IS31AP W STEREO CLASS-D AUDIO AMPLIFIER WITH POWER LIMIT AND DYNAMIC TEMPERATURE CONTROL November 2015

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W STEREO CLASS-D AUDIO AMPLIFIER WITH POWER LIMIT AND DYNAMIC TEMPERATURE CONTROL November 5 GENERAL DESCRIPTION The IS3AP20 is a high efficiency stereo Class-D audio amplifier with adjustable power limit function and dynamic temperature control. The loudspeaker driver operates from 8~26V supply voltage and analog circuit operates at 3.3V supply voltage. It can deliver W/CH output power into 8 loudspeaker within 0.2% THD+N and without external heat sink when playing music. IS3AP20 provides parallel BTL (Mono) application, and it can deliver 40W into 4 loudspeaker within 0.% THD+N. The adjustable power limit function allows user to set a voltage rail lower than half of 3.3V to limit the amount of current through the speaker. Output DC detection prevents speaker damage from long-time current stress. The dynamic temperature control is a gain control system. As chip junction temperature higher than a warning level, the gain level will decrease until junction temperature lower than the warning level. The output short circuit and over temperature protection include auto-recovery feature. The IS3AP20 is available in a thermally enhanced etssop-28 package. FEATURES Single supply voltage - 8V ~ 26V for loudspeaker driver - Built-in LDO output 3.3V for others Loudspeaker power from 24V supply - BTL Mode: W/CH into 8Ω @0.2% THD+N - Mode: 40W/CH into 4Ω @0.% THD+N Loudspeaker power from 3V supply - BTL Mode: 0W/CH into 8Ω @0% THD+N 87% efficient Class-D operation eliminates need for heat sink Differential inputs Four selectable, fixed gain settings Internal oscillator Short-Circuit protection with auto recovery option Under-voltage detection Over-voltage protection Pop noise and click noise reduction Adjustable power limit function for speaker protection Output DC detection for speaker protection Filter-Free operation Over temperature protection with auto recovery Dynamic temperature control prevents chip from over heating APPLICATIONS TV audio Bluetooth speaker system Docking speaker system Consumer audio equipment Integrated Silicon Solution, Inc. www.issi.com

TYPICAL APPLICATION CIRCUIT V CC Micro Controller Left Channel Input 00k k CINL+ F SDB FAULTB INL+ INL- GAIN0 GAIN AGND AVDD PLIM CINL- F R PL2 F 2 3 4 5 6 8 9 R PL 0 F IS3AP20 VCCL OUTL+ PGND OUTL- OUTR- PGND OUTR+ 27,28 nf 25 24 23 9 8 FB FB FB FB V CC 00 F 0. F nf nf nf nf Right Channel Input INR- CINR- F CINR+ F 2 4 INR+ VCCR 5,6 nf 0. F V CC 00 F Figure Typical Application Circuit (for BTL Stereo, Single-ended Input) V CC Micro Controller 00k k 2 SDB FAULTB VCCL 27,28 nf 0. F V CC 00 F R PL2 3 4 5 6 8 F 9 R PL 0 F IS3AP20 INL+ INL- GAIN0 GAIN AGND AVDD PLIM OUTL+ PGND OUTL- OUTR- PGND OUTR+ 25 24 23 9 8 FB FB 000pF 000pF Audio Input V CC INR- INR+ CINR- F CINR+ F 2 4 VCCR 5,6 nf 0. F V CC 00 F Figure 2 Typical Application Circuit (for Parallel BTL Mono, Single-ended Input) Integrated Silicon Solution, Inc. www.issi.com 2

PIN CONFIGURATION Package Pin Configuration (Top View) etssop-28 Integrated Silicon Solution, Inc. www.issi.com 3

