High Performance, Wide Bandwidth Accelerometer ADXL001

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FEATURES High performance accelerometer ±7 g, ±2 g, and ± g wideband ranges available 22 khz resonant frequency structure High linearity:.2% of full scale Low noise: 4 mg/ Hz Sensitive axis in the plane of the chip Frequency response down to dc Full differential signal processing High resistance to EMI/RFI Complete electromechanical self-test Output ratiometric to supply Velocity preservation during acceleration input overload Low power consumption: 2. ma typical 8-terminal, hermetic ceramic, LCC package APPLICATIONS Vibration monitoring Shock detection Sports diagnostic equipment Medical instrumentation Industrial monitoring GENERAL DESCRIPTION The ADXL1 is a major advance over previous generations of accelerometers providing high performance and wide bandwidth. This part is ideal for industrial, medical, and military applications where wide bandwidth, small size, low power, and robust performance are essential. V S High Performance, Wide Bandwidth Accelerometer ADXL1 Using the Analog Devices, Inc. proprietary fifth-generation imems process enables the ADXL1 to provide the desired dynamic range that extends from ±7 g to ± g in combination with 22 khz of bandwidth. The accelerometer output channel passes through a wide bandwidth differential-to-singleended converter, which allows access to the full mechanical performance of the sensor. The part can operate on voltage supplies from 3.3 V to V. The ADXL1 also has a self-test (ST) pin that can be asserted to verify the full electromechanical signal chain for the accelerometer channel. The ADXL1 is available in the industry-standard 8-terminal LCC and is rated to work over the extended industrial temperature range ( 4 C to +12 C). RESPONSE (db) 1 12 9 6 3 3 6 9 12 FUNCTIONAL BLOCK DIAGRAM 1 1 1 1 1k 1k 1k FREQUENCY (Hz) Figure 1. Sensor Frequency Response 71-12 V DD V DD2 TIMING GENERATOR ADXL1 MOD DIFFERENTIAL SENSOR DEMOD AMP OUTPUT AMPLIFIER X OUT SELF-TEST ST COM 71-1 Figure 2. Rev. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 916, Norwood, MA 262-916, U.S.A. Tel: 781.329.47 www.analog.com Fax: 781.461.3113 21 Analog Devices, Inc. All rights reserved.

ADXL1* PRODUCT PAGE QUICK LINKS Last Content Update: 2/23/217 COMPARABLE PARTS View a parametric search of comparable parts. EVALUATION KITS ADXL1 Breakout Board DOCUMENTATION Application Notes AN-62: Considerations for Soldering Accelerometers in LCC-8 Packages onto Printed Circuit Boards AN-688: Phase and Frequency Response of imems Accelerometers and Gyros Data Sheet ADXL1: High Performance, Wide Bandwidth Accelerometer Data Sheet REFERENCE DESIGNS CN33 DESIGN RESOURCES ADXL1 Material Declaration PCN-PDN Information Quality And Reliability Symbols and Footprints DISCUSSIONS View all ADXL1 EngineerZone Discussions. SAMPLE AND BUY Visit the product page to see pricing options. TECHNICAL SUPPORT Submit a technical question or find your regional support number. DOCUMENT FEEDBACK Submit feedback for this data sheet. This page is dynamically generated by Analog Devices, Inc., and inserted into this data sheet. A dynamic change to the content on this page will not trigger a change to either the revision number or the content of the product data sheet. This dynamic page may be frequently modified.

ADXL1 TABLE OF CONTENTS Features... 1 Applications... 1 General Description... 1 Functional Block Diagram... 1 Revision History... 2 Specifications... 3 Specifications for 3.3 V Operation... 3 Specifications for V Operation... 4 Recommended Soldering Profile... Absolute Maximum Ratings... 6 ESD Caution... 6 Pin Configuration and Function Descriptions... 7 Typical Performance Characteristics... 8 Theory of Operation... 11 Design Principles... 11 Mechanical Sensor... 11 Applications Information... 12 Application Circuit... 12 Self-Test... 12 Acceleration Sensitive Axis... 12 Operating Voltages Other Than V... 12 Layout, Grounding, and Bypassing Considerations... 13 Clock Frequency Supply Response... 13 Power Supply Decoupling... 13 Electromagnetic Interference... 13 Outline Dimensions... 14 Ordering Guide... 14 REVISION HISTORY 2/1 Rev. to Rev. A Added -2 and - models... Universal Changes to Table 1... 3 Changes to Table 2... 4 Added Figure 9 through Figure 18... 8 Changes to Ordering Guide... 14 1/9 Revision : Initial Version Rev. A Page 2 of 16

