Precision Micropower, Low Noise CMOS Rail-to-Rail Input/Output Operational Amplifiers FEATURES Low offset voltage: μv max Low input bias current: 1 pa max Single-supply operation: 1.8 V to 5 V Low noise: 22 nv/ Hz Micropower: μa max Low distortion No phase reversal Unity gain stable APPLICATIONS Battery-powered instrumentation Multipole filters Sensors Low power ASIC input or output amplifiers GENERAL DESCRIPTION The are single/dual/quad micropower rail-to-rail input and output amplifiers, respectively, that feature very low offset voltage as well as low input voltage and current noise. These amplifiers use a patented trimming technique that achieves superior precision without laser trimming. The parts are fully specified to operate from 1.8 V to 5. V single supply or from ±.9 V to ±2.5 V dual supply. The combination of low offsets, low noise, very low input bias currents, and low power consumption make the especially useful in portable and loop-powered instrumentation. The ability to swing rail-to-rail at both the input and output enables designers to buffer CMOS ADCs, DACs, ASICs, and other wide output swing devices in low power, single-supply systems. The AD863 is available in a tiny 5-lead TSOT-23 package. The AD867 is available in 8-lead MSOP and 8-lead SOIC packages. The AD869 is available in 14-lead TSSOP and 14-lead SOIC packages. PIN CONFIGURATIONS OUT 1 V 2 +IN 3 AD863 TOP VIEW (Not to Scale) 5 4 V+ IN Figure 1. 5-Lead TSOT-23 (UJ Suffix) OUT A 1 IN A 2 +IN A 3 V 4 AD867 TOP VIEW (Not to Scale) 4356-1 8 V+ 7 OUT B 6 IN B 5 +IN B Figure 2. 8-Lead MSOP (RM Suffix) OUT A 1 IN A 2 +IN A 3 V 4 AD867 TOP VIEW (Not to Scale) 8 V+ 7 OUT B 6 IN B 5 +IN B Figure 3. 8-Lead SOIC_N (R Suffix) OUT A 1 14 OUT D IN A +IN A V+ +IN B IN B OUT B 2 3 4 5 6 7 AD869 TOP VIEW (Not to Scale) 13 12 11 9 8 IN D +IN D V +IN C IN C OUT C Figure 4. 14-Lead TSSOP (RU Suffix) OUT A 1 IN A 2 14 OUT D 13 IN D +IN A 3 AD869 12 +IN D V+ 4 TOP VIEW 11 V +IN B 5 (Not to Scale) +IN C IN B 6 9 IN C OUT B 7 8 OUT C 4356-2 4356-3 4356-4 4356-5 Figure 5. 14-Lead SOIC_N (R Suffix) Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 96, Norwood, MA 262-96, U.S.A. Tel: 781.329.47 www.analog.com Fax: 781.461.3113 25 Analog Devices, Inc. All rights reserved.
TABLE OF CONTENTS Specifications... 3 Absolute Maximum Ratings... 5 ESD Caution... 5 Typical Performance Characteristics... 6 Applications... 12 No Phase Reversal... 12 Input Overvoltage Protection... 12 Driving Capacitive Loads... 12 Proximity Sensors... 13 Composite Amplifiers... 13 Battery-Powered Applications... 14 Photodiodes... 14 Outline Dimensions... 15 Ordering Guide... 17 REVISION HISTORY 6/5 Rev. A to Rev. B Updated Figure 49... 15 Changes to Ordering Guide... 17 /3 Rev. to Rev. A Added AD867 and AD869 Parts...Universal Changes to Specifications... 3 Changes to Figure 35... Added Figure 41... 11 8/3 Revision : Initial Version Rev. B Page 2 of 2