PIN DESCRIPTION No. Pin Description SDB Shutdown signal for IC (Low = disabled, output Hi-Z; High = operational). Voltage compliance to 26V. 2 FAULTB Open drain output used to display short circuit or dc detect fault. Voltage compliant to 26V. Short circuit faults can be set to autorecovery by connecting FAULTB pin to SDB pin. Otherwise, both short circuit faults and dc detect faults must be reset by cycling V CC. 3 INL+ Positive audio input for left channel. Biased at.65v. 4 INL- Negative audio input for left channel. Biased at.65v. 5 GAIN0 Gain select least significant bit. Voltage compliance to 26V. 6 GAIN Gain select most significant bit. Voltage compliance to 26V. 7,3,7, 2,22,26 NC Not connected. 8 AGND Analog signal ground. Connect to the thermal pad. 9 AVDD 3.3V regulated output. 0 PLIM Power limit level adjustment. Connect a resistor divider from AVDD to GND to set power limit. Give V PLIMIT <.55V to set power limit level. Connect to both of AVDD (>.55V) and GND are all without power limit feature. INR- Negative audio input for right channel. Biased at.65v. 2 INR+ Positive audio input for right channel. Biased at.65v. 4 5, 6 VCCR Parallel BTL mode switch, high for parallel BTL output. Voltage compliance to 26V. High-voltage power supply for right-channel. Right channel and left channel power supply inputs are connect internal. 8 OUTR+ Class-D H-bridge positive output for right channel. 9 PGND Power ground for the H-bridges. OUTR- Class-D H-bridge negative output for right channel. 23 OUTL- Class-D H-bridge negative output for left channel. 24 PGND Power ground for the H-bridges. 25 OUTL+ Class-D H-bridge positive output for left channel. 27, 28 VCCL Thermal Pad High-voltage power supply for left-channel. Right channel and left channel power supply inputs are connect internal. Connect to GND. Integrated Silicon Solution, Inc. www.issi.com 4

ORDERING INFORMATION Industrial Range: -40 C To +85 C Order Part No. Package QTY IS3AP20-ZLS2-TR IS3AP20-ZLS2 etssop-28, Lead-free 2500/Reel 50/Tube Copyright 5 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. www.issi.com 5

ABSOLUTE MAXIMUM RATINGS Supply voltage (VCCR, VCCL), V CC -0.3V ~ +30V Interface pin voltage, (SDB, GAIN0, GAIN,, FAULTB) -0.3V ~ +26V (PLIM, INL+, INL-, INR+, INR-) -0.3V ~ +3.6V Minimum load resistance, R L, (BTL: V CC > 5V) 4.8Ω (BTL: V CC 5V) 3.2Ω 3.2Ω Thermal resistance, θ JA 28 C/W Maximum junction temperature, T JMAX 50 C Storage temperature range, T STG -65 C ~ +50 C Operating temperature range, T A ESD (HBM) ESD (CDM) 40 C ~ +85 C ±2kV ±500V Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS V CC =24V, T A =25 C, R L =8Ω (unless otherwise noted). Symbol Parameter Condition Min. Typ. Max. Unit V CC Supply voltage to VCCL, VCCR 8 26 V I CC I SD I SC R DS(ON) V OS Quiescent current Shutdown current L/R channel over current protection Drain-source on-state resistance-high side PMOS Drain-source on-state resistance-low side NMOS Class-D output offset voltage (measured differential) V SDB = 2V, no load 32 50 V SDB = 2V, no load, V CC = 2V 35 V SDB = 0.8V, no load <0 25 V SDB = 0.8V, no load, V CC = 2V <0 25 V SDB = 2V, V CC = 24V 8 A V CC =2V, Id=500mA, T J =25 C 300 0 ma µa mω V I = 0, Gain= 36dB 5 mv Gain= 0.8V, Gain0=0.8V 8 22 G Gain Gain= 0.8V, Gain0= 2V 24 26 28 Gain= 2V, Gain0= 0.8V 30 32 34 db Gain= 2V, Gain0= 2V 34 36 38 t ON Turn-on time V SDB = 2V 5 ms t OFF Turn-off time V SDB = 0.8V 4 µs AV DD Internal regulated output I AVDD = 0.mA 3.0 3.3 3.6 V Integrated Silicon Solution, Inc. www.issi.com 6

