PACKAGE DIMENSIONS FEATURES Subminiature T-3/4 transfer molded.276 (7.0) MIN Low package profile Axial leads Wide viewing angle SMT versions.002 (.06).031 (.78).023 (.58).075 (1.9) DIA.056 (1.44).048 (1.24) CATHODE MARK (COLOR STRIPE ON SIDE OF PACKAGE) NOTES: ALL DIMENSIONS ARE IN INCHES (mm). DESCRIPTION These T-3/4 subminiature LED lamps feature a squarebase, transfer molded package for surface mount applications. A tinted diffused or water clear epoxy lens available in AIGaAs red, high-efficiency red, green, and yellow produces wide-angle beam emission and sharp on/off contrast. They are available with gullwing lead bends for top mounting, as well as yoke lead bends and Z-bends for mounting to the back of a PCB. ABSOLUTE MAXIMUM RATING c Parameter 6305A MV6700A 6405A MV6300A 6505A MV6400A Q101A Q105A Q150A Q155A Power Dissipation 135 85 135 85 mw Average Forward Current 30 20 30 30 ma Peak Forward Current (1 µs pulsewidth, 0.1% DF) 90 60 90 300 ma Lead Soldering Time at 260 C 5 5 5 5 sec Operating Temperature -55 to +100-55 to +100-50 to +100-20 to +100 C Storage Temperature -55 to +100-55 to +100-50 to +100-20 to +100 C Units Page 1 of 6
ELECTRICAL / OPTICAL CHARACTERISTICS (T A =25 C) Part Number QTLP- MV6700A MV6300A MV6400A Q150A Condition Luminous Intensity (mcd) Minimum 1.0 1.0 1.0 1.0* Typical 3.0 3.0 3.0 1.8* *Tested at I F = 1mA Forward Voltage (V) Maximum 3.0 3.0 3.0 1.8* Typical 1.8 2.0 2.0 1.6* *Tested at I F = 1mA Peak Wavelength (nm) 635 585 565 660 Spectral Line Half Width (nm) 40 36 28 20 Reverse Voltage (V) 5 5 5 5 I R = 100µA Viewing Angle ( ) 50 50 50 50 ELECTRICAL / OPTICAL CHARACTERISTICS (T A =25 C) Part Number QTLP- 6305A 6405A 6505A Q101A Q105A/ Q155A Condition Luminous Intensity (mcd) Minimum 3.0 3.0 3.0 22** 20.0**/2.0* **Tested at I F = 1mA Typical 12.0 12.0 12.0 45** 50.0**/4.0* **Tested at I F = 20mA Forward Voltage (V) Maximum 3.0 3.0 3.0 2.4** 2.4**/1.8* *Tested at I F = 1mA Typical 1.8 2.0 2.0 1.8** 1.8**/1.6* **Tested at I F = 20mA Peak Wavelength (nm) 635 585 565 660 660 Spectral Line Half Width (nm) 40 36 28 20 20 Reverse voltage (V) 5 5 5 5 5 I R = 100µA Viewing Angle ( ) 25 25 25 50 25 Page 2 of 6
TYPICAL PERFORMANCE CURVES Fig. 1 Forward Current vs. Forward Voltage Fig. 2 Relative Luminous Intensity vs. DC Forward Current IF - FORWARD CURRENT (ma) 90 80 70 60 50 40 30 20 AlGaAs RED HER YELLOW 10 GREEN 0 1.0 2.0 3.0 4.0 5.0 RELATIVE LUMNOUS INTENSITY (NORMALIZED AT 10 ma) 2.5 2.0 1.5 1.0 0.5 AlGaAs RED HER YELLOW GREEN 0.0 0 5 10 15 V F - FORWARD VOLTAGE (V) I F - DC FORWARD CURRENT (ma) Fig. 3 Relative Intensity vs. Peak Wavelength 1.0 GREEN YELLOW AlGaAs RED RELATIVE INTENSITY 0.5 HER 0 500 550 600 650 700 750 WAVELENGTH (nm) Page 3 of 6
RECOMMENDED PRINTED CIRCUIT BOARD PATTERN 0.106 (2.68) 0.035 (0.89) 0.035 (0.89) 0.035 (0.89) For Gullwing Lead Bend RECOMMENDED REFLOW SOLDERING PROFILE 5 sec MAX soldering time 240 C MAX +5 C/s MAX -5 C/s MAX 60-120 sec Preheating 120-150 C MAX Page 4 of 6
GULLWING LEAD CONFIGURATION.115 (2.92).099 (2.52) CATHODE.078 (1.9).002 (.06).008 (.2).154 (3.90).148 (3.75) ANODE.033 (.82).000 (.00).039 (1.0).028 (.7) FEATURES Available in Gullwing, Yoke and Z-bend lead formings Compatible with automatic placement equipment Compatible with vapor phase reflow soldering processes Long life solid state reliability Reel and tape or bulk packaging available DESCRIPTION These subminiature solid state lamps are transfer molded in an axial lead package. They are available in yellow, green, high efficiency red and AIGaAs red in both diffused and water clear lens. Automatic placement equipment can be used to mount the LEDs on the PC board. The lamps can be mounted using either batch or in line vapor phase reflow solder processes. NOTES: ALL DIMENSIONS ARE IN INCHES (mm) YOKE LEAD CONFIGURATION Z-BEND LEAD CONFIGURATION CATHODE ANODE CATHODE.300 (7.62) MAX ANODE.240 (6.1).232 (5.9).115 (2.92).099 (2.52).078 (1.9).047 (1.2).031 (0.8).002 (.06).033 (.85).026 (.65).128 (3.24).112 (2.84).078 (1.9).039 (.99).023 (.59).002 (.06).117 (2.96).100 (2.56).048 (1.22).032 (.82).033 (.85).026 (.66).189 (4.8).173 (4.4).034 (.86).026 (.66) Page 5 of 6
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 6 of 6