QUICK REFERENCE DATA ORDERING INFORMATION. Ordering code indicating type and packaging TYPE

Similar documents
QUICK REFERENCE DATA. Resistance tolerance ±5% Temperature coefficient: 1to4.7Ω ± /K 5.1 to 240 Ω ± /K Absolute maximum dissipation at

DISCRETE CERAMICS DATA SHEET. ARC241/ARC242 ARV241/ARV242 Array chip resistors size Product specification 2000 May 02

Power chip resistor size 2010 PRC111 1% FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability.

VALUE DESCRIPTION. R > 100 kω R/R max.: ±0.25% Ω R/R max.: ±0.1% Ω

DATA SHEET THIN-FILM CHIP RESISTORS TF 13 series, 0.1% TC25

DATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0

DATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0

High-ohmic/high-voltage resistors

POWER RESISTOR - PR01

POWER RESISTOR - PR03

Standard Metal Film Resistors

FUSIBLE RESISTOR - NFR25H

Z LEAD SURFACE MOUNT SPECIFICATION AC AXIAL CEMENTED WIREWOUND RESISTOR & PR POWER METAL FILM RESISTORS

BCcomponents DATA SHEET. MBA 0204; MBB 0207; MBE 0414 Professional leaded resistors. Product specification File under BCcomponents, BC08.

Power Metal Film Resistors

Power Metal Film Resistors

STANDARD FILM RESISTOR SFR25

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1218 (Pb Free) 5%; 1% Product specification Oct 13, 2004 V.1

BCcomponents DATA SHEET. MMU 0102; MMA 0204; MMB 0207 Professional MELF resistors. Product specification File under BCcomponents, BC08.

High Voltage Surge Resistor

Professional Leaded Resistors

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0603 (Pb Free) 5%, 1%

High Ohmic (up to 33 MΩ)/ High Voltage (up to 3.5 kv) Resistors

Fusible Power Metal Film Leaded Resistors

WF12T, WF08T, WF06T, WF04T 0.5%, 0.1% TC50 High Precision Thin Film chip resistors Size 1206, 0805, 0603, 0402

High Precision Thin Film Chip Resistor

Fusible, Non-Flammable Metal Film Leaded Resistors

TC25 High Precision Thin Film chip resistors Size 1206, 0805, 0603, 0402 (Anti-Sulfuration )

Lead (Pb)-Free Professional Leaded Resistors

TC25 High Precision Power Thin Film chip resistors Size 0805, 0603

WF12K, WF08K, WF06K, WF04K ±1.0%, 0.5%, ±0.25%, ±0.1% High Precision Thick Film chip resistors

FEATURES APPLICATIONS DESCRIPTION UNIT HVR25 HVR37. ± 5; E24 series

High Frequency Leaded Resistors

High Frequency Flat Chip Resistors

Lead (Pb)-Free Precision Leaded Resistors

MBA/SMA 0204, MBB/SMA 0207, MBE/SMA Precision. Precision Leaded Resistors

DATA SHEET ARRAY CHIP RESISTORS YC324 (8Pin/4R; Pb Free) 5%, 1% sizes Product specification Feb 22, 2005 V.1 Supersedes Date of Mar.

Surge Metal Film Leaded Resistor

MBA/SMA 0204, MBB/SMA 0207, MBE/SMA Professional. Professional Leaded Resistors

Professional MELF Resistors

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0603 5%, 1%, 0.5% RoHS compliant

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1%

High Ohmic Flat Chip Resistors

AXIAL WIREWOUND RESISTORS AC

PRODUCT DATASHEET. is brought to you by. SOS electronic distribution of electronic components

DATA SHEET. 5063JD series (space miser) 0.25 to 0.40 W; 1% and 5% Metal film resistors. BCcomponents

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0402 5%, 1% RoHS compliant & Halogen Free

High Ohmic/High Voltage Metal Film Leaded Resistors

SPECIFICATION FOR APPROVAL 1/8W 0816 LOW RESISTNACE CHIP RESISTOR

High Precision Thin Film Chip Resistor ± 0.05 %; ± 5 ppm/k

DATA SHEET CURRENT SENSOR - LOW TCR HIGH POWER PT-High power series 5%, 2%, 1% sizes 0402/0603/0805/1206/0815/2010/2512

High Precision Thin Film chip resistors (RoHS compliant Halogen Free) Size 2512, 2010, 1210, 1206, 0805, 0603, 0402, 0201

Trimmable Flat Chip Resistors

Lead (Pb)-Bearing High Stability Thin Film Chip Resistors

Power Metal Film Leaded Resistors

SPECIFICATION FOR APPROVAL. 1/2W, 0603, Low Resistance Chip Resistor (Lead / Halogen free)

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1% RoHS compliant

Wirewound/Metal Film Resistors, Commercial Power, Radial Lead

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0402 5%, 1% RoHS compliant

DATA SHEET HIGH OHMIC CHIP RESISTORS RC high ohmic series 20%, 10%, 5% sizes 0805/1206. RoHS compliant

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0603 5%, 1%, 0.5%, 0.1% Product specification July 01, 2014 V.5 Supersedes Date of Mar.