DC ELECTRICAL CHARACTERISTICS (CONTINUE) V CC =24V, T A =25 C, R L =8Ω (unless otherwise noted). Symbol Parameter Condition Min. Typ. Max. Unit Logic Electrical Characteristics V IH High level input voltage SDB, GAIN0, GAIN, 2 V V IL Low level input voltage SDB, GAIN0, GAIN, 0.8 V V OL Low level output voltage FAULTB, R PU =00kΩ, V CC =26V 0.8 V I IH I IL High level input current Low level input current SDB,GAIN0,GAIN,,V I =2V, V CC =8V SDB,GAIN0,GAIN,, V I =0.8V, V CC =8V 50 µa 5 µa AC ELECTRICAL CHARACTERISTICS V CC =24V, T A =25 C, R L =8Ω (unless otherwise noted). Symbol Parameter Condition Min. Typ. Max. Unit P O THD+N V N SNR PSRR Output power Total harmonic distortion + noise Output integrated noise Signal-to-noise ratio Power supply ripple rejection THD+N = 0%, f = khz, V CC = 3V 0 THD+N = 0%, f = khz, V CC = 6V 5 V CC =24V, R L =8Ω, f=khz, P O =5W (half-power) V CC =2V, R L =8Ω, f=khz, P O =5W (half-power) Hz to 22kHz, A-weighted filter, Gain = db, R L =8Ω Maximum output at THD+N < %, f = khz, Gain = db, A-weighted 0mV P-P ripple at khz, Gain = db, Inputs ac-coupled to AGND 0. 0. W % 30 µv 02 db -62 db X TALK Crosstalk f=khz, V O =Vrms, Gain=dB -83 db f OSC Oscillator frequency 250 30 khz T SD Thermal trip point 70 C T SD_HY Thermal hysteresis C Integrated Silicon Solution, Inc. www.issi.com 7

TYPICAL PERFORMANCE CHARACTERISTICS THD+N(%) 0 RL= 4Ω+33µH Gain = db f = khz Stereo VCC= 8V VCC= 0V VCC= 5V THD+N (%) 0 5 2 0.5 0.2 RL = 4Ω+33µH f = khz Gain = db VCC= 8V VCC= 2V VCC= 5V VCC = 8V 0. VCC= 2V 0. 0.05 VCC = 24V 0.0 0m m 50m 00m 500m 2 5 0 80 Output Power(W) 0.02 0.0 0m 50m 00m 500m 2 5 0 Output Power(W) 50 00 Figure 3 THD+N vs. Output Power Figure 4 THD+N vs. Output Power THD+N(%) 0 RL= 6Ω+47µH Gain = db f = khz Stereo VCC= 2V VCC= 5V THD+N (%) 0 5 2 0.5 0.2 RL = 6Ω+47µH f = khz Gain = db VCC= 8V VCC= 2V VCC= 5V VCC = 8V 0. VCC= 8V VCC= 24V 0. 0.05 VCC = 24V 0.02 0.0 0m m 50m 00m 500m 2 5 0 80 0.0 0m 50m 00m 500m 2 5 0 50 00 Output Power(W) Output Power(W) Figure 5 THD+N vs. Output Power Figure 6 THD+N vs. Output Power THD+N(%) 0 RL= 8Ω+66µH Gain = db f = khz Stereo VCC = 2V VCC= 5V THD+N (%) 0 5 2 0.5 0.2 RL= 8Ω+66µH f = khz Gain = db VCC = 8V VCC= 2V VCC= 5V VCC= 8V 0. VCC= 8V VCC= 24V 0. 0.05 0.0 0m m 50m 00m 500m 2 5 0 50 Output Power(W) Figure 7 THD+N vs. Output Power 0.02 Output Power(W) Figure 8 THD+N vs. Output Power VCC= 24V 0.0 0m 50m 00m 500m 2 5 0 50 00 Integrated Silicon Solution, Inc. www.issi.com 8

THD+N(%) 5 0. VCC = 24V RL = 8Ω+66µH Gain = db Stereo Po = 5W Po = 0W Po = W THD+N (%) 0 5 2 0.5 0.2 0. 0.05 VCC = 24V RL = 4Ω+33µH Gain = db PO= 5W PO= W 0.0 0.02 0.0 PO= 0W 0.00 50 00 0 500 k 2k 5k k 0.00 50 00 0 500 k 2k 5k 0k k Frequency(Hz) Frequency (Hz) Figure 9 THD+N vs. Frequency Figure 0 THD+N vs. Frequency THD+N (%) 0 5 2 0.5 0.2 0. 0.05 VCC = 2V RL = 8Ω+66µH Gain = db Stereo PO= 3W PO = 5W THD+N (%) 0 5 2 0.5 0.2 0. 0.05 VCC = 2V RL = 4Ω+33µH Gain = db PO= 0W PO = W 0.02 0.0 0.02 0.0 PO= W PO= 5W 0.00 50 00 0 500 k 2k 5k 0k k 0.00 50 00 0 500 k 2k 5k 0k k Frequency (Hz) Frequency (Hz) Figure THD+N vs. Frequency Figure 2 THD+N vs. Frequency 00 90 VCC = 2V VCC = 5V 00 90 VCC = 2V Efficiency(%) 80 70 60 50 40 30 VCC = 8V Efficiency(%) 80 70 60 50 40 30 VCC = 8V VCC = 24V 0 RL = 6Ω+47μH Gain = db Stereo 0 0 5 0 5 25 30 35 40 45 50 Output Power(W) Figure 3 Efficiency vs. Output Power RL = 4Ω+33μH 0 Gain = db 0 0 5 0 5 25 30 35 Output Power(W) Figure 4 Efficiency vs. Output Power 40 45 Integrated Silicon Solution, Inc. www.issi.com 9