SPECIFICATIONS Electrical Characteristics @ VS = 5 V, VCM = VS/2, TA = 25 C, unless otherwise noted. Table 1. Parameter Symbol Conditions Min Typ Max Unit INPUT CHARACTERISTICS Offset Voltage VOS VS = 3.3 V @ VCM =.5 V and 2.8 V 12 μv.3 V < VCM < +5.2 V 4 3 μv 4 C < TA < +125 C,.3 V < VCM < +5.2 V 7 μv Offset Voltage Drift VOS/ T 4 C < TA < +125 C 1 4.5 μv/ C Input Bias Current IB.2 1 pa 4 C < TA < +85 C pa 4 C < TA < +125 C pa Input Offset Current IOS.1.5 pa 4 C < TA < +85 C pa 4 C < TA < +125 C 2 pa Input Voltage Range IVR.3 +5.2 V Common-Mode Rejection Ratio CMRR V < VCM < 5 V 85 db 4 C < TA < +125 C 8 db Large Signal Voltage Gain AVO RL = kω,.5 V <VO < 4.5 V AD863 4 V/mV AD867/AD869 2 4 V/mV Input Capacitance CDIFF 1.9 pf CCM 2.5 pf OUTPUT CHARACTERISTICS Output Voltage High VOH IL = 1 ma 4.95 4.97 V 4 C to +125 C 4.9 V IL = ma 4.65 4.97 V 4 C to +125 C 4. V Output Voltage Low VOL IL = 1 ma 16 3 mv 4 C to +125 C mv IL = ma 16 2 mv 4 C to +125 C 33 mv Output Current IOUT ±8 ma Closed-Loop Output Impedance ZOUT f = khz, AV = 1 36 Ω POWER SUPPLY Power Supply Rejection Ratio PSRR 1.8 V < VS < 5 V 8 db Supply Current/Amplifier ISY VO = V 4 μa 4 C <TA < +125 C 6 μa DYNAMIC PERFORMANCE Slew Rate SR RL = kω.1 V/μs Settling Time.1% ts G = ±1, 2 V Step 23 μs Gain Bandwidth Product GBP RL = kω 4 khz RL = kω 316 khz Phase Margin ØO RL = kω, RL = kω 7 Degrees NOISE PERFORMANCE Peak-to-Peak Noise en p-p.1 Hz to Hz 2.3 3.5 μv Voltage Noise Density en f = 1 khz 25 nv/ Hz f = khz 22 nv/ Hz Current Noise Density in f = 1 khz.5 pa/ Hz Channel Separation Cs f = khz 115 db f = khz 1 db Rev. B Page 3 of 2
Electrical Characteristics @ VS = 1.8 V, VCM = VS/2, TA = 25 C, unless otherwise noted. Table 2. Parameter Symbol Conditions Min Typ Max Unit INPUT CHARACTERISTICS Offset Voltage VOS VS = 3.3 V @ VCM =.5 V and 2.8 V 12 μv.3 V < VCM < +1.8 V 4 3 μv 4 C < TA < +85 C,.3 V < VCM < +1.8 V μv 4 C < TA < +125 C,.3 V < VCM < +1.7 V 7 μv Offset Voltage Drift VOS/ T 4 C < TA < +125 C 1 4.5 μv/ C Input Bias Current IB.2 1 pa 4 C < TA < +85 C pa 4 C < TA < +125 C pa Input Offset Current IOS.1.5 pa 4 C < TA < +85 C pa 4 C < TA < +125 C 2 pa Input Voltage Range IVR.3 +1.8 V Common-Mode Rejection Ratio CMRR V < VCM < 1.8 V 8 98 db 4 C < TA < +85 C 7 db Large Signal Voltage Gain AVO RL = kω,.5 V <VO < 4.5 V AD863 1 3 V/mV AD867/AD869 2 V/mV Input Capacitance CDIFF 2.1 pf CCM 3.8 pf OUTPUT CHARACTERISTICS Output Voltage High VOH IL = 1 ma 1.65 1.72 V 4 C to +125 C 1.6 V Output Voltage Low VOL IL = 1 ma 38 6 mv 4 C to +125 C 8 mv Output Current IOUT ±7 ma Closed-Loop Output Impedance ZOUT f = khz, AV = 1 36 Ω POWER SUPPLY Power Supply Rejection Ratio PSRR 1.8 V < VS < 5 V 8 db Supply Current/Amplifier ISY VO = V 4 μa 4 C < TA < +85 C 6 μa DYNAMIC PERFORMANCE Slew Rate SR RL = kω.1 V/μs Settling Time.1% ts G = ±1, 1 V Step 9.2 μs Gain Bandwidth Product GBP RL = kω 385 khz RL = kω 316 khz Phase Margin ØO RL = kω, RL = kω 7 Degrees NOISE PERFORMANCE Peak-to-Peak Noise en p-p.1 Hz to Hz 2.3 3.5 μv Voltage Noise Density en f = 1 khz 25 nv/ Hz f = khz 22 nv/ Hz Current Noise Density in f = 1 khz.5 pa/ Hz Channel Separation Cs f = khz 115 db f = khz 1 db Rev. B Page 4 of 2
