SFP+ Dual LC 10G SMF 10Km 1310nm Transceiver. Features. Applications. Ordering Information APPLIED OPTOELECTRONICS, INC.

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Transcription:

Features Applications 10GBASE-LR Ethernet (9.95 to 10.31Gbps) CPRI 7 (9830.4 Mibit/s) CPRI 8 (10137.6 Mibit/s) SFP+ Type Dual LC Transceiver 1310nm DFB Laser PIN Photo Detector 10Km transmission with SMF 3.3V single power supply Compliant with SFP+ MSA Compliant with IEEE 802.3ae Hot pluggable Serial ID information support Digital diagnostic SFF-8472 compliant Compliant with RoHS Compliant with UL & TUV Compliant with SFF-8431 Ordering Information Form Factor Date Rate Media Distance Wavelength (nm) TX Power (dbm) RX Sensitivity (dbm) Voltage (V) Coupling Signal Detect DDM (Y/N) Temperature ( C) Part Number SFP-Dual-LC 10G SMF 10Km 1310 0.5 ~ -8.2 < -14.4 3.3 AC/AC TTL Y -40 ~ +90 Page 1 of 10

Absolute Maximum Ratings Parameter Symbol Conditions Min Max Unit Storage Temperature T S -- -40 90 C Storage Relative Humidity RH -- 5 95 % Supply Voltage V CC -- 0 4 V Recommended Operating Conditions Parameter Symbol Conditions Min Typ Max Unit Operating Temperature (Case) T C -- -40 -- 90 C Supply Voltage V CC -- 3.14 3.3 3.46 V Supply Current I TX +I RX -- -- -- 330 ma Data Rate DR -- -- 9.95 10.31 Gbps Electrical Characteristics Parameter Symbol Conditions Min Typ Max Unit Transmitter Differential Input Impedance R DI -- -- 100 -- Ohm Differential Input Voltage V DI AC-Coupled, peak to peak 150 -- 1200 mv Tx Disable Input-High V DISH -- 2.0 -- V CC+0.3 V Tx Disable Input-Low V DISL -- 0 -- 0.8 V Tx Fault Output-High V FOH -- 2.0 -- V CC+0.3 V Tx Fault Output-Low V FOL -- 0 -- 0.8 V Receiver Differential Output Impedance R DO -- -- 100 -- Ohm Differential Output Voltage V DO AC-Coupled, peak to peak 300 -- 850 mv Rx LOS Output-High V LOSH -- 2.00 -- V CC+0.3 V Rx LOS Output-Low V LOSL -- 0.00 -- 0.80 V Optical Characteristics (Vcc=3.14V to 3.46V, 9/125um SMF) Parameter Symbol Conditions Min Typ Max Unit Transmitter Optical Center Wavelength λc -- 1260 1310 1360 nm Spectral Width (-20) -- -- 1 nm Optical Output Power P o (Avg.) -8.2 -- 0.5 dbm Optical Extinction Ratio ER -- 3.5 -- -- db Side Mode Suppression Ratio SMSR -- 30 -- -- db Optical Modulation Amplitude OMA -- -5.2 -- -- dbm Relative Intensity Noise RIN 12OMA -- -- -- -128 db/hz Eye Mask -- Compliant with IEEE 802.3ae Receiver Operating Wavelength λ -- 1260 1310 1355 nm Receiver Overload P INMAX 1 0.5 -- -- dbm Rx Sensitivity (Avg.) @10.31Gbps P INMIN 1 -- -- -14.4 dbm Rx Sensitivity (OMA) @10.31Gbps P INMIN 1 -- -- -12.6 dbm Rx LOS Assert LOS A -- -30 -- -- dbm Rx LOS De-Assert LOS D -- -- -- -15 dbm Rx LOS Hysteresis -- -- 0.5 -- -- db Receiver Reflectance -- -- -- -- 12 db 1. Measured with PRBS 2 31 1 at 10-12 BER Page 2 of 10

Pin Description SFP+ Transceiver Electric Pad Layout SFP+ Transceiver Host PCB PAD Assignment Page 3 of 10

Pin Function Definitions Pin No. Pin Name Function/Description Power Sequence Order Note 1 VeeT Transmitter Ground 1st 1 2 Tx_Fault Transmitter Fault 3rd 2 3 Tx_Disable Transmitter Disable; Turns off transmitter laser output 3rd 3 4 SDA 2-wire Serial Interface Data Line (MOD-DEF2) 3rd 5 SCL 2-wire Serial Interface Clock (MOD-DEF1) 3rd 6 Mod_ABS Module Absent, connected to VeeT or VeeR in the module 3rd 4 7 RS0 Rate Select 0, (not functional) 3rd 8 Rx_LOS Receiver Loss of Signal Indication 3rd 2 9 RS1 Rate Select 1, (not functional) 3rd 10 VeeR Receiver Ground 1st 1 11 VeeR Receiver Ground 1st 1 12 RD- Receiver Inverted Data Output 3rd 13 RD+ Receiver Non-Inverted Data Output 3rd 14 VeeR Module Receiver Ground 1st 1 15 VccR Receiver 3.3 V Supply 2nd 16 VccT Transmitter 3.3 V Supply 2nd 17 VeeT Transmitter Ground 1st 1 18 TD+ Transmitter Non-Inverted Data Input 3rd 19 TD- Transmitter Inverted Data Input 3rd 20 VeeT Transmitter Ground 1st 1 Notes: 1. The module signal ground contacts, VeeR and VeeT, should be isolated from the module case. 2. This contact is an open collector/drain output contact and shall be pulled up with a 4.7k to 10k Ohms resistor to host_vcc on the host board. Pull ups can be connected to one of several power supplies, however the host board design shall ensure that no module contact has voltage exceeding module VccT/R + 0.5 V. 3. This contact is an input contact with a 4.7 kω to 10k Ohms pull up to VccT inside the module. 4. This contact shall be pulled up with a 4.7k to 10k Ohms resistor to host_vcc on the host board. Page 4 of 10