ADXL1 SPECIFICATIONS SPECIFICATIONS FOR 3.3 V OPERATION TA = 4 C to +12 C, VS = 3.3 V ± % dc, acceleration = g, unless otherwise noted. Table 1. ADXL1-7 ADXL1-2 ADXL1- Parameter Conditions Min Typ Max Min Typ Max Min Typ Max Unit SENSOR Nonlinearity.2 2.2 2.2 2 % Cross-Axis Sensitivity Includes package 2 2 2 % alignment Resonant Frequency 22 22 22 khz Quality Factor 2. 2. 2. SENSITIVITY Full-Scale Range IOUT ±1 μa 7 +7 2 +2 + g Sensitivity 1 Hz 16. 4.4 2.2 mv/g OFFSET Ratiometric Zero-g Output 1.3 1.6 1.9 1.3 1.6 1.9 1.3 1.6 1.9 V NOISE Noise 1 Hz to 4 Hz 8 9 1 mg rms Noise Density 1 Hz to 4 Hz 3.3 3.6 4.2 mg/ Hz FREQUENCY RESPONSE 3 db Frequency 32 32 32 khz 3 db Frequency Drift 2 2 2 % Over Temperature SELF-TEST Output Voltage Change 4 12 62 mv Logic Input High 2.1 2.1 2.1 V Logic Input Low.66.66.66 V Input Resistance To ground 3 3 3 kω OUTPUT AMPLIFIER Output Swing IOUT = ±1 μa.2 VS.2.2 VS.2.2 VS.2 V Capacitive Load 1 1 1 pf PSRR (CFSR) DC to 1 MHz.9.9.9 V/V POWER SUPPLY (VS) Functional Range 3.13 6 3.13 6 3.13 6 V ISUPPLY 2. 2. 2. ma Turn-On Time 1 1 1 ms Rev. A Page 3 of 16

ADXL1 SPECIFICATIONS FOR V OPERATION TA = -4 C to +12 C, VS = V ± % dc, acceleration = g, unless otherwise noted. Table 2. ADXL1-7 ADXL1-2 ADXL1- Parameter Conditions Min Typ Max Min Typ Max Min Typ Max Unit SENSOR Nonlinearity.2 2.2 2.2 2 % Cross-Axis Sensitivity Includes package 2 2 2 % alignment Resonant Frequency 22 22 22 khz Quality Factor 2. 2. 2. SENSITIVITY Full-Scale Range IOUT ±1 μa 7 +7 2 +2 + g Sensitivity 1 Hz 24.2 6.7 3.3 mv/g OFFSET Ratiometric Zero-g Output 2. 2. 3. 2. 2. 3. 2. 2. 3. V NOISE Noise 1 Hz to 4 Hz 6 7 mg rms Noise Density 1 Hz to 4 Hz 2.1 2.3 2.76 mg/ Hz FREQUENCY RESPONSE 3 db Frequency 32 32 32 khz 3 db Frequency Drift 2 2 2 % Over Temperature SELF-TEST Output Voltage Change 143 44 217 mv Logic Input High 3.3 3.3 3.3 V Logic Input Low.66.66.66 V Input Resistance To ground 3 3 3 kω OUTPUT AMPLIFIER Output Swing IOUT = ±1 μa.2 VS.2.2 VS.2.2 VS.2 V Capacitive Load 1 1 1 pf PSRR (CFSR) DC to 1 MHz.9.9.9 V/V POWER SUPPLY (VS) Functional Range 3.13 6 3.13 6 3.13 6 V ISUPPLY 4. 9 4. 9 4. 9 ma Turn-On Time 1 1 1 ms Rev. A Page 4 of 16

ADXL1 RECOMMENDED SOLDERING PROFILE Table 3. Soldering Profile Parameters Profile Feature Sn63/Pb37 Pb-Free Average Ramp Rate (TL to TP) 3 C/sec maximum 3 C/sec maximum Preheat Minimum Temperature (TSMIN) 1 C 1 C Maximum Temperature (TSMAX) 1 C 2 C Time (TSMIN to TSMAX), ts 6 sec to 12 sec 6 sec to 1 sec TSMAX to TL Ramp-Up Rate 3 C/sec 3 C/sec Time Maintained Above Liquidous (tl) Liquidous Temperature (TL) 183 C 217 C Liquidous Time (tl) 6 sec to 1 sec 6 sec to 1 sec Peak Temperature (TP) 24 C + C/ C 26 C + C/ C Time Within C of Actual Peak Temperature (tp) 1 sec to 3 sec 2 sec to 4 sec Ramp-Down Rate 6 C/sec maximum 6 C/sec maximum Time 2 C to Peak Temperature (tpeak) 6 minute maximum 8 minute maximum Soldering Profile Diagram T P RAMP-UP t P CRITICAL ZONE T L TO T P TEMPERATURE (T) T L T SMIN T SMAX t S PREHEAT t L RAMP-DOWN t PEAK TIME (t) Figure 3. Soldering Profile Diagram 71-22 Rev. A Page of 16