ABSOLUTE MAXIMUM RATINGS Table 3. Parameter 1 Rating Supply Voltage 6 V Input Voltage GND to VS Differential Input Voltage ±6 V Output Short-Circuit Duration to GND Indefinite Storage Temperature Range All Packages 65 C to +1 C Lead Temperature (Soldering, 6 sec) 3 C Operating Temperature Range 4 C to +125 C Junction Temperature Range All Packages 65 C to +1 C 1 Absolute maximum ratings apply at 25 C, unless otherwise noted. Table 4. Package Characteristics Package Type θja 1 θjc Unit 5-Lead TSOT-23 (UJ) 27 61 C/W 8-Lead MSOP (RM) 2 45 C/W 8-Lead SOIC_N (R) 158 43 C/W 14-Lead SOIC_N (R) 12 36 C/W 14-Lead TSSOP (RU) 18 35 C/W 1 θja is specified for the worst-case conditions, that is, θja is specified for device soldered in circuit board for surface-mount packages. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. B Page 5 of 2
TYPICAL PERFORMANCE CHARACTERISTICS 26 24 22 V S = 5V T A = 25 C V CM = V TO 5V 3 2 2 V S = 3.3V T A = 25 C NUMBER OF AMPLIFIERS 2 18 16 14 12 8 6 V OS (μv) 1 1 4 2 2 2 27 2 1 9 3 3 9 1 2 27 V OS (μv) 4356-6 3..3.6.9 1.2 1.5 1.8 2.1 2.4 2.7 3. V CM (V) 3.3 4356-9 Figure 6. Input Offset Voltage Distribution Figure 9. Input Offset Voltage vs. Common-Mode Voltage 3 4 NUMBERS OF AMPLIFIERS 25 2 15 T A = 4 C TO +125 C V CM = V INPUT BIAS CURRENT (pa) 3 3 2 2 1 5.4.8 1.2 1.6 2. 2.4 2.8 3.2 3.6 4. 4.4 4.8 5.2 TCVOS (μv/ C) 4356-7 25 75 125 TEMPERATURE ( C) 4356- Figure 7. Input Offset Voltage Drift Distribution Figure. Input Bias vs. Temperature V OS (μv) 3 2 2 1 1 2 2 V S = 5V T A = 25 C OUTPUT VOLTAGE TO SUPPLY RAIL (mv) 1.1 V S = 5V T A = 25 C SOURCE SINK 3..5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. V CM (V) 4356-8.1.1.1.1 1 LOAD CURRENT (ma) 4356-11 Figure 8. Input Offset Voltage vs. Common-Mode Voltage Figure 11. Output Voltage to Supply Rail vs. Load Current Rev. B Page 6 of 2
OUTPUT SWING (mv) 3 3 2 2 1 4 V S = 5V T A = 25 C V DD V OH @ ma LOAD V OL @ ma LOAD V DD V OH @ 1mA LOAD V OL @ 1mA LOAD 25 5 2 35 65 8 95 1 125 TEMPERATURE ( C) 4356-12 OUTPUT IMPEDANCE (Ω) 1925 17 1575 14 1225 875 7 525 3 175, ±.9V A = A = A = 1 1k k k FREQUENCY (Hz) 4356-15 Figure 12. Output Voltage Swing vs. Temperature Figure 15. Output Impedance vs. Frequency 8 6 R L = kω C L = 2pF φ = 7.9 225 18 135 14 12 OPEN-LOOP GAIN (db) 4 2 2 4 9 45 45 9 PHASE (Degree) CMRR (db) 8 6 4 2 6 135 2 8 18 4 225 1k k k 1M M FREQUENCY (Hz) 4356-13 6 1k k FREQUENCY (Hz) k 4356-16 Figure 13. Open-Loop Gain and Phase vs. Frequency Figure 16. Common-Mode Rejection Ratio vs. Frequency 5. 4.5 4. V S = 5V V IN = 4.9V p-p T = 25 C A V = 1 14 12 OUTPUT SWING (V p-p) 3.5 3. 2.5 2. 1.5 PSRR (db) 8 6 4 2 1. 2.5 4..1.1 1 FREQUENCY (khz) 4356-14 6 1k k k FREQUENCY (Hz) 4356-17 Figure 14. Closed-Loop Output Voltage Swing vs. Frequency Figure 17. PSRR vs. Frequency Rev. B Page 7 of 2
