subsystem to see which element yield better improvement in overall system reliability. It has been found that by adding redundant element has negligible impact for the most of the cases except for igniter module, where substantial improvement in the System Reliability is observed. Using this RBD analysis data, initiatives are taken to include additional igniter element at the design stage. Following figure shows the RBD model of the subsystem Controller Module Pressure Sensor Temperature Sensor Speed Sensor Inlet Valve Outlet Valve Igniter Engine Redundant Igniter Figure 1: RBD Model The following table shows the reliability percentage with redundant elements: Subsystem Configuration Reliability % Configuration (without redundant element) 99.99906% Redundant Controller Module 99.99906% Redundant Pressure Sensor 99.99908% Redundant Temperature Sensor 99.99906% Redundant Speed Sensor 99.99906% Redundant Inlet Valve 99.99906% Redundant Outlet Valve 99.99906% Redundant Generator 99.99906% Redundant Igniter 99.99944% Table1: Reliability data Duty Cycle Considerations Duty Cycle Considerations In order to correctly assess the overall failure rate of the system and improve the MTBF value, we have computed the operating failure rate values and non-operating (dormant) failure rate values of the parts and used the following equation to arrive at the overall part failure rate. For most of the cases the non-operating (dormant) failure rates of the parts are negligible, however it cannot be ruled out.

λ Part = λ operating * Duty Cycle + λ non-operating * (100 Duty Cycle) In secondary power subsystem the igniter module operates only during the start sequence of the engine. Hence the duty cycle formula is applied to compute the effective failure rate of the part. Using the duty cycle methods for all the pulsed operations the overall MTBF value of the subsystem is improved by 15%. Sensitivity Measures Sensitivity measures are used to prioritize the most important or critical components within a system. These measures indicate which components contribute most to the variance of the system-reliability estimate, and thus, which components might require additional testing or analysis to improve the component-reliability estimate. The following figure provides the details on failure rate distribution values of electronic parts for some of the important aircraft subsystems. It is apparent to note from the below pie chart that Capacitors are major contributors of electronics reliability of the subsystems. This is arrived by carefully analyzing the Reliability prediction reports and averaging the failure rate data of different aircraft systems. (The subsystem names and their failure rate values are not provided in this paper) Failure Rate Distribution 45% 30% Capacitors ICs 25% Others (Resistors, Inductors, Transistors, Diodes, Connectors, PCB) Figure 2: Failure Rate Distribution At the outset, it is important to reduce the failure rate values of the capacitors in order to reduce overall failure rate and improve the system MTBF. Most common reliability prediction techniques by the aircraft industry is empirically driven MILHDBK-217. Though it is popular and widely accepted in industry, they do not provide correct values in a numerous of situations. Therefore, during the last few years this method s popularity has been gradually declining, mostly due to proliferation of new electronic packaging technologies, continuous improvement in quality and reliability, and thus subsequent inability of MIL-HDBK-217 to make accurate failure rate predictions.

However, most of the mathematical models in MIL-HDBK217 along with the relevant principles of physics remain largely valid. This paper presents an attempt to further enhance the process of reliability prediction of capacitors and hence the overall system reliability by adjusting the existing empirical equations of Capacitor s Reliability prediction. The Failure rate values of capacitors will be improved lot by selecting established reliability and highest screened parts, however this will increase the cost and it is not a prudent solution unless the design/application warranted. The MIL-217 empirical equation for failure rate computation of a capacitor is given by = λ b π T π C π V π SR π E failures per 10 6 hours Nomenclature description: Part Failure rate λ b Base Failure rate π T Temperature Factor π C Capacitance Factor π V Voltage Stress Factor π SR Series Resistance Factor Quality Factor π E Environment Factor Based on field data, test data and related experience data, the Change in Value failure mode of the capacitor has very minimal or no impact in the system operation or performance, especially when the capacitor is used for decoupling purposes, hence there is a need to update the existing MIL217 empirical formula to derive the failure rate based on specific application of Capacitors. The existing MIL-217 formula is updated as (Modified) = λ b π T π C π V π SR π E * πa Failures per million hours i.e. (Modified) = (Existing) * π A π A is Adjustment Factor. π A = 1; for non-decoupling application π A = 0.65; for ceramic capacitors used for decoupling application Following are other important points that need to be considered to improve the reliability of capacitors: a) Select the Derating factors for the parts well below the standard derating guideline value (60%) b) Minimize the number parts with the help of appropriate design tradeoffs