ADXL1 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating Acceleration (Any Axis, Unpowered and 4 g Powered) Supply Voltage, VS.3 V to +7. V Output Short-Circuit Duration (VOUT to GND) Indefinite Storage Temperature Range 6 C to +1 C Operating Temperature Range C to +12 C Soldering Temperature (Soldering, 1 sec) 24 C Drops onto hard surfaces can cause shocks of greater than 4 g and can exceed the absolute maximum rating of the device. Exercise care during handling to avoid damage. ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A Page 6 of 16

ADXL1 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS V DD2 DNC 1 8 7 V DD DNC 2 6 X OUT COM 3 DNC = DO NOT CONNECT 4 ST DNC 71-4 ADXL1 TOP VIEW (Not to Scale) Figure 4. Pin Configuration Table. Pin Function Descriptions Pin No. Mnemonic Description 1, 2, DNC Do Not Connect. 3 COM Common. 4 ST Self-Test Control (Logic Input). 6 XOUT X-Axis Acceleration Output. 7 VDD 3.13 V to 6 V. Connect to VDD2. 8 VDD2 3.13 V to 6 V. Connect to VDD. Rev. A Page 7 of 16

ADXL1 TYPICAL PERFORMANCE CHARACTERISTICS VS = 3.3 V, TA = 2 C, unless otherwise noted. 6 2 4 3 2 1 2 1 1 71-71-8.7.6..4.3.2.1.1.2.3.4. VOLTS Figure. Zero-g Bias Deviation from Ideal.6.7 1.2 1.3 1.4 1. 1.6 1.7 1.8 1.9 16. 16.1 16.2 16.3 16.4 16. 16.6 16.7 16.8 (mv/g) Figure 8. ADXL1-7, Sensitivity Distribution (TA = 12 C) 4 3 4 3 3 3 2 2 1 1 2 2 1 1 71-6 71-24.7.6..4.3.2.1.1 VOLTS.2.3.4..6.7 4.3 4.32 4.34 4.36 4.38 4.4 4.42 4.44 (mv/g) 4.46 4.48 4. 4.2 4.4 Figure 6. Zero-g Bias Deviation from Ideal (TA = 12 C) 2 2 1 1 71-7 1.2 1.3 1.4 1. 1.6 1.7 1.8 1.9 16. 16.1 16.2 16.3 16.4 16. 16.6 16.7 16.8 Figure 9: ADXL1-2, Sensitivity Distribution 3 2 2 1 1 4.3 4.32 4.34 4.36 71-2 4.38 4.4 4.42 4.44 4.46 4.48 4. 4.2 4.4 4.6 (mv/g) (mv/g) Figure 7. ADXL1-7, Sensitivity Distribution Figure 1: ADXL1-2, Sensitivity Distribution (TA = 12 C) Rev. A Page 8 of 16

ADXL1 3 3 2 2 2 1 1 2 1 1 71-26 71-28 2.17 2.18 2.19 2.2 2.21 2.22 2.23 (mv/g) 2.24 2.2 2.26 2.27 11 112 114 116 118 12 122 124 126 128 (mv) 13 132 134 136 138 14 142 Figure 11. ADXL1-, Sensitivity Distribution Figure 14. ADXL1-2, Self-Test Delta 3 4 2 3 2 1 1 3 2 2 1 1 2.17 2.18 2.19 2.2 2.21 2.22 2.23 2.24 (mv/g) 2.2 2.26 2.27 2.28 2.29 71-27 6 7 8 9 6 61 62 63 64 6 66 67 (mv) 71-29 Figure 12. ADXL1-, Sensitivity Distribution (TA = 12 C) Figure 1. ADXL1-, Self-Test Delta 2 3 2 2 1 1 2 1 1 71-9 71-1 36 36 37 37 38 38 39 39 4 4 (mv) 41 41 42 42 43 43 44 2. 2.7 2.1 2.22 2.3 2.37 2.4 2.2 (ma) 2.6 2.67 2.7 2.82 2.9 Figure 13. ADXL1-7, Self-Test Delta Figure 16. ISUPPLY Distribution Rev. A Page 9 of 16