00 90 VCC = 2V 00 90 VCC = 2V 80 VCC = 8V VCC = 24V 80 VCC = 24V Efficiency(%) 70 60 50 40 30 VCC = 5V Efficiency(%) 70 60 50 40 30 VCC = 8V 0 RL = 8Ω+66μH Gain = db Stereo 0 0 5 0 5 25 30 35 40 45 50 55 60 Output Power(W) RL = 8Ω+66μH 0 Gain = db 0 0 5 0 5 25 30 35 Output Power(W) Figure 5 Efficiency vs. Output Power Figure 6 Efficiency vs. Output Power +0 - RL= 8Ω+66μH Gain = db VRipple = 0.2VPP Stereo +0 - RL= 4Ω+33µH Gain = db VRIPPLT = 0.2VPP PSRR(dB) -40-60 VCC= 24V VCC= 8V PSRR (db) -40-60 -80 VCC= 2V -80 VCC= 2V -00 VCC= 24V -00 50 00 0 500 k 2k 5k 0k k +0 - VCC = 24V RL= 8Ω+66µH Gain = db Frequency(Hz) Figure 7 PSRR - 50 00 0 500 k 2k 5k 0k k +0 - VCC = 2V RL= 8Ω+66µH Gain = db Frequency (Hz) Figure 8 PSRR Crosstalk (db) -40-60 -80 Right to Left Crosstalk (db) -40-60 -80 Right to Left -00 Left to Right - 50 00 0 500 k 2k 5k 0k k Frequency (Hz) Figure 9 Crosstalk -00 Left to Right - 50 00 0 500 k 2k 5k 0k k Frequency (Hz) Figure Crosstalk Integrated Silicon Solution, Inc. www.issi.com 0

FUNCTIONAL BLOCK DIAGRAM VCCL INL+ INL- Gain Gontrol Amplifier PLIMIT Modulator PWM Logic Power Stage OUTL+ OUTL- Thermal Warning Dynamic Temperature Control DC Detect Ramp Generator Select Short-Circuit Protection PGND VCCR INR+ INR- Gain Gontrol Amplifier PLIMIT Modulator PWM Logic Power Stage OUTR+ OUTR- PGND GAIN0 GAIN Gain Select PLIMIT Reference Short Circuit Error DC Detect Error FAULTB Logic FAULTB PLIM SDB I/O Buffer Select Control Logic Bias & Reference Thermal Detect Under-Voltage Protection Thermal Warning AGND Regulator AVDD Integrated Silicon Solution, Inc. www.issi.com

