MC3464, MC3364, NCV3364 Undervoltage Sensing Circuit The MC3464 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessorbased systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC3464 features a trimmedinpackage bandgap reference, and a comparator with precise thresholds and built in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of ma, and operation is guaranteed down to. V input with low standby current. The MC devices are packaged in 3pin TO 92, micro size TSOP5, pin SOIC and Micro surface mount packages. The NCV device is packaged in SOIC and TO92. Applications include direct monitoring of the 5. V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment. Features TrimmedInPackage Temperature Compensated Reference Comparator Threshold of 4.6 V at 25 C Precise Comparator Thresholds Guaranteed Over Temperature Comparator Hysteresis Prevents Erratic Output Capable of Sinking in Excess of ma Internal Clamp Diode for Discharging Delay Capacitor Guaranteed Operation with. V Low Standby Current Economical TO92, TSOP5, SOIC and Micro Surface Mount Packages NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes PbFree Packages are Available 5 Pin SOIC D SUFFIX CASE 75 Micro DM SUFFIX CASE 46A TSOP5 SN SUFFIX CASE 43. Ground 2. 3. 4. NC 5. NC 2 2 3 3 STRAIGHT LEAD BENT LEAD BULK PACK TAPE & REEL AMMO PACK TO92 P SUFFIX CASE 29 Pin PIN CONNECTIONS. 2. 3. Ground N.C. Ground N.C. 2 3 4 7 N.C. 6 N.C. 5 N.C. (Top View).2 V ref This device contains 2 active transistors. Figure. Representative Block Diagram = Sink Only Positive True Logic ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 7 of this data sheet. Semiconductor Components Industries, LLC, 27 August, 27 Rev. 7 Publication Order Number: MC3464/D
MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Voltage V in. to V Output Voltage V O V Output Sink Current (Note 2) I Sink Internally Limited ma Clamp Diode Forward Current, to Pin (Note 2) I F ma Power Dissipation and Thermal Characteristics P Sufix, Plastic Package Maximum Power Dissipation @ T A = 25 C Thermal Resistance, JunctiontoAir D Sufix, Plastic Package Maximum Power Dissipation @ T A = 25 C Thermal Resistance, JunctiontoAir DM Suffix, Plastic Package Maximum Power Dissipation @ T A = 25 C Thermal Resistance, JunctiontoAir P D R JA P D R JA P D R JA 625 2 625 2 52 24 mw C/W mw C/W mw C/W Operating Junction Temperature T J 5 C Operating Ambient Temperature MC3464 MC3364 NCV3364 T A to 7 4 to 5 4 to 25 C Storage Temperature Range T stg 65 to 5 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. ESD data available upon request. ELECTRICAL CHARACTERISTICS (For typical values T A = 25 C, for min/max values T A is the operating ambient temperature range that applies [Notes 3 and 4] unless otherwise noted.) COMPARATOR Threshold Voltage High State Output (V in Increasing) Low State Output (V in Decreasing) Hysteresis RESET OUTPUT Output Sink Saturation (V in = 4. V, I Sink =. ma) (V in = 4. V, I Sink = 2. ma) (V in =. V, I Sink =. ma) Characteristics Symbol Min Typ Max Unit V IH V IL V H 4.5 4.5. V OL Output Sink Current (V in, = 4. V) I Sink 27 6 ma Output Off State Leakage (V in, = 5. V) I OH.2.5 A Clamp Diode Forward Voltage, to Pin (I F = ma) V F.6.9.2 V TOTAL DEVICE Operating Voltage Range V in. to 6.5 V Quiescent Current (V in = 5. V) I in 39 5 A 2. Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 4. T low = C for MC3464 T high = 7 C for MC3464 4 C for MC3364 5 C for MC3364 4 C for NCV3364 25 C for NCV3364 5. NCV prefix is for automotive and other applications requiring site and change control. 4.6 4.59.2.46.5 4.7 4.7.5..4. V V 2
