FQPF9N50CF N-Channel QFET FRFET MOSFET 500 V, 9 A, 850 mω Description This N-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, active power factor correction (PFC), and electronic lamp ballasts. Features December 2013 9 A, 500 V, R DS(on) = 850 mω (Max.) @ = 10 V, = 4.5 A Low Gate Charge (Typ. 28 nc) Low Crss (Typ. 24 pf) 100% Avalanche Tested Fast Recovery Body Diode (Typ. 100 ns) D G DS G TO-220F S Absolute Maximum Ratings T C = 25 C unless otherwise noted. Symbol Parameter FQPF9N50CF Unit S Drain-Source Voltage 500 V Drain Current - Continuous (T C = 25 C) 9* A - Continuous (T C = 100 C) 5.4* A M Drain Current - Pulsed (Note 1) 36* A S Gate-Source Voltage ± 30 V E AS Single Pulsed Avalanche Energy (Note 2) 360 mj I AR Avalanche Current (Note 1) 9 A E AR Repetitive Avalanche Energy (Note 1) 4.4 mj dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns P D Power Dissipation (T C = 25 C) 44 W - Derate above 25 C 0.35 W/ C T J, T STG Operating and Storage Temperature Range -55 to +150 C T L Maximum Lead Temperature for Soldering, 1/8 from Case for 5 Seconds. 300 C * Drain current limited by maximum junction temperature Thermal Characteristics Symbol Parameter FQPF9N50CF Unit R θjc Thermal Resistance, Junction to Case, Max. 2.86 o C/W R θja Thermal Resistance, Junction to Ambient, Max. 62.5 1
Package Marking and Ordering Information Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity FQPF9N50CF FQPF9N50CF TO-220F Tube N/A N/A 50 units Electrical Characteristics T C = 25 C unless otherwise noted. Symbol Parameter Test Conditions Min. Typ. Max. Unit Off Characteristics BS Drain-Source Breakdown Voltage = 0 V, = 250 µa 500 -- -- V BS / T J Breakdown Voltage Temperature Coefficient = 250 µa, Referenced to 25 C -- 0.57 -- V/ C SS Zero Gate Voltage Drain Current = 500 V, = 0 V -- -- 10 µa = 400 V, T C = 125 C -- -- 100 µa I GSSF Gate-Body Leakage Current, Forward = 30 V, = 0 V -- -- 100 na I GSSR Gate-Body Leakage Current, Reverse = -30 V, = 0 V -- -- -100 na On Characteristics (th) Gate Threshold Voltage =, = 250 µa 2.0 -- 4.0 R DS(on) Static Drain-Source On-Resistance = 10 V, = 4.5 A -- 0.70 0.85 Ω g FS Forward Transconductance = 40 V, = 4.5 A -- 6.5 -- S Dynamic Characteristics C iss Input Capacitance = 25 V, = 0 V, -- 790 1030 pf V C f = 1.0 MHz oss Output Capacitance -- 130 170 pf C rss Reverse Transfer Capacitance -- 24 30 pf Switching Characteristics t d(on) Turn-On Delay Time = 250 V, = 9A, -- 18 45 ns t r Turn-On Rise Time R G = 25 Ω -- 65 140 ns t d(off) Turn-Off Delay Time -- 93 195 ns t f Turn-Off Fall Time (Note 4) -- 64 125 ns Q g Total Gate Charge = 400 V, = 9A, -- 28 35 nc Q gs Gate-Source Charge = 10 V -- 4 -- nc Q gd Gate-Drain Charge (Note 4) -- 15 -- nc Drain-Source Diode Characteristics and Maximum Ratings I S Maximum Continuous Drain-Source Diode Forward Current -- -- 9* A I SM Maximum Pulsed Drain-Source Diode Forward Current -- -- 36* A V SD Drain-Source Diode Forward Voltage = 0 V, I S = 9 A -- -- 1.4 V t rr Reverse Recovery Time = 0 V, I S = 9 A, -- 100 -- ns Q rr Reverse Recovery Charge di F / dt = 100 A/µs -- 0.3 -- µc NOTES: 1. Repetitive rating : pulse-width limited by maximum junction temperature. 2. L = 8 mh, I AS = 9 A, = 50 V, R G = 25 Ω, starting T J = 25 C. 3. I SD 11 A, di/dt 200 A/µs, BS, Starting T J = 25 C. 4. Essentially independent of operating temperature. 2
