A8430. Approximate actual size. Same pad footprint as SOT-23-5 R θja = 50 C/W, see note 1, page 2 AB SO LUTE MAX I MUM RAT INGS

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Transcription:

MLPD Approximate actual size GND FB 1 2 3 4 AB SO LUTE MAX I MUM RAT INGS Pin... 0.3 V to 36 V Remaining Pins... 0.3 V to 10 V Ambient Operating Temperature, T A... 40 C to 8 C Junction Temperature, T J(max)...10 C Storage Temperature, T S... C to 10 C EN Same pad footprint as SOT-23- R θja = 0 C/W, see note 1, page 2 The is a noninverting boost converter that steps-up the input voltage, to provide a programmable constant current output at up to 36 V for driving white LEDs in series. Driving LEDs in series ensures identical currents and uniform brightness. Up to four white LEDs can be driven at 20 ma from a single cell or a multicell NiMH power source. Up to seven white LEDs can be driven by increasing the supply voltage up to 10 V. The incorporates a power switch and feedback sense amplifier to provide a solution with minimum external components. The output current can be set by adjusting a single external sense resistor and can be varied with a voltage or filtered PWM signal when dimming control is required. The high switching frequency of 1.2 MHz allows the use of small inductor and capacitor values. The is provided in a -pin 3 mm x 3 mm MLP package (part number suffix EK), that has a nominal height of only 0.7 mm. The lead-free version (part number suffix EK-T) has 100% lead-free matte tin leadframe plating. FEATURES Output voltage up to 36 V 2. V to 10 V input Drives up to 4 LEDs at 20 ma from a 2. V supply Drives up to LEDs at 20 ma from a 3 V supply 1.2 MHz switching frequency 300 ma switch current limit 1 µa shutdown current APPLICATIONS LED backlights Portable battery-powered equipment Cellular phones PDAs (Personal Digital Assistant) Camcorders, personal stereos, MP3 players, cameras Mobile GPS systems Use the following complete part number when ordering: Part Number Package Description EEK -pin, MLPD Surface Mount EEK-T -pin, MLPD Lead-Free, Surface Mount

Functional Block Diagram FB V REF 1.2 V 9 mv A1 R C C C A2 R S Q Driver Σ Ramp Generator EN 1.2 MHz Oscillator GND ELECTRICAL CHARACTERISTICS at T A = 2 C, V IN = 3 V (unless otherwise noted) Characteristics Symbol Test Conditions Min. Typ. Max. Units Input Voltage Range V IN 2. 10 V Supply Current I SUP Active: I LOAD = 1 ma, V LOAD = 12 V 2. 3. ma Shutdown (EN = 0 V) 0.1 1 µa Feedback Reference Voltage V REF 86 9 104 mv Feedback Input Current I FB 20 7 na Switch Current Limit I LIM 300 ma Switch Frequency F 0.8 1.2 1.6 MHz Switch Maximum Duty Cycle D 8 90 % Switch Saturation voltage V CE(SAT) 30 mv Switch Leakage Current I SL µa Input Input Threshold Low V IL 0.4 V Input Threshold High V IH 1. V Input Leakage Leakage I IL 1 µa Note 1. Measured with 4-layer PCB. Please refer to application note Package Thermal Characteristics, for thermal performance measurement for 3 mm x 3 mm MLP package for additional information. 2

Operating Characteristics Using Typical Application Circuit (Schematic 1) Quiescent Current versus Input Voltage Quiescent Current versus Temperature 2. 2.1 Quiescent Current (ma) 2.0 1. 1.0 0. Quiescent Current (ma) 2.10 2.0 2.00 1.9 0 0 2 4 6 8 10 1.90 0 0 0 100 10 V IN (V) Temperature ( C) Feedback Bias Current versus Temperature Switching Frequency versus Temperature 20 1.2 Feedback Bias Current (na) 1 10 Switching Frequency (MHz) 1.20 1.1 1.10 1.0 0 0 0 0 100 10 1.00 0 0 0 100 10 Temperature ( C) Temperature ( C) Switch Pin Voltage versus Temperature 300 90 Conversion Efficiency versus Current 20 8 V CE(SAT) (mv) 200 10 100 Efficiency (%) 80 7 70 V IN = 3 V V IN = 4 V 0 6 0 0 0 0 100 10 Temperature ( C) 60 0 10 1 20 LED Current (ma) 3

