High Voltage Surface Mount Input Rectifier Diode, 25 2 D 2 PK (TO-263) node PRIMRY CHRCTERISTICS 3 ase cathode 2 3 node I F(V) 25 V R 2 V V F at I F.4 V I FSM 3 T J max. 5 C Package D 2 PK (TO-263) Circuit configuration Single FETURES Meets MSL level, per J-STD-2, LF maximum peak of 245 C Glass passivated pellet chip junction EC-Q qualified Meets JESD 2 class whisker test Flexible solution for reliable C power rectification High surge, low V F rugged blocking diode for DC charging stations Material categorization: for definitions of compliance please see /doc?9992 PPLICTIONS Input rectification On-board and off-board EV / HEV battery chargers DESCRIPTION The rectifier High Voltage Series has been optimized for very low forward voltage drop, with moderate leakage. OUTPUT CURRENT IN TYPICL PPLICTIONS PPLICTIONS SINGLE-PHSE RIDGE THREE-PHSE RIDGE UNITS Capacitive input filter T = 55 C, T J = 25 C common heatsink of C/W 2 23 MJOR RTINGS ND CHRCTERISTICS SYMOL CHRCTERISTICS VLUES UNITS I F(V) Sinusoidal waveform 25 V RRM 2 V I FSM 3 V F, T J = 25 C. V T J -4 to +5 C VOLTGE RTINGS PRT NUMER V RRM, MXIMUM PEK REVERSE VOLTGE V V RSM, MXIMUM NON-REPETITIVE PEK REVERSE VOLTGE V I RRM T 5 C m 2 3 Revision: 22-Feb-8 Document Number: 96425 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T /doc?9
SOLUTE MXIMUM RTINGS PRMETER SYMOL TEST CONDITIONS VLUES UNITS Maximum average forward current I F(V) T C = 6 C, 8 conduction half sine wave 25 Maximum peak one cycle ms sine pulse, rated V RRM applied 25 I non-repetitive surge current FSM ms sine pulse, no voltage reapplied 3 Maximum I 2 t for fusing I 2 ms sine pulse, rated V RRM applied 36 t 2 s ms sine pulse, no voltage reapplied 442 Maximum I 2 t for fusing I 2 t t =. ms to ms, no voltage reapplied 442 2 s ELECTRICL SPECIFICTIONS PRMETER SYMOL TEST CONDITIONS VLUES UNITS Maximum forward voltage drop V FM 25, T J = 25 C.4 V Forward slope resistance r t.4 m T J = 5 C Threshold voltage V F(TO).85 V T J = 25 C. Maximum reverse leakage current I RM V R = rated V RRM T J = 5 C. m THERML - MECHNICL SPECIFICTIONS PRMETER SYMOL TEST CONDITIONS VLUES UNITS Maximum junction and storage temperature range T J, T Stg -4 to +5 C Maximum thermal resistance, junction to case R thjc DC operation.9 Maximum thermal resistance, junction to ambient Typical thermal resistance, case to heatsink R thj () For D 2 PK version 62 R thcs Mounting surface, smooth, and greased.5 2 g pproximate weight.7 oz. Marking device Case style D 2 PK (TO-263) 25ETS2SH Note () When mounted on square (65 mm 2 ) PC of FR-4 or G- material 4 oz. (4 μm) copper 4 C/W C/W Revision: 22-Feb-8 2 Document Number: 96425 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T /doc?9
Maximum llowable Case Temperature ( C) 5 4 3 2 9 8 R thjc (DC) =.9 K/W 3 6 Conduction angle 9 2 8 5 5 2 25 3 Maximum verage Forward Power Loss (W) 6 5 4 3 2 DC 8 2 9 6 3 RMS limit Conduction period T J = 5 C 2 3 4 verage Forward Current () verage Forward Current () Fig. - Current Rating Characteristics Fig. 4 - Forward Power Loss Characteristics Maximum llowable Case Temperature ( C) 5 4 3 2 3 R thjc (DC) =.9 K/W 6 9 2 Conduction period 8 DC Peak Half Sine Wave Forward Current () 3 2 t any rated load condition and with rated V RRM applied following surge. Initial T J = 5 C at 6 Hz.83 s at 5 Hz. s 9 5 5 2 25 3 35 4 verage Forward