94 8553 DESCRIPTION is an infrared, 95 nm emitting diode in technology, molded in a PLCC-2 package for surface mounting (SMD). FEATURES Package type: surface mount Package form: PLCC-2 Dimensions (L x W x H in mm): 3.5 x 2.8 x.75 Peak wavelength: λ p = 95 nm High reliability Angle of half intensity: ϕ = ± 6 Low forward voltage Suitable for high pulse current operation Good spectral matching with Si photodetectors Package matched with IR emitter series VEMT37 Floor life: 68 h, MSL 3, acc. J-STD-2 Lead (Pb)-free reflow soldering AEC-Q qualified Compliant to RoHS directive 22/95/EC and in accordance to WEEE 22/96/EC Find out more about Vishay s Automotive Grade Product requirements at: www.vishay.com/applications APPLICATIONS Infrared source in tactile keyboards IR diode in low space applications PCB mounted infrared sensors Emitter in miniature photo-interrupters PRODUCT SUMMARY COMPONENT I e (mw/sr) ϕ (deg) λ P (nm) t r (ns) 4.5 ± 6 95 8 Test conditions see table Basic Characteristics ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM -GS8 Tape and reel MOQ: 75 pcs, 5 pcs/reel PLCC-2 -GS8 Tape and reel MOQ: 8 pcs, 8 pcs/reel PLCC-2 MOQ: minimum order quantity ** Please see document Vishay Material Category Policy : www.vishay.com/doc?9992 Document Number: 8373 For technical questions, contact: emittertechsupport@vishay.com www.vishay.com Rev..3, 3-Nov-9 322
ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V R 5 V Forward current ma Peak forward current t p /T =.5, t p = μs M 2 ma Surge forward current t p = μs SM.5 A Power dissipation P V 7 mw Junction temperature T j C Operating temperature range T amb - 4 to + 85 C Storage temperature range T stg - 4 to + C Soldering temperature Acc. figure, J-STD-2 T sd 26 C Thermal resistance junction/ambient J-STD-5, soldered on PCB R thja 25 K/W T amb = 25 C, unless otherwise specified P V - Power Dissipation (mw) 8 6 4 2 8 R thja = 25 K/W 6 4 2 2 3 4 5 6 7 8 9 234 T amb - Ambient Temperature ( C) - Forward Current (ma) 2 8 6 R thja = 25 K/W 4 2 2 3 4 5 6 7 8 9 2342 T amb - Ambient Temperature ( C) Fig. - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT = ma, t p = 2 ms V F.3.7 V Forward voltage = A, t p = μs V F.8 V Temperature coefficient of V F = ma TK VF -.3 mv/k Reverse current V R = 5 V I R μa Junction capacitance V R = V, f = MHz, E = C j 3 pf Radiant intensity = ma, t p = 2 ms I e.6 4.5 8 mw/sr =.5 A, t p = μs I e 35 mw/sr Radiant power = ma, t p = 2 ms φ e 5 mw Temperature coefficient of φ e = ma TKφ e -.8 %/K Angle of half intensity ϕ ± 6 deg Peak wavelength = ma λ p 95 nm Spectral bandwidth = ma Δλ 5 nm Temperature coefficient of λ p = ma TKλ p.2 nm/k Rise time T amb = 25 C, unless otherwise specified = 2 ma t r 8 ns = A t r 4 ns = 2 ma t f 8 ns Fall time = A t f 4 ns Virtual source diameter EN 6825- d.5 mm www.vishay.com For technical questions, contact: emittertechsupport@vishay.com Document Number: 8373 323 Rev..3, 3-Nov-9
