4V Drive Pch MOSFET RRR040P03

Similar documents
1.5V Drive Nch MOSFET RQ1C075UN

0.9V Drive Nch + Nch MOSFET EM6K34

4V Drive Pch MOSFET RRR015P03

New Designs. Not Recommended for. 2.5V Drive Nch MOSFET RSE002N Rev.A 1/5. Structure Silicon N-channel MOSFET. Dimensions (Unit : mm)

2.5V Drive Nch + Nch MOSFET

4V Drive Nch MOSFET RSD050N10

1.2V Drive Nch MOSFET

New Designs. Not Recommended for. 1.2V Drive Nch MOSFET RUE002N Rev.B 1/5. Structure. Dimensions (Unit : mm) Silicon N-channel MOSFET

1.2V Drive Pch MOSFET

1.5V Drive Nch+Pch MOSFET

1.2V Drive Nch MOSFET

New Designs. Not Recommended for. 4V Drive Nch+Nch MOSFET SH8K Rev.A 1/4. Structure Silicon N-channel MOSFET. Dimensions (Unit : mm)

2.5V Drive Nch MOSFET 1.5V Drive Pch MOSFET

4V Drive Nch + Pch MOSFET

4V Drive Pch+Pch MOSFET

0.9V Drive Nch MOSFET

4V Drive Nch MOSFET. Data Sheet RSJ300N10. 1/ Rev.A. Structure Silicon N-channel MOSFET. Dimensions (Unit : mm)

4V Drive Pch MOSFET. Data Sheet RP1H065SP. 1/ Rev.A. Dimensions (Unit : mm) Structure Silicon P-channel MOSFET

New Designs. Not Recommended for. 4V Drive Nch MOSFET. Data Sheet RSJ300N10. 1/ Rev.A. Dimensions (Unit : mm)

New Designs. Not Recommended for. 4V Drive Nch MOSFET. Data Sheet RSD080N06. 1/ Rev.A. Structure Silicon N-channel MOSFET

New Designs. Not Recommended for. 4V Drive Pch MOSFET. Data Sheet RSD140P06. 1/ Rev.A. Dimensions (Unit : mm)

10V Drive Nch MOSFET. Data Sheet RSJ400N06. 1/ Rev.A. Dimensions (Unit : mm) Structure Silicon N-channel MOSFET

2.5V Drive Nch MOSFET

4V Drive Nch + Pch MOSFET SH8M13

New Designs. Not Recommended for. 4V Drive Nch MOSFET. Data Sheet RSD175N10. 1/ Rev.A. Dimensions (Unit : mm)

SCT2080KE. 1200V 80m 35A 179W. R DS(on) (Typ.) N-channel SiC power MOSFET. Datasheet. Outline TO-247. Features. Inner circuit 1) Low on-resistance

Outline TSMT8. Road SW Tape width (mm) 8 Type Basic ordering unit (pcs) 3,000. Absolute maximum ratings(t a = 25 C) Parameter Symbol Value Unit P D

Outline. Inner circuit. DC/DC converters Tape width (mm) 8 Type Basic ordering unit (pcs) 3,000

Outline. Inner circuit. Switching Tape width (mm) 8 Type Basic ordering unit (pcs) 3,000

New Designs. Not Recommended for. 4V Drive Nch MOSFET RSD050N06. Data Sheet. 1/ Rev.B. Dimensions (Unit : mm)

Dimensions (Unit : mm) MPT3. (1)Gate (2)Drain (3)Source. Inner circuit GATE SOURCE 1 ESD PROTECTION DIODE 2 BODY DIODE 60 ±2. mw W.

Outline TSMT3. Inner circuit. (1) Gate (2) Source (3) Drain *1 ESD PROTECTION DIODE *2 BODY DIODE

Outline TSMT8. Inner circuit. DC/DC converters Tape width (mm) 8 Type Basic ordering unit (pcs) 3,000

Outline LPT(S) (SC-83) Inner circuit. Absolute maximum ratings(t a = 25 C) Parameter Symbol Value Unit I D E AS *3 P D 30 W P D 1.

