Dual Single-Pole, Normally Open OptoMOS Relay Parameter Ratings Units Blocking Voltage V P Load Current 3 ma rms / ma DC On-Resistance (max) 8 Features 37V rms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) High Reliability Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Machine Insertable, Wave Solderable Surface Mount Tape & Reel Versions Available Applications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls Description IXYS Integrated Circuits Division's is a V, 3mA, 8 dual single-pole, normally open (1-Form-A) Solid State Relay that has two independently controlled, optically coupled outputs. The output MOSFET switches and photovoltaic die employ optically coupled MOSFET technology to provide 37 V rms of input-to-output isolation. The relay outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAlAS infrared LED. This dual single-pole OptoMOS relay provides a more compact design solution than two discrete single-pole relays in a variety of applications, saving board space by incorporating both switches in a single 8-Pin package. Approvals UL Certified Component: File E7627 CSA Certified Component: Certificate 117739 EN/IEC 69-1 Certified Component: TUV Certificate B 494 6 Ordering Information Part # S STR P PTR Description 8-Pin DIP (/Tube) 8-Pin Surface Mount (/Tube) 8-Pin Surface Mount (1,/Reel) 8-Pin Flat Pack (/Tube) 8-Pin Flat Pack (1,/Reel) Pin Configuration 1 + Control - Switch #1 2 Control - Switch #1 3 + Control - Switch #2 4 Control - Switch #2 8 Load - Switch #1 7 Load - Switch #1 6 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A Pb e3 9% I % LOAD t on t off DS-- www.ixysic.com 1
Absolute Maximum Ratings @ 2 C Parameter Ratings Units Blocking Voltage V P Reverse Input Voltage V Input Control Current ma Peak (ms) 1 A Input Power Dissipation 1 mw Total Power Dissipation 2 8 mw Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Isolation Voltage, Input to Output 37 V rms Operational Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 1.33 mw / C 2 Derate linearly 6.67 mw / C Electrical Characteristics @ 2ºC (Unless Otherwise Noted) Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 - I L - - 3 ma rms / ma DC Peak t =ms I LPK - - ±4 ma P On-Resistance 2 I L =3mA R ON - 4. 8 Off-State Leakage Current V L =V P I LEAK - - 1 A Switching Speeds Turn-On t =ma, V L =V on -.43 3 Turn-Off t off -.17 3 ms Output Capacitance V L =V, f=1mhz C OUT - 1 - pf Input Characteristics Input Control Current to Activate 3 I L =3mA -. 2 ma Input Control Current to Deactivate - -.2.3 - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Reverse Input Current V R =V I R - - A Coon Characteristics Input to Output Capacitance - C I/O - 3 - pf 1 If both poles operate simultaneously, the load current must be derated so as not to exceed the package total power dissipation value. 2 Measurement taken within one (1) second of on-time. 3 For applications requiring high-temperature operation (T>6ºC), a LED drive currrent of 4mA is recoended. 2 www.ixysic.com