6 V S = 5V V S = 5V, 1.8V SMALL SIGNAL OVERSHOOT (%) 4 3 2 OS OS+ VOLTAGE NOISE (1μV/DIV) LOAD CAPACITANCE (pf) 4356-18 TIME (1s/DIV) 4356-21 Figure 18. Small Signal Overshoot vs. Load Capacitance Figure 21..1 Hz to Hz Input Voltage Noise 6 55 45 V S = 5V R L = kω C L = 2pF A V = 1 SUPPLY CURRENT (μa) 4 35 3 25 2 15 VOLTAGE (mv/div) 5 4 25 5 2 35 65 8 TEMPERATURE ( C) 95 1 125 4356-19 TIME (4μs/DIV) 4356-22 Figure 19. Supply Current vs. Temperature Figure 22. Small Signal Transient 9 8 T A = 25 C V S = 5V R L = kω C L = 2pF A V = 1 SUPPLY CURRENT (μa) 7 6 4 3 2 VOLTAGE (1V/DIV) 1. 2. 3. 4. 5. SUPPLY VOLTAGE (V) 4356-2 TIME (2μs/DIV) 4356-23 Figure 2. Supply Current vs. Supply Voltage Figure 23. Large Signal Transient Rev. B Page 8 of 2
V IN (mv) V OUT (V) V V +2.5V mv R L = kω A V = V IN = mv VOLTAGE NOISE DENSITY (nv/ Hz) 176 154 132 1 88 66 44 22 TIME (4μs/DIV)) (4μs/DIV) 4356-24 1 2 3 4 5 6 7 8 9 FREQUENCY (khz) 4356-27 Figure 24. Negative Overload Recovery Figure 27. Voltage Noise Density vs. Frequency V IN (mv) V OUT (V) V V R L = kω A V = V IN = mv mv TIME (4μs/DIV) +2.5V 4356-25 NUMBER OF AMPLIFIERS 8 7 7 6 6 5 4 4 3 3 2 2 1 V S = 1.8V T A = 25 C V CM = V to 1.8V 3 24 18 12 6 6 12 18 24 3 V OS (μv) 4356-28 Figure 25. Positive Overload Recovery Figure 28. VOS Distribution VOLTAGE NOISE DENSITY (nv/ Hz) 168 144 12 96 72 48 24 V OS (μv) 3 2 V S = 1.8V T A = 25 C 2 1 1 2 2.1.2.3.4.5.6.7.8.9 1. FREQUENCY (khz) 4356-26 3.3.6.9 1.2 1.5 1.8 V CM (V) 4356-29 Figure 26. Voltage Noise Density vs. Frequency Figure 29. Input Offset Voltage vs. Common-Mode Voltage Rev. B Page 9 of 2
OUTPUT VOLTAGE TO SUPPLY RAIL (mv) 1.1 V S = 1.8V T A = 25 C SOURCE SINK OPEN-LOOP GAIN (db) 8 6 4 2 2 4 6 8 V S = ±.9V R L = kω C L = 2pF φ = 7 225 18 135 9 45 45 9 135 18 PHASE (Degree).1.1.1.1 1 LOAD CURRENT (ma) 4356-3 225 1 1M M FREQUENCY (Hz) 4356-33 Figure 3. Output Voltage to Supply Rail vs. Load Current Figure 33. Open-Loop Gain and Phase vs. Frequency 14 9 8 V S = 1.8V 12 V S = 1.8V OUTPUT SWING (mv) 7 6 4 3 V DD V OH @ 1mA LOAD V OL @ 1mA LOAD CMRR (db) 8 6 4 2 2 2 4 4 25 5 2 35 65 8 95 1 125 TEMPERATURE ( C) 4356-31 6 1k k k FREQUENCY (Hz) 4356-34 Figure 31. Output Voltage Swing vs. Temperature Figure 34. Common-Mode Rejection Ratio vs. Frequency 6 1.8 SMALL SIGNAL OVERSHOOT (%) 4 3 2 V S = 1.8V T A = 25 C A V = 1 OS OS+ OUTPUT SWING (V p-p) 1.5 1.2.9.6.3 V S = 1.8V V IN = 1.7V p-p T = 25 C A V = 1 LOAD CAPACITANCE (pf) 4356-32..1.1 1 FREQUENCY (khz) 4356-35 Figure 32. Small Signal Overshoot vs. Load Capacitance Figure 35. Closed-Loop Output Voltage Swing vs. Frequency Rev. B Page of 2
