Features. Description. Table 1: Device summary Order code Marking Package Packing STF24N60DM2 24N60DM2 TO-220FP Tube

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Transcription:

N-channel 600 V, 0.175 Ω typ., 18 A MDmesh DM2 Power MOSFET in a TO-220FP package Datasheet - production data Features Order code VDS @ TJmax RDS(on) max. ID 650 V 0.200 Ω 18 A TO-220FP Fast-recovery body diode Extremely low gate charge and input capacitance Low on-resistance 100% avalanche tested Extremely high dv/dt ruggedness Zener-protected Figure 1: Internal schematic diagram Applications Switching applications Description This high voltage N-channel Power MOSFET is part of the MDmesh DM2 fast recovery diode series. It offers very low recovery charge (Qrr) and time (trr) combined with low RDS(on), rendering it suitable for the most demanding high efficiency converters and ideal for bridge topologies and ZVS phase-shift converters. Table 1: Device summary Order code Marking Package Packing 24N60DM2 TO-220FP Tube September 2016 DocID025498 Rev 5 1/13 This is information on a product in full production. www.st.com

Contents Contents 1 Electrical ratings... 3 2 Electrical characteristics... 4 2.1 Electrical characteristics (curves)... 6 3 Test circuits... 8 4 Package information... 9 4.1 TO-220FP package information... 10 5 Revision history... 12 2/13 DocID025498 Rev 5

Electrical ratings 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ± 25 V ID (1) Drain current (continuous) at TC = 25 C 18 Drain current (continuous) at TC= 100 C 11 IDM (2)(1) Drain current (pulsed) 72 A PTOT Total dissipation at TC = 25 C 30 W dv/dt (3) Peak diode recovery voltage slope 40 dv/dt (4) MOSFET dv/dt ruggedness 50 VISO Tstg Tj Notes: (1) Limited by package. Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; TC = 25 C) Storage temperature range Max. operating junction temperature range (2) Pulse width is limited by safe operating area. (3) ISD 18 A, di/dt 400 A/µS, VDS(peak) < V(BR)DSS, VDD = 400 V. (4) VDS 480 V. A V/ns 2500 V 55 to 150 C Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max. 4.2 Rthj-amb Thermal resistance junction-ambient max. 62.5 C/W Table 4: Avalanche characteristics Symbol Parameter Value Unit IAR EAS Avalanche current, repetitive or not repetitive (pulse width limited by TJmax) Single pulse avalanche energy (starting TJ =25 C, ID = IAR; VDD = 50 V) 3.5 A 180 mj DocID025498 Rev 5 3/13

Electrical characteristics 2 Electrical characteristics (Tcase= 25 C unless otherwise specified) Table 5: On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS IDSS IGSS Drain-source breakdown voltage Zero gate voltage drain current Gate-body leakage current VGS = 0 V, ID = 1 ma 600 V VGS = 0 V, VDS = 600 V 1.5 µa VGS = 0 V, VDS = 600 V, TC = 125 C (1) 100 µa VDS = 0 V, VGS = ±25 V ±10 µa VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µa 3 4 5 V RDS(on) Notes: Static drain-source onresistance (1) Defined by design, not subject to production test. VGS = 10 V, ID = 9 A 0.175 0.200 Ω Table 6: Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance - 1055 - pf Coss Output capacitance VDS = 100 V, f = 1 MHz, - 56 - pf VGS = 0 V Reverse transfer Crss - 2.4 - pf capacitance Coss eq. (1) Equivalent output capacitance VDS = 0 to 480 V, VGS = 0 V - 259 - pf RG Intrinsic gate resistance f = 1 MHz, ID = 0 A - 7 - Ω Qg Total gate charge VDD = 480 V, ID = 18 A, - 29 - nc VGS = 10 V Qgs Gate-source charge - 6 - nc (see Figure 15: "Test circuit for Qgd Gate-drain charge gate charge behavior") - 12 - nc Notes: (1) Coss eq. is defined as a constant equivalent capacitance giving the same charging time as COSS when VDS increases from 0 to 80% VDSS. 4/13 DocID025498 Rev 5

