Applications impedance matching balanced to unbalanced transformation push-pull amplifier. FREQUENCY (MHz) 1 db MHz

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Surface Mount RF Transformer 50Ω 3 to 300 MHz Maximum Ratings Operating Temperature -20 C to 85 C Storage Temperature -55 C to 100 C RF Power 0.25W DC Current Pin Connections 30mA Permanent damage may occur if any of these limits are exceeded. PRIMARY DOT 6 PRIMARY 4 SECONDARY DOT 1 SECONDARY 3 SECONDARY CT 2 NOT USED 5 Outline Drawing Lead #1 identifier shall be located in the cross-hatched area shown. Identifier may be either a molded or marked feature. Features excellent amplitude unbalance. 0.2 db typ. excellent phase unbalance, 4 deg. typ. in 1 db bandwidth plastic base with solder plated leads aqueous washable Applications impedance matching balanced to unbalanced transformation push-pull amplifier Ω RATIO (Secondary/Primary) FREQUENCY (MHz) Transformer Electrical Specifications CASE STYLE: DB714 +RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications Available Tape and Reel at no extra cost Reel Size Devices/Reel 7 20, 50, 100, 200, 500 13 1000, 2000 INSERTION LOSS* 1 db MHz 2 3-300 3-300 * Insertion Loss is referenced to mid-band loss, 0.3 db typ. PCB Land Pattern Typical Performance Data FREQUENCY (MHz) INSERTION LOSS (db) INPUT R. LOSS (db) Suggested Layout, Tolerance to be within ±.002 Outline Dimensions ( inch mm ) A B C D E F.160.150.160.050.040.025 4.06 3.81 4.06 1.27 1.02 0.64 G H J K wt.028.065.190.030 grams 0.71 1.65 4.83 0.76 0.15 1.0 3.00 0.44 27.84 5.00 0.40 29.78 9.00 0.37 30.87 30.00 0.38 29.47 50.00 0.45 28.16 90.00 0.52 24.71 150.00 0.55 21.46 220.00 0.61 18.39 250.00 0.58 17.86 300.00 0.74 16.10 INSERTION LOSS 50 INPUT RETURN LOSS Demo Board MCL P/N: TB-145 Config. A INSERTION LOSS (db) 0.8 0.6 0.4 0.2 RETURN LOSS (db) 40 30 20 10 0.0 0 50 100 150 200 250 300 FREQUENCY (MHz) 0 0 50 100 150 200 250 300 FREQUENCY (MHz) Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, Standard Terms ); Purchasers of this part are entitled REV. F to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits website at www.minicircuits.com/mclstore/terms.jsp M164261 ED-7875/8 Mini-Circuits IG/TD/CP/AM 171010 www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com Page 1 of 1

RF Transformer Typical Performance Data FREQUENCY INSERTION LOSS RETURN LOSS (MHz) (db) (db) 3.00 0.44 27.84 5.00 0.40 29.78 9.00 0.37 30.87 30.00 0.38 29.47 50.00 0.45 28.16 90.00 0.52 24.71 150.00 0.55 21.46 220.00 0.61 18.39 250.00 0.58 17.86 300.00 0.74 16.10 REV. X1 060803 Page 1 of 2

RF Transformer Typical Performance Curves Insertion Loss 0.30 0.35 0.40 Insertion Loss (db) 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 Frequency (MHz) 14 Return Loss 16 18 Return Loss (db) 20 22 24 26 28 30 32 34 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 Frequency (MHz) REV. X1 060803 Page 2 of 2

Case Style Outline Dimensions DB DB714 PCB Land Pattern Suggested Layout, Tolerance to be within.002 CASE # A B C D E F G H J K WT. GRAM.160.150.160.050.040.025.028.065.190.030 DB714.15 (4.06) (3.81) (4.06) (1.27) (1.02) (0.64) (0.71) (1.65) (4.83) (0.76) Dimensions are in inches (mm). Tolerances: 2 Pl. +.01; 3Pl..005 Notes: 1. Case material: Plastic. 2. Termination finish: For RoHS Case Styles: Tin plate over Nickel plate. All models, (+) suffix. For RoHS-5 Case Styles: Tin-Lead plate. All models, no (+) suffix. 3. Lead #1 identifier shall be located in the cross-hatched area shown. Identifier may be either a molded or marked feature. 98-DB Rev.: R (11/16/15) M153548 File: 98-DB Sheet 1 of 3 This document and its contents are the property of Mini-Circuits.

Tape & Reel Packaging TR-F47 Tape Width, Device Cavity mm Pitch, mm 12 8 Reel Size, Devices per Reel inches see note 13 1000, 2000 7 20, 50, 100, 200, 500 Note: Please consult individual model data sheet to determine device per reel availability. Mini-Circuits carrier tape materials provide protection from ESD (Electro-Static Discharge) during handling and transportation. Tapes are static dissipative and comply with industry standards EIA-481/EIA-541. Go to: www.minicircuits.com/pages/pdfs/tape.pdf 98-TR-F47 Rev.: D (01/03/12) M134880 File: 98-TR-F47.doc Sheet 1 of 1 This document and its contents are the property of Mini-Circuits.

Mini-Circuits Environmental Specifications ENV02 All Mini-Circuits products are manufactured under exacting quality assurance and control standards, and are capable of meeting published specifications after being subjected to any or all of the following physical and environmental test. Specification Test/Inspection Condition Reference/Spec Operating Temperature -20 to 85 C Ambient Environment Individual Model Data Sheet Storage Temperature -55 to 100 C Ambient Environment Individual Model Data Sheet Humidity 90 to 95% RH, 240 hours, 50 C MIL-STD-202, Method 103, Condition A, Except 50 C and end-point electrical test done within 12 hours Thermal Shock -55 to 100 C, 100 cycles MIL-STD-202, Method 107, Condition A-3, except +100 C Solder Reflow Heat Sn-Pb Eutetic Process: 225 C peak Pb-Free Process 245-250 C peak J-STD-020, Table 4-1, 4-2 and 5-2, Figure 5-1 Solderability 10X Magnification J-STD-002, 95% Coverage Vibration (High Frequency) 20g peak, 10-2000 Hz, 12 times in each of three perpendicular directions (total 36) MIL-STD-202, Method 204, Condition D Mechanical Shock 50g, 11 ms, 1/2-sine, 18 shocks: 3 each direction, each of 3 axes MIL-STD-202, Method 213, Condition A Marking Resistance to Solvents Isopropyl alcohol + mineral spirits at 25 C; terpene defluxer at 25 C; distilled water + proylene glycol monomethyl ether + monoethanolamine at 63 C to 70 C MIL-STD-202, Method 215 ENV02 Rev: A 02/25/11 M130240 File: ENV02.pdf This document and its contents are the property of Mini-Circuits. Page: 1