M4490 Hex ontact Bounce Eliminator The M4490 is cotructed with complementary MOS enhancement mode devices, and is used for the elimination of extraneous level changes that result when interfacing with mechanical contacts. The digital contact bounce eliminator circuit takes an input signal from a bouncing contact and generates a clean digital signal four clock periods after the input has stabilized. The bounce eliminator circuit will remove bounce on both the make and the break of a contact closure. The clock for operation of the M4490 is derived from an internal R oscillator which requires only an external capacitor to adjust for the desired operating frequency (bounce delay). The clock may also be driven from an external clock source or the oscillator of another M4490 (see Figure 5). NOTE: Immediately after powerup, the outputs of the M4490 are in indeterminate states. Features Diode Protection on All Inputs Six Debouncers Per Package Internal Pullups on All Data Inputs an Be Used as a Digital Integrator, System Synchronizer, or Delay Line Internal Oscillator (R), or External lock Source TTL ompatible Data Inputs/Outputs Single Line Input, Debounces Both Make and Break ontacts Does Not Require Form (Single Pole Double Throw) Input Signal ascadable for Longer Time Delays Schmitt Trigger on lock Input (Pin 7) Supply Voltage Range = 3. to 8 V hip omplexity: 546 FETs or 36.5 Equivalent Gates PbFree Packages are Available* MAXIMUM RATINGS oltages Referenced to V SS ) Parameter Symbol Value Unit D Supply Voltage Range 0.5 to +8. Input or Output Voltage Range (D or Traient) V in, V out 0.5 to + 0.5 Input urrent (D or Traient) per Pin I in ± 0 ma Power Dissipation, per Package (Note ) P D 500 mw Ambient Temperature Range T A 55 to +25 Storage Temperature Range T stg 65 to +50 Lead Temperature (8Second Soldering) T L 260 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating onditio is not implied. Extended exposure to stresses above the Recommended Operating onditio may affect device reliability.. Temperature Derating: Plastic P and D/DW Packages: 7.0 mw/ From 65 To 25 This device contai protection circuitry to guard agait damage due to high static voltages or electric fields. However, precautio must be taken to avoid applicatio of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation, V in and V out should be cotrained to the range V SS in or V out ). Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V SS or ). Unused outputs must be left open. V PDIP6 P SUFFIX ASE 648 SOI6 DW SUFFIX ASE 75G SOEIAJ6 F SUFFIX ASE 966 6 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G = PbFree Package MARKING DIAGRAMS 4490 AWLYYWWG ORDERING INFORMATION See detailed ordering and shipping information in the package dimeio section on page 9 of this data sheet. 6 6 M4490P AWLYYWWG M4490 ALYWG *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor omponents Industries, LL, 2006 Publication Order Number: M4490/D
M4490 ELETRIAL HARATERISTIS oltages Referenced to V SS ) 55 25 ÎÎ 25 ÎÎ haracteristic Symbol Min Max Î Typ Î Min (Note 2) Max Min Max Unit Output Voltage 0 Level V OL Î V in = or 0 0 0.05Î 0 0.05 0 Î 0.05 0.05 5 0.05 0 0.05 0.05 Level V V in = 0 or Î OH 4.95 4.95 4.95 0 9.95 Î 9.95 0 Î 9.95 5 4.95 4.95 5 4.95 Input Voltage 0 Level V O = 4.5 or 0.5 ) Î IL O = 9.0 or.0 ) O 0.5 3.0Î 2.25.5 4.50Î 3.0.5 3.0 = 3.5 or.5 ) 5 4.0 6.75 4.0 4.0 O = 0.5 or 4.5 ) Level Î V O =.0 or 9.0 ) IH Î O =.5 or 3.5 ) 0 3.5 7.0 3.5 Î 7.0 2.75 3.5 5.50Î 7.0 5 8.25 Output Drive urrent I Oscillator Output SourceÎ OH madc Î OH = 2.5 V) 0.6 0.5.5 0.4 OH = 4.6 V) 0.2 Î 0. 0.3Î 0.08 OH = 9.5 V) 0 0.23 Î 0.2 0.8Î 0.6 OH = 3.5 V) 5.4.2 3.0.0 Debounce Outputs Î OH = 2.5 V) OH 0.9 Î 0.75 2.2Î 0.6 = 4.6 V) 0.9 0.6 0.46 0.2 OH = 9.5 V) 0 0.6 Î 0.5.2Î 0.4 OH = 3.5 V) 5.8.5 4.5.2 Oscillator Output SinkÎ I OL = 0.4 V) OL Î OL madc = 0.5 V) 0.36 OL =.5 V) 0 0.9 0.75 0.9 0.24 2.3 0.6 ÎÎ 5 4.2 3.5 0 2.8 Debounce Outputs OL Î = 0.4 V) OL = 0.5 V) 2.6 Î 2.2 4.0 Î.8 OL =.5 V) 0 4.0 3.3 9.0 2.7 5 2 Î 0 35 Î 8. Input urrent Î I IH 5 2.0Î 0.2 Î 2.0 Debounce Inputs in = ) ÎÎ Input urrent Oscillator Pin 7 I in = V SS or ) Î in 5 ± 620Î ± 255 ± 400 Î ± 250 Pullup Resistor Source urrent Î I IL Debounce Inputs 0 in = V SS ) 5 75 340 505 375 Î 40 740 280 00 Î 45 90 Î 255 380 500 570Î 750 70 45 25 225 440 660 Input apacitance Î in Î Î 7.5 pf Quiescent urrent Î I SS in = V SS or, I out = 0 A) 0 ÎÎ 50 280 40 00 90 225 90 80 5 840 225 650 550 2. Data labelled Typ is not to be used for design purposes but is intended as an indication of the I s potential performance. 3