Electrical characteristics Table 7: Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time VDD = 300 V, ID = 9 A - 15 - ns RG = 4.7 Ω, VGS = 10 V tr Rise time - 8.7 - ns (see Figure 14: "Test circuit for td(off) Turn-off-delay time resistive load switching times" - 60 - ns tf Fall time and Figure 19: "Switching time waveform") - 15 - ns Table 8: Source-drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD Source-drain current - 18 A ISDM (1) Source-drain current (pulsed) - 72 A VSD (2) Forward on voltage VGS = 0 V, ISD = 18 A - 1.6 V trr Qrr IRRM trr Qrr IRRM Notes: Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current (1) Pulse width is limited by safe operating area. (2) Pulse test: pulse duration = 300 µs, duty cycle 1.5%. ISD = 18 A, di/dt = 100 A/µs, VDD = 60 V (see Figure 16: "Test circuit for inductive load switching and diode recovery times") ISD = 18 A, di/dt = 100 A/µs, VDD = 60 V, Tj = 150 C (see Figure 16: "Test circuit for inductive load switching and diode recovery times") - 155 ns - 956 nc - 12.5 A - 200 ns - 1450 nc - 13 A DocID025498 Rev 5 5/13

Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2: Safe operating area Figure 3: Thermal impedance Figure 4: Output characteristics Figure 5: Transfer characteristics Figure 6: Gate charge vs gate-source voltage Figure 7: Static drain-source on-resistance 6/13 DocID025498 Rev 5

Figure 8: Capacitance variations Electrical characteristics Figure 9: Output capacitance stored energy Figure 10: Normalized gate threshold voltage vs temperature Figure 11: Normalized on-resistance vs temperature Figure 12: Source-drain diode forward characteristics Figure 13: Normalized V(BR)DSS vs temperature DocID025498 Rev 5 7/13

Test circuits 3 Test circuits Figure 14: Test circuit for resistive load switching times Figure 15: Test circuit for gate charge behavior Figure 16: Test circuit for inductive load switching and diode recovery times Figure 17: Unclamped inductive load test circuit Figure 18: Unclamped inductive waveform Figure 19: Switching time waveform 8/13 DocID025498 Rev 5

Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DocID025498 Rev 5 9/13

Package information 4.1 TO-220FP package information Figure 20: TO-220FP package outline 10/13 DocID025498 Rev 5

Package information Table 9: TO-220FP package mechanical data mm Dim. Min. Typ. Max. A 4.4 4.6 B 2.5 2.7 D 2.5 2.75 E 0.45 0.7 F 0.75 1 F1 1.15 1.70 F2 1.15 1.70 G 4.95 5.2 G1 2.4 2.7 H 10 10.4 L2 16 L3 28.6 30.6 L4 9.8 10.6 L5 2.9 3.6 L6 15.9 16.4 L7 9 9.3 Dia 3 3.2 DocID025498 Rev 5 11/13

Revision history 5 Revision history Table 10: Document revision history Date Revision Changes 12-Nov-2013 1 First release. 21-Jan-2014 2 03-Mar-2014 3 05-Mar-2015 4 20-Sep-2016 5 Modified: dv/dt value in Table 2 Modified: IAR value in Table 4 Modified: IDSS and VGS(th) in Table 5 Minor text changes Modified: Figure 1 Modified: PTOT value and note 1 in Table 2 Modified: Rthj-case value in Table 3 Modified: IAR value in Table 4 Minor text changes Document status promoted from preliminary to production data. Updated title, features and description in cover page. Updated Figure 2: "Safe operating area". Minor text changes 12/13 DocID025498 Rev 5

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2016 STMicroelectronics All rights reserved DocID025498 Rev 5 13/13