Ceramic Bandpass Filter 5Ω Maximum Ratings Operating Temperature Storage Temperature 15 to 16 MHz -55 o C to 1 o C -55 o C to 1 o C RF Power Input* 1.5W at 25 o C *Passband rating, derate linearly to.25w at 1 o C ambient. Permanent damage may occur if any of these limits are exceeded. Pin Connections RF IN 1 RF OUT 3 GROUND 2,4,5,6 Outline Drawing Features Excellent VSWR, 1.1:1 typ @ passband Small size Temperature stable LTCC construction Applications Harmonic rejection Transmitters / receivers CENTER FREQ. (MHz) CASE STYLE: FV16-1 Bandpass Filter Electrical Specifications 1,2 (T AMB = 25 O C) PASSBAND (MHz) (Loss < 5dB) F1 - F2 Loss > db F3 F4 STOPBANDS (MHz) VSWR (:1) Loss 3dB Typ F5 F6 Passband Max. Stopband Typ. 156 15-16 11 21 14 215-4 1.7 1. Measured on Mini-Circuits Characterization Test Board TB-285. 2. This filter is not intended for use as a DC Blocking circuit element. In Application where DC voltage is present at either input or output ports, blocking capacitors are required at the corresponding RF port. Typical Frequency Response +RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications Functional Schematic PCB Land Pattern ATTENUATION (db) 3 5 RF IN RF OUT F5 F3 F1 F2 F4 F6 FREQUENCY (MHz) Typical Performance Data at 25 o C Demo Board MCL P/N: TB-285 Suggested PCB Layout (PL-158) 6X ø.15 PTH FOR GROUND PACKAGE OUTLINE Suggested Layout, Tolerance to be within ±.2 inch Outline Dimensions ( mm ) A B C D E F.126.63.35.24.22.11 3. 1.6.89.61.56.28 G H J K wt..39.24.42.123 grams.99.61 1.7 3.12..12 Frequency Insertion Loss VSWR (MHz) (db) (:1) 5 68.59 193.2 62.54 91.43 5 49.47 52.65 14 33.62 25.94 11 28.46 22.87 125 16.2 11.46 134 8.35 4.69 14 4.54 2.9 15 2.69 1.7 156 2.61 1.16 16 2.81 1.41 178 4.32 1.35 185 8.81 2.82 191 15.77 4.78 27.69 6.56 21 44. 8.12 215 44.37 8.27 35 31.29 44.55 4 38.45 35.46.1 TYP PIN 1.12.73.55.44 ±.2 TRACE WIDTH, 2 PL. (SEE NOTE BELOW).34.17 NOTES:.1 TYP 1. TRACE WIDTH IS SHOWN FOR ROGERS RO435B WITH DIELECTRIC THICKNESS. ±.15. COPPER: 1/2 OZ. EACH SIDE. FOR OTHER MATERIALS TRACE WIDTH MAY NEED TO BE MODIFIED. 2. BOTTOM SIDE OF THE PCB IS CONTINUOUS GROUND PLANE. DENOTES PCB COPPER LAYOUT WITH SMOBC (SOLDER MASK OVER BARE COPPER) DENOTES COPPER LAND PATTERN FREE OF SOLDER MASK INSERTION LOSS (db) 1 8 6 4 INSERTION LOSS 6 1 18 24 3 36 4 FREQUENCY (MHz) Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, Standard Terms ); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits website at www.minicircuits.com/mclstore/terms.jsp Mini-Circuits www.minicircuits.com P.O. Box 35166, Brooklyn, NY 11235-3 (718) 934-45 sales@minicircuits.com 3. 2.9 2.8 2.7 2.6 2.5 15 153 156 159 16 VSWR 1 1 1 1 1.5 1.4 1.3 1.2 1.1 1. VSWR 15 153 156 159 16 6 1 18 24 3 36 4 FREQUENCY (MHz) REV. B M151121 EDR-8496F1 RAV/URJ 16112 Page 1 of 1