M4490 SWITHING HARATERISTIS (Note 3) ( L = 50 pf, T A = 25 ) Î V DD Î Typ haracteristic Symbol Min (Note 4) Max Unit ÎÎ Output Rise Time t TLH ÎÎ All Outputs Î 0 80 Î 90 360 80 5 65 30 Output Fall Time Oscillator Output ÎÎ t THL 0 00 Î 50 200 00 5 40 80 ÎÎ Debounce Outputs ÎÎ t THL ÎÎ Î 0 60 Î 30 20 60 5 20 40 ÎÎ Propagation Delay Time t PHL ÎÎ Oscillator Input to Debounce Outputs Î 0 285 Î 20 570 240 5 95 90 ÎÎ t PLH ÎÎ Î 0 370 Î 60 740 320 5 20 240 ÎÎ lock Frequency ( Duly ycle) f cl ÎÎ (External lock) Î 0 2.8 Î 6.4 3.0 MHz 5 9 4.5 ÎÎ Setup Time (See Figure ) t su Î 0 00 50 80 Î 40 5 60 30 Maximum External lock Input t ÎÎ Rise and Fall Time ÎÎ r, t f 0 ÎÎ No Limit Oscillator Input 5 Oscillator Frequency f ÎÎ OS out ÎÎ osc, typ.5 Hz ÎÎ ext (in F) ÎÎ ext 00 pf* Î Note: These equatio are intended to be a design guide. 0 ÎÎ 4.5 ÎÎ Laboratory experimentation may be required. Formulas are typicallyî ext (in F) ± 5% of actual frequencies. 5 6.5 Î ext (in F) 3. The formulas given are for the typical characteristics only at 25. 4. Data labelled Typ is not to be used for design purposes but is intended as an indication of the I s potential performance. *POWERDOWN ONSIDERATIONS Large values of ext may cause problems when powering down the M4490 because of the amount of energy stored in the capacitor. When a system containing this device is powered down, the capacitor may discharge through the input protection diodes at Pin 7 or the parasitic diodes at Pin 9. urrent through these internal diodes must be limited to 0 ma, therefore the turnoff time of the power supply must not be faster than t = DD V SS ) ext /(0 ma). For example, If V SS = 5 V and ext = F, the power supply must turn off no faster than t = (5 V) ( F)/0 ma =.5 ms. This is usually not a problem because power supplies are heavily filtered and cannot discharge at this rate. When a more rapid decrease of the power supply to zero volts occurs, the M4490 may sustain damage. To avoid this possibility, use external clamping diodes, D and D2, connected as shown in Figure 2. OS in A out A out OS in A in t PLH 90% 0% t r t PHL 90% 0% t f t su Figure. Switching Waveforms D ext D2 7 9 OS in OS out M4490 Figure 2. Discharge Protection During Power Down 4
M4490 ORDERING INFORMATION M4490DW M4490DWG Device Package Shipping SOI6 SOI6 (PbFree) 47 Units / Rail M4490DWR2 M4490DWR2G M4490F M4490FG M4490FEL M4490FELG SOI6 SOI6 (PbFree) SOEIAJ6 SOEIAJ6 (PbFree) SOEIAJ6 SOEIAJ6 (PbFree) 000 / Tape & Reel 50 Units / Rail 2000 Units / Tape & Reel M4490P M4490PG PDIP6 PDIP6 (PbFree) 25 Units / Rail For information on tape and reel specificatio, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specificatio Brochure, BRD80/D. 9
M4490 PAKAGE DIMENSIONS PDIP6 ASE 64808 ISSUE T A 6 9 8 B NOTES:. DIMENSIONING AND TOLERANING PER ANSI Y4.5M, 982. 2. ONTROLLING DIMENSION: INH. 3. DIMENSION L TO ENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INLUDE MOLD FLASH. 5. ROUNDED ORNERS OPTIONAL. H G F S K T SEATING PLANE D 6 PL 0.25 (0.00) M T A M J L M INHES MILLIMETERS DIM MIN MAX MIN MAX A 0.740 0.770 8.80 9.55 B 0.250 0.270 6.35 6.85 0.45 0.75 3.69 4.44 D 0.05 0.02 0.39 0.53 F 0.040 0.70.02.77 G 0.00 BS 2.54 BS H 0.050 BS.27 BS J 0.008 0.05 0.2 0.38 K 0.0 0.30 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 0 0 0 S 0.020 0.040 0.5.0 SO6 WB ASE 75G03 ISSUE 8X H 0.25 M B M D A 6 9 E 8 6X B B 0.25 M T A S B S A h X 45 NOTES:. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANES PER ASME Y4.5M, 994. 3. DIMENSIONS D AND E DO NOT INLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.5 PER SIDE. 5. DIMENSION B DOES NOT INLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.3 TOTAL IN EXESS OF THE B DIMENSION AT MAXIMUM MATERIAL ONDITION. MILLIMETERS DIM MIN MAX A 2.35 2.65 A 0.0 0.25 B 0.35 0.49 0.23 0.32 D 0.5 0.45 E 7.40 7.60 e.27 BS H 0.05 0.55 h 0.25 0.75 L 0.50 0.90 q 0 7 4X e A T SEATING PLANE L 0