October 13, 2006 Agilent 2AZ1A CMOS Image Sensor Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com
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Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Introduction 1.4 Major Findings 2 Device Overview 2.1 Cell Phone 2.2 CMOS Imager Module 2.3 2AZ1A Die 2.4 Die Features 3 Process Analysis 3.1 General Device Structure 3.2 Die Edge 3.3 Bond Pads 3.4 Passivation 3.5 Inter-Metal Dielectrics (IMD) and Pre-Metal Dielectric (PMD) 3.6 Metallization 3.7 Vias and Contacts 3.8 MOS Transistors Poly 3.9 Isolation 3.10 Wells and Epi 4 Pixel Array Analysis 4.1 Plan View Cell Analysis 4.2 Cross-Sectional Cell Analysis 4.3 Color Filter Analysis Report Evaluation
Overview 1-1 1 Overview 1.1 List of Figures 2 Device Overview 2.1.1 Front View of Sony Ericsson T610 Cell Phone 2.1.2 Back View of Sony Ericsson T610 Cell Phone 2.1.3 Overall View of PCB Board and CAmera Module 2.2.1 MA02T Module Top View 2.2.2 MA02T Module Bottom View 2.3.1 2AZ1A Die Photograph (Color Filters Intact) 2.3.2 2AZ1A Die Photograph (Color Filters Removed) 2.3.3 Die Markings 2.4.1 Die Corner 2.4.2 Die Corner 2.4.3 Plan View of Pixel Array (Color Filters Intact) 2.4.4 Minimum Pitch Bond Pads 3 Process Analysis 3.1.1 Agilent 2AZ1A General Device Structure 3.2.1 Die Edge 3.2.2 Die Edge Seal 3.3.1 Typical Bond Pad 3.3.2 Detail of Au:Al Inter-Metallic 3.3.3 Detail of Bond Pad Edge 3.4.1 Final Device Passivation 3.5.1 Inter-Metal Dielectric 1 (IMD 1) 3.5.2 Inter-Metal Dielectric 1 (IMD 2) 3.5.3 Pre-Metal Dielectric (PMD) 3.6.1 General Metal Structure 3.6.2 Minimum Pitch Metal 3 3.6.3 Minimum Pitch Metal 2 3.7.1 Minimum Pitch Via 2 s 3.7.2 Minimum Pitch Via 1 s 3.7.3 Contacts to Diffusion 3.8.1 Typical NMOS Transistor 3.9.1 Bird s Beak Profile 3.10.1 Well Structure
Overview 1-2 4 Pixel Array Analysis 4.1.1 Corner of Pixel Array Illustrating Bayer RGB Color Pattern 4.1.2 Corner of Pixel Array With Color Filters and Lenses Removed 4.1.3 Detail of Pixel Array Metal 3 4.1.4 Detail of Pixel Array Metal 2 4.1.5 Detail of Pixel Array Metal 1 4.1.6 Detail of Pixel Array Poly 4.1.7 Detail of Pixel Array Substrate 4.2.1 Pixel Array Transfer Transistor (T1) 4.2.2 Detail of Reset Transistor (T1) and Photodiode Cathode Diffusion 4.2.3 Pixel Array Source Follower Transistor (T2) 4.2.4 Pixel Array Row Select Transistor (T3) 4.3.1 Lenses and Color Filters 4.3.2 Detail of a Lens 1.2 List of Tables 3.4.1 Passivation Vertical Dimensions 3.5.1 IMD and PMD Vertical Dimensions 3.6.1 Metallization Vertical Dimensions 3.6.2 Metallization Horizontal Dimensions 3.7.1 Via and Contact Horizontal Dimensions