VOLTAGE (mv/div) V S = 1.8V R L = kω C L = 2pF A V = 1 VOLTAGE NOISE DENSITY (nv/ Hz) 176 154 132 1 88 66 44 22 V S = ±.9V TIME (4μs/DIV) 4356-36 1 2 3 4 5 6 7 8 9 FREQUENCY (khz) 4356-39 Figure 36. Small Signal Transient Figure 39. Voltage Noise Density VOLTAGE (mv/div) V S = 1.8V R L = kω C L = 2pF A V = 1 CHANNEL SEPARATION (db) 2 4 6 8, ±.9V 12 TIME (2μs/DIV) 4356-37 14 1k k k 1M FREQUENCY (Hz) 4356-4 Figure 37. Large Signal Transient Figure 4. Channel Separation 168 V S = ±.9V VOLTAGE NOISE DENSITY (nv/ Hz) 14 112 84 56 28.1.2.3.4.5.6.7.8.9 1. FREQUENCY (khz) 4356-38 Figure 38. Voltage Noise Density Rev. B Page 11 of 2
APPLICATIONS NO PHASE REVERSAL The do not exhibit phase inversion even when the input voltage exceeds the maximum input common-mode voltage. Phase reversal can cause permanent damage to the amplifier, resulting in system lockups. The can handle voltages of up to 1 V over the supply. V IN V IN = 6V p-p A V = 1 R L = kω The use of the snubber circuit is usually recommended for unity gain configurations. Higher gain configurations help improve the stability of the circuit. Figure 44 shows the same output response with the snubber in place. V S = ±.9V V IN = mv C L = 2nF R L = kω VOLTAGE (1V/DIV) V OUT 4356-42 Figure 42. Output Response to a 2 nf Capacitive Load, Without Snubber TIME (4μs/DIV) 4356-41 V EE Figure 41. No Phase Response INPUT OVERVOLTAGE PROTECTION If a voltage 1 V higher than the supplies is applied at either input, the use of a limiting series resistor is recommended. If both inputs are used, each one should be protected with a series resistor. To ensure good protection, the current should be limited to a maximum of 5 ma. The value of the limiting resistor can be determined from the equation (VIN VS)/(RS + 2 Ω) 5 ma 2mV + V V+ R S 1Ω V CC C S 47pF Figure 43. Snubber Network C L 4356-43 V SY = ±.9V V IN = mv C L = 2nF R L = kω R S = 1Ω C S = 47pF DRIVING CAPACITIVE LOADS The are capable of driving large capacitive loads without oscillating. Figure 42 shows the output of the in response to a mv input signal, with a 2 nf capacitive load. Although it is configured in positive unity gain (the worst case), the AD863 shows less than 2% overshoot. Simple additional circuitry can eliminate ringing and overshoot. Figure 44. Output Response to a 2 nf Capacitive Load, With Snubber 4356-44 One technique is the snubber network, which consists of a series RC and a resistive load (see Figure 43). With the snubber in place, the are capable of driving capacitive loads of 2 nf with no ringing and less than 3% overshoot. Rev. B Page 12 of 2
Optimum values for RS and CS are determined empirically; Table 5 lists a few starting values. Table 5. Optimum Values for the Snubber Network CL (pf) RS (Ω) CS (pf) ~ 68 1 33 16~2 4 PROXIMITY SENSORS Proximity sensors can be capacitive or inductive and are used in a variety of applications. One of the most common applications is liquid level sensing in tanks. This is particularly popular in pharmaceutical environments where a tank must know when to stop filling or mixing a given liquid. In aerospace applications, these sensors detect the level of oxygen used to propel engines. Whether in a combustible environment or not, capacitive sensors generally use