Outline. Inner circuit. DC/DC converters Tape width (mm) 8 Type Basic ordering unit (pcs) 3,000

Outline. Inner circuit. DC/DC converters Tape width (mm) 8 Type Basic ordering unit (pcs) 3,000

Outline TO-220FM. Inner circuit. Switching Power Supply Tape width (mm) - Type Basic ordering unit (pcs) 500. Parameter Symbol Value Unit P D 40 W

Outline SOP8 (SC-87) Inner circuit. Switching Power Supply Tape width (mm) 12 Type Basic ordering unit (pcs) 2,500

Power management (dual transistors)

SCT2450KE N-channel SiC power MOSFET

Outline TSST8. Inner circuit. (1) Drain (2) Drain (3) Drain (4) Gate. DC/DC converters Tape width (mm) 8 Type Basic ordering unit (pcs) 3,000

2.5V Drive Nch+Pch MOSFET

Outline (SC-63) <SOT-428> Inner circuit. (1) Gate (2) Drain (3) Source (1) Parameter Symbol Value Unit I D E AS *3 P D 20 W P D 0.

SCT2450KE N-channel SiC power MOSFET

2.5V Drive Nch+Pch MOSFET

SCT3080KL N-channel SiC power MOSFET

2.5V Drive Pch MOS FET

SCT2080KE N-channel SiC power MOSFET

S2307 N-channel SiC power MOSFET bare die

S2301 N-channel SiC power MOSFET bare die

4V Drive Nch MOS FET RSS085N05 RSS085N05. Transistor 1/4. Structure Silicon N-channel MOS FET. External dimensions (Unit : mm)

Outline. Inner circuit. DC/DC converters Tape width (mm) 10 Type Load Switch Basic ordering unit (pcs) 3,000 Taping code

SCT2120AF N-channel SiC power MOSFET

S4108 N-channel SiC power MOSFET bare die

4V+2.5V Drive Nch+Pch MOSFET

R6015ANX 600V. R DS(on) (Max.) 15A 50W. Nch 600V 15A Power MOSFET. Datasheet. Outline. Features. Inner circuit 1) Low on-resistance.

2.5V Drive Pch MOS FET

2.5V Drive Pch MOS FET

SCT3030AL N-channel SiC power MOSFET

New Designs. Not Recommended for R6008FNX 600V 0.95W 8A 50W. R DS(on) (Max.) Nch 600V 8A Power MOSFET. Datasheet. Outline. Inner circuit.

SCT2H12NZ N-channel SiC power MOSFET

DC-DC Converter ( 20V, 4.0A)

SCT3040KL N-channel SiC power MOSFET

SCT2750NY N-channel SiC power MOSFET

SCT3040KL N-channel SiC power MOSFET

SCT3030KL N-channel SiC power MOSFET

SCT3060AL N-channel SiC power MOSFET

SCT3060AL N-channel SiC power MOSFET

2.5V Drive Pch+Pch MOSFET

S4103 N-channel SiC power MOSFET bare die

4V Drive Nch MOS FET RHU002N06 RHU002N06. Transistors. Rev.B 1/4. External dimensions (Unit : mm) Structure Silicon N-channel MOS FET transistor

SCT3080AL N-channel SiC power MOSFET

2.5V Drive Nch+SBD MOSFET

Switching ( 30V, 4.5A)

DC-DC Converter ( 20V, 1.0A)

Switching ( 30V, 5.0A)

RCX450N20 V DSS 200V 45A 40W. Nch 200V 45A Power MOSFET. Datasheet. Outline. Inner circuit. Features 1) Low on-resistance. 2) Fast switching speed.