PERFORMANCE DATA@ 2ºC (Unless Otherwise Noted)* 3 LED Forward Voltage Distribution ( =ma) Turn-On Time Distribution ( =ma, I L =ma) 2 Turn-Off Time Distribution ( =ma, I L =ma) 2 1 1 1 1.26 1.27 1.28 1.29 1.3 1.31 LED Forward Voltage (V).13..16.18.19.2.22 Turn-On Time (ms).34.38.42.46..4.8 Turn-Off Time (ms) LED Current to Operate Distribution =ma) On-Resistance Distribution ( =2mA, I L =ma) 2 Blocking Voltage Distribution 1 1 1.4.4...6.6.7 LED Current to Operate (ma) 4.46 4.48 4. 4.2 4.4 4.6 4.8 On-Resistance ( ) 139 14 141 142 143 144 Blocking Voltage (V P ) LED Forward Voltage vs. Temperature 1.6 Turn-On Time vs. LED Forward Current =8mA). Turn-Off Time vs. LED Forward Current =8mA).4 LED Forward Voltage (V) 1. 1.4 1.3 1.2 1.1 =ma =ma =2mA =ma =ma 1. -4-4 6 8 Turn-On Time (ms).4.3.2.1 3 4 LED Forward Current (ma) Turn-Off Time (ms).44.44.43.43.42 3 4 LED Forward Current (ma) LED Current (ma).8.7.7.6.6.. LED Current to Operate vs. Temperature =ma).4-4 - 4 6 8 Turn-On Time (ms).26.24.22..18.16 Turn-On Time vs. Temperature ( =ma, I L =8mA).14-4 - 4 6 8 Turn-Off Time (ms) Turn-Off Time vs. Temperature ( =ma, I L =8mA).6.6...4.4.3.3.2-4 - 4 6 8 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. www.ixysic.com 3
PERFORMANCE DATA@ 2ºC (Unless Otherwise Noted)* On-Resistance ( ) 6. 6... 4. On-Resistance vs. Temperature ( =2mA, I L =ma) 4. -4-4 6 8 Load Current (ma).6.4.2. -.2 -.4 Typical Load Current vs. Load Voltage ( =2mA) -.6 -.3 -.2 -.1..1.2.3 Load Voltage (V) Load Current (ma) Maximum Load Current vs. Temperature ( =ma) Total Current - Both Poles Operating * 4 4 3 Single Pole Operating 3 * Neither pole to exceed single pole limits -4-4 6 8 Blocking Voltage (V P ) Blocking Voltage vs. Temperature 148 146 144 142 14 138 136 134-4 - 4 6 8 Leakage (na) 2 1 Leakage Current vs. Temperature Measured Across Pins & 6, 7 & 8 (V L =V) -4-4 6 8 Load Curent (A) Energy Rating Curve (Single Pole, =ma) 1..9.8.7.6..4.3.2 s s 1ms ms ms 1s s s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Rating / S / P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD- must be observed. Device / S P Maximum Temperature x Time ºC for 3 seconds 26ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recoends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb e3 www.ixysic.com
2.4 ±.127 (. ±.) 6.3 ±.127 (. ±.) Pin 1.47 ±.76 (.18 ±.3) 4.64 TYP (.16) 9.62 ±.381 (.38 ±.1) MECHANICAL DIMENSIONS 3.32 ±.1 (.13 ±.2) 7.6 ±.24 (.3 ±.) 9.144 ±.8 (.36 ±.) 7.239 TYP. (.28).24 ±.127 (. ±.) 8-.8 DIA. (8-.31 DIA.) 6.3 ±.127 (. ±.) 7.6 ±.127 (.3 ±.) PCB Hole Pattern 2.4 ±.127 (. ±.) 7.6 ±.127 (.3 ±.).813 ±.2 (.32 ±.4) S 2.4 ±.127 (. ±.) 9.62 ±.381 (.38 ±.1) 3.32 ±.1 (.13 ±.2).63 ±.127 (.2 ±.) PCB Land Pattern 2.4 (.) 6.3 ±.127 (. ±.) Pin 1 9.2 ±.24 (.37 ±.).47 ±.76 (.18 ±.3) 7.6 ±.24 (.3 ±.).24 ±.127 (. ±.) 1.6 (.649).6 (.2) 8.9 (.33) 4.44 ±.127 (.17 ±.).813 ±.2 (.32 ±.4) P 2.4 ±.127 (. ±.) 6.3 ±.127 (. ±.) Pin 1 9.398 ±.127 (.37 ±.) 9.62 ±.381 (.38 ±.1) 2.19 ±.2 (.8 ±.1) MIN /.2 MAX ( MIN /.4 MAX) 7.6 ±.24 (.3 ±.).3 ±.13 (.8 ±.) 2.286 MAX. (.9 MAX.).63 ±.127 (.2 ±.) 1. (.6) PCB Land Pattern.6 (.2) 2.4 (.) 8.7 (.342).47 ±.76 (.18 ±.3).864 ±.1 (.34 ±.4) 6 www.ixysic.com
STR Tape & Reel MECHANICAL DIMENSIONS 33.2 DIA. (13. DIA.) Top Cover Tape Thickness.2 MAX. (.4 MAX.) Bo=.3 (.46) W=16. (.63) Embossed Carrier Embossment K =4.9 (.193) K 1 =4. (.16) Ao=.3 (.46) P=12. (.472) User Direction of Feed NOTES: 1. carry tolerances of EIA Standard 481-2 2. Tape complies with all Notes for constant dimensions listed on page of EIA-481-2 PTR Tape & Reel 33.2 DIA. (13. DIA.) 2. (.79) 4. (.17) Top Cover Tape Thickness.2 MAX. (.4 MAX.) 7. (.29) Bo =.3 (.46) W = 16. (.63) Embossed Carrier K = 2.7 (.6) K 1 = 2. (.79) P = 12. (.472) User Direction of Feed Ao =.3 (.46) Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-- Copyright 12, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/12