low voltage. The precision and low voltage of the make the parts an excellent choice for such applications. R1 1kΩ V IN V V+ R2 V EE 99kΩ V CC AD863 R3 1kΩ V CC U5 V+ AD8541 V V EE R4 99kΩ Figure 45. High Gain Composite Amplifier 4356-45 COMPOSITE AMPLIFIERS A composite amplifier can provide a very high gain in applications where high closed-loop dc gains are needed. The high gain achieved by the composite amplifier comes at the expense of a loss in phase margin. Placing a small capacitor, CF, in the feedback in parallel with R2 ( Figure 45) improves the phase margin. Picking CF = pf yields a phase margin of about 45 for the values shown in Figure 45. A composite amplifier can be used to optimize dc and ac characteristics. Figure 46 shows an example using the AD863 and the AD8541. This circuit offers many advantages. The bandwidth is increased substantially, and the input offset voltage and noise of the AD8541 become insignificant since they are divided by the high gain of the AD863. The circuit of Figure 46 offers a high bandwidth (nearly double that of the AD863), a high output current, and a very low power consumption of less than μa. V IN R1 1kΩ R2 kω V EE AD863 V CC V V+ R3 1kΩ V+ R4 V Ω C2 V AD8541 CC V EE C3 Figure 46. Low Power Composite Amplifier 4356-46 Rev. B Page 13 of 2
BATTERY-POWERED APPLICATIONS The are ideal for battery-powered applications. The parts are tested at 5 V, 3.3 V, 2.7 V, and 1.8 V and are suitable for various applications whether in single or dual supply. In addition to their low offset voltage and low input bias, the have a very low supply current of 4 μa, making the parts an excellent choice for portable electronics. The TSOT package allows the AD863 to be used on smaller board spaces. PHOTODIODES Photodiodes have a wide range of applications from bar code scanners to precision light meters and CAT scanners. The very low noise and low input bias current of the AD863/AD867/ AD869 make the parts very attractive amplifiers for I-V conversion applications. Figure 47 shows a simple photodiode circuit. The feedback capacitor helps the circuit maintain stability. The signal bandwidth can be increased at the expense of an increase in the total noise; a low-pass filter can be implemented by a simple RC network at the output to reduce the noise. The signal bandwidth can be calculated by ½πR2C2 and the closed-loop bandwidth is the intersection point of the open-loop gain and the noise gain. The circuit shown in Figure 47 has a closed-loop bandwidth of 58 khz and a signal bandwidth of 16 Hz. Increasing C2 to pf yields a closed-loop bandwidth of 65 khz, but only 3.2 Hz of signal bandwidth can be achieved. C2 pf R2 MΩ V CC R1 MΩ C1 pf AD863 V EE 4356-47 Figure 47. Photodiode Circuit Rev. B Page 14 of 2