SCT3030AL N-channel SiC power MOSFET

SCT3017AL N-channel SiC power MOSFET

SCT3030KL N-channel SiC power MOSFET

SCT3120AL N-channel SiC power MOSFET

SCT2080KE N-channel SiC power MOSFET

Outline TUMT3. DC/DC converters Tape width (mm) 8 Type Basic ordering unit (pcs) 3,000

MOS FIELD EFFECT TRANSISTOR

SCT3105KL N-channel SiC power MOSFET

Medium Power Transistor ( 32V, 1A)

SCH2080KE N-channel SiC power MOSFET co-packaged with SiC-SBD

Low V CE(sat) transistor (strobe flash)

RCD080N25 V DSS 250V 8A 20W. Nch 250V 8A Power MOSFET. Data Sheet. Outline. Inner circuit. Features 1) Low on-resistance. 2) Fast switching speed.

1.5V Drive Nch MOSFET

Outline. Inner circuit. Application Tape width (mm) - Type Switching Power Supply Basic ordering unit (pcs) 450 Taping code

Outline. Inner circuit. Application Tape width (mm) - Type Switching Power Supply Basic ordering unit (pcs) 360 Taping code

PPM723T201E0 P-Channel MOSFET

Switching (60V, 300mA)

4V Drive Nch+SBD MOSFET

PNM723T201E0 N-Channel MOSFET

US6U37 Structure Dimensions TUMT6 for Features Applications Inner circuit Package specifications Designs Absolute maximum ratings Recommended New

2SK4124. SANYO Semiconductors DATA SHEET 2SK4124. Features. Specifications. N-Channel Silicon MOSFET General-Purpose Switching Device Applications

PPM723T201E0 P-Channel MOSFET

2SK4192LS. SANYO Semiconductors DATA SHEET 2SK4192LS. Features. Specifications. N-Channel Silicon MOSFET General-Purpose Switching Device Applications

Transcription:

4V Drive Pch MOSFET Structure Silicon P-channel MOSFET Dimensions (Unit : mm) TSMT3 Features ) Low On-resistance. 2) Space saving small surface mount package (TSMT3). 3) 4V drive. (3) () (2) Abbreviated symbol : UG Application Switching Packaging specifications Package Taping Type Code TL Basic ordering unit (pieces) 3 Inner circuit () (3) 2 Absolute maximum ratings (Ta = 25 C) Symbol Limits Unit Drain-source voltage V DSS 3 V Gate-source voltage V GSS 2 V Drain current Continuous I D 4 A I DP * 6 A Source current Continuous I S.8 A (Body Diode) I SP * 6 A Power dissipation P D *2. W Channel temperature Tch 5 C Range of storage temperature Tstg 55 to +5 C * Pw s, Duty cycle % *2 Mounted on a ceramic board. () Gate (2) Source (3) Drain (2) ESD PROTECTION DIODE 2 BODY DIODE Thermal resistance Symbol Limits Unit Channel to Ambient Rth (ch-a) 25 C / W *Mounted on a ceramic board. * /5 2.4 - Rev.A

Electrical characteristics (Ta = 25 C) Symbol Min. Typ. Max. Unit Gate-source leakage I GSS - - A V GS = 2V, V DS =V Drain-source breakdown voltage V (BR)DSS 3 - - V I D = ma, V GS =V Zero gate voltage drain current I DSS - - A V DS = 3V, V GS =V Gate threshold voltage V GS (th). - 2.5 V V DS = V, I D = ma Input capacitance C iss - - pf V DS = V Output capacitance C oss - 5 - pf V GS =V Reverse transfer capacitance C rss - 3 - pf f=mhz Turn-on delay time t d(on) * - 5 - ns I D = 2A, V DD 5V Rise time t r * - 3 - ns V GS = V Turn-off delay time t d(off) * - 85 - ns R L =7.5 Fall time t f * - 45 - ns R G = Total gate charge Q g * -.5 - nc I D = 4A, V DD 5V Gate-source charge Q gs * - 3. - nc V GS = 5V R L =3.8 Gate-drain charge Q gd * - 3.3 - nc R G = * Conditions - 32 45 I D = 4A, V GS = V Static drain-source on-state * R - 45 63 m I D = 2A, V GS = 4.5V resistance DS (on) - 52 72 I D = 2A, V GS = 4.V Forward transfer admittance l Y fs l * 2.7 - - S I D = 4A, V DS = V Body diode characteristics (Source-Drain) (Ta = 25 C) Symbol Min. Typ. Max. Unit Conditions Forward Voltage V SD * - -.2 V I s = 4A, V GS =V * 2/5 2.4 - Rev.A