I MC3464, MC3364, NCV3364 5. V O, OUTPUT VOLTAGE (V). 6. 4. 2. R L = k to V in T A = 25 C V O, OUTPUT VOLTAGE (V) 4. 3. 2.. R L = k to V in T A = 25 C 2. 4. 6.. V in, INPUT VOLTAGE (V) Figure 2. Output Voltage versus Voltage 4.56 4.5 4.6 4.62 4.64 V in, INPUT VOLTAGE (V) Figure 3. Output Voltage versus Voltage 4.63. R L = k to V in th, THRESHOLD VOLTAGE (V) V 4.62 4.6 4.6 4.59 4.5 Upper Threshold High State Output Lower Threshold Low State Output in, INPUT CURRENT (ma)..6.4.2 T A = 25 C 5 C T A = 25 C 4 C 4 C 5 C 4.57 55 25 25 5 75 25 T A, AMBIENT TEMPERATURE ( C) Figure 4. Comparator Threshold Voltage versus Temperature 2. 4. 6.. V in, INPUT VOLTAGE (V) Figure 5. Current versus Voltage V OL, OUTPUT SATURATION (V) 2..5..5 V in = 4. V T A = 5 C T A = 25 C T A = 4 C 9% 5. V 4. V % 5.V 4.V V in V in k V in = 5. V to 4. V R L = k T A = 25 C 2 3 4 REF I Sink, SINK CURRENT (ma) Figure 6. Output Saturation versus Sink Current 2 ns/div Figure 7. Delay Time 3
IF, FORWARD CURRENT (ma) 6 4 2 V in = V T A = 25 C.4..2.6 V F, FORWARD VOLTAGE (V) Figure. Clamp Diode Forward Current versus Voltage Power Supply.2 V ref Figure 9. Low Voltage Microprocessor R C DLY A time delayed reset can be accomplished with the addition of C DLY. For systems with extremely fast power supply rise times (<5 ns) it is recommended that the RC DLY time constant be greater than 5. s. V th(mpu) is the microprocessor reset input threshold. t DLY = RC DLY In Microprocessor Circuit V th(mpu) V in TEST DATA Power Supply I in R H.2V ref R L V H 4.6 R H.2 R L V th(lower) 34 R H x 6 Where:R H 5 Where:R L.5, k Microprocessor Circuit Comparator hysteresis can be increased with the addition of resistor R H. The hysteresis equation has been simplified and does not account for the change of input current I in as V CC crosses the comparator threshold (Figure 4). An increase of the lower threshold V th(lower) will be observed due to I in which is typically 34 A at 4.59V. The equations are accurate to ±% with R H less than 5 and R L between.5 k and k V H (mv) 2 5 4 7 2 64 9 327 276 4 V th (mv) 3.4 6. 6. 6 6 34 34 5 5 R H () 2 2 3 3 47 47 5 5 R L (k).5 4.7.5 2.7.5 2.7.5 2.7.5 2.7.5 Figure. Low Voltage Microprocessor with Additional Hysteresis 4
Power Supply.k Solar Cells.2V ref.2v ref Figure. Voltage Monitor Figure 2. Solar Powered Battery Charger 25H V in =.5 to 4.5V 4.7k 47 MPSW5A 47 N59 22 6.2k V O = 5. V I O = 5 ma 33 N756 Test Conditions Results Line Regulation V in =.5 V to 4.5 V, I O = 5 ma 35 mv Load Regulation V in = 2.6 V, I O = ma to 5 ma 2 mv Output Ripple V in = 2.6 V, I O = 5 ma 6 mvpp Efficiency V in = 2.6 V, I O = 5 ma 77%.2V ref Figure 3. Low Power Switching Regulator V CC R L 4.6V 27 MTP355EL.2V ref Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC3464, its output grounds the gate of the L 2 MOSFET. Figure 4. MOSFET Low Voltage Gate Drive Protection 5
ORDERING INFORMATION MC3464D5 MC3464D5G Device Operating Temperature Range Package Shipping SOIC SOIC 9 Units / Rail MC3464D5R2 SOIC 25 Units/ Tape & Reel MC3464D5R2G SOIC MC3464DM5R2 Micro 4 Units / Tape & Reel MC3464DM5R2G Micro MC3464P5 TO92 2 Units / Bag MC3464P5G TO92 MC3464P5RA T A = C to 7 C TO92 2 Units / Tape & Reel MC3464P5RAG TO92 MC3464P5RP TO92 2 Units / Ammo Pack MC3464P5RPG MC3464P5RM MC3464P5RMG TO92 TO92 TO92 MC3464SN5T TSOP5 3 Units / Tape & Reel MC3464SN5TG MC3364D5 MC3364D5G TSOP5 SOIC SOIC 9 Units / Rail MC3364D5R2 SOIC 25 Units / Tape & Reel MC3364D5R2G SOIC MC3364DM5R2 Micro 4 Units / Tape & Reel MC3364DM5R2G Micro MC3364P5 TO92 2 Units / Bag MC3364P5G T J = 4 C to 5 C TO92 MC3364P5RA TO92 2 Units / Tape & Reel MC3364P5RAG TO92 MC3364P5RP TO92 2 Units / Ammo Pack MC3364P5RPG TO92 MC3364SN5T TSOP5 3 Units / Tape & Reel MC3364SN5TG TSOP5 For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications Brochure, BRD/D. *NCV3364: T low = 4 C, T high = 25 C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. 6