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1%, 0.5%, 0.1% Product specification June 25, 2014 V.5. RoHS compliant

WTC CHIP RESISTOR SELECTION GUIDE

High Stability Thin Film Flat Chip Resistor 0.05 % (1000 h rated power at 70 C)

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0201 5%, 1% RoHS compliant

Precision Thin Film Chip Resistor Array

DATA SHEET THICK FILM CHIP RESISTORS Introduction

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1218 5%, 1% RoHS compliant

WA04P π type chip attenuator

DATA SHEET LOW OHMIC HIGH POWER CHIP RESISTORS RL-High power series 5%, 2%, 1% sizes 0805/1206

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1%

High Pulse Load Carbon Film Leaded Resistors

DATA SHEET HIGH VOLTAGE CHIP RESISTORS RV series 5%, 1% sizes 0805/1206/2512. RoHS compliant

SPECIFICATION FOR APPROVAL. 1/32W, Low Resistance Chip Resistor (Lead / Halogen free)

SPECIFICATION FOR APPROVAL. 1/8W, 0402, Low Resistance Chip Resistor (Lead / Halogen Free)

High Stability Thin Film Chip Resistor 0.05 % (1000 h rated power at 70 C)

DATA SHEET THICK FILM CHIP RESISTORS Automotive Precision grade AC series 0.1%, 0.5%, 1%, TC 50

Array chip resistors size ARC241/ARC242 ARV241/ARV242

High Stability Thin Film Chip Resistor 0.05 % (1000 h rated power at 70 C)

sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512

Metallized Polycarbonate film capacitors MKC 344

SMD - Resistors. Pulse Withstanding Thick Film Chip Resistor-SMDP Series. Product: Size: 0603/0805/1206/1210/2010/2512. official distributor of

sizes 0402/0603/0805/1206/ 1210/1218/2010/2512 RoHS compliant & Halogen Free

KP 376 KP/MMKP 376. AC and pulse metallized polypropylene film capacitors. Fig.1 Simplified outlines.

DATA SHEET CURRENT SENSOR - LOW TCR PA0402 series 5%, 1% sizes 0402

Hi-Rel Thin Film Chip Resistors

DATA SHEET CURRENT SENSOR - LOW TCR PA0603 series 5%, 1% sizes 0603

DATA SHEET ARRAY CHIP RESISTORS YC/TC 164 (8Pin/4R) 5%, 1% sizes

Sales: Technical: Fax:

Professional Thin Film Chip Resistor Array

High Stability Thin Film Flat Chip Resistor 0.05 % (1000 h rated power at 70 C)

DATA SHEET LOW OHMIC CHIP RESISTORS RL series 5%, 2%, 1% sizes 0402/0603/0805/1206/ 1210/1218/2010/2512

DATA SHEET CURRENT SENSOR - LOW TCR PE Series - Wide Terminal 5%, 1%, 0.5%

Precision Thin Film Chip Resistor Superior Moisture Resistivity

DATA SHEET ARRAY CHIP RESISTORS YC 158/358 (10Pin/8R) 5% sizes 0612/1225

High Stability Thin Film Chip Resistors

DATA SHEET HIGH VOLTAGE CHIP RESISTORS RV series 0.5%, 1%, 5%

DATA SHEET CHIP RESISTORS RF ATTENUATORS ATV321 (Pb Free)

Ultra Precision Thin Film Chip Resistors

High Pulse Load MELF Resistor

Transcription:

FEATURES Overload protection without the risk of fire Grey coating for ease of recognition Reduced size of final equipment Low assembly costs Higher component and equipment reliability. APPLICATIONS Power supplies in small sized equipment Car telephones Portable radio, CD and cassette players. DESCRIPTION The resistors are constructed on a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste which is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance, by laser cutting of this resistive layer. The resistive layer is covered with a protective coat and printed with the resistance value. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a lead/tin alloy. To enable recognition of a fusible device, the resistor should be mounted face up. QUICK REFERENCE DATA DESCRIPTION VALUE Resistance range to 5 Ω; E24/E96 series Resistance tolerance ± Temperature coefficient: to4.7ω ±250 6 /K 5. to 5 Ω ±200 6 /K Absolute maximum dissipation at T amb =70 C 0.25 W Maximum permissible voltage 200 V (DC or RMS) Operating temperature range 55 C to +25 C Climatic category ( 60068) 55/25/56 Basic specification 605-8 ORDERING INFORMATION Table Ordering code indicating type and packaging ORDERING CODE 2322 750... PAPER TAPE ON REEL 5000 units 6... Ordering code (2NC) The resistors have a 2-digit ordering code starting with 2322 The subsequent 4 digits indicate the resistor type and packaging; see Table. The remaining 4 digits indicate the resistance value: The first 3 digits indicate the resistance value. The last digit indicates the resistance decade in accordance with Table 2. Table 2 Last digit of 2NC RESISTANCE DECADE LAST DIGIT to 9.76 Ω 8 to 97.6 Ω 9 0 to 240 Ω ORDERING EXAMPLE The ordering code of a resistor, value 200 Ω, packed in paper tape and supplied on a reel of 5000 units is: 2322 750 6200. 999 Feb 36

FUNCTIONAL DESCRIPTION Product characterization Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of ±. The values of the E24/E96 2 t (s) 2,,,,,,,,,,, series are in accordance with publication 60063. Fusing characteristics The resistors will fuse without the risk of fire and within an indicated range of overload. Fusing means that the CCA852 2 t (s) 2 resistive value of the resistor increases at least 0 times; see Figs and 2. The fusing characteristic is measured under constant voltage with resistors mounted on a ceramic or glass epoxy (FR4) substrate; see Fig.3.,, CCA853 8 0 2 4 6 3 P overload (W) This graph is based on measured data which may deviate according to the application. Fig. Fusing characteristic: Ω R < 240 Ω, measured using ceramic board material. 8 0 2 4 6 3 P overload (W) This graph is based on measured data which may deviate according to the application. Fig.2 Fusing characteristic: Ω R < 240 Ω, measured using glass epoxy (FR4) board material. resistor mount (FACE UP) handbook, full pagewidth lead frame mount Al 2 O 3 or FR4 40.3 7.6 0.635 mm conductor: NiCr Au.5 µm Ni 0.5 µm Au 0. µm.7.0 mm Fig.3 Test substrate layout. CCB649 999 Feb 362

Limiting values LIMITING VOLTAGE () LIMITING POWER (W) 200 (2) 0.25 Notes. The maximum voltage that may be continuously applied to the resistor element, see publication 605-8. 2. The maximum voltage that may be applied after fusing is shown in Fig.4. 50 V max 40 30 20 MBG605 2 R 3 n (Ω) Fig.4 Maximum applied voltage after fusing. DERATING The power that the resistor can dissipate depends on the operating temperature; see Fig.5. PULSE LOADING CAPABILITIES 2 MBG607 V max Pmax (%P rated) 0 MLB206.2/50 µsec /700 µsec 50 0 55 0 50 70 0 25 o T amb ( C) 2 R n (Ω) 3 These pulses may not be applied on a regular basis. Fig.5 Maximum dissipation (P max ) in percentage of rated power as a function of the ambient temperature (T amb ). Fig.6 Maximum permissible peak pulse voltage without failing to open circuit in accordance with DIN 60040 (CO) 533. 999 Feb 363

3 handbook, full pagewidth MBG606 Pmax (W) 2 single pulse tp/ti = 00 6 5 4 3 2 t i (s) Fig.7 Pulse on a regular basis; maximum permissible peak pulse power ( Pˆ max ) as a function of pulse duration, single pulse and repetitive pulse t p /t i = 00. 600 handbook, full pagewidth Vmax 500 MBG608 400 300 200 0 0 6 5 4 3 2 t i (s) Fig.8 Pulse on a regular basis; maximum permissible peak pulse voltage ( Vˆ max ) as a function of pulse duration. 999 Feb 364