ADXL1 4 3 3 2 2 1 1 2.1 2.17 2.2 2.32 2.4 2.47 2. 2.62 2.7 2.77 2.8 2.92 3. 71-11 CH1 mv B W CH2 mv B W M1.µs A CH2 1.38V T 42.8% 71-12 (ma) Figure 17. ISUPPLY at 12 C Figure 18. Turn-On Characteristic (1 μs per DIV) Rev. A Page 1 of 16

ADXL1 THEORY OF OPERATION DESIGN PRINCIPLES The ADXL1 accelerometer provides a fully differential sensor structure and circuit path for excellent resistance to EMI/RFI interference. This latest generation SOI MEMS device takes advantage of mechanically coupled but electrically isolated differential sensing cells. This improves sensor performance and size because a single proof mass generates the fully differential signal. The sensor signal conditioning also uses electrical feedback with zero-force feedback for improved accuracy and stability. This force feedback cancels out the electrostatic forces contributed by the sensor circuitry. Figure 19 is a simplified view of one of the differential sensor cell blocks. Each sensor block includes several differential capacitor unit cells. Each cell is composed of fixed plates attached to the device layer and movable plates attached to the sensor frame. Displacement of the sensor frame changes the differential capacitance. On-chip circuitry measures the capacitive change. MECHANICAL SENSOR The ADXL1 is built using the Analog Devices SOI MEMS sensor process. The sensor device is micromachined in-plane in the SOI device layer. Trench isolation is used to electrically isolate, but mechanically couple, the differential sensing elements. Single-crystal silicon springs suspend the structure over the handle wafer and provide resistance against acceleration forces. ACCELERATION PLATE CAPACITORS UNIT SENSING CELL ANCHOR MOVING PLATE FIXED PLATES MOVABLE FRAME UNIT FORCING CELL ANCHOR Figure 19. Simplified View of Sensor Under Acceleration 71-19 Rev. A Page 11 of 16

ADXL1 APPLICATIONS INFORMATION APPLICATION CIRCUIT Figure 2 shows the standard application circuit for the ADXL1. Note that VDD and VDD2 should always be connected together. The output is shown connected to a 1 pf output capacitor for improved EMI performance and can be connected directly to an ADC input. Use standard best practices for interfacing with an ADC and do not omit an appropriate antialiasing filter. V S ST C VDD.1µF SELF-TEST DNC DNC COM 1 2 3 8 4 V DD2 ADXL1 TOP VIEW (Not to Scale) DNC = DO NOT CONNECT ST 7 6 V DD X OUT C OUT 1nF DNC Figure 2. Application Circuit X OUT The fixed fingers in the forcing cells are normally kept at the same potential as that of the movable frame. When the digital self-test input is activated, the ADXL1 changes the voltage on the fixed fingers in these forcing cells on one side of the moving plate. This potential creates an attractive electrostatic force, causing the sensor to move toward those fixed fingers. The entire signal channel is active; therefore, the sensor displacement causes a change in XOUT. The ADXL1 self-test function verifies proper operation of the sensor, interface electronics, and accelerometer channel electronics. Do not expose the ST pin to voltages greater than VS +.3 V. If this cannot be guaranteed due to the system design (for instance, if there are multiple supply voltages), then a low VF clamping diode between ST and VS is recommended. 71-23 ACCELERATION SENSITIVE AXIS The ADXL1 is an x-axis acceleration and vibration-sensing device. It produces a positive-going output voltage for vibration toward its Pin 8 marking. PIN 8 Figure 21. XOUT Increases with Acceleration in the Positive X-Axis Direction OPERATING VOLTAGES OTHER THAN V The ADXL1 is specified at VS = 3.3 V and VS = V. Note that some performance parameters change as the voltage is varied. In particular, the XOUT output exhibits ratiometric offset and sensitivity with supply. The output sensitivity (or scale factor) scales proportionally to the supply voltage. At VS = 3.3 V, the output sensitivity is typically 16 mv/g. At VS = V, the output sensitivity is nominally 24.2 mv/g. XOUT zero-g bias is nominally equal to VS/2 at all supply voltages. ZERO-g BIAS (V) 3. 3. 2. 2. 1. NOMINAL ZERO-g HIGH LIMIT LOW LIMIT 1. 3.2 3.7 4.2 4.7.2.7 71-2 SUPPLY VOLTAGE (V) Figure 22. Typical Zero-g Bias Levels Across Varying Supply Voltages Self-test response in gravity is roughly proportional to the cube of the supply voltage. For example, the self-test response for the ADXL1-7 at VS = V is approximately 1.4 V. At VS = 3.3 V, the self-test response for the ADXL1-7 is approximately 4 mv. To calculate the self-test value at any operating voltage other than 3.3 V or V, the following formula can be applied: (STΔ @ VX) = (STΔ @ VS) (VX/VS) 3 where: VX is the desired supply voltage. VS is 3.3 V or V. 71-16 Rev. A Page 12 of 16