Limitations of MIL-217 The MIL-HDBK-217F standard will not support the failure rate computation for some of the important parts that are used in the new generation product design. These include, but not limited to: 1 Memory devices with size more than 1 mega bits 2 64 bit processors Failure rate computation for complex memory devices using MIL-217: The failure rate equation for the memory devices as per MIL217 handbook is given as = (C1π T + C2π E + λ cyc ) π L failures per 10 6 hours Nomenclature description: C1 C 2 π T π E λ cyc π L Part Failure rate Die complex Failure rate Package Failure rate Temperature Factor Quality Factor Environment Factor Read/write cycle induced Failure rate Learning Factor In the above equation, the Die complex Failure Rate (C1) values for the memory devices having storage bits size more than 1 M bits is not provided in the MIL- 217 handbook. The C1 values for memory devices with storage size more than 1 M bits are derived by linearly extrapolating the existing values provided in the MIL-217 handbook. These values are shown in the below table. Memory Size, B (Bits) ROM MOS PROM, UVEPROM EEPROM EAPROM DRAM SRAM (MOS & BiMOS) Table 2: Die Complexity Failure Rate for Memories C1 ROM PROM Bipolar SRAM Up to 16K 0.00065 0.00085 0.0013 0.0078 0.0094 0.0052 16K < B < 64K 0.0013 0.0017 0.0025 0.016 0.019 0.011 64K < B < 256K 0.0026 0.0034 0.0050 0.031 0.038 0.021 256 K<B<1 M 0.0052 0.0068 0.010 0.062 0.075 0.042 1M< B< 4 M 0.00104 0.00136 0.020 0.124 0.150 0.084 4M<B<16M 0.00208 0.00272 0.040 0.248 0.300 0.168

Failure rate computation for 64-bit processors using MIL 217: The failure rate equation for the Microprocessor devices as per MIL-217 handbook is given as = (C1π T + C2π E ) π L failures per 10 6 hours The MIL-217 handbook provides the C1 values up to 32-bit processors. The C1 values for 64-bit Microprocessors are derived by linearly extrapolating the existing values provided in the MIL-217 handbook. These values are shown in the below table. No of bits Bipolar MOS C1 C1 Up to 8 bits 0.060 0.14 Up to 16 bits 0.12 0.28 Up to 32 bits 0.24 0.56 Up to 64 bits 0.48 0.108 Table 3: Die Complexity Failure Rate for Processors C1 The failure rate values computed using this approach is almost inline with manufacturer s warranty data for both memory devices and processors References [1] Military handbook -Reliability prediction of electronic equipment. MIL- HDBK-217F-Notice 2 [2] Military handbook Electronics Reliability Design Handbook. MIL-HDBK- 338B [3] Failure Mode Distribution -91 Handbook CONTACT Raghuram R HCL Technologies LTD 64-66, SP, 2 nd Main Road Ambattur Industrial estate Ambattur Chennai-600 058 E mail:raghuramr@hcl.in Web: http://www.hcltech.com

CUSTOM APPLICATION SERVICES ENGINEERING AND R&D SERVICES ENTERPRISE APPLICATION SERVICES ENTERPRISE TRANSFORMATION SERVICES IT INFRASTRUCTURE MANAGEMENT BUSINESS PROCESS OUTSOURCING About HCL About HCL Enterprise HCL Enterprise is a $5 billion leading Global Technology and IT Enterprise that comprises two companies listed in India - HCL Technologies & HCL Infosystems. The 3-decade-old enterprise, founded in 1976, is one of India s original IT garage start-ups. Its range of offerings spans Product Engineering, Custom & Package Applications, BPO, IT Infrastructure Services, IT Hardware, Systems Integration, and distribution of ICT products. The HCL team comprises over 58,000 professionals of diverse nationalities, who operate from 20 countries including 360 points of presence in India. HCL has global partnerships with several leading Fortune 1000 firms, including leading IT and Technology firms. For more information, please visit www.hcl.in. About HCL Technologies HCL Technologies is a leading global IT services company, working with clients in the areas that impact and redefine the core of their businesses. Since its inception into the global landscape after its IPO in 1999, HCL focuses on transformational outsourcing, underlined by innovation and value creation, and offers integrated portfolio of services including software-led IT solutions, remote infrastructure management, engineering and R&D services and BPO. HCL leverages its extensive global offshore infrastructure and network of offices in 19 countries to provide holistic, multi-service delivery in key industry verticals including Financial Services, Manufacturing, Aerospace & Defense, Telecom, Retail & CPG, Life Sciences & Healthcare, Media & Entertainment, Travel, Transportation & Logistics, Automotive, Government and Energies & Utilities. HCL takes pride in its philosophy of Employee First which empowers our 52,714 transformers to create a real value for the customers. HCL Technologies, along with its subsidiaries, had consolidated revenues of US$ 2.0 billion, as on 30th September 2008. For more information, please visit www.hcltech.com