MDD4N25 N-Channel MOSFET 250V, 3.0A, 1.75Ω

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Transcription:

MDDN5 N-Channel MOSFET 5V, 3.A,.75Ω General Description The MDDN5 uses advanced Magnachip s MOSFET Technology, which provides low on-state resistance, high switching performance and excellent quality. MDDN5 is suitable device for SMPS, HID and general purpose applications. Features V DS = 5V = 3.A R DS(ON).75Ω Applications Power Supply PFC LED TV @V GS = V Absolute Maximum Ratings (Ta = 5 o C) Characteristics Symbol Rating Unit Drain-Source Voltage V DSS 5 V Gate-Source Voltage V GSS ±3 V Continuous Drain Current T C=5 o C 3. A T C= o C.9 A Pulsed Drain Current () M A Power Dissipation T C=5 o C P D 37 W Derivate above 5 o C.9 W/ o C Peak Diode Recovery dv/dt (3) dv/dt 5.5 V/ns Repetitive Pulse Avalanche Energy () E AR 3.7 mj Avalanche current () I AR 3. A Single Pulse Avalanche Energy () E AS 5 mj Junction and Storage Range T J, T stg -55~5 o C Thermal Characteristics Characteristics Symbol Rating Unit Thermal Resistance, Junction-to-Ambient () R θja Thermal Resistance, Junction-to-Case () R θjc 3. o C/W

Ordering Information Part Number Temp. Range Package Packing RoHS Status MDDN5RH -55~5 o C D-PAK Reel and Tape Halogen Free Electrical Characteristics (Ta =5 o C) Static Characteristics Characteristics Symbol Test Condition Min Typ Max Unit Drain-Source Breakdown Voltage BV DSS = 5μA, V GS = V 5 - - Gate Threshold Voltage V GS(th) V DS = V GS, = 5μA 3. - 5. Drain Cut-Off Current SS V DS = 5V, V GS = V - - μa Gate Leakage Current I GSS V GS = ±3V, V DS = V - - na Drain-Source ON Resistance R DS(ON) V GS = V, =.5A.38.75 Ω Forward Transconductance g fs V DS = 3V, =.5A -.7 - S Dynamic Characteristics Total Gate Charge Q g -. - Gate-Source Charge Q gs V DS = V, = 3.6A, V GS = V -.35 - Gate-Drain Charge Q gd -.95 - Input Capacitance C iss - 6 - Reverse Transfer Capacitance C rss V DS = 5V, V GS = V, f =.MHz - 3 - Output Capacitance C oss - 3 - Turn-On Delay Time t d(on) - 8 - Rise Time t r V GS = 5V, V DS = 5V, = 3.6A, - - Turn-Off Delay Time t d(off) R G = 5Ω - 5 - Fall Time t f - 6 - Drain-Source Body Diode Characteristics Maximum Continuous Drain to Source Diode Forward Current I S - - 3. A Source-Drain Diode Forward Voltage V SD I S = 3.A, V GS = V - -.5 V Body Diode Reverse Recovery Time t rr - - ns I F = 3.6A, di/dt = A/μs (3) Body Diode Reverse Recovery Charge Q rr -.3 - μc V nc pf ns Note :. Pulse width is based on R θjc & R θja and the maximum allowed junction temperature of 5 C.. Pulse test: pulse width 3us, duty cycle %, pulse width limited by junction temperature T J(MAX)=5 C. 3. I SD 3.6A, di/dt 3A/us, V DD BVdss, R g =5Ω, Starting T J=5 C. L=9.3mH, I AS=3.A, V DD=5V, R g =5Ω, Starting T J=5 C

(A) BV DSS, (Normalized) Drain-Source Breakdown Voltage,Drain Current [A] R DS(ON) [Ω ] Reverse Drain Current [A] R DS(ON), (Normalized) Drain-Source On-Resistance 6 5 V gs =5.5V =6.V =6.5V =7.V =8.V =V =5V Notes. 5 μs Pulse Test. T C =5 3 3 VGS=V V GS =V 3 5 6 7 8 9 3 5 6 7 8 9 V DS,Drain-Source Voltage [V] Fig. On-Region Characteristics 3 5 6 7 8,Drain Current [A] Fig. On-Resistance Variation with Drain Current and Gate Voltage 3...5. V GS = V. =3.A. V GS = V. = 5 μa...5...9.5. -5 5 5 T J, Junction [ o C] Fig.3 On-Resistance Variation with.8-5 5 5 T J, Junction [ o C] Fig. Breakdown Voltage Variation vs. * Notes ;. Vds=3V R 5. V GS = V.5 s Pulse test 5 5 5-55. 3 5 6 7 8 9 V GS [V] Fig.5 Transfer Characteristics....6.8.. V SD, Source-Drain Voltage [V] Fig.6 Body Diode Forward Voltage Variation with Source Current and 3

Power (W), Drain Current [A], Drain Current [A] Z θ JC (t), Thermal Response V GS, Gate-Source Voltage [V] Capacitance [pf] Note : = 3.6A 5V 5V C oss C iss = C gs + C gd (C ds = shorted) C oss = C ds + C gd C rss = C gd 8 V C iss 6 C rss Notes ;. V GS = V. f = MHz 3 5 Q G, Total Gate Charge [nc] Fig.7 Gate Charge Characteristics V DS, Drain-Source Voltage [V] Fig.8 Capacitance Characteristics Operation in This Area is Limited by R DS(on) - - Single Pulse T J =Max rated T C =5 ms DC ms ms - V DS, Drain-Source Voltage [V] s - - D=.5...5.. single pulse Duty Factor, D=t /t PEAK T J = P DM * Z θ JC * R θ JC (t) + T C R Θ JC =3. /W -5 - -3 - - t, Rectangular Pulse Duration [sec] Fig.9 Maximum Safe Operating Area Fig. Transient Thermal Response Curve 5 single Pulse R thjc = 3. /W T C = 5. 3.5 3..5. 5.5..5 E- E-3.. Pulse Width (s) Fig. Single Pulse Maximum Power Dissipation. 5 5 75 5 5 T C, Case [ ] Fig. Maximum Drain Current vs. Case

Physical Dimension D-PAK, 3L Dimensions are in millimeters, unless otherwise specified 5

DISCLAIMER: The Products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power generation, medical appliances, and devices or systems in which malfunction of any Product can reasonably be expected to result in a personal injury. Seller s customers using or selling Seller s products for use in such applications do so at their own risk and agree to fully defend and indemnify Seller. MagnaChip reserves the right to change the specifications and circuitry without notice at any time. MagnaChip does not consider responsibility for use of any circuitry other than circuitry entirely included in a MagnaChip product. is a registered trademark of MagnaChip Semiconductor Ltd. 6