Ceramic Band Pass Filter Typical Performance Data FREQUENCY INSERTION LOSS RETURN LOSS (MHz) (db) (db) 5 68.59.9 62.54.19 5 49.47.33 14 33.62.67 11 28.46.76 125 16.2 1.52 134 8.35 3.76 14 4.54 9.5 15 2.69 29. 156 2.61 22.42 16 2.81 15.3 178 4.32 16.63 185 8.81 6.45 191 15.77 3.69 27.69 2.67 21 44. 2.15 215 44.37 2.11 35 31.29.39 4 38.45.49 REV. X1 8219 Page 1 of 1
Ceramic Band Pass Filter Typical Performance Curves Insertion Loss 1 Insertion Loss (db) 3 4 5 6 7 8 9 5 1 15 1 14 16 18 1 5 1 15 25 3 35 4 45 Frequency (MHz) Return Loss 5 1 15 Return Loss (db) 25 3 35 4 5 1 15 25 3 35 1 14 16 18 45 5 5 1 15 25 3 35 4 45 Frequency (MHz) REV. X1 8219 Page 1 of 1
Case Style Outline Dimensions FV FV16-1 PCB Land Pattern Suggested Layout, Tolerance to be within ±.2 CASE # A B C D E F G H J K L M N P FV16-1.126 (3.).63 (1.6).35 (.89).24 (.61).22 (.56).11 (.28).39 (.99) Dimensions are in inches (mm). Tolerances: 2 Pl. +.1; 3 Pl. +.5.24 (.61).42 (1.7).123 (3.12) WT. GRAM. Notes: 1. Open style, ceramic base. 2. Termination finish: For RoHS Case Styles: Tin plate over Nickel plate. All models, (+) suffix. For RoHS-5 Case Styles: Tin-Lead plate. All models, no (+) suffix. 98-FV Rev.: T (5/2/14) M145992 File: 98-FV.doc Sheet 2 of 7 This document and its contents are the property of Mini-Circuits.
Tape & Reel Packaging TR-F75 Tape Width, mm Device Cavity Pitch, mm Reel Size, inches 8 4 7 Devices per Reel Small quantity standards (see note) 5 1 5 1 Standard 3 Note: Please consult individual model data sheet to determine device per reel availability. Mini-Circuits carrier tape materials provide protection from ESD (Electro-Static Discharge) during handling and transportation. Tapes are static dissipative and comply with industry standards EIA-481/EIA-541. Go to: www.minicircuits.com/pages/pdfs/tape.pdf 98-TR-F75 Rev.: F (3/22/11) M13947 File: 98-TR-F75.doc Sheet 1 of 1 This document and its contents are the property of Mini-Circuits.
Mini-Circuits Environmental Specifications ENV6 All Mini-Circuits products are manufactured under exacting quality assurance and control standards, and are capable of meeting published specifications after being subjected to any or all of the following physical and environmental test. Specification Test/Inspection Condition Reference/Spec Operating Temperature -55 to 1 C Ambient Environment Individual Model Data Sheet Storage Temperature -55 to 1 C Ambient Environment Individual Model Data Sheet Humidity 9 to 95% RH, 24 hours, 5 C MIL-STD-2, Method 13, Condition A, Except 5 C and end-point electrical test done within 12 hours Solder Reflow Heat Sn-Pb Eutetic Process: 225 C peak Pb-Free Process 245-25 C peak J-STD-, Table 4-1, 4-2 and 5-2, Figure 5-1 Solderability 1X Magnification J-STD-2, Para 4.2.5, Test S, 95% Coverage Vibration (High Frequency) g peak, 1- Hz, 12 times in each of three perpendicular directions (total 36) MIL-STD-2, Method 4, Condition D Mechanical Shock 5g, 11 ms, 1/2-sine, 18 shocks: 3 each direction, each of 3 axes MIL-STD-2, Method 213, Condition A ENV6 Rev: A 2/25/11 M1324 File: ENV6.pdf This document and its contents are the property of Mini-Circuits. Page: 1