APPLICATIONS INFORMATION GAIN SETTINGS The gain of the IS3AP20 is set by two input pins, GAIN0 and GAIN. By varying input resistance in IS3AP20, the various volume gains are achieved. The respective volume gain and input resistance are listed in Table. However, there is % variation in input resistance from production variation. Table Volume gain and input impedance GAIN GAIN0 Volume Gain (db) Input Resistance, R IN (kω) 0 0 60 0 26 30 0 32 5 36 9 SHUTDOWN (SDB) CONTROL Pulling SDB pin low will let IS3AP20 operate in low-current state for power conservation. The IS3AP20 outputs will enter mute once SDB pin is pulled low, and regulator will also disable to save power. If let SDB pin floating, the chip will enter shutdown mode because of the internal pull low resistor. For the best power-off performance, place the chip in the shutdown mode in advance of removing the power supply. DC DETECTION IS3AP20 has dc detection circuit to protect the speakers from DC current which might be occurred as input capacitor defect or inputs short on printed circuit board. The detection circuit detects first volume amplifier stage output, when both differential outputs voltage become higher than a determined voltage or lower than a determined voltage for more than 4ms, the dc detect error will occur and report to FAULTB pin. At the same time, loudspeaker drivers of right/left channel will disable and enter Hi- Z. This fault can t be cleared by cycling SDB, it is necessary to cycle the V CC supply. The minimum differential input voltages required to trigger the DC detect function are shown in Table 2. The input voltage must keep above the voltage listed in the table for more than 4msec to trigger the DC detect fault. The equivalent class-d output duty of the DC detect threshold is listed in Table 3. For 8V supply, DC detect fault will occur as output duty exceed 3% for more than 4msec. Table 2 DC Detect Threshold AV (db) V IN (mv, differential) 04 26 52 32 26 36 6 Table 3 Output DC Detect Duty (for Either Channel) V CC (V) Output Duty Exceeds 8 3% 2 8.7% 6 6.5% 24 4.3% THERMAL PROTECTION If the internal junction temperature is higher than 70 C, the outputs of loudspeaker drivers will be disabled and at low state. The temperature for IS3AP20 returning to normal operation is about 50 C. The variation of protected temperature is about 0%. Thermal protection faults are not reported on the FAULTB pin. SHORT-CIRCUIT PROTECTION To protect loudspeaker drivers from over-current damage, IS3AP20 has built-in short-circuit protection circuit. When the wires connected to loudspeakers are shorted to each other or shorted to GND or to V CC, overload detectors may activate. Once one of right and left channel overload detectors are active, the amplifier outputs will enter a Hi-Z state and the protection latch is engaged. The short protection fault is reported on FAULTB pin as a low state. The latch can be cleared by reset SDB or power supply cycling. The short circuit protection latch can have autorecovery function by connect the FAULTB pin directly to SDB pin. The latch state will be released after 4ms, and the short protection latch will recycle if output overload is detected again. UNDER-VOLTAGE DETECTION When the AVDD voltage is lower than 2.7V or the V CC voltage is lower than 7.5V, loudspeaker drivers of right/left channel will be disabled and kept at low state. Otherwise, IS3AP20 return to normal operation. Integrated Silicon Solution, Inc. www.issi.com 2

OVER-VOLTAGE PROTECTION When the V CC is higher than 30V, loudspeaker will be disabled kept at low state. The protection status will be released as V CC lower than 28.7V. POWER LIMIT FUNCTION The voltage at PLIM pin (pin 0) can used to limit the power of first gain control amplifier output. Add a resistor divider from AVDD to ground to set the voltage V PLIMIT at the PLIMIT pin. The voltage V PLIM sets a limit on the output peak-to-peak voltage. The maximum BTL output voltage of the gain control amplifier is limited to 2 (.55V V PLIM ). The Class-D BTL output voltage on loudspeaker is amplified by 9.95 of 2 (.55V V PLIM ). For normal BTL operation (Stereo) and (Mono) operation: P OUT 2 2 V 9.95 R 2 P for unclipped power () Where: - V P is the peak voltage of gain control amplifier output, if (V IN Gv /2) < (.55V V PLIM ), then V P = (V IN Gv /2). If (V IN Gv /2) > (.55V V PLIM ), then V P = (.55V V PLIM ). - V IN is the input peak voltage. - Gv is the gain of gain control amplifier, the four gain levels are V/V, 2V/V, 4V/V, 6.34V/V, corresponding to db, 26dB, 32dB, 36dB overall gain. - AVDD is the regulator output at pin 9, typical 3.3V. - R L is the load resistance. - P OUT (0% THD) =.25 x P OUT (unclipped). L Table 4 PLIM Typical Operation V PLIM (V) Test Conditions Output P O (W) @ THD+N= % V CC =24V R L =8Ω V PLIM (V) @ THD+N= 0% Output Voltage (V P-P ) 25 0.54 0.65 40 0.65 0.75 35.6 5 0.77 0.85 30.8 0 0.9 0.98 25.2 5..5 7.8 Note: Connect PLIM pin to AVDD (>.55V) or GND (either one) to disable power limit function. (MONO) FUNCTION IS3AP20 provides the application of parallel BTL operation with two outputs of each channel connected directly. If the pin is tied high, the positive and negative outputs of left and right channel are synchronized and in phase. Apply the input signal to the RIGHT channel input in mode and let the LEFT channel input grounded, and place the speaker between the LEFT and RIGHT outputs. The output current capability is doubled of that in normal mode. See the application circuit example for (Mono) mode operation. For normal BTL (Stereo) operation, connect the pin to ground. DYNAMIC TEMPERATURE CONTROL (DTC) The DTC function is designed to protect the loudspeaker from over heating. As the junction temperature is higher than OT_W, the gain of amplifier will decrease step by step every 0.25s. Finally, as the junction temperature is lower than OT_R, the attenuated gain steps will be released step by step every 0.5s. If DTC can t suppress the temperature and the temperature reach to the OT trip point (70 C), the amplifier will be shutdown. The OT hysteresis temperature equals to OT_R. Typically, OT_W is 60 o C and OT_R is 45 C. Figure 2 Gain Contribution of the Two Gain Stages Integrated Silicon Solution, Inc. www.issi.com 3