Mechanical Design Diagram Page 5 of 10

Specific EEPROM Memory Contents Page A0h AOI E130 31 Add Name of field ACSII HEX 0 Identifier 03:SFP Transceiver 03 1 Ext. Identifier 04:SFP Transceiver 04 2 Connector 07:LC 07 3 10G Ethernet 20:10G Base-LR 20 4 SONET/SDH 00 5 SONET/SDH 00 6 Ethernet 00 Transceiver 7 Fiber Channel 00 8 Fiber Channel 00 9 Fiber Channel 00 10 Fiber Channel 00 11 Encoding 01:8B10B, 03:NRZ, 05:SONET, 06:64B/66B, 06 12 BR, Nominal 100Mbps/unit -> HEX 67:10.3G 67 13 Reserved Reserved 00 14 Length(9um, km) 1km /unit -> HEX 0A :10KM 0A 15 Length (9um) 100m /unit -> HEX 64:10000M 64 16 Length (50um), OM2 10m /unit -> HEX 00 17 Length (62.5um), OM1 10m /unit -> HEX 00 18 Length (Copper) 1m /unit -> HEX 00 19 Length (50 um), OM3 10m /unit -> HEX 00 20 A 41 21 O 4F 22 I 49 23 20 24 20 25 20 26 20 27 20 Vendor name SFP Vendor Name (ASCII) 28 20 29 20 30 20 31 20 32 20 33 20 34 20 35 20 Page 6 of 10

36 Reserved Reserved 00 37 00 38 Vendor OUI SFP Vendor IEEE company ID, No ID set "00" 00 39 00 40 A 41 41 7 37 42 E 45 43 L 4C 44 L 4C 45 N 4E 46 D 44 47 3 33 Vendor PN SFP Vendor Part Number (ASCII) 48 A 41 49 D 44 50 O 4F 51 A 41 52 0 30 53 7 37 54 9 39 55 7 37 56 B 42 Hardware Revision (HEX) Ver B 57 0 30 Vendor rev 58 3 33 Firmware Revision (HEX) V3.00 59 0 30 60 05 Wavelength Wavelength -> HEX (051E: 1310nm) 61 1E 62 Reserved 00 63 CC_BASE Check Sum 0 to 62 byte 80 64 65 Options 18:TX-DIS,TX_Fault 1A:TX-DIS,TX_Fault,RX-LOS 66 BR, max 1% /unit 00 67 BR, min 1% /unit 00 00 1A 68 XX 69 XX 70 XX 71 Vendor SN Vendor SN (ASCII) XX 72 XX 73 XX 74 XX Page 7 of 10

75 XX 76 XX 77 XX 78 XX 79 XX 80 XX 81 XX 82 XX 83 XX 84 XX Year (ASCII) 85 XX 86 XX Month (ASCII) 87 XX Date code 88 XX Day (ASCII) 89 XX 90 20 Blank 91 20 92 Diagnostic Monitoring Type 93 Enhanced Options 58:W/I DDM(Ext_Cal), 68:W/I DDM(Int_Cal) E0:A/W, Tx_Dis, Tx_fault F0:A/W, Tx_Dis, Tx_fault, Rx_LOS B0:A/W, Tx_fault, Rx_LOS 94 SFF-8472 Compliance 01:9.3, 02:9.5, 03:10.2, 04:10.4, 05:11.0, 06:11.3 06 95 CC_EXT Check Sum 64 to 94 byte XX 68 F0 96 00 97 00 98 00 99 00 100 00 101 00 102 Read-only Read-only 00 103 00 104 00 105 00 106 00 107 00 108 00 Page 8 of 10

109 00 110 00 111 00 112 00 113 00 114 00 115 00 116 00 117 00 118 00 119 00 120 00 121 00 122 00 123 00 124 00 125 00 126 00 127 00 Page 9 of 10

Regulatory Compliance Item Electromagnetic Interference (EMI) Standard FCC Part 15 Class B EN55022 Class B (CISPR 22B) VCCI Class B MIL-STD-883E Method 3015.7 Electrostatic Discharge to the Electrical Pins (ESD) Electrostatic Discharge to the Receptacle (ESD) IEC 61000-4-2 RoHS 2011/65/EU Laser Eye Safety FDA 21CFR 1040.10 and 1040.11 Component Recognition UL and TUV Laser Safety Information All versions of this laser are Class 1 laser products per IEC 1 /EN 2 60825-1. Users should observe safety precautions such as those recommended by ANSI 3 Z136.1, ANSI Z36.2 and IEC 60825-1. This product conforms to FDA (CDRH) 21 CFR 1040.10 and 1040.11 except for deviations of laser safety class designation pursuant to 'Laser Notice No.50' Product labeling: Class 1 Laser Product Compliance with 21 CFR 1040.10 and 1040.11 If labeling is not affixed to the module due to size constraints; then rather, labeling is placed on the outside of the shipping box. This product is not shipped with a power supply. Caution: use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Certifications UL 60950-1 (E243407) TUV EN60950-1, EN 60825-1, EN 60825-2 Documentation is available upon request. (1) IEC is a registered trademark of the International Electro technical Commission (2) Within Europe the IEC standard has been adopted as a European Normative standard known as EN 60825, and each European country will have its own version of this standard, for example, the British Standards version known as BS EN 60825. There can be small differences between the different countries versions of EN 60825, and these are in part caused by the process of translating the standard into the native language of that country. (3) ANSI is a registered trademark of the American National Standards Institute Note : All information contained in this document is subject to change without notice. Page 10 of 10