MECHANICAL DATA Mass per 0 units MASS (g).0 Marking All resistors are marked with a four digit code on the protective coat to designate the nominal resistance value. 4-DIGIT MARKING For all values, the R is used as a decimal point. Example MARKING 20R PACKAGE MARKING RESISTANCE 20 Ω The packaging is also marked and includes resistance value, tolerance, catalogue number, quantity, production period, batch number and source code. Outlines handbook, 4 columns Table 3 T W,,, t b For dimensions see Table 3. t t,,,,,, 220R Chip resistor type and relevant physical dimensions; see Fig.9 L 3.20 +0./ 0.20 L Fig.9 Outlines. W protective coat,, resistor layer inner electrode,,, T end termination ceramic substrate protective coat marking MBE929 t t t b.60 ±0.5 0.55 ±0. 0.45 ±0.25 0.50 ±0.25 999 Feb 365

TESTS AND REQUIREMENTS Essentially all tests are carried out in accordance with the schedule of publication 605-8, category LCT/UCT/56 (rated temperature range: Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing also covers the requirements specified by EIA and EIAJ. The tests are carried out in accordance with publication 60068, Recommended basic climatic and mechanical robustness testing procedure for electronic components and under standard atmospheric conditions according to 60068-, subclause 5.3. Unless otherwise specified the following values apply: Temperature: 5 C to35 C Relative humidity: 4 to 7 Air pressure: 86 kpa to 6 kpa (860 mbar to 60 mbar). In Table 4 the tests and requirements are listed with reference to the relevant clauses of publications 605-8 and 60068 ; a short description of the test procedure is also given. In some instances deviations from the recommendations were necessary for our method of specifying. All soldering tests are performed with mildly activated flux. Table 4 Test procedures and requirements 605-8 CLAUSE 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS Tests in accordance with the schedule of publication 605-8 4.4. visual examination no holes; clean surface; no damage 4.4.2 dimensions (outline) gauge 0.45 T 0.65.45 W.75 3.0 L 3.3 4.5 resistance applied voltage (+0/ %): R R nom : max. ± R<Ω: 0. V Ω R<0 Ω: 0.3 V 0 Ω R<240 Ω: V 4.8 20 (Tb) resistance to soldering heat unmounted chips; ± s; 260 ±5 C R/R max.: ±(% +0.05 Ω) 4.29 45 (Xa) component solvent resistance 999 Feb 366 isopropyl alcohol or H 2 O followed by brushing in accordance with MIL 202 F 4.7 20 (Ta) solderability unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±2 C 4.7 voltage proof on insulation maximum voltage (RMS) during minute metal block method 4.3 short time overload room temperature; P = 6.25 P n ; 5 s (V 2 V max ) 4.33 bending resistors mounted on a 90 mm glass epoxy resin PCB (FR4), bending: 3 mm 4.9 4 (Na) rapid change of temperature 4.24.2 3 (Ca) damp heat (steady state) 30 minutes at LCT and 30 minutes at UCT; 5 cycles good tinning ( 9 covered); no breakdown or flashover R/R max.: ±(% +0.05 Ω) R/R max.: ±(% +0.05 Ω) R/R max.: ±(% +0.05 Ω) 56 days; 40 ±2 C; 93 +2/ 3% RH; R/R max.: ±(3% +0. Ω) loaded with 0.0 P n

605-8 CLAUSE 60068-2 TEST METHOD 4.25. endurance 00 +48/ 0 hours; 70 ±2 C; loaded with P n or V max ;.5 hours on and 0.5 hours off 4.23.2 27 (Ba) endurance at upper category temperature R/R max.: ±(3% +0. Ω) 00 +48/ 0 hours; no load R/R max.: ±(3% +0. Ω) 4.8.4.2 temperature at 20/LCT/20 C and 20/UCT/20 C: coefficient R<5Ω ±250 6 /K R 5 Ω ±200 6 /K Other tests in accordance with 605 clauses and 60068 test method 4.7 20 (Ta) solderability (after ageing) 8 hours steam or 6 hours 55 C; unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±2 C 4.6.. insulation resistance voltage (DC) after minute, metal block method: 0 V 4.2 noise publication 6095 (measured with Quantech-equipment) Other applicable tests (JIS) C 5202 7.5 resistance to damp heat (steady state) TEST PROCEDURE REQUIREMENTS 00 +48/ 0 hours; 40 ±2 C; 93 +2/ 3% RH; loaded with P n or V max ;.5 hours on and 0.5 hours off good tinning ( 9 covered); no damage R ins min.: 3 MΩ max. 2 µv/v R/R max.: ±( +0. Ω) leaching unmounted chips 60 ± s; 260 ±5 C good tinning; no leaching trio damp heat test 00 +48/ 0 hours; 85 ±2 C; 85 ± RH; loaded with 0. P n or V max R/R max.: ±( +0. Ω) 999 Feb 367