Features. Description. Table 1: Device summary Order code Marking Package Packaging STW45NM50 W45NM50 TO-247 Tube

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1 Electrical ratings Electrical characteristics Electrical characteristics (curves)... 6

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Transcription:

N-channel 500 V, 0.08 Ω typ., 45 A MDmesh Power MOSFET in a TO-247 package Datasheet - production data Features Order code VDS RDS(on) max ID 500 V 0.1 Ω 45 A TO-247 1 3 2 100% avalanche tested High dv/dt and avalanche capabilities Low input capacitance and gate charge Low gate input resistance Applications Switching applications Figure 1: Internal schematic diagram Description This N-channel Power MOSFET is developed using STMicroelectronics' revolutionary MDmesh technology, which associates the multiple drain process with the company's PowerMESH horizontal layout. This device offer extremely low on-resistance, high dv/dt and excellent avalanche characteristics. Utilizing ST's proprietary strip technique, this Power MOSFET boasts an overall dynamic performance which is superior to similar products on the market. Table 1: Device summary Order code Marking Package Packaging W45NM50 TO-247 Tube July 2016 DocID8477 Rev 6 1/12 This is information on a product in full production. www.st.com

Contents Contents 1 Electrical ratings... 3 2 Electrical characteristics... 4 2.1 Electrical characteristics (curves)... 6 3 Test circuits... 8 4 Package information... 9 4.1 TO-247 package information... 9 5 Revision history... 11 2/12 DocID8477 Rev 6

Electrical ratings 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±30 V ID Drain current (continuous) at TC = 25 C 45 A ID Drain current (continuous) at TC = 100 C 28.4 A IDM (1) Drain current (pulsed) 180 A PTOT Total dissipation at TC = 25 C 390 W dv/dt (2) Peak diode recovery voltage slope 15 V/ns Tstg Tj Storage temperature range Operating junction temperature range -55 to 150 C Notes: (1) Pulse width limited by safe operating area. (2) ISD 45 A, di/dt 400 A/µs, VDS(peak) V(BR)DSS, VDD 80% V(BR)DSS Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case 0.32 C/W Rthj-amb Thermal resistance junction-ambient 30 C/W Table 4: Avalanche characteristics Symbol Parameter Value Unit IAR EAS Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) Single pulse avalanche energy (starting TJ=25 C, ID=IAR, VDD=50 V) 15 A 700 mj DocID8477 Rev 6 3/12

Electrical characteristics 2 Electrical characteristics (TCASE = 25 C unless otherwise specified) Table 5: On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS IDSS Drain-source breakdown voltage Zero gate voltage drain current ID = 1 ma, VGS = 0 V 500 V VGS = 0 V, VDS = 500 V 10 VGS = 0 V, VDS = 500 V, TC= 125 C (1) IGSS Gate-body leakage current VDS = 0 V, VGS = ±30 V ±100 na VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µa 3 4 5 V RDS(on) Notes: Static drain-source onresistance (1) Defined by design, not subject to production test. 100 VGS = 10 V, ID = 22.5 A 0.08 0.1 Ω µa Table 6: Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance - 3290 - pf Coss Output capacitance VDS = 25 V, f = 1 MHz, - 865 - pf VGS Reverse transfer = 0 V Crss - 140 - pf capacitance Coss eq. (1) Equivalent output capacitance VGS = 0 V, VDS = 0 to 400 V - 270 - pf Qg Total gate charge VDD = 400 V, ID = 45 A, - 113 - nc Qgs Gate-source charge VGS = 10 V (see Figure 14: "Test circuit for gate charge - 17 - nc Qgd Gate-drain charge behavior") - 82 - nc RG Gate input resistance f = 1 MHz, ID= 0 A - 1.7 - Ω Notes: (1) Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDS 4/12 DocID8477 Rev 6

Table 7: Switching times Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time VDD = 250 V, ID = 22.5 A, RG = 4.7 Ω, - 29.1 - ns VGS = 10 V (see Figure 15: "Test tr Rise time circuit for inductive load switching and diode recovery times") - 73.6 - ns Off-voltage rise VDD = 400 V, ID = 45 A, RG = 4.7 Ω, time VGS = 10 V (see Figure 15: "Test - 20.8 - ns tf Fall time circuit for inductive load switching and - 58.3 - ns tc Cross-over time diode recovery times") - 67.6 - ns tr(voff) Table 8: Source-drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD Source-drain current - 45 A ISDM (1) Source-drain current (pulsed) - 180 A VSD (2) Forward on voltage ISD = 45 A, VGS = 0 V - 1.5 V trr Reverse recovery time ISD = 45 A, di/dt = 100 A/µs Qrr IRRM Reverse recovery charge Reverse recovery current VDD = 60 V (see Figure 15: "Test circuit for inductive load switching and diode recovery times") trr Reverse recovery time ISD = 45 A, di/dt = 100 A/µs Qrr IRRM Notes: Reverse recovery charge Reverse recovery current (1) Pulse width limited by safe operating area. (2) Pulsed: pulse duration = 300 µs, duty cycle 1.5% VDD = 100 V, Tj = 150 C (see Figure 15: "Test circuit for inductive load switching and diode recovery times") - 454 ns - 9380 nc - 41.3 A - 567 ns - 12700 nc - 44.8 A DocID8477 Rev 6 5/12

Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2: Safe operating area Figure 3: Thermal impedance d Figure 4: Output characteristics Figure 5: Transfer characteristics Figure 6: Gate charge vs gate-source voltage Figure 7: Static drain-source on resistance 6/12 DocID8477 Rev 6

Figure 8: Capacitance variations Electrical characteristics Figure 9: Normalized gate threshold voltage vs temperature Figure 10: Normalized on-resistance vs temperature Figure 11: Normalized V(BR)DSS vs temperature Figure 12: Source-drain diode forward characteristics DocID8477 Rev 6 7/12

Test circuits 3 Test circuits Figure 13: Test circuit for resistive load switching times Figure 14: Test circuit for gate charge behavior Figure 15: Test circuit for inductive load switching and diode recovery times Figure 16: Unclamped inductive load test circuit Figure 17: Unclamped inductive waveform Figure 18: Switching time waveform 8/12 DocID8477 Rev 6

Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 4.1 TO-247 package information Figure 19: TO-247 package outline DocID8477 Rev 6 9/12

Package information Table 9: TO-247 package mechanical data mm Dim. Min. Typ. Max. A 4.85 5.15 A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c 0.40 0.80 D 19.85 20.15 E 15.45 15.75 e 5.30 5.45 5.60 L 14.20 14.80 L1 3.70 4.30 L2 18.50 ØP 3.55 3.65 ØR 4.50 5.50 S 5.30 5.50 5.70 10/12 DocID8477 Rev 6

Revision history 5 Revision history Table 10: Document revision history Date Revision Changes 30-Mar-2005 4 Modified value on Source drain diode 23-Jul-2009 5 Modified values on Switching times 18-Jul-2016 6 Modified: Table 2: "Absolute maximum ratings", Table 3: "Thermal data", Table 4: "Avalanche characteristics", Table 5: "On/off states", Table 6: "Dynamic", Table 7: "Switching times" and Table 8: "Source-drain diode" Modified: Section 5.1: "Electrical characteristics (curves)" Updated: Section 7.1: "TO-247 package information" DocID8477 Rev 6 11/12

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2016 STMicroelectronics All rights reserved 12/12 DocID8477 Rev 6