Electrical characteristics curves DRAIN CURRENT : -I D [A] 4 3 2 V GS = -V V GS = -4.V V GS = -2.8V V GS = -2.5V DRAIN CURRENT : -I D [A] 4 3 2 V GS = -2.8V V GS = -V V GS =-4.V V GS =-3.V V GS = -2.5V DRAIN CURRENT : -I D [A] V DS = -V Ta= 25 C Ta= 75 C Ta= 25 C Ta= - 25 C...2.4.6.8 2 4 6 8. 2 3 4 DRAIN-SOURCE VOLTAGE : -V DS [V] DRAIN-SOURCE VOLTAGE : -V DS [V] GATE-SOURCE VOLTAGE : -V GS [V] Fig. Typical Output Characteristics( Ⅰ) Fig.2 Typical Output Characteristics( Ⅱ) Fig.3 Typical Transfer Characteristics V GS = -4.V V GS = -V. V GS = -V.. Fig.4 Static Drain-Source On-State Resistance vs. Drain Current(Ⅰ) Fig.5 Static Drain-Source On-State Resistance vs. Drain Current(Ⅱ) Fig.6 Static Drain-Source On-State Resistance vs. Drain Current(Ⅲ) V GS = -4.V. FORWARD TRANSFER ADMITTANCE : Yfs [S] V DS = -V... SOURCE CURRENT : -I s [A]. V GS =V Ta=-25 C..5.5 SOURCE-DRAIN VOLTAGE : -V SD [V] Fig.7 Static Drain-Source On-State Resistance vs. Drain Current(Ⅳ) Fig.8 Forward Transfer Admittance vs. Drain Current Fig.9 Reverse Drain Current vs. Sourse-Drain Voltage 3/5 2.4 - Rev.A

RESISTANCE : R DS (ON)[mΩ] 5 5 I D = -2.A I D = -4.A 5 5 SWITCHING TIME : t [ns] t d(on) t d(off) t r.. t f V DD = -5V V GS = -V R G =Ω GATE-SOURCE VOLTAGE : -V GS [V] 8 6 4 2 V DD = -5V I D = -4.A R G =Ω 5 5 GATE-SOURCE VOLTAGE : -V GS [V] TOTAL GATE CHARGE : Qg [nc] Fig. Static Drain-Source On-State Resistance vs. Gate Source Voltage Fig. Switching Characteristics Fig.2 Dynamic Input Characteristics CAPACITANCE : C [pf] f=mhz V GS =V Crss Coss Ciss.. DRAIN-SOURCE VOLTAGE : -V DS [V] Fig.3 Typical Capacitance vs. Drain-Source Voltage 4/5 2.4 - Rev.A

Measurement circuits Pulse Width ID RL VDS % 5% 9% 5% D.U.T. % % RG VDD VDS td(on) 9% 9% tr td(off) tf ton toff Fig.- Switching time measurement circuit Fig.-2 Switching Waveforms VG ID RL VDS Qg IG(Const.) D.U.T. VDD Qgs Qgd Charge Fig.2- Gate charge measurement circuit Fig.2-2 Gate Charge Waveform 5/5 2.4 - Rev.A

Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http:///contact/ 2 ROHM Co., Ltd. All rights reserved. RA

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ROHM Semiconductor: TL