Figure 22 Dynamic Temperature Control Function Input Capacitors (C IN ) The performance at low frequency (bass) is affected by the corner frequency (f C ) of the high-pass filter composed of input resistor (R IN ) and input capacitor (C IN ), determined in Equation (2). Typically, a 0.µF or µf ceramic capacitor is suggested for C IN. The resistance of input resistors is different at different gain setting. The respective gain and input resistance are listed in Table (shown at GAIN SETTING). However, there is % variation in input resistance from production variation. f C Hz (2) 2π R C IN IN Figure 24 Typical Ferrite Bead Filter Output LC Filter If the traces from the IS3AP20 to speaker are not short, it is recommended to add the output LC filter to eliminate the high frequency emissions. Figure 25 shows the typical output filter for 8Ω speaker with a cut-off frequency of 27kHz and Figure 26 shows the typical output filter for 4Ω speaker with a cut-off frequency of 27kHz. Figure 23 Corner Frequency Ferrite Bead Selection If the traces from the IS3AP20 to speaker are short, the ferrite bead filters can reduce the high frequency emissions to meet FCC requirements. A ferrite bead that has very low impedance at low frequency and high impedance at high frequency (above MHz) is recommended. The impedance of the ferrite bead can be used along with a small capacitor with a value around 000pF to reduce the frequency spectrum of the signal to an acceptable level. Figure 25 Typical LC Output Filter for 8Ω Speaker Figure 26 Typical LC Output Filter for 4Ω Speaker Integrated Silicon Solution, Inc. www.issi.com 4

Power Supply Decoupling Capacitor (C S ) Because of the power loss on the trace between the device and decoupling capacitor, the decoupling capacitor should be placed close to VCCR/L and PGND to reduce any parasitic resistor or inductor. A low ESR ceramic capacitor, typically 000pF, is suggested for high frequency noise rejection. For mid-frequency noise filtering, place a capacitor typically 0.µF or µf as close as possible to the device VCCR/L leads works best. For low frequency noise filtering, a 00µF or greater capacitor (tantalum or electrolytic type) is suggested. Figure 27 Recommended Power Supply Decoupling Capacitors Integrated Silicon Solution, Inc. www.issi.com 5

CLASSIFICATION REFLOW PROFILES Profile Feature Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Pb-Free Assembly 50 C 0 C 60- seconds Average ramp-up rate (Tsmax to Tp) Liquidous temperature (TL) Time at liquidous (tl) 3 C/second max. 27 C 60-50 seconds Peak package body temperature (Tp)* Max 260 C Time (tp)** within 5 C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25 C to peak temperature Max 30 seconds 6 C/second max. 8 minutes max. Figure 28 Classification Profile Integrated Silicon Solution, Inc. www.issi.com 6

PACKAGE INFORMATION etssop-28 Integrated Silicon Solution, Inc. www.issi.com 7

RECOMMENDED LAND PATTERN 5.0 0.65 3.0 0.35 6.5 9.45.0 Note:. Land pattern complies to IPC-735. 2. All dimensions in MM. 3. This document (including dimensions, notes & specs) is a recommendation based on typical circuit board manufacturing parameters. Since land pattern design depends on many factors unknown (eg. user s board manufacturing specs), user must determine suitability for use. Integrated Silicon Solution, Inc. www.issi.com 8

REVISION HISTORY Revision Detail Information Date A Initial release 5.09.0 B. Update EC table 2. Add performance characteristics curves. 3. Add land pattern 5.0. Integrated Silicon Solution, Inc. www.issi.com 9

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