3A, 8 mω Ultra Low On resistance Load Switch IC with Reverse Current Blocking and Thermal Shutdown function

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TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic TCK111G, TCK112G 3A, 8 mω Ultra Low On resistance Load Switch IC with Reverse Current Blocking and Thermal Shutdown function The TCK111G and TCK112G are Load Switch ICs for power management with Reverse Current Blocking and Thermal Shutdown function featuring ultra low switch on resistance, high output current and wide input voltage operation from 1.1 to 5.5 V. Switch ON resistance is only 8.3 mω (typ.) at V IN = 5.0 V, -1.5 A load conditions and output current is available on 3.0 A. And these feature a slew rate control driver and output auto-discharge function. This device is available in 0.5 mm pitch ultra small package WCSP6C (1.0 mm x 1.5 mm, t: 0.5 mm (typ.)).thus this devices is ideal for portable applications that require high-density board assembly such as cellular phone. WCSP6C Weight: 1.4 mg (typ.) Feature Low ON resistance: R ON = 8.3 mω (typ.) at V IN = 5.0 V, -1.5 A R ON = 8.4 mω (typ.) at V IN = 3.3 V, -1.5 A R ON = 8.4 mω (typ.) at V IN = 1.8 V, -1.5 A R ON = 8.5 mω (typ.) at V IN = 1.1 V, -1.5 A Wide input voltage operation: V IN = 1.1 to 5.5 V Reverse current blocking Inrush current reducing circuit Thermal Shutdown function Output auto-discharge ( TCK112G ) Pull down connection between CONTROL and GND Ultra small package : WCSP6C (1.0mm x 1.5mm, t: 0.5 mm(typ.)) 1

Absolute Maximum Ratings (Ta = 25 C) Characteristics Symbol Rating Unit Input voltage V IN -0.3 to 6.0 V Control voltage V CT -0.3 to 6.0 V Output voltage V OUT -0.3 to 6.0 V DC 3.0 A Output current I OUT Pulse 4.0 (Note 1) A Power dissipation P D 1.2 (Note 2) W Operating temperature range T opr 40 to 85 C Junction temperature Tj 150 C Storage temperature T stg 55 to 150 C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ( Handling Precautions / Derating Concept and Methods ) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note1: 100 μs pulse, 2% duty cycle Note2: Rating at mounting on a board (Board material: Glass epoxy (FR4) Board dimension: 25.4mm x 25.4mm (both sides of board),t=1.6mm, Cu pad area: 645mm 2 ) Pin Assignment(Top view) Top marking 1 2 A B C A1: VOUT B1: VOUT C1: GND A2: VIN B2: VIN C2: CONTROL Index Lot trace code V: TCK111G W: TCK112G 2

Block Diagram Reverse Current Blocking V IN V OUT Charge Pump Q 1 Thermal Shut down Control CONTROL Logic Slew Rate Control Driver Q 2 Pull Down Output Discharge (TCK112G only) GND Function table Part number Function Reverse current blocking Thermal shutdown Output auto-discharge Control pin connection TCK111G Built in Built in N/A Pull down TCK112G Built in Built in Built in Pull down Operation Logic table 1.1 V V IN 5.5 V (Ta = -40 to 85 C) Control High Control Low Control OPEN TCK111G TCK112G Output Q 1 ON ON Discharge Q 2 OFF Reverse current block Active Active Output Q 1 OFF OFF Discharge Q 2 ON Reverse current block Active Active Output Q 1 OFF OFF Discharge Q 2 ON Reverse current block Active Active 3