BASIC CHARACTERISTICS T amb = 25 C, unless otherwise specified - Forward Current (ma) t p /T =.5..2.5 DC..2 T amb < 6 C.5 I e - Radiant Intensity (mw/sr).. 95 9985 t p - Pulse Length (ms). 94 7956 2 3 4 - Forward Current (ma) Fig. 3 - Pulse Forward Current vs. Pulse Duration Fig. 6 - Radiant Intensity vs. Forward Current 4 I - Forward Current (ma) F 3 2 - Radiant Power (mw) e Φ - 2 3 4. 2 3 4 94 7996 V F - Forward Voltage (V) 94 82 - Forward Current (ma) Fig. 4 - Forward Current vs. Forward Voltage Fig. 7 - Radiant Power vs. Forward Current.2.6 V F rel - Relative Forward Voltage (V)...9.8.7 2 4 = ma 6 8 Φ e rel I e rel ;.2.8.4 = 2 ma - 5 4 94 799 T amb - Ambient Temperature ( C) 94 7993 T amb - Ambient Temperature ( C) Fig. 5 - Relative Forward Voltage vs. Ambient Temperature Fig. 8 - Relative Radiant Intensity/Power vs. Ambient Temperature Document Number: 8373 For technical questions, contact: emittertechsupport@vishay.com www.vishay.com Rev..3, 3-Nov-9 324
.25 2 3 Φ e rel - Relative Radiant Power..75.5.25 = ma I e, rel - Relative Radiant Intensity..9.8.7 4 5 6 7 8 ϕ - Angular Displacement 94 7994 9 95 λ - Wavelength (nm) 94 83.6.4.2 Fig. 9 - Relative Radiant Power vs. Wavelength Fig. - Relative Radiant Intensity vs. Angular Displacement PACKAGE DIMENSIONS in millimeters 3.5 ±.2.75 ±..9 technical drawings according to DIN specifications Pin identification Mounting Pad Layout.2 area covered with solder resist 2.8 ±.5 C A 2.2 2.6 (2.8) 4 4 Ø 2.4.6 (.9) 3 +.5 Drawing-No.: 6.54-567.-4 Issue: 5; 4..8 254 Die Position (for reference only) X = +/-.2 mm centrical Y = +/-.2 mm centrical Z =.3 mm +/-.25 mm, from top of die bottom of component www.vishay.com For technical questions, contact: emittertechsupport@vishay.com Document Number: 8373 325 Rev..3, 3-Nov-9
SOLDER PROFILE Temperature ( C) 984 3 25 2 5 5 255 C 24 C 27 C max. 2 s max. ramp up 3 C/s 5 5 2 25 3 Time (s) max. 3 s max. s max. 26 C 245 C max. ramp down 6 C/s Fig. - Lead (Pb)-free Reflow Solder Profile acc. J-STD-2 DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 68 h Conditions: T amb < 3 C, RH < 6 % Moisture sensitivity level 3, acc. to J-STD-2..6.4 4. 3.9 3.5 3. 2.5.95 Fig. 3 - Tape Dimensions in mm for PLCC-2 MISSING DEVICES A maximum of.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. De-reeling direction 4. 3.9 5.75 5.25 3.6 3.4.85.65 8.3 7.7 2.2 2..25 4. 3.6 94 8668 94 858 DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-2 or label. Devices taped on reel dry using recommended conditions 92 h at 4 C (+ 5 C), RH < 5 %. > 6 mm Tape leader 4 empty compartments Carrier leader min. 75 empty compartments Carrier trailer TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. Adhesive tape Fig. 4 - Beginning and End of Reel The tape leader is at least 6 mm and is followed by a carrier tape leader with at least 4 empty compartments. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartments and sealed with cover tape. Blister tape Component cavity 94 867 Fig. 2 - Blister Tape Document Number: 8373 For technical questions, contact: emittertechsupport@vishay.com www.vishay.com Rev..3, 3-Nov-9 326
COVER TAPE REMOVAL FORCE 2 4.5 3.5 2.5.5 3. 2.75. 9. The removal force lies between. N and. N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 8 with regard to the feed direction. Identification Label: Vishay type group tape code production code quantity 8 78 4.4 max. 63.5 6.5 94 8665 Fig. 5 - Dimensions of Reel-GS8 2.4 8.4 4.5 3.5 2.5.5 3. 2.75 Identification Label: Vishay type group tape code production code quantity 32 329 4.4 max. 62.5 6. 8857 Fig. 6 - Dimensions of Reel-GS8 www.vishay.com For technical questions, contact: emittertechsupport@vishay.com Document Number: 8373 327 Rev..3, 3-Nov-9
Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 9 www.vishay.com Revision: 8-Jul-8