Current () Fig. 2 - Current Rating Characteristics Number of Equal mplitude Half Cycle Current Pulses (N) Fig. 5 - Maximum Non-Repetitive Surge Current Maximum verage Forward Power Loss (W) 4 35 3 25 2 5 5 8 2 9 6 3 RMS limit Conduction angle T J = 5 C 5 5 2 25 3 Peak Half Sine Wave Forward Current () 3 2. Maximum non-repetitive surge current versus pulse train duration. Initial T J = 5 C No voltage reapplied Rated V RRM reapplied. verage Forward Current () Pulse Train Duration (s) Fig. 3 - Forward Power Loss Characteristics Fig. 6 - Maximum Non-Repetitive Surge Current Revision: 22-Feb-8 3 Document Number: 96425 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T /doc?9
Instantaneous Forward Current () T J = 25 C T J = 5 C 2 3 4 5 Instantaneous Forward Voltage (V) Fig. 7 - Forward Voltage Drop Characteristics Z thjc - Transient Thermal Impedance ( C/W). Single pulse D =.5 D =.33 D =.25 D =.7 D =.8 Steady state value (DC operation)..... Square Wave Pulse Duration (s) Fig. 8 - Thermal Impedance Z thjc Characteristics Revision: 22-Feb-8 4 Document Number: 96425 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T /doc?9
ORDERING INFORMTION TLE Device code VS- 25 E T S 2 S L H M3 2 3 4 5 6 7 8 9 - product 2 - Current rating (25 = 25 ) 3 - Circuit configuration E = single diode 4 - Package: T = D 2 PK 5 - Type of silicon: S = standard recovery rectifier 6 - Voltage code x = V RRM 7 - S = surface mountable 2 = 2 V 8 - L = tape and reel (left oriented), for different orientation, contact factory 9 - H = EC-Q qualified - Environmental digit: M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free ORDERING INFORMTION (Example) PREFERRED P/N QUNTITY PER REEL MINIMUM ORDER QUNTITY PCKGING DESCRIPTION 8 8 3" diameter reel LINKS TO RELTED DOCUMENTS Dimensions Part marking information Packaging information SPICE model /doc?9546 /doc?95444 /doc?9637 /doc?9549 Revision: 22-Feb-8 5 Document Number: 96425 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T /doc?9
DIMENSIONS in millimeters and inches D 2 PK Outline Dimensions Conforms to JEDEC outline D 2 PK (SMD-22) (3) L (2)(3) E 4 c2 (E) (D) (3) Pad layout. (.43) 9.65 (.38) D L2 2 x e 2 3 H (2) 2 x b2 2 x b C Detail. M M c ±.4 M E View - H (3) 7.9 (.7) 5. (.625) 2.32 (.8) Plating 2.64 (.3) 2.4 (.96) (4) b, b3 3.8 (.5) ase Metal Gauge plane Lead tip to 8 L3 L L4 Detail Rotated 9 CW Scale: 8: Seating plane (c) (b, b2) Section - and C - C Scale: None c (4) SYMOL MILLIMETERS INCHES MILLIMETERS INCHES NOTES SYMOL MX. MX. MX. MX. NOTES 4.6 4.83.6.9 D 6.86 8..27.35 3..254.. E 9.65.67.38.42 2, 3 b.5.99.2.39 E 7.9 8.8.3.346 3 b.5.89.2.35 4 e 2.54 SC. SC b2.4.78.45.7 H 4.6 5.88.575.625 b3.4.73.45.68 4 L.78 2.79.7. c.38.74.5.29 L -.65 -.66 3 c.38.58.5.23 4 L2.27.78.5.7 c2.4.65.45.65 L3.25 SC. SC D 8.5 9.65.335.38 2 L4 4.78 5.28.88.28 Notes () Dimensioning and tolerancing per SME Y4.5 M-994 (2) Dimension D and E do not include mold flash. Mold flash shall not exceed.27 mm (.5") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L, D and E (4) Dimension b and c apply to base metal only (5) Datum and to be determined at datum plane H (6) Controlling dimension: inch (7) Outline conforms to JEDEC outline TO-263 Revision: 8-Jul-5 Document Number: 9546 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T /doc?9
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