OUTLINE DIMENSIONS 5. (.1968) 4.8 (.189) 4. (.1574) 3.8 (.1497) 8 5 1 4 6.2 (.244) 5.8 (.2284).25 (.98). (.4) COPLANARITY. 1.27 (.) BSC SEATING PLANE 1.75 (.688) 1.35 (.532).51 (.21).31 (.122).25 (.98).17 (.67) 8. (.196).25 (.99) 45 1.27 (.).4 (.157) COMPLIANT TO JEDEC STANDARDS MS-12-AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN Figure 48. 8-Lead Standard Small Outline Package [SOIC_N] (R-8) Dimensions shown in millimeters and (inches) 2.9 BSC 5 4 1.6 BSC 2.8 BSC 1 2 3 *.9.87.84 PIN 1 1.9 BSC.95 BSC *1. MAX. MAX. SEATING.3 PLANE.2.8 8 4.6.45.3 *COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS. Figure 49. 5-Lead Thin Small Outline Transistor Package [TSOT] (UJ-5) Dimensions shown in millimeters 3. BSC 3. BSC 8 1 5 4 4.9 BSC PIN 1.65 BSC.15..38.22 COPLANARITY. 1. MAX SEATING PLANE.23.8 Rev. B Page 15 of 2 8 COMPLIANT TO JEDEC STANDARDS MO-187-AA Figure. 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters.8.6.4
8.75 (.3445) 8.55 (.3366) 4. (.1575) 3.8 (.1496) 14 8 1 7 6.2 (.2441) 5.8 (.2283).25 (.98). (.39) COPLANARITY. 1.27 (.) BSC.51 (.21).31 (.122) 1.75 (.689) 1.35 (.531) SEATING PLANE.25 (.98).17 (.67) 8. (.197) 45.25 (.98) 1.27 (.).4 (.157) COMPLIANT TO JEDEC STANDARDS MS-12-AB CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN Figure 51. 14-Lead Standard Small Outline Package [SOIC_N] (R-14) Dimensions shown in millimeters and (inches) 5. 5. 4.9 14 8 4. 4.4 4.3 6.4 BSC 1 7 1.5 1..8 PIN 1.15.5.65 BSC.3.19 1.2 MAX SEATING PLANE.2.9 COPLANARITY. 8 COMPLIANT TO JEDEC STANDARDS MO-153-AB-1.75.6.45 Figure 52. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters Rev. B Page 16 of 2
ORDERING GUIDE Model Temperature Range Package Description Package Option Branding AD863AUJ-R2 4 C to +125 C 5-Lead TSOT-23 UJ-5 BFA AD863AUJ-REEL 4 C to +125 C 5-Lead TSOT-23 UJ-5 BFA AD863AUJ-REEL7 4 C to +125 C 5-Lead TSOT-23 UJ-5 BFA AD863AUJZ-R2 1 4 C to +125 C 5-Lead TSOT-23 UJ-5 AX AD863AUJZ-REEL 1 4 C to +125 C 5-Lead TSOT-23 UJ-5 AX AD863AUJZ-REEL7 1 4 C to +125 C 5-Lead TSOT-23 UJ-5 AX AD867ARM-R2 4 C to +125 C 8-Lead MSOP RM-8 A AD867ARM-REEL 4 C to +125 C 8-Lead MSOP RM-8 A AD867ARMZ-R2 1 4 C to +125 C 8-Lead MSOP RM-8 AG AD867ARMZ-REEL 1 4 C to +125 C 8-Lead MSOP RM-8 AG AD867AR 4 C to +125 C 8-Lead SOIC_N R-8 AD867AR-REEL 4 C to +125 C 8-Lead SOIC_N R-8 AD867AR-REEL7 4 C to +125 C 8-Lead SOIC_N R-8 AD867ARZ 1 4 C to +125 C 8-Lead SOIC_N R-8 AD867ARZ-REEL 1 4 C to +125 C 8-Lead SOIC_N R-8 AD867ARZ-REEL7 1 4 C to +125 C 8-Lead SOIC_N R-8 AD869AR 4 C to +125 C 14-Lead SOIC_N R-14 AD869AR-REEL 4 C to +125 C 14-Lead SOIC_N R-14 AD869AR-REEL7 4 C to +125 C 14-Lead SOIC_N R-14 AD869ARZ 1 4 C to +125 C 14-Lead SOIC_N R-14 AD869ARZ-REEL 1 4 C to +125 C 14-Lead SOIC_N R-14 AD869ARZ-REEL7 1 4 C to +125 C 14-Lead SOIC_N R-14 AD869ARU 4 C to +125 C 14-Lead TSSOP RU-14 AR869ARU-REEL 4 C to +125 C 14-Lead TSSOP RU-14 AD869ARUZ 1 4 C to +125 C 14-Lead TSSOP RU-14 AR869ARUZ-REEL 1 4 C to +125 C 14-Lead TSSOP RU-14 1 Z = Pb-free part. Rev. B Page 17 of 2
NOTES Rev. B Page 18 of 2
NOTES Rev. B Page 19 of 2
NOTES 25 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C4356 6/5(B) Rev. B Page 2 of 2