Functional Description Typical Application A typical application circuit for the is provided in schematic diagram 1. This illustrates a method of driving three white LEDs in series. The conversion efficiency of this configuration is shown in chart 1. Pin Functions The diagram also shows a method of connecting the individual pins, whos functions are described as follows:. Supply to the control circuit. A bypass capacitor must be connected from close to this pin to GND.. Low-side switch connection between the inductor () and ground. Because rapid changes of current occur at this pin, the traces on the PCB that are connected to this pin should be minimized. In addition, the inductor () and diode (D1) should be connected as close to this pin as possible. EN. Setting lower than 0.4 V disables the and puts the control circuit into the low-power Sleep mode. Greater than 1. V fully enables the. GND. Ground reference connected directly to the ground plane. The sense resistor () should have a separate connection directly to this point. FB. Feedback pin for LED current control. The reference voltage is 9 mv. The top of the sense resistor () is typically connected to this pin. 22µH D1 Conversion Efficiency versus Input Voltage 9 2.V to 4.2V 1µF 0.22µF Conversion Efficiency (%) 90 8 80 7 70 3 LEDs 4 LEDs LEDs 6 2 3 4 6 7 8 9 10 V IN (V) Schematic 1. Typical application Chart 1. Conversion efficiency when driving various quantities of LEDs in the typical application circuit 4

Application Information Component Selection The component values shown in schematic 1 are sufficient for most applications. To reduce the output ripple the inductor may be increased, but in most cases this results in excessive board area and cost. Inductor Selection. With an internal PWM frequency of 1.2 MHz, the optimal inductor value for most cases is 22 µh. The inductor should have low winding resistance, typically < 1 Ω, and the core should have low losses when operating at 1.2 MHz. For worst case conditions, high output voltage and current and low input voltage, the inductor should be rated at the switch current limit, I LIM. If high temperature operation is required a derating factor will have to be considered. In some cases, where lower inductor currents are expected, the current rating can be decreased. Several inductor manufacturers have and are developing suitable small-size inductors, including: Murata, Panasonic, Sumida, Taiyo Yuden, and TDK. Diode Selection. The diode should have a low forward voltage to reduce conduction losses. In addition, it should have a low capacitance to reduce switching losses. Schottky diodes can provide both these features, if carefully selected. The forward voltage drop is a natural advantage for Schottky diodes, and it reduces as the current rating increases. However, as the current rating increases, the diode capacitance also increases. As a result, the optimal selection is usually the lowest current rating above the circuit maximum. With the, a current rating in the range from 100 ma to 200 ma is usually sufficient. Capacitor Selection. Because the capacitor values are low, ceramic capacitors are the best choice for use with the. To reduce performance variation as temperature changes, low drift capacitor types, such as X7R and XR, should be used. Suitable capacitors are available from: Taiyo Yuden, Murata, Kemet, and AVX. Dimming Control LED brightness can be controlled either by modifying the voltage at the top of the sense resistor () to control the LED current, I LOAD, directly, or by using a PWM signal on the EN pin to chop the output. Feedback modulation. By adding a voltage drop between the FB pin and (the sense resistor), as shown in schematic 2, the LED current, I LOAD, can be made to decrease. As V C (control voltage) increases, the voltage drop across R2 also increases. This causes the voltage at FB to increase, and the reduces I LOAD to compensate. As V C increases further, the current drops to zero, and R2 maintains the full 9 mv on FB. Reducing V C diminishes the voltage across R2 until, at 9 mv on V C, there is no drop across R2 and the current level is defined by. Reducing V C below 9 mv causes I LOAD to increase further, due to the voltage drop across R2 in the reverse direction. This continues until, at zero volts on V C, there is approximately mv across R2. At that point, I LOAD (ma), is defined as: I LOAD = 100 mv / where is the resistance of the sense resister (Ω). PWM Control. LED dimming control can also be generated by a filtered PWM signal as shown in schematic 3. In this case, a 0% duty cycle (PWM = 0 V) corresponds to full brightness and a 100% duty cycle causes the LED current, I LOAD, to go to zero. 2.V to 4.2V 1µF 22µH D1 V C R2 kω R3 90kΩ Schematic 2. Dimming control with dc voltage feedback modulation 0.22µF 6