LAYOUT, GROUNDING, AND BYPASSING CONSIDERATIONS CLOCK FREQUENCY SUPPLY RESPONSE In any clocked system, power supply noise near the clock frequency may have consequences at other frequencies. An internal clock typically controls the sensor excitation and the signal demodulator for micromachined accelerometers. If the power supply contains high frequency spikes, they may be demodulated and interpreted as acceleration signals. A signal appears at the difference between the noise frequency and the demodulator frequency. If the power supply noise is 1 Hz away from the demodulator clock, there is an output term at 1 Hz. If the power supply clock is at exactly the same frequency as the accelerometer clock, the term appears as an offset. If the difference frequency is outside the signal bandwidth, the output filter attenuates it. However, both the power supply clock and the accelerometer clock may vary with time or temperature, which can cause the interference signal to appear in the output filter bandwidth. The ADXL1 addresses this issue in two ways. First, the high clock frequency, 12 khz for the output stage, eases the task of choosing a power supply clock frequency such that the difference between it and the accelerometer clock remains well outside the filter bandwidth. Second, the ADXL1 has a fully differential signal path, including a pair of electrically isolated, mechanically coupled sensors. The differential sensors eliminate most of the power supply noise before it reaches the demodulator. Good high frequency supply bypassing, such as a ceramic capacitor close to the supply pins, also minimizes the amount of interference. ADXL1 The clock frequency supply response (CFSR) is the ratio of the response at the output to the noise on the power supply near the accelerometer clock frequency or its harmonics. A CFSR of.9 V/V means that the signal at the output is half the amplitude of the supply noise. This is analogous to the power supply rejection ratio (PSRR), except that the stimulus and the response are at different frequencies. POWER SUPPLY DECOUPLING For most applications, a single.1 μf capacitor, CDC, adequately decouples the accelerometer from noise on the power supply. However, in some cases, particularly where noise is present at the 1 MHz internal clock frequency (or any harmonic thereof), noise on the supply can cause interference on the ADXL1 output. If additional decoupling is needed, a Ω (or smaller) resistor or ferrite bead can be inserted in the supply line. Additionally, a larger bulk bypass capacitor (in the 1 μf to 4.7 μf range) can be added in parallel to CDC. ELECTROMAGNETIC INTERFERENCE The ADXL1 can be used in areas and applications with high amounts of EMI or with components susceptible to EMI emissions. The fully differential circuitry of the ADXL1 is designed to be robust to such interference. For improved EMI performance, especially in automotive applications, a 1 pf output capacitor is recommended on the XOUT output. Rev. A Page 13 of 16

ADXL1 OUTLINE DIMENSIONS.183.177 SQ.171 R.8 (4 PLCS).28.197 SQ.188 TOP VIEW.22.1.8 (R 4 PLCS).1.6.2.94.78.62.82.7.8...4.7 REF R.8 (8 PLCS) 7.31 (PLATING OPTION 1, SEE DETAIL A.2 FOR OPTION 2).19.3.2 DIA.1 BOTTOM VIEW 1 3.19 SQ.18.1.92 DETAIL A (OPTION 2) 11188-C Figure 23. 8-Terminal Ceramic Leadless Chip Carrier [LCC] (E-8-1) Dimensions shown in inches ORDERING GUIDE Model 1 Temperature Range g Range Package Description Package Option ADXL1-7BEZ 4 C to +12 C ±7 g 8-Terminal LCC E-8-1 ADXL1-7BEZ-R7 4 C to +12 C ±7 g 8-Terminal LCC E-8-1 ADXL1-2BEZ 4 C to +12 C ±2 g 8-Terminal LCC E-8-1 ADXL1-2BEZ-R7 4 C to +12 C ±2 g 8-Terminal LCC E-8-1 ADXL1-BEZ 4 C to +12 C ± g 8-Terminal LCC E-8-1 ADXL1-BEZ-R7 4 C to +12 C ± g 8-Terminal LCC E-8-1 EVAL-ADXL1-2Z Evaluation Board EVAL-ADXL1-Z Evaluation Board EVAL-ADXL1-7Z Evaluation Board 1 Z = RoHS Compliant Part. Rev. A Page 14 of 16

ADXL1 NOTES Rev. A Page 1 of 16

ADXL1 NOTES 21 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D71--2/1(A) Rev. A Page 16 of 16