ORDERING INFORMATION Device Operating Temperature Range Package Shipping NCV3364D5R2* NCV3364D5R2G* SOIC SOIC 25 Units / Tape & Reel NCV3364P5RA* TO92 2 Units / Tape & Reel NCV3364P5RAG* TO92 NCV3364P5RP* T A = 4 C to 25 C TO92 2 Units / Ammo Pack NCV3364P5RPG* TO92 NCV3364DM5R2* Micro 4 Units / Tape & Reel NCV3364DM5R2G* Micro For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications Brochure, BRD/D. *NCV3364: T low = 4 C, T high = 25 C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. MARKING DIAGRAMS SOIC D SUFFIX CASE 75 Micro DM SUFFIX CASE 46A TO92 P SUFFIX CASE 29 3x64 ALYW5 V364 ALYW5 Ly5 AYW VI5 AYW MC3x 64P5 ALYWW NCV3 64P5 ALYWW 2 3 2 3 TSOP5 SN SUFFIX CASE 43 5 SRB AYW MC3464 5 SSN AYW MC3364 x = 3 or 4 y = C or I A = Assembly Location L = Wafer Lot Y = Year W, WW = Work Week = PbFree Package (Note: Microdot may be in either location) 7
PACKAGE DIMENSIONS SOIC D SUFFIX CASE 757 ISSUE AH X Y B A 5 4 S.25 (.) M Y M K NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 92. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION.5 (.6) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE.27 (.5) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 75 THRU 756 ARE OBSOLETE. NEW STANDARD IS 757. Z H G D C.25 (.) M Z Y S X S SEATING PLANE. (.4) N X 45 M J MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4. 5..9.97 B 3. 4..5.57 C.35.75.53.69 D.33.5.3.2 G.27 BSC.5 BSC H..25.4. J.9.25.7. K.4.27.6.5 M N.25.5..2 S 5. 6.2.22.244 SOLDERING FOOTPRINT*.52.6 7..275 4..55.6.24.27.5 SCALE 6: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
PACKAGE DIMENSIONS Micro DM SUFFIX CASE 46A2 ISSUE G H E D E NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 92. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED.5 (.6) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED.25 (.) PER SIDE. 5. 46A OBSOLETE, NEW STANDARD 46A2. PIN ID T SEATING PLANE.3 (.5) e b PL. (.3) M T B S A S A A c L MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A..43 A.5..5.2.3.6 b.25.33.4..3.6 c.3..23.5.7.9 D 2.9 3. 3..4..22 E 2.9 3. 3..4..22 e.65 BSC.26 BSC L.4.55.7.6.2.2 HE 4.75 4.9 5.5.7.93.99 SOLDERING FOOTPRINT*.4 X.4.3.5 X 3.2.26 4.24.67 5.2.2.65 6X.256 SCALE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 9
PACKAGE DIMENSIONS TSOP5 SN SUFFIX CASE 432 ISSUE H 2X 2X NOTE 5. T.2 T L.5 5 4 2 3 H G A B C T D 5X S.2 SEATING PLANE C A B J K DETAIL Z M DETAIL Z SOLDERING FOOTPRINT* NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y4.5M, 994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN.2 FROM BODY. MILLIMETERS DIM MIN MAX A 3. BSC B.5 BSC C.9. D.25.5 G.95 BSC H.. J..26 K.2.6 L.25.55 M S 2.5 3..95.37.9.74 2.4.94..39.7.2 SCALE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
PACKAGE DIMENSIONS R A N B TO92 (TO226) P SUFFIX CASE 29 ISSUE AM STRAIGHT LEAD BULK PACK NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 92. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P L SEATING INCHES MILLIMETERS PLANE K DIM MIN MAX MIN MAX A.75.25 4.45 5.2 B.7.2 4.32 5.33 C.25.65 3. 4.9 D.6.2.47.533 X X D G.45.55.5.39 H.95.5 2.42 2.66 G J.5.2.39.5 H J K.5 2.7 V C L.25 6.35 N..5 2.4 2.66 P. 2.54 SECTION XX R.5 2.93 N V.35 3.43 R A B BENT LEAD TAPE & REEL AMMO PACK NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y4.5M, 994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P T MILLIMETERS SEATING PLANE K DIM MIN MAX A 4.45 5.2 B 4.32 5.33 C 3. 4.9 D.4.54 G X X D G 2.4 2. J.39.5 K 2.7 J N 2.4 2.66 V P.5 4. C R 2.93 SECTION XX V 3.43 N Micro is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 27 USA Phone: 33675275 or 34436 Toll Free USA/Canada Fax: 33675276 or 344367 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 22955 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 42 33 79 29 Japan Customer Focus Center Phone: 3577335 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC3464/D