By applying a PWM signal directly to the EN pin, the is turned on or off, and I LOAD is either full (as defined by ) or zero. By varying the duty cycle of the PWM signal, the LED brightness can be controlled from off (0% duty cycle) to full (100% duty cycle). The PWM frequency should be in the range from 1 khz to 10 khz. Several other schemes are possible, for example, digitally switching additional resistors across to increase I LOAD. In this case, would be selected for the minimum desired brightness. Soft Start-Up To provide fast start-up operation, no soft start is implemented in the control circuit. At power-on, the bypass capacitor () is discharged, which means that the supply must provide the in-rush current through the inductor. This can be reduced by modulating the feedback with a softstart circuit as shown in schematic 4. When power is first applied, the capacitor C3 is discharged and pulls the FB pin high, reducing the output drive to minimum. As C3 charges, when the bottom drops below about 0.8 V, the feedback from the sense resistor () takes over full control of the output current. Overvoltage Protection An overvoltage event can occur when the LEDs become disconnected or fail in an open state. In these cases, the current flow through the sense resistor becomes zero, thus the feedback voltage becomes zero. The compensates by increasing the on time of the switch, which increases the output voltage. 2. V to 4.2 V 1 µf V C (PMW) 22 µh D1 A843 R4 10 kω R3 90 kω C3 100 nf R2 kω Schematic 3. Dimming control with filtered PWM 2.V to 4.2V 1µF 22µH D1 Schematic 4. Soft start operation C3 2.2 nf R2 1kΩ R3 kω 6.3 Ω 0.22 µf 0.22µF 7

Overvoltage protection for the requires a Zener diode to clamp the output voltage, as shown in schematic. The Zener voltage should be greater than the maximum output voltage of the LED string. The Zener diode also should be able to sink more than 0.1 ma of current. Parallel LED Strings The can be used to power parallel strings of LEDs, which have the same number of LEDs on each string. It is important that the voltage drop is the same across all of the parallel strings, to ensure that all of the LEDs are illuminated and that the current though each string is equal. A typical circuit with two parallel strings is shown in schematic 6. The coversion efficiency of this configuration is shown in chart 2. 2.V to 4.2V 1µF 22µH D1 R2 1kΩ Schematic. Overvoltage protection with Zener clamp 22µH D1 0.22µF 1µF 0.22µF 2.V to 4.2V R2 Schematic 6. Parallel strings of LEDs Conversion Efficiency for Two Parallel Strings 9 90 Efficiency (%) 8 80 7 70 Two 3-LED strings Two 4-LED strings Two 7-LED strings 6 2 3 4 6 7 8 9 10 Input Voltage (V) Chart 2. Conversion efficiency when driving two parallel strings of varying lengths 8

Terminal List Table Pin Name Function 1 Internal power FET 2 GND Ground 3 FB Feedback input 4 EN input Input supply Package EK 3.00 BSC.118 A 1 2 0.0 0.30 0.4 0.30.020.012.018.012 0.9 BSC.037 1 2 0.80 0.70 0.20.008 REF 0.0 0.80.002.031 0.00 0.70.000.028.031.028 0.7.030 NOM 0.0 MIN.020 R0.20 REF.008 0.7.030 NOM 0.1 MIN.006 2.10 1.8.083.073 B 0.0 MIN 1.10 0.8.020.043.033 Dimensions in millimeters U.S. Customary dimensions (in.) in brackets, for reference only A Pin index area B Exposed thermal pad C Optional thermal vias, 0.30 [.012], pitch 1.2 [.047] D Typical pad layout including solder pad for exposed thermal pad; adjust as necessary to meet application process requirements E Typical pad layout with contact pads only; adjust as necessary to meet application process requirements 3.40.134 REF 0.20 REF.008 C 1.10 MAX.043 3.40.134 REF E 1 0.9 BSC.037 D 1 0.9 BSC.037 2.10 MAX.083 9

The products described here are manufactured under one or more U.S. patents or U.S. patents pending. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail speci fi ca tions as may be required to permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro products are not authorized for use as critical components in life-support devices or sys tems without express written approval. The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use; nor for any in fringe ment of patents or other rights of third parties which may result from its use. Copyright 2003, 2004, 200 AllegroMicrosystems, Inc. 10