Electrical Characteristics DC Characteristics (Ta = -40 to 85 C) Characteristics Symbol Test Condition Ta = 25 C Ta = 40 to 85 C Min Typ. Max Min Max Unit Input voltage V IN 1.1 5.5 1.1 5.5 V 1.2V < V IN 5.5 V 1.0 1.0 CONTROL High-level input voltage V IH V 1.1V V IN 1.2 V 0.9 0.9 CONTROL Low-level input voltage V IL V IN = 1.1 to 5.5 V 0.4 0.4 V V IN = V CT = 1.1 V 55 μa Quiescent current ( ON state) I Q I OUT = 0 ma V IN = V CT = 1.8 V 50 μa V IN = V CT = 3.3 V 48 μa V IN = V CT = 5.0 V 69 106 μa Standby current ( OFF state) I Q(OFF) V IN = 5.5 V, V CT = 0 V, V OUT = OPEN (Note 3) 0.5 1.4 μa Reverse blocking current I RB V OUT = 5.0 V, = 0 V, V CT = 0 V V IN 0.6 10 μa Reverse blocking voltage threshold V RB V OUT V IN 40 mv Reverse blocking release voltage threshold V RBR V OUT V IN -30 mv On resistance R ON I OUT = -1.5 A V IN = 5.0 V 8.3 15 V IN = 3.3 V 8.4 V IN = 1.8 V 8.4 V IN = 1.1 V 8.5 15 mω Output discharge on resistance R SD (TCK112G) 380 Ω Note 3 : Except OFF-state switch current ( I SD(OFF) : V IN = 5.5 V, V CT = 0 V, V OUT = GND ). AC Characteristics (Ta = 25 C) Characteristics Symbol Test Condition(Figure 1) Min Typ. Max Unit V OUT rise time t r V IN = 5.0 V, R L = 2.5 Ω, C L =1.0 μf 0.5 ms V OUT fall time t f V IN = 5.0 V, R L = 2.5 Ω, C L =1.0 μf 5 μs Turn on delay t ON V IN = 5.0 V, R L = 2.5 Ω, C L =1.0 μf 0.2 ms Turn off delay t OFF V IN = 5.0 V, R L = 2.5 Ω, C L =1.0 μf 4 μs AC Waveform t r t f V CT 50% 50% V IH V OUT 90% 90% V IL 10% 10% V OUT t ON 10% 90% t OFF V OH V OL Figure 1 t r, t f, t ON, t OFF Waveforms 4

Application Note 1. Application circuit example (top view) The figure below shows the recommended configuration for TCK111G and TCK112G. CONTROL GND VIN V OUT LOAD C IN 1.0 μf C OUT 1.0 μf C L R L 1) Input and Output capacitor An input capacitor (C IN ) and an output capacitor (C OUT ) are necessary for the stable operation of TCK111G and TCK112G. And it is effective to reduce voltage overshoot or undershoot due to sharp changes in output current and also for improved stability of the power supply. When used, place C IN and C OUT more than 1.0μF as close to V IN pin to improve stability of the power supply. 2) Control pin A control pins for TCK111G and TCK112G are both Active High, which controls both the pass-through n-ch MOSFET and the discharge n-ch MOSFET (only for TCK112G), operated by the control voltage and Schmitt trigger. When the control voltage level is High, Output n-ch MOSFET is ON state and discharge n-ch MOSFET is OFF state. When control voltage level is Low, and the state of the MOSFETs is reversed. Also, pull down resistance equivalent to a few MΩ is connected between CONTROL and GND, thus the load switch IC is in OFF state even when CONTROL pin is OPEN. In addition, CONTROL pin has a tolerant function such that it can be used even if the control voltage is higher than the input voltage. 2. Reverse current blocking Reverse current blocking function is designed in these products. This function is active regardless output n-ch MOSFET ON/OFF state in condition that V IN is supplied However these does not assure for the suppression of uprising device operation. In use of these products, please read through and understand dissipation idea for absolute maximum ratings from the above mention or our Semiconductor Reliability Handbook. Then use these products under absolute maximum ratings in any condition. Furthermore, Toshiba recommend inserting failsafe system into the design. 3. Thermal shut down function Thermal shutdown function is designed in these products, but these does not assure for the suppression of uprising device operation. In use of these products, please read through and understand dissipation idea for absolute maximum ratings from the above mention or our Semiconductor Reliability Handbook. Then use these products under absolute maximum ratings in any condition. Furthermore, Toshiba recommend inserting failsafe system into the design. 5

4. Power Dissipation Board-mounted power dissipation ratings for TCK111G and TCK112G are available in the Absolute Maximum Ratings table. Power dissipation is measured on the board condition shown below. [The Board Condition] Board material: Glass epoxy (FR4) Board dimension: 25.4mm x 25.4mm (both sides of board),t=1.6mm, Cu pad area: 645mm 2 1600 P D Ta (WCSP6C) Power dissipation PD (mw) 1200 800 400 0 40 0 40 80 120 Ambient temperature Ta ( C) Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into consideration the ambient temperature, input voltage, output current etc. and applying the appropriate derating for allowable power dissipation during operation. 6

Representative Typical Characteristics 1) ON resistance ON resistance RON (mω) 12 11 10 9 8 R ON - V IN I OUT = -1.5A Ta = 25 C ON resistance RON (mω) 12 11 10 9 8 R ON - I OUT V IN = 1.1 V Ta = 25 C 7 0 1.0 2.0 3.0 4.0 5.0 5.5 Input voltage V IN (V) 7 0 0.5 1.0 1.5 2.0 2.5 3.0 Output current I OUT (A) 2) Quiescent current Quiescent current(on) IQ (μa) 180 150 120 90 60 30 0 0 I Q (ON) - V IN I OUT = 0 ma Ta = 25 C 1 2 3 4 5 6 Input voltage V IN (V) 7

Package dimension WCSP6C Unit: mm Weight: 1.4 mg (typ.) 8

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