Features. Description. Table 1: Device summary Order code Marking Package Packaging STR1P2UH7 1L2U SOT-23 Tape and reel

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Transcription:

P-channel 20 V, 0.087 Ω typ., 1.4 A STripFET H7 Power MOSFET in a SOT-23 package Datasheet - production data Features Order code VDS RDS(on) max ID STR1P2UH7 20 V 0.1 Ω @ 4.5 1.4 A Very low on-resistance Very low capacitance and gate charge High avalanche ruggedness Applications Switching applications Figure 1: Internal schematic diagram D (3) Description This P-channel Power MOSFET utilizes the STripFET H7 technology with a trench gate structure combined with extremely low onresistance. The device also offers ultra-low capacitances for higher switching frequency operations. G (1) S (2) Table 1: Device summary Order code Marking Package Packaging STR1P2UH7 1L2U SOT-23 Tape and reel For the P-channel Power MOSFET the actual polarity of the voltages and the current must be reversed. June 2015 DocID025025 Rev 3 1/12 This is information on a product in full production. www.st.com

Contents STR1P2UH7 Contents 1 Electrical ratings... 3 2 Electrical characteristics... 4 2.1 Electrical characteristics (curves)... 6 3 Test circuits... 8 4 Package mechanical data... 9 4.1 SOT-23 package mechanical data... 9 5 Revision history... 11 2/12 DocID025025 Rev 3

Electrical ratings 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 20 V VGS Gate-source voltage ± 8 V ID Drain current (continuous) at Tpcb = 25 C 1.4 A ID Drain current (continuous) at Tpcb = 100 C 0.9 A IDM (1) Drain current (pulsed) 5.6 A PTOT Total dissipation at Tpcb = 25 C 0.35 W Tstg Storage temperature - 55 to 150 C Tj Max. operating junction temperature 150 C Notes: (1) Pulse width limited by safe operating area Table 3: Thermal data Symbol Parameter Value Unit Rthj-pcb (1) Thermal resistance junction-pcb max, single operation 357 C/W Notes: (1) When mounted on 1inch² FR-4 board, 2 oz Cu For the P-channel Power MOSFET the actual polarity of the voltages and the current must be reversed. DocID025025 Rev 3 3/12

Electrical characteristics STR1P2UH7 2 Electrical characteristics (TC = 25 C unless otherwise specified) Table 4: On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage ID = 250 µa, VGS = 0 20 V IDSS IGSS Zero gate voltage drain current Gate-body leakage current VDS = 20 V, VGS = 0 1 µa VGS = ± 8 V, VDS = 0 10 na VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µa 0.4 1 V RDS(on) Static drain-source on-resistance VGS = 4.5 V, ID = 0.7 A 0.087 0.1 Ω VGS = 2.5 V, ID = 0.7 A 0.11 0.13 Ω VGS = 1.8 V, ID = 0.7 A 0.145 0.18 Ω Table 5: Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance - 510 - pf Coss Output capacitance VDS = 10 V, f = 1 MHz, - 66 - pf VGS Reverse transfer = 0 Crss - 44 - pf capacitance Qg Total gate charge VDD = 10 V, ID = 3 A, - 4.8 - nc Qgs Gate-source charge VGS = 4.5 V - 0.7 - nc Qgd Gate-drain charge (see Figure 14: "Gate charge test circuit") - 0.8 - nc Table 6: Switching times Symbol Parameter Test conditions Min. Typ. Max Unit Turn-on delay - 9 - ns time VDD = 10 V, ID = 1.5 A, tr Rise time RG = 4.7 Ω, VGS = 4.5 V - 21 - ns Turn-off delay (see Figure 15: "Test circuit for inductive - 40 - ns time load switching and diode recovery times") td(on) td(off) tf Fall time - 19 - ns For the P-channel Power MOSFET the actual polarity of the voltages and the current must be reversed. 4/12 DocID025025 Rev 3

Table 7: Source drain diode Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit VSD (1) Forward on voltage ISD = 1 A, VGS = 0 - - 1 V trr Reverse recovery time VDD = 10 V - 12.5 ns Qrr Reverse recovery charge di/dt = 100 A/µs, ISD = 1 A - 5 nc IRRM Reverse recovery current Tj = 150 C (see Figure 15: "Test circuit for inductive load switching and diode recovery times") - 0.8 A Notes: (1) Pulsed: pulse duration = 300 µs, duty cycle 1.5%. For the P-channel Power MOSFET the actual polarity of the voltages and the current must be reversed. DocID025025 Rev 3 5/12

Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2: Safe operating area GIPG061020141457MT ID (A) STR1P2UH7 Figure 3: Thermal impedance δ 1 Operation in this area is Limited by max R DS(on) 1ms 10ms 100ms 0.01 0.02 0.05 0.1 0.2 0.1 Tj=150 C Tpcb=25 C Single pulse 0.01 0.1 1 10 VDS(V) Figure 4: Output characteristics Figure 5: Transfer characteristics GIPG011020141520MT ID (A) 7 VDS=2V 6 5 4 3 2 1 0 0 1 2 VGS(V) Figure 6: Gate charge vs gate-source voltage Figure 7: Static drain-source on-resistance GIPG031020140945MT RDS(on) (mω) VGS=4.5V 92 91 90 89 88 87 86 85 0 0.5 1 1.5 2 2.5 ID(A) 6/12 DocID025025 Rev 3

Figure 8: Capacitance variations Electrical characteristics Figure 9: Normalized gate threshold voltage vs temperature Figure 10: Normalized on-resistance vs temperature RDS(on) GIPG031020141106MT (norm) 1.5 VGS=4.5V 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6-75 0 50 75 125 TJ( C) Figure 11: Normalized V(BR)DSS vs temperature V(BR)DSS GIPG031020141114MT (norm) 1.06 ID=1m A 1.04 1.02 1.00 0.98 0.96 0.94-75 -25 25 75 125 TJ( C) Figure 12: Source-drain diode forward characteristics DocID025025 Rev 3 7/12

Test circuits STR1P2UH7 3 Test circuits Figure 13: Switching times test circuit for resistive load Figure 14: Gate charge test circuit Figure 15: Test circuit for inductive load switching and diode recovery times 8/12 DocID025025 Rev 3

Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 4.1 SOT-23 package mechanical data Figure 16: SOT-23 mechanical drawing DocID025025 Rev 3 9/12

Package mechanical data STR1P2UH7 Table 8: SOT-23 mechanical data mm Dim. Min. Typ. Max. A 0.89 1.40 A1 0 0.10 B 0.30 0.51 C 0.085 0.18 D 2.75 3.04 e 0.85 1.05 e1 1.70 2.10 E 1.20 1.75 H 2.10 3.00 L 0.60 S 0.35 0.65 L1 0.25 0.55 a 0 8 Figure 17: SOT-23 recommended footprint Dimensions are in mm. 10/12 DocID025025 Rev 3

Revision history 5 Revision history Table 9: Document revision history Date Revision Changes 18-Jul-2013 1 First release. 07-Oct-2014 2 Document status promoted from target data to preliminary data. Updated title, features and description in cover page. Updated Section 2: "Electrical characteristics". Minor text changes. 05-Jun-2015 3 Document status promoted from preliminary to production data. DocID025025 Rev 3 11/12

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2015 STMicroelectronics All rights reserved 12/12 DocID025025 Rev 3