Typical Performance Characteristics Figure 1. On-Region Characteristics 10 1 Top : 15.0 V 10.0 V 8.0 V 7.0 V 6.0 V 5.5 V 5.0 V Bottom : 4.5 V 10 0 10 1, Drain-Source Voltage [V] 1. 250µ s Pulse Test 2. T C = 25 Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage 2.0 Figure 2. Transfer Characteristics 10 1 150 o C 25 o C -55 o C 2 4 6 8 10, Gate-Source Voltage [V] Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue 1. = 40V 2. 250µ s Pulse Test R DS(ON) [Ω ], Drain-Source On-Resistance 1.5 1.0 0.5 = 10V = 20V Note : T J = 25 R, Reverse Drain Current [A] 10 1 150 25 1. = 0V 2. 250µ s Pulse Test 0 5 10 15 20 25 0.2 0.4 0.6 0.8 1.0 1.2 1.4 V SD, Source-Drain voltage [V] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics Capacitance [pf] 2000 1600 1200 800 400 C iss C oss C rss 0 10 0 10 1, Drain-Source Voltage [V] C iss = C gs + C gd (C ds = shorted) C oss = C ds + C gd C rss = C gd Notes ; 1. = 0 V 2. f = 1 MHz, Gate-Source Voltage [V] 12 10 8 6 4 2 = 100V = 250V = 400V Note : = 9A 0 0 5 10 15 20 25 30 Q G, Total Gate Charge [nc] 3
Typical Performance Characteristics (Continued) Figure 7. Breakdown Voltage Variation vs. Temperature BS, (Normalized) Drain-Source Breakdown Voltage 1.2 1.1 1.0 0.9 0.8-100 -50 0 50 100 150 200 T J, Junction Temperature [ o C] 1. = 0 V 2. = 250 µ A Figure 9. Maximum Safe Operating Area 10 2 10 1 Operation in This Area is Limited by R DS(on) 1 ms 10 ms 100 ms DC 1. T C = 25 o C 2. T J = 150 o C 3. Single Pulse 100 µ s 10 µ s Figure 8. On-Resistance Variation vs. Temperature R DS(ON), (Normalized) Drain-Source On-Resistance 3.0 2.5 2.0 1.5 1.0 0.5 0.0-100 -50 0 50 100 150 200 T J, Junction Temperature [ o C] Figure 10. Maximum Drain Current vs. Case Temperature 10 8 6 4 2 1. = 10 V 2. = 4.5 A 10-2 10 1 10 2 10 3, Drain-Source Voltage [V] 0 25 50 75 100 125 150 T C, Case Temperature [ ] Figure 11. Transient Thermal Response Curve Z θjc (t), Thermal Response [ o C/W] 10-2 D=0.5 0.2 0.1 0.05 0.02 0.01 single pulse N otes : 1. Z θ JC (t) = 2.86 /W M ax. 2. D uty F actor, D =t 1 /t 2 3. T JM - T C = P DM * Z θ JC (t) P DM t 1 t 2 10-5 10-4 10-3 10-2 10 1 t 1, Square W ave Pulse D uration [sec] 4
12V 200nF IG = const. 50KΩ 300nF Figure 12. Gate Charge Test Circuit & Waveform Same Type as DUT DUT R L 10V Q gs 90% Q g Q gd Charge R G DUT 10% t d(on on) t r t d(off) tf t on t off Figure 13. Resistive Switching Test Circuit & Waveforms L AS -- E AS = AS -- 1 BS -- LI 2 2 AS -------------------- BV BS - BS I AS R G (t) DUT (t) t p t p Time Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms 5
R G DUT I SD Driver + _ L Same Type as DUT dv/dt controlled by RG I SD controlled by pulse period ( Driver ) Gate Pulse Width D = -------------------------- Gate Pulse Period 10V I FM, Body Diode Forward Current I SD ( DUT ) di/dt I RM Body Diode Reverse Current ( DUT ) Body Diode Recovery dv/dt V SD Body Diode Forward Voltage Drop Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms 6
Mechanical Dimensions Figure 16. TO220, Molded, 3-Lead, Full Pack, EIAJ SC91, Straight Lead Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings: http:///package/packagedetails.html?id=pn_tf220-003 7
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